Material box for packaging semiconductor chip

Abstract

The utility model discloses a material box for semiconductor chip packaging, and belongs to the technical field of semiconductor chip packaging. The material box comprises a material box assembly, the material box assembly is composed of an upper box body and a lower box body, the upper box body is connected to the lower box body in a sleeved mode, a row of pin end clamping grooves are formed in the side wall of the lower box body, the upper box body comprises a top plate, the side wall of the top plate is provided with a first side plate and a second side plate, a cavity is formed in the second side plate, and a row of containing grooves are formed in the second side plate. A row of baffles are arranged in the cavity of the second side plate, a gap exists between every two adjacent baffles, a connecting plate is in sliding fit with the gaps, and sliding blocks are arranged on the side walls of the baffles. According to the utility model, the material box assembly is formed by the upper box body and the lower box body, the semiconductor chip is arranged in the material box assembly, and the connecting plate is lapped on the pin end clamping groove, so that the position of the connecting plate can be flexibly adjusted according to the semiconductor chips with different sizes or pin layouts, and the placing and fixing requirements of the chips can be better met.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor chip packaging, specifically to a material box for semiconductor chip packaging. BACKGROUND

[0002] The material box for semiconductor chip packaging is an indispensable part in the semiconductor manufacturing and packaging process. It is a device specially designed for material storage, transportation and protection during the semiconductor chip packaging process. It ensures the stability, safety and cleanliness of semiconductor components during the packaging process, thereby improving production efficiency and quality. The packaging material box is usually made of high-quality materials such as aluminum alloy, anti-static materials or corrosion-resistant alloys. These materials not only have high strength, but also have good corrosion resistance and thermal conductivity, which can effectively protect the components from the influence of the external environment.

[0003] When different specifications of chips are packaged, due to the different thicknesses and pin end numbers of the chips, the pin ends placed in the second storage slot cannot be limited, and the semiconductor chips are prone to displacement. SUMMARY

[0004] The utility model aims at providing a kind of material box for semiconductor chip packaging, and the connecting plate is overlapped on the pin end slot, which can be flexibly adjusted according to the position of the connecting plate of different size or pin layout semiconductor chip, better adapt to the placement and fixation needs of chip.

[0005] The utility model is realized by the following technical solutions:

[0006] The utility model is a kind of material box for semiconductor chip packaging, including material box assembly, material box assembly is by upper box body and lower box body, upper box body is sleeved on lower box body, lower box body side wall is equipped with a pin end slot, upper box body includes top plate, top plate side wall is respectively provided with first side plate and second side plate, second side plate interior is equipped with cavity, second side plate is equipped with a row of placement slot, the cavity inside second side plate is equipped with a row of baffle, there is gap between adjacent two baffles, gap is slidably connected with connecting plate, baffle side wall is equipped with sliding block, connecting plate side wall is equipped with sliding slot, sliding slot is slid in sliding block, connecting plate is overlapped on pin end slot.

[0007] Further, L-shaped plates are installed on both side walls of the lower box body, threaded holes are formed on the L-shaped plates, and the L-shaped plates are fitted inside the first side plates.

[0008] Further, threaded bolts are fitted on the first side plates, and one end of the threaded bolts is fitted in the threaded holes.

[0009] Further, the first side plates and the second side plates are both two, and the two first side plates and the second side plates are respectively arranged on the side walls around the top plate.

[0010] Further, two threaded rods are arranged in the lower box body, two hole plates are movably connected to the two threaded rods, a limiting plate is arranged between the two hole plates, and rubber pads are arranged on the side walls of the limiting plate.

[0011] Further, a threaded ring is threadedly connected to the threaded rod, and the threaded ring is arranged on one side of the hole plate.

[0012] The utility model has the following beneficial effects:

[0013] The utility model discloses a material box assembly which is composed of the upper box body and the lower box body, and the semiconductor chip is arranged in the material box assembly.

[0014] The utility model discloses a material box assembly which is composed of the upper box body and the lower box body, and the semiconductor chip is arranged in the material box assembly.

[0015] Of course, it is not necessary for any product embodying the utility model to achieve all the advantages mentioned above. BRIEF DESCRIPTION OF DRAWINGS

[0016] Figure 1 Fig. 4 is a structural schematic view of the upper box body and the lower box body in a separated state;

[0017] Figure 2 Fig. 4 is a structural schematic view of the upper box body and the lower box body in a separated state;

[0018] Figure 3 Fig. 4 is a structural schematic view of the upper box body and the lower box body in a separated state;

[0019] Figure 4 Fig. 4 is a structural schematic view of the upper box body and the lower box body in a separated state.

