Carrying platform adapter for supporting detection of front and back surfaces of primary and secondary rings

Abstract

The utility model discloses a carrier adapter for detecting the front and back surfaces of a support primary and secondary ring, which comprises a first disc, an adsorption structure is arranged on the first disc, and the adsorption structure is connected with a vacuum conveying end; the adsorption structure comprises a first vacuum groove and a first bearing ring, the first vacuum groove is formed in the bottom end face of the first disc, the first bearing ring is fixedly connected to the position, located on the upper side end face of the first vacuum groove, of the first disc, and a plurality of micropores are formed in the first bearing ring. The micro holes are communicated with the first vacuum grooves, the adsorption structure further comprises negative pressure adsorption assemblies, and the end face of the top of the first disc is connected with the multiple negative pressure adsorption assemblies. According to the utility model, the iron ring for bearing the 6-inch or 8-inch compound wafer is high in stability and not easy to fall off, the front surface or the back surface of the iron ring for supporting the 6-inch or 8-inch compound wafer can be fixed, and the wafer can be conveniently detected.

Description

TECHNICAL FIELD

[0001] The utility model belongs to wafer detection technical field, concretely relates to a support sub - mother ring front and back detection is with the stage adapter. BACKGROUND

[0002] In the semiconductor manufacturing process, wafer detection machine is a vital link. Through detection, chip problems can be found and repaired in time, thereby improving the quality and manufacturing efficiency of chips, and wafer detection machine can also carry out electrical test, fault analysis, yield evaluation, etc., to ensure the performance and reliability of chips. Wafer detection machine includes a stage adapter, the stage adapter is placed on the stage of the machine, the vacuum conveying end is connected above the stage adapter, the iron ring of the wafer is adsorbed and carried by conveying negative pressure through the vacuum conveying end, the stage adapter moves in X and Y axis direction, and the camera on Z axis is convenient for scanning the surface of wafer.

[0003] With the development of science and technology, more and more customers choose to use 6 inch or 8 inch compound wafer, however, for the iron ring carrying 6 inch or 8 inch compound wafer, the currently used stage adapter cannot well carry the iron ring, fix it, the stability is poor, and when the front and back detection is carried out, the existing stage adapter cannot adapt to the fixing of the wafer on the front and back iron rings, and the arm cannot well enter the lower part of the stage adapter to take and place the arm, the taking and placing error is prone to occur, and the safety is low.

[0004] Therefore, in view of the above technical problems, it is necessary to provide a support sub - mother ring front and back detection is with the stage adapter.

[0005] The information disclosed in this BACKGROUND section is only intended to increase an understanding of the general background of the present utility model and is not intended to be a recognition or a suggestion that this information forms a prior art that is already known in the art. UTILITY MODEL CONTENT

[0006] The utility model aims at providing a support sub - mother ring front and back detection is with the stage adapter, which can solve the problems in the background art.

[0007] In order to achieve the above-mentioned purpose, the technical scheme provided by the utility model in one embodiment is as follows:

[0008] A support sub - mother ring front and back detection is with the stage adapter, including first disc, the first disc is provided with adsorption structure, the adsorption structure is connected with vacuum conveying end;

[0009] The adsorption structure comprises a first vacuum groove and a first bearing ring, a first vacuum groove is formed in the bottom end face of the first disc, the first disc is fixedly connected with the first bearing ring on the upper side end face of the first vacuum groove, a plurality of micropores are formed in the first bearing ring and are communicated with the first vacuum groove.

[0010] In one or more embodiments of the utility model, the adsorption structure further comprises a negative pressure adsorption assembly, a plurality of negative pressure adsorption assemblies are connected to the top end face of the first disc, the negative pressure adsorption assembly comprises a first silica gel suction nozzle and a second silica gel suction nozzle, the second silica gel suction nozzle is integrally formed on the top end face of the first silica gel suction nozzle, a suction pipe is integrally formed on the bottom end face of the first silica gel suction nozzle, the first silica gel suction nozzle, the suction pipe and the second silica gel suction nozzle are communicated with each other.

[0011] In one or more embodiments of the utility model, the diameter of the first silica gel suction nozzle gradually decreases from the middle end face to the two side end faces, and the diameter of the second silica gel suction nozzle gradually decreases from the top end face to the bottom end face.

