Mask manufacturing apparatus

Abstract

A mask manufacturing apparatus includes: a stage for supporting a mask frame; and a guide disposed at a side portion of the mask frame, restricting a horizontal movement of the mask frame, and including a roller disposed at an end portion of the guide facing the mask frame.

Description

Technical Field

[0001] This disclosure generally relates to a mask manufacturing apparatus. More specifically, this disclosure relates to a mask manufacturing apparatus for manufacturing a display device and a method for manufacturing a mask using the mask manufacturing apparatus. Background Technology

[0002] With the advancement of information technology, the importance of display devices in connecting users with information has become increasingly apparent. Various types of display devices are widely used in different fields. These display devices include liquid crystal displays (LCDs), organic light-emitting diode displays (OLEDs), plasma display panels (PDPs), and quantum dot displays.

[0003] The fabrication of light-emitting elements (e.g., organic light-emitting elements) included in display devices typically uses masks to control the deposition of materials forming the light-emitting elements. Variations in mask placement can affect the accuracy of deposition. Utility Model Content

[0004] One embodiment of this disclosure provides a mask manufacturing apparatus with improved manufacturing accuracy.

[0005] One embodiment of this disclosure provides a method for manufacturing a mask using a mask manufacturing apparatus.

[0006] A mask manufacturing apparatus according to an embodiment of the present disclosure includes: a table for supporting a mask frame; and a guide disposed on a side of the mask frame to restrict horizontal movement of the mask frame, and including a roller disposed at an end portion of the guide facing the mask frame.

[0007] In one embodiment, the roller may include a spherical caster.

[0008] In one embodiment, the mask frame may include a first side portion, a second side portion parallel to the first side portion, a third side portion intersecting both the first side portion and the second side portion, and a fourth side portion parallel to the third side portion, and the guide may include a first guide adjacent to the first side portion, a second guide adjacent to the second side portion, a third guide adjacent to the third side portion, and a fourth guide adjacent to the fourth side portion.

[0009] In one embodiment, the first guide and the second guide can restrict the movement of the mask frame in a first direction within a first predetermined gap, and the third guide and the fourth guide can restrict the movement of the mask frame in a second direction intersecting the first direction within a second predetermined gap.

[0010] In one embodiment, a plurality of air vents may be defined in the stage for guiding air to the mask frame and suspending the mask frame above the stage.

[0011] In one embodiment, the device may further include an alignment camera disposed above the platform.

[0012] In one embodiment, the alignment camera may be configured to check the alignment of the mask frame while the mask frame is suspended.

[0013] In one embodiment, a strip mask may be disposed on the mask frame, wherein the strip mask may include a patterned portion and a dummy portion, wherein a plurality of unit regions may be defined on the patterned portion, and the dummy portion surrounds the patterned portion.

[0014] A mask manufacturing apparatus according to one embodiment includes: a stage having a plurality of vents disposed in an edge portion of an upper surface of the stage; a plurality of guides configured to overlap with a plurality of sides of the stage and form a confining space above the stage; and a plurality of rollers disposed at end portions of the plurality of guides and facing the confining space.

[0015] In one embodiment, each of the plurality of rollers includes a spherical caster.

[0016] In one embodiment, an alignment camera may be positioned above the stage, wherein the alignment camera is configured to check the alignment of the mask frame while the mask frame is suspended within a confined space.

[0017] A method for manufacturing a mask according to an embodiment of the present disclosure includes: placing a mask frame on a stage in which an air hole is defined; suspending the mask frame above the stage by air leaving the air hole; and restricting horizontal movement of the mask frame by means of a guide disposed on a side of the mask frame and including a roller disposed at an end portion of the guide facing the side of the mask frame.

[0018] In one embodiment, the roller may include a spherical caster that rolls into contact with the mask frame.

[0019] In one embodiment, the mask frame may include a first side, a second side parallel to the first side, a third side intersecting both the first and second sides, and a fourth side parallel to the third side, and the guide may include a first guide adjacent to the first side, a second guide adjacent to the second side, a third guide adjacent to the third side, and a fourth guide adjacent to the fourth side, wherein the method may further include guiding air from a plurality of holes including the air holes defined in the stage to each of the first, second, third, and fourth sides of the mask frame.

[0020] In one embodiment, the method may further include: restricting the movement of the mask frame in a first direction within a first predetermined gap by means of the first guide and the second guide; and restricting the movement of the mask frame in a second direction intersecting the first direction within a second predetermined gap by means of the third guide and the fourth guide.

[0021] In one embodiment, the method may further include checking the alignment of the mask frame after suspending the mask frame above the stage.

[0022] In one embodiment, the alignment of the mask frame can be checked by an alignment camera, and the guide is configured such that the mask frame can be located within the imaging area of ​​the alignment camera.

[0023] In one embodiment, the method may further include: placing a strip mask on the mask frame after restricting the horizontal movement of the mask frame.

[0024] In one embodiment, the method may further include welding the strip mask to the mask frame after placing the strip mask on the mask frame.

[0025] In one embodiment, the position of the guide can be maintained after the strip mask is welded to the mask frame.

[0026] A mask manufacturing apparatus according to an embodiment of the present disclosure may include: a table on which a mask frame is disposed; and a guide disposed on a side of the mask frame, restricting horizontal movement of the mask frame, and including a roller disposed at an end portion of the guide facing the side of the mask frame. Since the movement of the mask frame can be restricted by the guide, the manufacturing accuracy of the mask can be improved. Furthermore, since the guide includes a roller, friction on the guide can be reduced or eliminated during alignment of the mask frame.

[0027] Furthermore, the vents can be confined within the stage, and the air exiting the vents can suspend the mask frame. When the mask frame is suspended above the stage, friction between the stage and the mask frame can be reduced or eliminated, and the impact on the flatness of the upper surface of the stage (i.e., the mounting surface) can be reduced or eliminated. Accordingly, the manufacturing accuracy of the mask can be improved, and cavitation that reduces the impact on flatness can be avoided in the mask frame.

[0028] Furthermore, since alignment is performed via a guide, the alignment of the mask frame can be checked while the mask frame is suspended. Consequently, the manufacturing accuracy of the mask is not degraded by the mask frame moving within or out of the imaging area of ​​the alignment camera.