[0020] In the drawings: 1, material box assembly; 2, upper box body; 3, lower box body; 301, pin end clamping groove; 302, L-shaped plate; 303, threaded hole; 304, threaded rod; 305, hole plate; 306, limiting plate; 307, rubber pad; 308, threaded ring; 4, top plate; 5, first side plate; 501, bolt; 6, second side plate; 601, placing groove; 7, connecting plate; 701, sliding groove; 8, baffle; 801, sliding block. DETAILED DESCRIPTION

[0021] The technical solutions in the embodiments of the present application will be clearly and completely described with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the scope of the present application.

[0022] Please refer to Figures 1-4 The present application provides a technical scheme: a material box for semiconductor chip packaging, comprising a material box assembly 1, the material box assembly 1 is composed of an upper box body 2 and a lower box body 3, the semiconductor chip is placed inside the material box assembly 1, the upper box body 2 is sleeved on the lower box body 3, the upper and lower box body structure of the material box and the connection mode of each component make the operation relatively simple when placing or taking out the semiconductor chip, the chip is conveniently operated by opening the upper box body, the assembly and disassembly process is also relatively easy, and the work efficiency is improved.

[0023] A row of pin end clamping grooves 301 is formed in the side wall of the lower box body 3, the pin end of the semiconductor chip is placed in the pin end clamping groove 301, the row of pin end clamping grooves 301 formed in the side wall of the lower box body 3 accurately places the pin end of the semiconductor chip, realizes positioning of the pin of the chip, prevents the pin from shaking, bending or colliding with each other in the material box, ensures the integrity and performance of the pin, the upper box body 2 is sleeved on the lower box body 3 to form a closed space, the semiconductor chip is completely contained in the material box assembly 1, the chip is prevented from being physically impacted, dust polluted and the like from the outside, and good protection is achieved.

[0024] The upper box body 2 comprises a top plate 4, first and second side plates 5 and 6 are arranged on the side wall of the top plate 4 respectively, a cavity is formed in the inside of the second side plate 6, a row of placement grooves 601 is formed on the second side plate 6, a row of baffle plates 8 is arranged in the cavity of the second side plate 6, a gap exists between adjacent two baffle plates 8, a connecting plate 7 is slidingly connected in the gap, a sliding block 801 is formed in the side wall of the baffle plate 8, a sliding groove 701 is arranged on the side wall of the connecting plate 7, the sliding groove 701 slides in the sliding block 801, the connecting plate 7 is lapped on the pin end clamping groove 301, the baffle plate 8 in the inside of the second side plate 6 and the connecting plate 7 are slidingly matched through the sliding block 801 and the sliding groove 701, and the connecting plate 7 is lapped on the pin end clamping groove 301, so that the position of the connecting plate 7 can be flexibly adjusted according to semiconductor chips of different sizes or pin layouts, and the placement and fixing requirements of the chip are better adapted.

[0025] The lower box body 3 is provided with L-shaped plates 302 on both sides, and threaded holes 303 are formed in the L-shaped plates 302. The L-shaped plates 302 are fitted in the first side plates 5, and threaded bolts 501 are fitted in the first side plates 5. The first side plates 5 and the second side plates 6 are both provided with two, and the two first side plates 5 and the second side plates 6 are arranged on the side walls of the top plate 4. The L-shaped plates 302 of the lower box body 3 are fitted in the first side plates 5, and the threaded bolts 501 of the first side plates 5 are screwed with the threaded holes 303 of the L-shaped plates 302, so that the upper box body 2 and the lower box body 3 are tightly connected, the stability of the whole structure of the material box is ensured, and the upper and lower box bodies are prevented from being separated during transportation and storage.

[0026] Two threaded rods 304 are arranged in the lower box body 3, two hole plates 305 are movably fitted on the two threaded rods 304, and a limiting plate 306 is arranged between the two hole plates 305. The two threaded rods 304 in the lower box body 3 are fitted with the hole plates 305 and the threaded ring 308. By adjusting the position of the threaded ring 308 on the threaded rod 304, the position of the hole plate 305 is adjusted, and then the installation position of the limiting plate 306 is adjusted, so as to ensure the limiting effect of the limiting plate 306 on the chip.

