Ceramic substrate of automatic wafer bonding machine
By setting an adjustable fixing component on the ceramic substrate of the wafer bonding machine, the problem that the substrate can only accommodate one type of wafer is solved, realizing compatibility of wafers of multiple specifications, reducing production costs and improving the versatility of the equipment.
Patent Information
- Application Number
- CN202520206837.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-10
- Publication Date
- 2026-01-20
- Estimated Expiration
- 2035-02-10
AI Technical Summary
In the existing technology, the substrate can only accommodate one type of wafer and is not compatible with other types of wafers, which makes the substrate incompatible with other types of equipment and increases the cost of replacing equipment.
An automatic wafer bonding machine with a ceramic substrate is designed. It adopts an adjustable fixing component. By setting multiple receiving slots and adjustable fixing components on the substrate body, it can fix and process wafers of different specifications. The components include threaded connection of push block and push rod, sliding connection of push block and receiving slot, threaded connection of push rod and substrate, rotatable connection of push block and push rod, and rubber pads in the receiving slot to protect the wafer.
This enables the same substrate to be compatible with wafers of various specifications, reducing production costs and improving the versatility of equipment and processing efficiency.
Smart Images
Figure CN223816389U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to wafer processing technical field especially is related to a kind of ceramic substrate of automatic wafer die bonder. BACKGROUND
[0002] Wafer thinning is an important link in chip manufacturing process, wafer is reduced to about one hundred microns after thinning polishing, thickness from hundreds of microns. Because the characteristics of Ⅲ-Ⅴ group material is brittle and hard, in the process of thinning, cannot like Si material provide effective support to itself, must be fixed on hard substrate (generally quartz or ceramic) using wax and other adhesives, then carry out thinning polishing operation. In addition, wafer front surface pattern is different, especially for mesa structure epitaxial wafer, in order to protect chip front surface structure, need the wax layer after sticking piece has suitable thickness and adhesive force. The mainstream sticking piece technology at present stage has two, respectively is solid wax technology and liquid wax technology.
[0003] Solid wax technology is simple and low in cost, but wax quality and wafer size are negatively correlated, the larger the wafer is, the more difficult it is to stick well, and the wax layer thickness is more controlled.
[0004] Liquid wax technology is to spin-coat liquid wax on the front surface of the wafer, bake it, and then place it on a heated substrate. Then, use an air bag to pressurize the wafer to make it tightly bonded. This method uses liquid wax, which is more expensive than solid wax. However, the spinning process is completed by a machine, which can effectively control the thickness of the wax layer by adjusting the speed. The wax layer is uniform and less likely to have air bubbles. Large-size silicon wafer is usually processed using this method. For small-size (2-3 inch) Ⅲ-Ⅴ wafer, multiple wafers are usually bonded on a large substrate to improve processing efficiency and reduce the cost of single wafer processing.
[0005] Due to the limitation of the liquid wax bonding substrate, the wafer can only be processed on the matching substrate, and the substrate cannot be compatible with other models of equipment. It is too expensive to replace a new bonding machine for some less commonly used specifications and low-frequency substrates.
[0006] Therefore, it is urgent to overcome the defects of the existing technology in this technical field. UTILITY MODEL CONTENTS
[0007] The technical problem to be solved by the utility model is that one substrate can only accommodate one model of wafer, and cannot be compatible with other models of wafer.
[0008] The utility model adopts the following technical solutions:
[0009] On the one hand, the utility model provides a kind of ceramic substrate of automatic wafer die bonder, including: substrate body 1 and multiple adjustable fixing components 2, the adjustable fixing component 2 is threadedly connected with the substrate body 1.
[0010] The substrate body 1 is provided with a plurality of accommodating grooves 10, each of the adjustable fixing assemblies 2 is provided with one of the accommodating grooves 10, the accommodating grooves 10 are used for placing wafers 3, the adjustable fixing assembly 2 comprises a push block 20 and a push rod 21, the push block 20 is in sliding connection with the groove bottom of the accommodating groove 10, the push rod 21 is in threaded connection with the substrate body 1, and the push block 20 and the push rod 21 are in rotary connection.