[0029] A method for manufacturing a mask according to an embodiment of the present disclosure may include: placing a mask frame on a stage in which vents are defined; suspending the mask frame above the stage by air exiting the vents; and restricting horizontal movement of the mask frame by means of a guide disposed on a side of the mask frame and including a roller disposed at an end portion of the guide facing the side of the mask frame. When the mask frame is suspended above the stage, friction between the stage and the mask frame can be reduced or eliminated, the effect of the flatness of the upper surface of the stage can be reduced or eliminated, and cavitation for reducing the effect of flatness can be omitted from the mask frame. Furthermore, since the guide includes a roller, friction of the guide can be reduced or eliminated when aligning the mask frame.

[0030] Furthermore, the mask manufacturing method may further include checking the alignment of the mask frame after suspending it above the stage. The alignment of the mask frame can be checked by the alignment camera, and the guide can be configured such that the mask frame can be located within the imaging area of ​​the alignment camera. Accordingly, due to the mask frame, the manufacturing accuracy of the mask can be maintained, and the mask frame can move within or remain within the imaging area of ​​the alignment camera.

[0031] Furthermore, even after the strip mask is welded to the mask frame, the guide can continue to restrict the horizontal movement of the mask frame. Accordingly, the manufacturing accuracy of the mask can be maintained. Attached Figure Description

[0032] The accompanying drawings illustrate embodiments of the present disclosure and are included to provide a further understanding of the present invention together with the description of embodiments thereof.

[0033] Figure 1 This is a side view of a mask manufacturing apparatus according to an embodiment of the present disclosure.

[0034] Figure 2 for Figure 1 A magnified view of region A.

[0035] Figure 3 For example, including Figure 1 A view of a roller in a mask manufacturing apparatus according to one embodiment.

[0036] Figure 4 for Figure 1 A plan view of the mask manufacturing apparatus.

[0037] Figure 5 for Figure 4 A magnified view of region B.

[0038] Figure 6 Here is a view illustrating the effect of a mask manufacturing apparatus.

[0039] Figure 7 A view of an example deposition apparatus, through Figure 1 A mask manufactured by a mask manufacturing apparatus according to one embodiment is disposed in the deposition apparatus.

[0040] Figure 8 Example settings Figure 7 A view of the mask in the deposition apparatus.

[0041] Figure 9 For example, by Figure 7 A view of pixels created by a deposition device.

[0042] Figure 10 , Figure 11 , Figure 12 , Figure 13 and Figure 14 Example usage Figure 1 A view of a mask manufacturing method using a mask manufacturing apparatus. Detailed Implementation

[0043] The illustrative, non-limiting embodiments of this disclosure will become clearer from the following detailed description taken in conjunction with the accompanying drawings. The inventive concept can be implemented in various modifications and has various forms. However, it should be understood that the inventive concept is not intended to be limited to the specific forms disclosed, but rather, on the contrary, is intended to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the inventive concept. The same reference numerals or symbols always refer to the same elements.

[0044] In the accompanying drawings, the thickness, ratio, and size of the components may be enlarged to effectively depict the technical content.

[0045] Figure 1 This is a side view of a mask manufacturing apparatus according to an embodiment of the present disclosure. Figure 2 for Figure 1 A magnified view of region A. Figure 3 For example, including Figure 1 A view of a roller in a mask manufacturing apparatus according to one embodiment. Figure 4 for Figure 1 A plan view of the mask manufacturing apparatus. Figure 5 for Figure 4 A magnified view of region B.

[0046] refer to Figures 1 to 5 A mask manufacturing apparatus according to one embodiment may include a stage ST, a guide GU, and an alignment camera VI. The mask manufacturing apparatus can manufacture a mask MA. The mask MA can be used in a deposition process to form pixels included in a display device (e.g., Figure 9 The pixel PX). The deposition process can be on a substrate (e.g., Figure 9 The process of depositing material on a substrate (BS). The mask MA may include a pattern of holes that allows a portion of the deposited material to pass through the mask MA and be deposited on the substrate. This document will refer to... Figure 7 , Figure 8 and Figure 9 Provides a detailed description of the mask MA and the deposition process using the mask MA.

[0047] In one embodiment, the mask frame MF can be disposed on a stage ST. For example, the stage ST can be configured to support the mask frame MF. For example, the stage ST can have a mounting surface defined by a first direction and a second direction. For example, the second direction can intersect the first direction. The first direction (DR1) and the second direction (DR2) can form a plane, which can be a horizontal plane. The mask frame MF can be mounted on the mounting surface.

[0048] In one embodiment, such as Figure 4 As depicted, an vent AH can be defined within the stage ST. Air exiting the vent AH in the stage ST can provide a force that suspends the mask frame MF above the stage ST. For example, air can be guided in a third direction (DR3). The third direction can intersect both the first and second directions. For example, the third direction can be perpendicular to the first and second directions and can be a vertical direction.

[0049] In one embodiment, vents AH can be formed in the edge portion of the stage ST. Multiple vents AH can be formed in the edge portions of the long and short sides of the stage ST. The openings can be defined in the mask frame MF (see...). Figure 8 In the central part of the mask frame MF, air can pass through the opening. The vent AH can be confined to the edge portion of the stage ST that overlaps with the edge portion of the mask frame MF. The vent AH can be omitted from the area of ​​the stage ST that overlaps with the opening.

[0050] Air can provide force to space the mask frame MF from the stage ST in a third-order direction. For example, the mask frame MF can be suspended from the stage ST by air at a certain height (e.g., Figure 2 (H). For example, the mask frame MF can be floated upwards above the stage ST using the force of air.

[0051] In one embodiment, the ST may include an air supply system. For example, the air supply system may be an air pump (such as an air compressor or reciprocating pump) or a compressed air cylinder. The air supply system may supply airflow to the air vent AH. An air pipe may connect the ST and the air supply system. A controller may control at least one of the air flow rate or air discharge rate.

[0052] In one embodiment, a plurality of air vents AH can be disposed in the edge portion of the stage ST (e.g., the edge portion of the upper surface of the stage ST). For example, the plurality of air vents AH can be disposed in the edge portion of the stage ST at regular intervals. Accordingly, the air vents AH can uniformly supply air, and the mask frame MF can be suspended at a uniform height in the third direction.