[0027] The limiting plate 306 is provided with a rubber pad 307 on the side wall, and a threaded ring 308 is screwed on the threaded rod 304. The threaded ring 308 is arranged on one side of the hole plate 305. The limiting plate 306 arranged between the two hole plates 305 in the lower box body 3 is provided with a rubber pad 307 on the side wall. After the chip is placed in the material box, the chip is buffered and limited by the elasticity of the rubber pad 307, so as to prevent the chip from being damaged due to collision with the box body caused by shaking in the material box.

[0028] When the material box is used for packaging semiconductor chips, the semiconductor chips are placed in the lower box body 3, the limiting plate 306 on the threaded hole 303 is slid, so that the rubber pad 307 on one side of the limiting plate 306 can be attached to the side wall of the semiconductor chip, so as to ensure the fixed installation of the semiconductor chip in the lower box body 3. After the semiconductor chip is received, the upper box body 2 is connected to the top end of the lower box body 3, so that the upper box body 2 and the lower box body 3 form the whole material box assembly 1. The L-shaped plate 302 of the lower box body 3 is arranged in the first side plate 5 of the upper box body 2, and the L-shaped plate 302 is connected with the first side plate 5 through the threaded bolt 501, so as to ensure the arrangement of the upper box body 2 on the lower box body 3. The pin end of the semiconductor chip is arranged in the pin end slot 301 of the lower box body 3. When the upper box body 2 is connected to the lower box body 3, the bottom end of the baffle 8 in the cavity of the second side plate 6 abuts against the pin end. According to the arrangement of the pin end, the baffle 8 can slide at the gap between the connecting plates 7, so as to ensure the limiting and fixing of the baffle 8 to the pin end, and the pin end slot 301 is shielded and protected by the baffle 8.

[0029] The preferred embodiments disclosed above are only used to help describe the utility model. The preferred embodiments do not describe all the details and do not limit the utility model to the specific embodiments. Obviously, according to the content of the specification, many modifications and changes can be made. The specification selects and specifically describes these embodiments in order to better explain the principle and practical application of the utility model, so that the person skilled in the art can well understand and utilize the utility model. The utility model is limited by the claims and the whole scope and equivalents thereof.

Claims

1. A material box for semiconductor chip packaging, comprising a box assembly (1) which is composed of an upper box body (2) and a lower box body (3), characterized in that: The upper box body (2) is sleeved on the lower box body (3), the lower box body (3) is provided with a pin end clamping groove (301) on the side wall, the upper box body (2) comprises a top plate (4), the top plate (4) is provided with a first side plate (5) and a second side plate (6) on the side wall respectively, the second side plate (6) is internally provided with a cavity, the second side plate (6) is provided with a discharge groove (601), the cavity of the second side plate (6) is provided with a row of baffles (8), there is a gap between adjacent two baffles (8), the gap is slidably connected with a connecting plate (7), the side wall of the baffle (8) is provided with a sliding block (801), the side wall of the connecting plate (7) is provided with a sliding groove (701), the sliding groove (701) is slid in the sliding block (801), and the connecting plate (7) is lapped on the pin end clamping groove (301).

2. The material box for semiconductor chip packaging according to claim 1, wherein, The lower box body (3) is provided with an L-shaped plate (302) on the two side walls, the L-shaped plate (302) is provided with a threaded hole (303), and the L-shaped plate (302) is matched in the first side plate (5).

3. The material box for semiconductor chip packaging according to claim 2, wherein, The first side plate (5) is provided with a threaded bolt (501), and one end of the threaded bolt (501) is matched in the threaded hole (303).

4. The material box for semiconductor chip packaging according to claim 3, wherein, The first side plate (5) and the second side plate (6) are two, and the two first side plates (5) and the second side plates (6) are arranged on the side walls of the top plate (4) respectively.

5. The material box for semiconductor chip packaging according to claim 1, wherein, The lower box body (3) is provided with two threaded rods (304), two hole plates (305) are movably matched on the two threaded rods (304), a limiting plate (306) is arranged between the two hole plates (305), and a rubber pad (307) is arranged on the side wall of the limiting plate (306).

6. The material box for semiconductor chip packaging according to claim 5, wherein, The threaded rod (304) is provided with a threaded ring (308), and the threaded ring (308) is arranged on one side of the hole plate (305).

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