[0011] Preferably, the push block 20 comprises an upper fixed block 200 and a lower fixed block 201, the upper fixed block 200 and the lower fixed block 201 are fixedly connected through one of adhesive connection or screw connection, the upper fixed block 200 and the lower fixed block 201 are both provided with a fixed groove 202, and one end of the push rod 21 is in rotary connection with the fixed groove 202.
[0012] Preferably, the lower surface of the lower fixed block 201 is provided with a guide protrusion 2010, the bottom of the accommodating groove 10 is provided with a guide sliding groove 100, and the guide protrusion 2010 is in sliding connection with the guide sliding groove 100.
[0013] Preferably, the push rod 21 is a ball head bolt, one end of the push rod 21 is provided with an integrally-formed spherical protrusion 210 and an annular protrusion 211, and the shape of the fixed groove 202 is matched with the shape of the spherical protrusion 210 and the annular protrusion 211.
[0014] Preferably, the maximum wafer size that can be accommodated by the accommodating groove 10 is 4.4 inches, and the minimum wafer size is 2 inches.
[0015] Preferably, when the wafer size placed in the accommodating groove 10 is less than 4.4 inches, the wafer 3 is placed on a cushion block, and the cushion block and the wafer 3 are clamped in the accommodating groove 10 by the adjustable fixing assembly 2.
[0016] Preferably, the push rod 21 is provided with a first threaded portion 212 and a cross-shaped clamping groove 213, the sidewall of the accommodating groove 10 is provided with a threaded hole 101, the first threaded portion 212 is in threaded connection with the threaded hole 101, the adjustable fixing assembly 2 further comprises a handle 22, the end surface of the handle 22 connected with the push rod 21 is provided with a cross-shaped clamping plate 220, and the cross-shaped clamping groove 213 is in clamping connection with the cross-shaped clamping plate 220.
[0017] Preferably, the accommodating groove 10 is a straight groove, and the sidewall of the accommodating groove 10 is provided with a rubber pad 102.
[0018] Preferably, the depth of the accommodating groove 10 is 6 mm ± 0.01 mm.
[0019] Preferably, the push block 20 is arc-shaped as a whole, and the radius of the front end of the push block 20 matches the radius of the arc-shaped area of the accommodating groove 10.
[0020] Compared with the prior art, the beneficial effects of the utility model lie in that the adjustable fixing assembly 2 is arranged in the accommodating groove 10 of the substrate body 1, so that the accommodating groove 10 can accommodate different specifications of the wafer 3, the wafer 3 is placed in the accommodating groove 10, the push block 20 is clamped with the sidewall of the accommodating groove 10 by rotating the push rod 21, and the wafer 3 can be further processed, so that the ceramic substrate of the utility model can be compatible with wafers of multiple specifications, and the scheme of the ceramic substrate provided by the utility model is more conducive to controlling the production cost. BRIEF DESCRIPTION OF DRAWINGS
[0021] In order to more clearly illustrate the technical scheme of the embodiments of the utility model, the drawings needed to be used in the embodiments of the utility model will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model, and other drawings can be obtained by those skilled in the art without creating labor under the premise of the drawings.
[0022] Figure 1 It is the whole structure schematic diagram of the ceramic substrate of the automatic wafer die bonder provided by the embodiment of the utility model;
[0023] Figure 2 It is the schematic diagram of the adjustable fixing assembly of the ceramic substrate of the automatic wafer die bonder provided by the embodiment of the utility model;
[0024] Figure 3 It is the schematic diagram of the guide sliding block of the ceramic substrate of the automatic wafer die bonder provided by the embodiment of the utility model;
[0025] Figure 4 It is the schematic diagram of the substrate body of the ceramic substrate of the automatic wafer die bonder provided by the embodiment of the utility model.
[0026] Among them, the reference signs are:
[0027] 1-substrate body, 10-accommodating groove, 100-guide sliding groove, 101-screw hole, 102-rubber pad, 2-adjustable fixing assembly, 20-push block, 200-upper fixed block, 201-lower fixed block, 2010-guide protrusion, 202-fixed groove, 21-push rod, 210-spherical protrusion, 211-annular protrusion, 212-first threaded part, 213-cross clamping groove, 22-handle, 220-cross clamping plate, 3-wafer. DETAILED DESCRIPTION
[0028] In order to make the purpose, technical scheme and advantages of the utility model clearer and more apparent, the utility model will be further described in detail below in combination with the drawings and examples.