[0053] During levitation (air-bearing), the mask frame MF may deviate from its intended position. For example, even if the first center of the stage ST and the second center of the mask frame MF are aligned at the first moment, they may subsequently become misaligned once the mask frame MF is levitation.

[0054] In one embodiment, the guide GU may be disposed on the side EP of the mask frame MF. The guide GU can compensate for positional errors of the mask frame MF. The guide GU can compensate for positional errors of the mask frame MF caused by levitation. For example, the guide GU can restrict the horizontal movement of the mask frame MF.

[0055] In one embodiment, the mask frame MF may have a rectangular shape. In another embodiment, the mask frame MF may include a first side EP1, a second side EP2, a third side EP3, and a fourth side EP4. The second side EP2 may be substantially parallel to the first side EP1. The third side EP3 may intersect the first side EP1 and the second side EP2. For example, the third side EP3 may be substantially perpendicular to the first side EP1 and the second side EP2. The fourth side EP4 may be substantially parallel to the third side EP3. For example, the fourth side EP4 may be perpendicular to the first side EP1 and the second side EP2.

[0056] In one embodiment, a plurality of guide GUs may be provided. In one embodiment, the plurality of guide GUs may include a first guide GU1, a second guide GU2, a third guide GU3, and a fourth guide GU4. The first guide GU1 may be adjacent to a first side EP1 of the mask frame MF. The second guide GU2 may be adjacent to a second side EP2 of the mask frame MF. The third guide GU3 may be adjacent to a third side EP3 of the mask frame MF. The fourth guide GU4 may be adjacent to a fourth side EP4 of the mask frame MF. For example, the plurality of guide GUs may include at least one guide GU provided at each side of the mask frame MF.

[0057] For example, such as Figure 4 As depicted, multiple guide members GU can be disposed at the side EP of the mask frame MF. For example, the first guide member GU1 and the fifth guide member GU5 can be disposed at the first side EP1 of the mask frame MF. The first guide member GU1 and the fifth guide member GU5 can be disposed on the opposite side of the first side EP1 of the mask frame MF. The second guide member GU2 and the sixth guide member GU6 can be disposed at the second side EP2 of the mask frame MF. The second guide member GU2 and the sixth guide member GU6 can be disposed on the opposite side of the second side EP2 of the mask frame MF. The seventh guide member GU7 and the third guide member GU3 can be disposed at the third side EP3 of the mask frame MF. The seventh guide member GU7 and the third guide member GU3 can be disposed on the opposite side of the third side EP3 of the mask frame MF. The fourth guide member GU4 and the eighth guide member GU8 can be disposed at the fourth side EP4 of the mask frame MF. The fourth guide GU4 and the eighth guide GU8 can be located on the opposite side of the fourth side EP4 of the mask frame MF.

[0058] In one embodiment, such as Figure 4 As depicted, multiple guide members GU can be disposed above and on the sides of the stage ST. For example, the first guide member GU1 and the fifth guide member GU5 can be disposed on the first side of the stage ST corresponding to the first side EP1 of the mask frame MF. The second guide member GU2 and the sixth guide member GU6 can be disposed on the second side of the stage ST corresponding to the second side EP2 of the mask frame MF. The seventh guide member GU7 and the third guide member GU3 can be disposed on the third side of the stage ST corresponding to the third side EP3 of the mask frame MF. The fourth guide member GU4 and the eighth guide member GU8 can be disposed on the fourth side of the stage ST corresponding to the fourth side EP4 of the mask frame MF. Parts of the guide members GU can overlap with the upper surface of the stage ST. The guide members GU can form a confinement space above the stage ST to restrict the horizontal movement of the mask frame MF.

[0059] However, this disclosure is not limited thereto. For example, three or more guide GUs may be provided on the side EP of the mask frame MF. As another example, one guide GU may be provided on the side EP of the mask frame MF. In yet another example, different numbers of guide GUs may be provided at different side EPs of the mask frame MF.

[0060] The guide GU can restrict the horizontal movement of the mask frame MF (e.g., movement in a first direction and / or movement in a second direction). In one embodiment, the first guide GU1 and the second guide GU2 can restrict the movement of the mask frame MF in the first direction, and the third guide GU3 and the fourth guide GU4 can restrict the movement of the mask frame MF in the second direction.

[0061] For example, the guide GU can restrict the horizontal movement of the mask frame MF (e.g., movement in a first direction and / or movement in a second direction) within a predetermined gap G. For example, as Figure 4 and Figure 5 As depicted, the fifth guide GU5 allows the mask frame MF1 to move within the first gap G1, and the fourth guide GU4 allows the mask frame MF to move within the second gap G2.

[0062] However, this disclosure is not limited thereto. For example, such as Figure 5 As depicted, the dimensions of the first gap G1 and the second gap G2 may be different; however, the dimensions of the first gap G2 and the second gap G1 may be the same.

[0063] Furthermore, the size of the gap G, which allows the mask frame MF to move via the guide GU, can be varied in various ways depending on, for example, the manufacturing precision of the mask MA.

[0064] For example, the first guide GU1 and the second guide GU2 can restrict the movement of the mask frame MF in the first direction within a predetermined gap, and the third guide GU3 and the fourth guide GU4 can restrict the movement of the mask frame MF in the second direction within a predetermined gap.

[0065] In one embodiment, the guide GU may include a friction-reducing device. The friction-reducing device may be disposed at the end portion of the guide GU facing the mask frame MF.

[0066] In one embodiment, the guide GU may include a roller RO. The roller RO may be disposed at the end portion of the guide GU facing the side of the mask frame MF and facing the confining space.

[0067] In one embodiment, the roller RO may include a spherical caster. For example, such as Figure 3As depicted, a spherical caster may include a housing HO, multiple bearings BE, a rotating body RT, and a cover CO. For example, a mounting groove may be defined in the housing HO. The mounting groove may be a semi-circular mounting groove. The rotating body RT may be received in the mounting groove. The multiple bearings BE may be disposed between the rotating body RT and the housing HO. The cover CO may be disposed at an opening in the housing HO. The cover CO may be disposed between the housing HO and the rotating body RT. The cover CO may prevent the rotating body RT and / or the multiple bearings BE from detaching from the housing HO. The cover CO may expose a portion of the rotating body RT to the opening in the housing HO. When the rotating body RT rotates, one or more of the multiple bearings BE may rotate within the housing HO, reducing the frictional resistance between the rotating body RT and the housing HO.