[0012] In one or more embodiments of the utility model, a plurality of limiters are connected to the top end face of the first disc, the limiter comprises an outer cover and a base, a top plate is fixedly connected to the top end face of the base, a pair of bottom plates are fixedly connected to the bottom end face of the base, and the top end face of the outer cover abuts against the top end face of the top plate.

[0013] In one or more embodiments of the utility model, a sleeve ring is sleeved on the outer side end face of the base, and a plurality of supporting columns are fixedly connected to the outer side end face of the sleeve ring.

[0014] In one or more embodiments of the utility model, a first outer connecting plate is integrally formed on one side end face of the first disc.

[0015] In one or more embodiments of the utility model, a plurality of reinforcing ribs are fixedly connected to the outer side end face of the first disc located in the first bearing ring, and a pair of third outer connecting plates are integrally formed on one side end face of the first disc.

[0016] In one or more embodiments of the utility model, the first vacuum groove is a plurality of polygons with different shapes.

[0017] In one or more embodiments of the utility model, a plurality of first threaded holes are formed in the top end face of the first disc, threaded columns are screw-connected to the first threaded holes, and supporting pads are fixedly connected to the top end face of the threaded columns.

[0018] In one or more embodiments of the utility model, a pair of opposite end faces of the first disc is integrally formed with a second outer plate, a limiting hole is formed on the second outer plate, and a plurality of second grooves are formed on the first disc.

[0019] Compared with the prior art, the support sub-mother ring front and back detection support adapter has the following advantages.

[0020] 1) can bear 6 inch or 8 inch compound wafer iron ring, high stability, not easy to fall;

[0021] 2) support the fixing of the front or back of the 6 inch or 8 inch compound wafer iron ring, facilitate the detection of the wafer;

[0022] 3) the arm can enter the support adapter below the 6 inch or 8 inch compound wafer iron ring, and the iron ring can be taken and placed. BRIEF DESCRIPTION OF DRAWINGS

[0023] In order to more clearly illustrate the technical scheme in the embodiments of the utility model or the prior art, the drawings needed to be used in the embodiment or the prior art description will be briefly introduced below, and obviously, the drawings in the following description are only some embodiments in the utility model, and for those skilled in the art, other drawings can be obtained according to these drawings without creative labor.

[0024] Figure 1 It is the structure schematic view of the adapter front end direction of the support sub-mother ring front and back detection support adapter in the embodiment of the utility model;

[0025] Figure 2 It is the use state schematic view of the support sub-mother ring front and back detection support adapter in the embodiment of the utility model;

[0026] Figure 3 It is the structure schematic view of A in the embodiment of the utility model; Figure 2

[0027] Figure 4 It is the structure schematic view of the limiter 103;

[0028] Figure 5 It is the rear view of the iron ring 2 of the adapter front end direction of the support sub-mother ring front and back detection support adapter in the embodiment of the utility model;

[0029] Figure 6 It is the structure schematic view of the adapter back surface positioning iron ring 2 of the support sub-mother ring front and back detection support adapter in the embodiment of the utility model;

[0030] Figure 7 ​This is a rear view of the adapter back positioning iron ring 2 of a platform adapter for supporting front and back detection of mother and daughter rings in Embodiment 1 of this utility model;

[0031] Figure 8 This is a schematic diagram of a platform adapter for supporting front and back detection of a mother and daughter ring, according to Embodiment 2 of this utility model.

[0032] Explanation of key figure labels:

[0033] 1-First disc, 101-First bearing ring, 102-Negative pressure adsorption assembly, 1021-First silicone nozzle, 1022-Strut, 1023-Second silicone nozzle, 103-Limiter, 1031-Outer cover, 1032-Loop ring, 1033-Support column, 1034-Base, 1035-Top plate, 1036-Chassis, 104-First groove, 105-First connecting plate, 106-First outer plate, 2-Iron ring, 3-Second groove, 4-Second outer plate, 401-Limiting hole, 5-First vacuum groove, 6-First pin, 701-Support pad, 702-Third outer plate, 703-Reinforcing rib, 704-Second connecting plate, 705-Second pin. Detailed Implementation

[0034] To enable those skilled in the art to better understand the technical solutions of this utility model, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort should fall within the protection scope of this utility model.