[0029] Unless otherwise required by context, the term "comprises" or "comprising" as used in this specification is to be construed as meaning "including, but not limited to". In describing the disclosure, the terms "one embodiment", "some embodiments", "an exemplary embodiment", "an example", "a specific example" or "some examples" as used herein are intended to indicate that the feature(s) so described can include, but are not limited to, the particular feature(s) so described in the embodiment(s) or example(s) in question. The use of these terms herein does not therefore mean that a particular feature is essential to the embodiment(s) or example(s) in question. Furthermore, it will be understood that the terms "comprises", "comprising", "includes", "including" and / or "has", "having" when used herein, are used to indicate the presence of the stated feature(s) but do not preclude the presence of one or more other feature(s).
[0030] In the description of the utility model, it is to be understood that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like is based on the orientation or positional relationship shown in the drawings, and is only for the purpose of facilitating the description of the disclosure and simplifying the description, and does not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the disclosure.
[0031] In the description of the utility model, the terms "first", "second" are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features limited by "first", "second" can include one or more of the features explicitly or implicitly. In the description of the embodiments of the disclosure, unless otherwise specified, the meaning of "multiple" is two or more. In addition, for example, in the description, the same type of nouns can also be described as two independent individuals by adding "A", "B" at the end, in which case the features limited by "A", "B" are only used for the purpose of distinguishing the same type of individual description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated.
[0032] In describing some embodiments, the terms "coupled," "coupled," and "connected," and their derivative expressions, may be used. For example, the term "connected" may be used in describing some embodiments to indicate that two or more components have direct physical or electrical contact with each other. Similarly, the term "coupled" may be used in describing some embodiments to indicate that two or more components have direct physical or electrical contact. However, the terms "connected" or "coupled" may also refer to two or more components that do not have direct contact with each other but still cooperate or interact with each other, such as "optical coupling" or "wireless connection." The embodiments disclosed herein are not necessarily limited to the scope of this invention.
[0033] In the description of this utility model, the expression "A and / or B" (where A and B are used to formally represent specific features) will be involved. The corresponding expression includes the following three combinations: only A, only B, and a combination of A and B.
[0034] As used in this invention, “about,” “approximately,” or “approximately” includes the stated value and the average value within an acceptable range of deviation from the specified value, wherein the acceptable range of deviation is determined by a person skilled in the art taking into account the measurement under discussion and the error associated with the measurement of the specified quantity (i.e., the limitations of the measurement system).
[0035] Furthermore, the technical features involved in the various embodiments of this utility model described below can be combined with each other as long as they do not conflict with each other.
[0036] Example 1:
[0037] Embodiment 1 of this utility model provides a ceramic substrate for an automatic wafer bonding machine, such as... Figure 1 As shown, it includes: a substrate body 1 and a plurality of adjustable fixing components 2, wherein the adjustable fixing components 2 are threadedly connected to the substrate body 1; the substrate body 1 is provided with a plurality of receiving slots 10, and each of the adjustable fixing components 2 is provided with one receiving slot 10. The receiving slot 10 is used to place the wafer 3. The adjustable fixing component 2 includes a push block 20 and a push rod 21. The push block 20 is slidably connected to the bottom of the receiving slot 10, and the push rod 21 is threadedly connected to the substrate body 1. The push block 20 and the push rod 21 are rotatably connected.
[0038] To ensure that the wafer 3 is clamped without being damaged, the receiving groove 10 is a straight groove, and a rubber pad 102 is provided on the side wall of the receiving groove 10. The rubber pad 102 has high temperature resistance. The number of receiving grooves 10 can be [number missing]. Figure 1 The four shown can also be other numbers, and no specific limit is given here.