[0068] However, this disclosure is not limited thereto. For example, multiple bearings BE and / or caps CO may be omitted.

[0069] For example, rollers RO can include various components, and the structure of spherical casters can be modified in various ways.

[0070] In one embodiment, the friction reduction device may include an airflow device. The airflow device can use the pressure of an airflow to guide the airflow through the side EP of the mask frame MF in a non-contact manner to align the mask frame MF. Accordingly, friction caused by contact alignment can be reduced.

[0071] Refer again Figure 1 In one embodiment, the alignment camera VI may face the mask frame MF. In another embodiment, the alignment camera VI may be disposed on the mask frame MF. The alignment camera VI may be configured to capture an image of the mask frame MF. The alignment camera VI may use various methods to check the alignment of the mask frame MF. For example, the alignment camera VI may check the position of the mask frame MF relative to alignment marks disposed on the stage ST. In another example, the alignment camera VI may check the position of the mask frame MF relative to alignment marks disposed on the lens of the alignment camera VI. In yet another example, the alignment camera VI may use imaging software to check the position of the mask frame MF. However, the methods for checking the alignment of the mask frame MF according to embodiments of the present disclosure are not limited thereto.

[0072] In one embodiment, when the mask frame MF is suspended, the alignment camera VI can check the alignment (e.g., position coordinates or relative positioning) of the mask frame MF.

[0073] For example, the mask frame MF may include alignment marks. The alignment camera VI can check the alignment of the mask frame MF by capturing images of the alignment marks.

[0074] A mask manufacturing apparatus can be used to manufacture a mask MA. In one embodiment, the mask MA may include a mask frame MF and a strip mask SM.

[0075] In one embodiment, the strip mask SM can be disposed on the mask frame MF.

[0076] In one embodiment, the strip mask SM may include a patterned portion (e.g., Figure 8 The pattern portion 312). The pattern portion can define multiple cell regions CEL and dummy portions (e.g., Figure 8 The dummy portion 314). The dummy portion can be set to surround the pattern portion. See also [link / reference] in this document. Figure 8 Describe the patterned and hypothetical parts in detail.

[0077] A strip mask SM can be fixed to a mask frame MF. In one embodiment, a portion of the strip mask SM can be welded to the mask frame MF. For example, an end portion of the strip mask SM can be welded to the mask frame MF.

[0078] When a strip mask SM is attached to a mask frame MF, a portion of the strip mask SM may sag in the direction of gravity. When the strip mask SM is attached to the mask frame MF in a sagging state, the accuracy of the mask MA may decrease. To improve the accuracy of the mask MA, the strip mask SM can be attached to the mask frame MF while maintaining tension. In this case, the tension of the strip mask SM can be transmitted to the mask frame MF. When attaching the strip mask SM, the position of the mask frame MF may change due to the tension of the previously attached strip mask SM. In one embodiment, the positional change of the mask frame MF can be compensated for by suspending the mask frame MF and checking the alignment of the mask frame MF using an alignment camera VI. For example, the alignment of the mask frame MF can be checked before attaching each strip mask SM. For example, the mask frame MF can be suspended before attaching each strip mask SM.

[0079] When the mask frame MF is not suspended, residual tension may persist, which can be maintained by friction between the mask MA and the stage ST. If positional changes cannot be monitored, changes caused by tension may not be compensated for, potentially affecting the manufacturing accuracy of the mask MA.

[0080] According to one embodiment, the mask manufacturing apparatus can suspend the mask frame MF to reduce friction and substantially prevent residual tension.

[0081] When the mask frame MF is suspended, its position may shift, and it may move from the imaging area of ​​the aligned camera VI. To reduce or prevent this shift, a mask manufacturing apparatus according to one embodiment may include a guide GU. The guide GU can be configured taking into account the manufacturing tolerances of the mask frame MF and the imaging area of ​​the aligned camera VI.

[0082] When the mask frame MF moves while suspended, the mask frame MF may contact the guide GU. Friction may occur between the sides of the guide GU and the sides of the mask frame MF. This friction may exert tension on the mask frame MF, and this tension may affect the manufacturing accuracy of the mask MA. In one embodiment, a roller RO can reduce or eliminate friction between the mask frame MF and the guide GU, which can reduce or eliminate tension. For example, the roller RO may be included on the side of the guide GU. In one embodiment, the roller RO may include a spherical caster.

[0083] Figure 6 Here is a view illustrating the effect of a mask manufacturing apparatus.

[0084] refer to Figure 6 The mounting surface of the stage ST may be uneven. For example, the first mask M1 can be fixed to the mask frame MF at the first position C1 of the stage ST. Next, the second mask M2, whose center can be aligned with the second position C2 of the stage ST, can be fixed to the mask frame MF. The level of the first position C1 of the stage ST may be higher than the level of the second position C2 of the stage ST.

[0085] In the mask manufacturing apparatus according to the comparative embodiment, a strip mask can be set on a mask frame MF that contacts the stage ST, and then the strip mask is fixed to the mask frame. In this case, the first mask M1 can be manufactured at a higher level than the second mask M2, and tolerances in mask manufacturing may occur due to the difference in level.

[0086] Tolerances in mask manufacturing can affect deposition accuracy in deposition processes using masks. For example, as mask manufacturing tolerances increase, defects (e.g., dark spots, mixed colors, etc.) are more likely to occur in display devices. These defects can arise during the deposition of the deposition material, which may be deposited in areas where pixels are to be formed during the deposition process (e.g., Figure 9 The location outside the position of pixel PX).

[0087] According to embodiments of this disclosure, the strip mask SM can be disposed on the mask frame MF in a non-contact state, and the strip mask SM can be fixed on the mask frame MF. By reducing or eliminating contact with the mounting surface of the stage ST, the influence of the flatness of the mounting surface of the stage ST can be reduced or eliminated, and the tolerance of mask manufacturing can be reduced. In other words, since the mask frame MF is suspended above the stage ST, friction between the stage ST and the mask frame MF can be reduced or eliminated, and the influence of the flatness of the mounting surface of the stage ST can be eliminated.