[0035] Example 1

[0036] like Figures 1-5 As shown in the figure, an embodiment of this utility model provides a stage adapter for detecting the front and back sides of a mother-daughter ring, including a first disk 1. An adsorption structure is provided on the first disk 1, and the adsorption structure is connected to a vacuum conveying end. The vacuum conveying end delivers a vacuum, which is used to adsorb and fix the iron ring through the adsorption structure. This method is suitable for detecting the front (front end) side of the iron ring on a 6-inch compound wafer. Compared to existing technologies that cannot adsorb and fix the iron ring and have poor stability, the adsorption structure of this application can stably fix the iron ring, ensuring its transport stability and high safety. Furthermore, its special design allows for easy handling of the iron ring by an arm, reducing the risk of wafer damage due to arm handling errors.

[0037] The adsorption structure comprises a first vacuum groove 5 and a first bearing ring 101. The bottom end face of the first disc 1 is provided with the first vacuum groove 5. The upper end face of the first disc 1 is fixedly connected with the first bearing ring 101. The first bearing ring 101 is provided with a plurality of micropores. The micropores are communicated with the first vacuum groove 5. The iron ring 2 is adsorbed and fixed through the first vacuum groove 5. The iron ring has high stability and is convenient for further detection. The front surface of the 6-inch compound wafer iron ring can be adsorbed and fixed, and the wafer is convenient for detection.

[0038] The first bearing ring 101 is a circular ring structure. The plurality of end faces of the first bearing ring 101 are ceramic microporous surfaces. The micropores are used for conveying vacuum for adsorption. The adsorption stability is higher.

[0039] The adsorption structure further comprises a negative pressure adsorption assembly 102. The top end face of the first disc 1 is connected with a plurality of negative pressure adsorption assemblies 102. The first disc 1 is fixedly connected with the first bearing ring 101. The height of the negative pressure adsorption assembly 102 matches the height of the stopper 103. The bottom of the iron ring 2 is conveniently carried.

[0040] The plurality of negative pressure adsorption assemblies 102 and the plurality of stoppers 103 are distributed on the plurality of end faces of the first disc 1. The arm can be adapted, and the iron ring 2 is conveniently taken and placed on the upper end face of the stage adapter.

[0041] The size of the first disc 1, the plurality of negative pressure adsorption assemblies 102 and the plurality of stoppers 103 matches the iron ring of the 6-inch compound wafer. The iron ring of the 6-inch compound wafer can be adapted and fixed.

[0042] The top end faces of the negative pressure adsorption assembly 102 and the stopper 103 are in the same horizontal plane. The iron ring is conveniently fixed horizontally on the top end faces of the negative pressure adsorption assembly 102 and the stopper 103. The stability is high.

[0043] The negative pressure adsorption assembly 102 comprises a first silica gel suction nozzle 1021 and a second silica gel suction nozzle 1023. The second silica gel suction nozzle 1023 is integrally formed on the top end face of the first silica gel suction nozzle 1021. The bottom end face of the first silica gel suction nozzle 1021 is integrally formed with a suction pipe 1022.

[0044] The suction pipe 1022 is communicated with the first vacuum groove 5. The first silica gel suction nozzle 1021, the suction pipe 1022 and the second silica gel suction nozzle 1023 are communicated with each other. The vacuum conveying end is conveyed to the suction pipe 1022, the first silica gel suction nozzle 1021 and the second silica gel suction nozzle 1023 in sequence through the first vacuum groove 5. The iron ring 2 located above is adsorbed. After being fixed, the wafer detection is started.

[0045] Furthermore, the diameter of the first silicone nozzle 1021 gradually decreases from the middle end face to both end faces. The diameter of the second silicone nozzle 1023 gradually decreases from the top end face to the bottom end face. This facilitates the retainer 103 to adhere to the iron ring 2 and then strengthen its adsorption and fixation.

[0046] A first connecting plate 105 is bonded to one end face of the first disc 1, and a plurality of first grooves 104 are formed on the first disc 1.

[0047] Multiple limiters 103 are fixedly connected to the top end face of the first disc 1. The bottom of the iron ring 2 is supported and fixed by the multiple limiters 103 to ensure its stability during transportation.

[0048] The limiter 103 includes an outer cover 1031 and a base 1034, with a top plate 1035 fixedly connected to the top end face of the base 1034. The top end face of the outer cover 1031 abuts against the top end face of the top plate 1035, and the top plate 1035 matches the top end face of the outer cover 1031, with the outer cover 1031 sleeved on the top plate 1035.