[0039] By providing an adjustable fixing component 2 in the receiving groove 10 of the substrate body 1, the receiving groove 10 can accommodate wafers 3 of different specifications. When the wafer 3 is placed in the receiving groove 10, the push rod 21 is rotated so that the push block 20 clamps the wafer 3 with the side wall of the receiving groove 10, and the wafer 3 can be further processed. Compared with the existing method of adapting one type of wafer 3 to one substrate, the ceramic substrate of this utility model can be compatible with multiple specifications of wafers. The solution of using the ceramic substrate provided by this utility model is more conducive to controlling production costs.
[0040] Regarding the pusher block 20 described in the above scheme, in order to facilitate processing and assembly, such as Figure 2 As shown, the push block 20 includes an upper fixing block 200 and a lower fixing block 201. The upper fixing block 200 and the lower fixing block 201 are fixedly connected by either adhesive or screws. Both the upper fixing block 200 and the lower fixing block 201 are provided with fixing grooves 202. One end of the push rod 21 is rotatably connected to the fixing groove 202. When the push block 20 slides in the receiving groove 10, if there is only one fixed point on the side wall of the receiving groove 10, it is impossible to completely guarantee that the movement path of the push block 20 is straight. Therefore, in order to ensure the stability of the push block 20 during the movement and clamping of the wafer 3, such as... Figure 3 and Figure 4 As shown, the lower surface of the lower fixing block 201 is provided with a guide protrusion 2010, and the bottom of the receiving groove 10 is provided with a guide slide groove 100. The guide protrusion 2010 is slidably connected to the guide slide groove 100.
[0041] For putter 21, see [link / reference] Figure 2 As shown, the push rod 21 is a ball-head bolt. One end of the push rod 21 is provided with an integrally formed spherical protrusion 210 and an annular protrusion 211. The shape of the fixing groove 202 matches the shape of the spherical protrusion 210 and the annular protrusion 211. During the rotation of the push rod 21, the spherical protrusion 210 and the annular protrusion 211 rotate inside the fixing groove 202.
[0042] As mentioned in the aforementioned scheme, the receiving groove 10 is a straight groove. In one embodiment, since the commonly used wafer sizes are 4.4 inches, 4 inches, 3 inches, 2.5 inches and 2 inches, the largest wafer size that the receiving groove 10 can accommodate is 4.4 inches and the smallest wafer size is 2 inches. When the end face of the push block 20 connected to the push rod 21 is nearly flush with the side wall of the receiving groove 10, it can accommodate the largest size wafer 3. The meaning of "nearly flush" is that when the push block 20 is completely flush with the side wall of the receiving groove 10, the wafer 3 can be placed inside the receiving groove 10 and then clamped. As the push block 20 continues to advance in the receiving groove 10, it can accommodate smaller size wafers 3. To facilitate the installation of the push rod 20, when the push block 20 is pushed to the limit position of the slide groove 100, it is sufficient to allow the push rod 20 to pass through the inside of the receiving groove 10. The limit position is when the guide protrusion 2010 of the lower fixing block 201 is pushed to the farthest end of the guide slide groove 100. In one embodiment, the width of the push block 20 can be 10mm or other sizes. The specific dimensions can be designed when designing the size of the receiving groove 10 and the substrate body 1 to ensure that it can accommodate the preset maximum and minimum size wafers 3. No strict limitations are imposed here.
[0043] To accommodate the largest wafer 3, the pusher 20 is generally arc-shaped, and the radius of the front end of the pusher 20 matches the radius of the arc-shaped area of the receiving groove 10. Furthermore, since the thickness of a 4.4-inch wafer 3 is 6mm, the depth of the receiving groove 10 is 6mm ± 0.01mm. However, since smaller wafers 3 are thinner, wafers smaller than 4.4 inches are all less than 6mm thick. Therefore, when a wafer smaller than 4.4 inches is placed in the receiving groove 10, the wafer 3 is placed on a pad, and the pad and the wafer 3 are clamped together within the receiving groove 10 by the adjustable fixing component 2. The thickness of the pad is determined according to the thickness of its corresponding wafer 3, such that the sum of the thickness of the pad and the thickness of the wafer 3 is 6mm.