[0088] In the case of the mask manufacturing apparatus according to the embodiment, the mask frame MF can be passed through an air hole (e.g., away from the stage ST) Figure 2 Air is suspended in the pores (AH). For example, the mask frame MF can omit the structure used to create cavitation therein (e.g., grooves formed on the lower surface of the mask frame MF). For example, the mask frame MF can have a substantially planar lower surface. In this case, the process of forming cavitation on the mask frame can be omitted, and manufacturing costs, time, etc., can be improved. In addition, changes caused by cavitation in the mask frame MF can be reduced or eliminated.

[0089] In the case of a mask manufacturing apparatus according to an embodiment of the present disclosure, such as Figure 1 As described, the mask manufacturing tolerance can be improved by using air leaving the stage ST to suspend the mask frame MF. Additionally, the mask manufacturing tolerance can be improved by restricting the horizontal degree of freedom of the mask frame MF by the guide GU. In other words, in the case of the mask manufacturing apparatus according to the embodiments of this disclosure, the manufacturing accuracy of the mask can be improved by reducing or eliminating contact with surrounding structures, and cavitation can be prevented from forming in the mask frame.

[0090] Figure 7 A view of an example deposition apparatus, through Figure 1 A mask manufactured by a mask manufacturing apparatus according to one embodiment is disposed in the deposition apparatus. Figure 8 Example settings Figure 7 A view of the mask in the deposition apparatus.

[0091] refer to Figure 7 and Figure 8 The deposition apparatus 1000 may include an electrostatic chuck 100, a mask unit 300, a deposition source 400, a cooling plate 600, and a magnetic plate 700 disposed in a vacuum chamber VC.

[0092] The vacuum chamber VC provides a hermetically sealed space, and the deposition conditions can be set to vacuum. The vacuum chamber VC may include a top surface, a bottom surface, and side surfaces. The bottom surface may face the top surface on a third-direction DR3. Each of the side surfaces may be perpendicularly connected to the top and bottom surfaces. At least one opening may be provided in the surface of the vacuum chamber VC. For example, the opening may be controlled by a gate or door that can be used to maintain the hermetically sealed space. The substrate SUB can enter and exit the vacuum chamber VC through the opening.

[0093] The electrostatic chuck 100 can be disposed inside the vacuum chamber VC. The drive unit can be disposed between the electrostatic chuck 100 and the inner wall of the vacuum chamber VC. The electrostatic chuck 100 can be moved in the third direction DR3 or in the opposite direction to DR3 by operation of the drive unit. For example, the electrostatic chuck 100 can be moved vertically by operation of the drive unit.

[0094] The electrostatic chuck 100 may include a housing and a plurality of electrodes disposed inside the housing. The electrodes may include a first electrode and a second electrode with different polarities. For example, the first electrode may have a positive polarity (+), and the second electrode may have a negative polarity (-).

[0095] The electrodes can be arranged alternately in the first direction DR1 and / or the second direction DR2. For example, the electrodes can be arranged alternately in the second direction DR2. Alternatively, the electrodes can be arranged alternately in the first direction DR1. Alternatively, the electrodes can be arranged diagonally (e.g., in directions intersecting the second direction DR2 and the third direction DR3).

[0096] The electrostatic chuck 100 can overlap with the substrate SUB in a planar view. The electrostatic chuck 100 can completely overlap with the substrate SUB in a planar view. Accordingly, while depositing the deposition material provided from the deposition source 400, it is possible to suppress or prevent the substrate SUB from drooping in the direction opposite to the third direction DR3.

[0097] The electrostatic chuck 100 can clamp or dechuck the substrate SUB using electrostatic force. The electrostatic chuck 100 can be a bipolar or unipolar electrostatic chuck. In the case of a bipolar electrostatic chuck 100, the chuck 100 may include multiple electrode plates. For example, the substrate SUB can be clamped by applying a voltage between two electrode plates. In the case of a unipolar electrostatic chuck 100, the chuck 100 may include one or more electrode plates. The substrate SUB can be clamped by applying a voltage between one or more electrode plates and the substrate SUB. After performing the deposition process, the electrostatic chuck 100 can dechuck the substrate SUB.

[0098] The electrostatic chuck 100 may have a multilayer structure. For example, the electrostatic chuck 100 may include a base layer, an insulating layer, and electrodes. The base layer may contain a material for providing a clamping surface capable of clamping or releasing the substrate SUB. For example, the base layer may contain ceramic, aluminum, titanium, stainless steel, alumina, yttrium oxide, or aluminum nitride. These example materials may be used alone or in combination with each other. The insulating layer may contain a material with high heat resistance and high chemical stability. For example, the insulating layer may contain yttrium oxide or alumina. When a voltage is applied to the electrodes, the substrate SUB can be clamped or released by the electrostatic chuck 100. However, the electrostatic chuck 100 according to embodiments of the present disclosure is not limited thereto.

[0099] The bracket 200 can be positioned between the electrostatic chuck 100 and the mask frame 320. The bracket 200 can fix the substrate SUB.

[0100] The first end of the support 200 can be connected to one side of the electrostatic chuck 100. Accordingly, the electrostatic chuck 100 and the support 200 can move simultaneously.

[0101] For example, the support 200 can move linearly in the direction of DR3 or in the opposite direction to DR3. However, the electrostatic chuck 100 according to embodiments of the present disclosure is not limited thereto. The support 200 may include an additional connecting portion, and the connecting portion may move linearly or rotationally.

[0102] The mask unit 300 can be disposed below the electrostatic chuck 100. For example, the mask unit 300 can be disposed below the support 200.

[0103] Figure 7 The mask unit 300 can be made of Figure 1 An embodiment of a mask MA manufactured by a mask manufacturing apparatus. In other words, Figure 1 The mask frame MF can correspond to Figure 8 The mask frame 320, and Figure 1 The strip mask SM can correspond to Figure 8 The strip mask 310.

[0104] The mask unit 300 may include a strip mask 310 and a mask frame 320. The mask unit 300 may be disposed below the electrostatic chuck 100. For example, the mask unit 300 may be disposed below the support 200.