[0049] Preferably, a friction pad is bonded to the upper side of the outer cover 1031 where it contacts the iron ring 2, and the top end face of the top plate 1035 where it contacts the outer cover 1031 is also a friction pad, so as to achieve better support and fixation for the iron ring 2.

[0050] A collar 1032 is fitted onto the outer end face of the base 1034. Multiple support columns 1033 are fixedly connected to the outer end face of the collar 1032. The support columns 1033 match the inner wall end face of the outer cover 1031. The support columns 1033 abut against the inner wall end face of the outer cover 1031 to fix the outer cover 1031 and at the same time ensure that the outer cover 1031 is not easily deformed.

[0051] like Figure 4 As shown, a pair of base plates 1036 are fixedly connected to the bottom end face of the base 1034, and the pair of base plates 1036 are arranged vertically on the base 1034.

[0052] The chassis 1036 located on the upper end face matches the bottom end face of the outer cover 1031, and the chassis 1036 located on the upper end face is attached to the bottom end face of the support column 1033. Multiple support columns 1033 are supported, improving the stability of the outer cover 1031 fitted onto the top plate 1035. The bottom end face of the outer cover 1031 fitted onto the top plate 1035 is attached to the chassis 1036 located on the upper end face.

[0053] Furthermore, the first disc 1 has a second threaded hole on the bottom end face of the base 1036, and the base 1036 and the base 1034 have a third threaded hole that matches the second threaded hole. The second threaded hole and the third threaded hole are connected by a bolt, and the limiter 103 is fixed on the first disc 1 by the bolt.

[0054] The first disk 1 has a pair of opposite end faces integrally formed with a first external plate 106, which facilitates the fixing of the whole on the wafer inspection machine.

[0055] Multiple first pins 6 are fixedly connected to the bottom end face of the first external board 106. The first pins 6 are inserted into the holes on the platform of the wafer inspection machine for positioning and fixation.

[0056] Example 2

[0057] like Figures 6-7 As shown, the first disk 1 is fixedly connected to a plurality of reinforcing ribs 703 on the outer end face of the first bearing ring 101 to improve the stability of the first bearing ring 101 fixed on the first disk 1. A pair of third external plates 702 are integrally formed on one side end face of the first disk 1 to adapt to the positioning detection of the back side of the iron ring of the 6-inch compound wafer.

[0058] A second pin 705 is fixedly connected to one end face of the third external board 702. The second pin 705 facilitates the fixation of the entire assembly onto the wafer inspection machine.

[0059] The first vacuum groove 5 consists of multiple polygons of different shapes, which are evenly distributed on the bottom end face of the first disk 1 and match the back of the iron ring of the 6-inch compound wafer. The first support ring 101 is used to fix and adsorb the wafer.

[0060] The top end face of the first disc 1 is provided with a plurality of first threaded holes, and a threaded post is threadedly connected to the first threaded hole. A support pad 701 is bonded to the top end of the threaded post, and the bottom end face of the iron ring 2 can be supported by the support pad 701.

[0061] The difference between Example 2 and Example 1 is that Example 1 is used to inspect the front side of the iron ring 2, while Example 2 is used to inspect the back side of the iron ring 2.

[0062] Both Example 2 and Example 1 use a first bearing ring 101 and a first vacuum groove 5. The size of the first disk 1 and the first bearing ring 101 is adapted to the iron ring of a 6-inch compound wafer. However, the adsorption structure of Example 1 adds a negative pressure adsorption component 102. Furthermore, Example 1 uses multiple limiters 103 to better support and fix the iron ring 2, while Example 2 uses a support pad 701 to better support and fix the iron ring 2.

[0063] Example 3

[0064] like Figure 5As shown, the first disc 1 is integrally formed with a second outer plate 4 at a pair of opposite end faces, the second outer plate 4 is provided with a limiting hole 401, and the first disc 1 is provided with a plurality of second grooves 3.

[0065] The difference between the third embodiment and the first and second embodiments is that the third embodiment is provided with a plurality of second grooves 3 on the first disc 1, and the shape of the second outer plate 4 is smaller than that of the first outer plate 106, the sizes of the first disc 1, the negative pressure adsorption assembly 102 and the stopper 103 are matched with the iron ring of the 8-inch compound wafer, and the stopper 103 and the negative pressure adsorption assembly 102 can be attached to the bottom end face of the iron ring 2 to support it. The third embodiment is used for fixing the iron ring of the 8-inch compound wafer, while the first and second embodiments are used for fixing the iron ring of the 6-inch compound wafer.