[0044] In order to enable the push rod 21 to be threadedly connected to the substrate body 1, and to facilitate the rotation of the push rod 21, such as Figure 2 and Figure 4As shown, the push rod 21 is provided with a first threaded portion 212 and a cross-shaped groove 213. The side wall of the receiving groove 10 is provided with a screw hole 101. The first threaded portion 212 is threadedly connected to the screw hole 101. The adjustable fixing assembly 2 also includes a handle 22. The end face of the handle 22 connected to the push rod 21 is provided with a cross-shaped retaining plate 220. The cross-shaped groove 213 is engaged with the cross-shaped retaining plate 220. During installation, first place the spherical protrusion 210 and the annular protrusion 211 in the fixing groove 202. After fixing the upper fixing block 200 and the lower fixing block 201 together, place them in the sliding groove 100. After pushing the push block 20 to the limit position, push the push rod 21 out of the screw hole 101. Finally, engage the cross-shaped retaining plate 220 of the handle 22 with the cross-shaped groove 213. It is then ready for use.
[0045] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.
Claims
1. A ceramic substrate for an automatic wafer bonding machine, characterized in that, include: The substrate body (1) and a plurality of adjustable fixing components (2) are threadedly connected to the substrate body (1); The substrate body (1) is provided with a plurality of receiving slots (10), and each of the adjustable fixing components (2) is provided with one receiving slot (10). The receiving slot (10) is used to place the wafer (3). The adjustable fixing component (2) includes a push block (20) and a push rod (21). The push block (20) is slidably connected to the bottom of the receiving slot (10), and the push rod (21) is threadedly connected to the substrate body (1). The push block (20) and the push rod (21) are rotatably connected.
2. The ceramic substrate of the automatic wafer bonding machine according to claim 1, characterized in that, The push block (20) includes an upper fixing block (200) and a lower fixing block (201). The upper fixing block (200) and the lower fixing block (201) are fixedly connected by adhesive or screws. Both the upper fixing block (200) and the lower fixing block (201) are provided with fixing grooves (202). One end of the push rod (21) is rotatably connected to the fixing groove (202).
3. The ceramic substrate of the automatic wafer bonding machine according to claim 2, characterized in that, The lower surface of the lower fixing block (201) is provided with a guide protrusion (2010), and the bottom of the receiving groove (10) is provided with a guide slide groove (100). The guide protrusion (2010) is slidably connected to the guide slide groove (100).
4. The ceramic substrate of the automatic wafer bonding machine according to claim 3, characterized in that, The push rod (21) is a ball head bolt. One end of the push rod (21) is provided with an integrally formed spherical protrusion (210) and an annular protrusion (211). The shape of the fixing groove (202) matches the shape of the spherical protrusion (210) and the annular protrusion (211).
5. The ceramic substrate of the automatic wafer bonding machine according to claim 1, characterized in that, The receiving slot (10) can accommodate a maximum wafer size of 4.4 inches and a minimum wafer size of 2 inches.
6. The ceramic substrate of the automatic wafer bonding machine according to claim 5, characterized in that, When the wafer (3) placed in the receiving groove (10) is less than 4.4 inches in size, the wafer (3) is placed on a pad, and the pad and the wafer (3) are held together in the receiving groove (10) by the adjustable fixing component (2).
7. The ceramic substrate of the automatic wafer bonding machine according to any one of claims 1-6, characterized in that, The push rod (21) is provided with a first threaded part (212) and a cross slot (213). The side wall of the receiving groove (10) is provided with a screw hole (101). The first threaded part (212) is threadedly connected to the screw hole (101). The adjustable fixing component (2) also includes a handle (22). The end face of the handle (22) connected to the push rod (21) is provided with a cross plate (220). The cross slot (213) is engaged with the cross plate (220).
8. The ceramic substrate of the automatic wafer bonding machine according to any one of claims 1-6, characterized in that, The receiving groove (10) is a straight groove, and the side wall of the receiving groove (10) is provided with a rubber pad (102).
9. The ceramic substrate of the automatic wafer bonding machine according to any one of claims 1-6, characterized in that, The depth of the receiving groove (10) is 6mm ± 0.01mm.
10. The ceramic substrate of the automatic wafer bonding machine according to any one of claims 1-6, characterized in that, The push block (20) is arc-shaped, and the radius of the front end of the push block (20) matches the radius of the arc-shaped area of the receiving groove (10).