[0105] In one embodiment, the strip mask 310 may include a patterned portion 312 and a dummy portion 314, wherein a plurality of unit regions may be defined on the patterned portion 312 (e.g., Figure 5 Multiple cell regions (CELs) are provided, with the dummy portion 314 positioned adjacent to the pattern portion 312. For example, the dummy portion 314 may surround the pattern portion 312.

[0106] Multiple holes may be formed in the patterned portion 312. The holes may be, for example, slits. Deposited material can be supplied to the substrate SUB through the holes. Cell regions may be spaced apart from each other. The cell regions may be arranged along one of the first direction DR1 and the second direction DR2, or they may be arranged in a matrix along the first direction DR1 and the second direction DR2. However, this disclosure is not limited thereto.

[0107] The mask frame 320 can be disposed below the electrostatic chuck 100. For example, the mask frame 320 can be disposed below the support 200.

[0108] In one embodiment, the strip mask 310 may be disposed on the mask frame 320. In another embodiment, the strip mask 310 may be disposed on the upper surface 322 of the mask frame 320. In yet another embodiment, the strip mask 310 may be fixed to the upper surface 322 of the mask frame 320. For example, the strip mask 310 may be welded to the mask frame 320.

[0109] An opening 324 may be disposed in the middle portion of the mask frame 320. The opening 324 may have a rectangular shape. The opening 324 in the mask frame 320 may define an edge portion of the mask frame 320. A strip mask 310 may be disposed on the mask frame 320 such that a hole formed on the strip mask 310 overlaps with the opening 324 formed in the mask frame 320 in the thickness direction (i.e., the third direction DR3) of the mask frame 320.

[0110] The mask frame 320 may contain metal. For example, the metal may include stainless steel, Invar alloy, nickel, or cobalt. These materials may be used alone or in combination with each other.

[0111] The deposition source 400 can be positioned below the mask unit 300.

[0112] The deposition source 400 can supply deposition material. The deposition source 400 may include a heating source and at least one nozzle for supplying deposition material.

[0113] The deposition source 400 can provide a deposition material to be deposited on the substrate SUB. According to one embodiment, the deposition material may include a metal, an organic material, or an inorganic material. For example, if the deposition material is an organic material, an organic material layer can be formed by a deposition process.

[0114] The deposited material may include an evaporable material or a sublimated material. When the deposited material is an evaporable material, a heating source may be positioned adjacent to the deposited material. The heating source can heat and evaporate the deposited material. In one embodiment, the heating source may be omitted.

[0115] The nozzle can be positioned above the deposited material. The nozzle can spray the deposited material onto DR3 in a third direction. At least one nozzle can be provided. In one embodiment, multiple nozzles can be provided. The nozzles can be spaced apart from each other in the first direction DR1 and / or the second direction DR2. The number, spacing, shape, etc., of the nozzles can vary depending on the deposited material.

[0116] A power supply 500 can be connected to the electrostatic chuck 100. For example, the power supply 500 can be connected to the electrodes of the electrostatic chuck 100. For example, the power supply 500 may include a first terminal defined as a positive electrode and a second terminal defined as a negative electrode. The first electrode can be connected to the first terminal such that the first electrode can have a positive polarity. The second electrode can be connected to the second terminal such that the second electrode can have a negative polarity. The electrostatic chuck 100 can receive voltage from the power supply 500 to generate electrostatic force.

[0117] The cooling plate 600 can be positioned above the electrostatic chuck 100. A drive unit can be positioned between the cooling plate 600 and the inner wall of the vacuum chamber VC. The cooling plate 600 can be moved in the third direction DR3 or the opposite direction to DR3 by operation of the drive unit. For example, the cooling plate 600 can be moved vertically by operation of the drive unit. The drive unit for the cooling plate 600 and the drive unit for the electrostatic chuck 100 can be provided separately. Accordingly, deposition quality degradation caused by vibration of the cooling plate 600 can be suppressed or prevented.

[0118] Cooling plate 600 may contain cooling materials. For example, cooling plate 600 may include a cooling gas. The cooling gas may be argon or hydrogen. These example materials may be used alone or in combination with each other. Cooling plate 600 may be driven independently to control the temperature of electrostatic chuck 100. The temperature of the entire area of ​​the clamping surface of electrostatic chuck 100 may be controlled to be uniform and constant, thereby reducing or preventing strain on the substrate SUB caused by temperature deviations.

[0119] A magnetic plate 700 can be disposed above a cooling plate 600. A drive unit can be disposed between the magnetic plate 700 and the inner wall of the vacuum chamber VC. The drive unit for the cooling plate 600 and the drive unit for the magnetic plate 700 can be the same device or separate devices. When the drive units for the cooling plate 600 and the magnetic plate 700 are separate devices, both drive units can be controlled simultaneously. In one embodiment, the drive units for the cooling plate 600 and the magnetic plate 700 can be controlled separately from each other. When the drive units for the magnetic plate 700 and the electrostatic chuck 100 are provided separately from each other, the degradation of deposition quality caused by vibration of the magnetic plate 700 can be reduced or prevented.

[0120] According to one embodiment, the support 200 may include a third connecting portion 260. The third connecting portion 260 may be rotatably movable, and the support 200 including the third connecting portion 260 and the substrate SUB may not overlap each other. For example, the third connecting portion 260 may be located offset from the substrate SUB. Accordingly, ineffective space (the portion of the substrate SUB overlapping with the support 200 in a plan view) may be eliminated, and the effective area of ​​the unit arrangement may be increased.

[0121] Figure 9 For example, by Figure 7 A view of pixels created by a deposition device.

[0122] refer to Figure 9 Pixel PX may include a substrate BS, a buffer layer BFR, a transistor TR, a gate insulating layer GI, an interlayer insulating layer ILD, a via insulating layer VIA, a light-emitting element EL, and a pixel defining layer PDL. The transistor may include an active layer ACT, a gate electrode GE, a source electrode SE, and a drain electrode DE. The light-emitting element EL may include a first electrode AE, a light-emitting layer EML, and a second electrode CE. Display area DA may include an emitting region PA and a non-emitting region NPA. At least a portion of the transistor TR and the light-emitting element EL may be disposed within the emitting region PA. The non-emitting region NPA may be adjacent to the emitting region PA in a plan view. For example, in a plan view, the non-emitting region NPA may surround the emitting region PA. Here, the plan view may refer to the view when viewed in a third-direction DR3.