[0066] In use, the arm inserts the iron ring 2 into the inner wall end face of the stage adapter, and under the special design of the adsorption structure and the first bearing ring 101, the iron ring 2 can be quickly inserted into the stage adapter for conveying to the top end face of the first bearing ring 101, and after the adsorption structure starts to convey negative pressure to adsorb and fix the iron ring 2, the next step of detecting the wafer is started.

[0067] It is apparent for those skilled in the art that the present application is not limited to the details of the above-described exemplary embodiments, and the present application can be implemented in other concrete forms without departing from the spirit or essential characteristics of the present application. Therefore, the embodiments should be considered in all aspects as illustrative and not restrictive, and the scope of the present application is defined by the appended claims rather than the above description, and it is intended to encompass all changes falling within the meaning and range of equivalents of the elements of the claims. Any reference signs in the claims should not be considered as limiting the claims involved.

[0068] In addition, it should be understood that although the present specification is described in terms of embodiments, not every embodiment contains only one independent technical solution, and the description manner of the specification is only for the sake of clarity, and those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can be properly combined to form other embodiments that those skilled in the art can understand.

Claims

1. A support adapter for supporting a primary- secondary ring right- wrong side detection, characterized by, The first disc is provided with an adsorption structure connected with a vacuum conveying end; The adsorption structure comprises a first vacuum groove and a first bearing ring, the bottom end surface of the first disc is provided with the first vacuum groove, and the upper end surface of the first vacuum groove is fixedly connected with the first bearing ring.

2. A support adapter for a mother and daughter ring right and wrong side detection according to claim 1, characterized in that, The adsorption structure further comprises a negative pressure adsorption assembly, the top end surface of the first disc is connected with a plurality of negative pressure adsorption assemblies, the negative pressure adsorption assembly comprises a first silica gel suction nozzle and a second silica gel suction nozzle, the second silica gel suction nozzle is integrally formed on the top end surface of the first silica gel suction nozzle, the bottom end surface of the first silica gel suction nozzle is integrally formed with a suction tube, the suction tube is communicated with the first vacuum groove, and the first silica gel suction nozzle, the suction tube and the second silica gel suction nozzle are communicated with each other.

3. A support adapter for a mother and daughter ring right and wrong side detection according to claim 2, characterized in that, The diameter of the first silica gel suction nozzle gradually decreases from the middle end surface to the two side end surfaces, and the diameter of the second silica gel suction nozzle gradually decreases from the top end surface to the bottom end surface.

4. The support adapter for a mother and daughter ring according to claim 2 or 3, wherein, The top end surface of the first disc is connected with a plurality of limiters, the limiter comprises an outer cover and a base, the top end surface of the base is fixedly connected with a top plate, the bottom end surface of the base is fixedly connected with a pair of bottom plates, and the top end surface of the outer cover abuts against the top end surface of the top plate.

5. A support adapter for a mother and daughter ring right and wrong side detection according to claim 4, characterized in that, The outer side surface of the base is sleeved with a sleeve ring, and the outer side surface of the sleeve ring is fixedly connected with a plurality of supporting columns.

6. A support adapter for a mother and daughter ring according to claim 5, wherein, The first disc is integrally formed with a first outer plate on one side end surface.

7. A support adapter for a mother and daughter ring right and wrong side detection according to claim 1, wherein, The first disc is integrally formed with a pair of third outer plates on one side end surface.

8. A support adapter for a mother and daughter ring right and wrong side detection according to claim 7, characterized in that, The first vacuum groove is a plurality of polygons with different shapes.

9. The support adapter for a mother and daughter ring according to claim 8, wherein, The top end surface of the first disc is provided with a plurality of first threaded holes, the first threaded holes are threadedly connected with threaded columns, and the top end surface of the threaded column is fixedly connected with a supporting pad.

10. A support adapter for a mother and daughter ring right and wrong side detection according to claim 1, wherein, The first disc is integrally formed with a second outer plate on a pair of opposite end surfaces, the second outer plate is provided with a limiting hole, and the first disc is provided with a plurality of second grooves.

Images