[0123] The substrate BS may comprise glass, quartz, or plastic. In one embodiment, the substrate BS may be flexible, bendable, or rollable.

[0124] A buffer layer (BFR) can be disposed on a substrate (BS). The buffer layer (BFR) can contain an inorganic insulating material. For example, the buffer layer (BFR) can contain silicon oxide, silicon nitride, or silicon oxynitride. The buffer layer (BFR) can be used to suppress or block impurities, so that the active layer (ACT) of the transistor (TR) is not damaged by impurities diffusing from the substrate (BS).

[0125] The active layer ACT can be disposed on the buffer layer BFR. In one embodiment, the active layer ACT can include a silicon semiconductor. For example, the active layer ACT can include amorphous silicon or polycrystalline silicon. In another embodiment, the active layer ACT can include an oxide semiconductor. For example, the active layer ACT can include zinc oxide, zinc tin oxide, zinc indium oxide, indium oxide, titanium oxide, indium gallium zinc oxide, or indium zinc tin oxide.

[0126] A gate insulating layer GI can be disposed on the active layer ACT. The gate insulating layer GI can contain an inorganic insulating material. For example, the gate insulating layer GI can contain silicon oxide, silicon nitride, silicon oxynitride, titanium oxide, or tantalum oxide. The gate insulating layer GI can be used to electrically insulate the active layer ACT and the gate electrode GE from each other.

[0127] The gate electrode GE can be disposed on the gate insulating layer GI. The gate electrode GE can contain a conductive material. For example, the gate electrode GE can contain a metal, alloy, conductive metal oxide, or transparent conductive material. A gate signal can be applied to the gate electrode GE. The gate signal can turn the transistor TR on or off and adjust the conductivity of the active layer ACT.

[0128] An interlayer insulating layer (ILD) can be disposed on the gate electrode GE. The ILD can contain organic and / or inorganic insulating materials. The ILD can electrically insulate the source electrode SE and drain electrode DE from the gate electrode GE.

[0129] The source electrode SE and drain electrode DE can be disposed on the interlayer insulating layer ILD. Each of the source electrode SE and drain electrode DE can contain a conductive material. For example, each of the source electrode SE and drain electrode DE can contain a metal, alloy, conductive metal oxide, or transparent conductive material. Each of the source electrode SE and drain electrode DE can electrically contact the active layer ACT through contact holes passing through the interlayer insulating layer ILD and the gate insulating layer GI.

[0130] The via insulating layer VIA can be disposed on the source electrode SE and the drain electrode DE. The via insulating layer VIA can contain an organic insulating material. For example, the via insulating layer VIA can contain polyacrylic acid resin, polyimide resin, or acrylic resin. Accordingly, the top surface of the via insulating layer VIA can be substantially flat.

[0131] The first electrode AE ​​can be disposed on the through-hole insulating layer VIA. The first electrode AE ​​can contain a conductive material. For example, the first electrode AE ​​can contain a metal, alloy, conductive metal oxide, or transparent conductive material. The first electrode AE ​​can electrically contact the source electrode SE or drain electrode DE through a contact hole penetrating the through-hole insulating layer VIA. In one embodiment, the first electrode AE ​​can be referred to as the anode electrode.

[0132] A pixel defining layer (PDL) may be disposed on the first electrode AE. The PDL may comprise an organic insulating material. For example, the PDL may comprise a polyacrylamide compound or a polyimide compound. The PDL may separate the emitter region (PA) of each pixel (PX). The PDL may include pixel openings that expose the first electrode AE.

[0133] The light-emitting layer (EML) can be disposed on the first electrode AE ​​within the pixel aperture. The EML can contain an organic light-emitting material. In one embodiment, the EML can have a multilayer structure including various functional layers. In one embodiment, the EML can include at least one of a hole injection layer, a hole transport layer, an electron transport layer, and an electron injection layer.

[0134] The second electrode CE can be disposed on the light-emitting layer EML and can cover the pixel defining layer PDL. In one embodiment, the second electrode CE can be referred to as the cathode electrode.

[0135] In one embodiment, the light-emitting layer EML can be formed by depositing a deposition material onto the first electrode AE. In this case, a deposition apparatus (e.g., Figure 7 (Deposition apparatus 1000).

[0136] However, this disclosure is not limited thereto, and the layer formed by the deposited material is not limited, as long as the layer is formed by a deposition process. For example, the deposition process may include a sputtering process. The depositable layer may be a functional layer (such as a hole transport layer or an electron transport layer), or it may be a capping layer or encapsulation layer disposed on the second electrode CE. The deposited material may comprise organic and / or inorganic materials.

[0137] Figure 10 , Figure 11 , Figure 12 , Figure 13 and Figure 14 Example usage Figure 1 A view of an example mask manufacturing method using a mask manufacturing apparatus. In the following text, references to the above may be omitted or simplified. Figures 1 to 5 The description of the mask manufacturing apparatus overlaps with the description of the mask manufacturing apparatus.

[0138] refer to Figures 10 to 14 An example method for manufacturing a mask according to an embodiment of the present disclosure may include: placing a mask frame MF on a stage ST in which an air hole AH is defined (S100); suspending the mask frame MF above the stage ST by air leaving the air hole AH (S200); checking the alignment of the mask frame MF (S300); restricting the horizontal movement of the mask frame MF by a guide GU disposed on the side of the mask frame MF and including a roller RO at the end portion of the guide GU facing the side of the mask frame MF (S400); and placing a strip mask SM on the mask frame MF and fixing the strip mask SM to the mask frame MF (S500).

[0139] like Figure 10 and Figure 11As depicted, in one embodiment, the mask frame MF can be disposed on a stage ST in which an air hole AH is defined (S100), and the mask frame MF can be suspended above the stage ST by air leaving the air hole AH (S200).

[0140] When the mask frame MF is suspended above the stage ST, friction between the stage ST and the mask frame MF can be reduced or eliminated, and the effect of the flatness of the upper surface of the stage ST can be reduced or eliminated. Accordingly, the mask (e.g., Figure 1 The manufacturing precision of the mask (MA) is improved. Furthermore, by omitting cavitation from the mask frame (MF), the effect of the flatness of the mask frame (MF) can be reduced or eliminated.

[0141] like Figure 12 As depicted, in one embodiment, the alignment of the mask frame MF can be checked (S300). The alignment of the mask frame MF can be checked by the alignment camera VI, and the guide GU can be set so that the mask frame MF can be located within the imaging area R1 of the alignment camera VI.

[0142] Accordingly, the reduction in the manufacturing accuracy of the mask due to the movement of the mask frame MF within or from the imaging area R1 of the camera VI can be reduced or prevented.

[0143] like Figure 13 As depicted, in one embodiment, the horizontal movement of the mask frame MF can be restricted by a guide GU disposed on the side of the mask frame MF and including a roller RO (S400) at the end of the guide GU facing the side of the mask frame MF.

[0144] In one embodiment, as referenced Figure 3 As described, roller RO may include spherical casters.

[0145] In one embodiment, as referenced above Figure 4The mask frame MF described herein may include a first side portion EP1, a second side portion EP2 substantially parallel to the first side portion EP1, a third side portion EP3 intersecting the first side portion EP1 and the second side portion EP2, and a fourth side portion EP4 substantially parallel to the third side portion EP3. The guide member GU may include a first guide member GU1 adjacent to the first side portion EP1 of the mask frame MF, a second guide member GU2 adjacent to the second side portion EP2 of the mask frame MF, a third guide member GU3 adjacent to the third side portion EP3 of the mask frame MF, and a fourth guide member GU4 adjacent to the fourth side portion EP4 of the mask frame MF. In one embodiment, the first guide member GU1 and the second guide member GU2 may restrict movement of the mask frame MF in a first direction, and the third guide member GU3 and the fourth guide member GU may restrict movement of the mask frame MF in a second direction.

[0146] Since the guide GU includes the roller RO, friction between the guide GU and the mask frame MF can be reduced or eliminated when aligning the mask frame MF.

[0147] like Figure 14 As depicted, in one embodiment, the mask frame MF can be lowered onto the stage ST in an aligned state (e.g., by closing the air exiting the vent AH defined in the stage ST). A strip mask SM can be disposed on the mask frame MF, and the strip mask SM can be fixed to the mask frame MF (S500). For example, the strip mask SM can be welded to the mask frame MF. In one embodiment, even when the strip mask SM is fixed to the mask frame MF, the guide GU can continue to restrict the horizontal movement of the mask frame MF.

[0148] Accordingly, the movement of the mask frame can be restricted, and the manufacturing accuracy of the mask can be maintained.

[0149] According to one embodiment, the mask frame MF can be suspended, the guide GU can ensure alignment, the alignment camera VI can check the alignment, and the strip mask SM can be fixed to the mask frame MF. With reduced or eliminated friction between components, the process of suspending the mask frame MF and checking alignment can be reliably performed, and repetition of this process can be avoided. For example, alignment can be reliably maintained during the placement of the mask frame MF. Accordingly, if successful alignment is achieved in approximately one or two attempts for the strip mask SM, process time can be reduced.

[0150] Additionally, by (e.g., using air flotation in the vertical direction and rotating in the horizontal direction by roller RO) reducing the effects due to friction and the flatness of the platform ST (e.g., Figure 6The impact caused by the level difference of the ST (Station) can reduce the manufacturing differences or tolerances between different masks MA.

[0151] The mask manufacturing apparatus according to embodiments of the present invention can be applied to processes for manufacturing display devices, such as computers, laptops, mobile phones, smartphones, smart tablets, PMPs, PDAs, or MP3 players.

[0152] This disclosure should not be construed as limiting itself to the embodiments set forth herein. Rather, the embodiments are provided so that this disclosure will be exhaustive and complete, and will fully convey the concept of this disclosure to those skilled in the art.

[0153] Although the present invention has been specifically shown and described with reference to embodiments thereof, those skilled in the art will understand that various changes in form and detail may be made therein without departing from the spirit or scope of the invention as defined by the claims.

Claims

1. A mask manufacturing apparatus, characterized in that, The mask manufacturing apparatus includes: A platform for supporting the mask frame; and A guide, disposed on the side of the mask frame, restricts the horizontal movement of the mask frame, and includes a roller disposed at the end portion of the guide facing the mask frame.

2. The mask manufacturing apparatus according to claim 1, characterized in that, The roller includes spherical casters.

3. The mask manufacturing apparatus according to claim 1, characterized in that, The mask frame includes a first side portion, a second side portion parallel to the first side portion, a third side portion intersecting both the first side portion and the second side portion, and a fourth side portion parallel to the third side portion. The guide includes a first guide disposed adjacent to the first side, a second guide disposed adjacent to the second side, a third guide disposed adjacent to the third side, and a fourth guide disposed adjacent to the fourth side.

4. The mask manufacturing apparatus according to claim 3, characterized in that, The first guide and the second guide restrict the movement of the mask frame in the first direction within a first predetermined gap, and The third guide and the fourth guide restrict the movement of the mask frame in a second direction intersecting the first direction within a second predetermined gap.

5. The mask manufacturing apparatus according to claim 1, characterized in that, The mask manufacturing apparatus further includes a plurality of air holes defined in the stage for guiding air to the mask frame and for suspending the mask frame above the stage.

6. The mask manufacturing apparatus according to claim 5, characterized in that, The mask manufacturing apparatus further includes: A homing camera is positioned above the platform.

7. The mask manufacturing apparatus according to claim 6, characterized in that, The alignment camera is configured to check the alignment of the mask frame while the mask frame is suspended.

8. A mask manufacturing apparatus, characterized in that, The mask manufacturing apparatus includes: The platform has a plurality of air holes disposed in the edge portion of the upper surface of the platform; Multiple guides are configured to overlap with multiple sides of the stage and form a confined space above the stage; and Multiple rollers are disposed at the end portions of the multiple guides and facing the restricted space.

9. The mask manufacturing apparatus according to claim 8, characterized in that, Each of the plurality of rollers includes a spherical caster.

10. The mask manufacturing apparatus according to claim 8, characterized in that, The mask manufacturing apparatus further includes: A aligning camera positioned above the platform. The alignment camera is configured to check the alignment of the mask frame while the mask frame is suspended within the restricted space.

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