Solder ball purging device

Abstract

The utility model provides a solder ball purging device, which comprises a tool bit module, an air supply pipeline and a nozzle, and is characterized in that the tool bit module comprises a tool bit and is used for pushing off a to-be-processed solder ball on a wafer; the air supply pipeline is communicated with an air source; a fixed angle is formed between the nozzle and the tool bit, and the nozzle is fixedly connected with the air supply pipeline and used for blowing the solder balls pushed away by the tool bit away from the surface of the wafer. According to the solder ball purging device, by fixing the angle between the nozzle and the tool bit, intervention of manual operation is reduced, the risk that a wafer is blown away due to misoperation and the product damage rate are reduced, and the possibility that the wafer is scratched or broken is reduced; the solder ball purging device can provide consistent blowing angle and strength, and the stability and repeatability of the test process are improved; according to the solder ball purging device, the time of adjusting the angle and the force of the air gun by an operator in the testing process is shortened, and the testing efficiency is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the field of semiconductor package test equipment, specifically relates to a solder ball blowing device. BACKGROUND

[0002] In the field of semiconductor packaging and testing, the shear strength evaluation of solder balls or tin balls is a key step to ensure the reliability of semiconductor devices. Currently, the commonly used semiconductor test equipment stabilizes the wafer through the vacuum adsorption function of the platform to ensure the stability of the wafer during the test process and prevent displacement.

[0003] In actual operation, after using the semiconductor test equipment to push off the excess solder balls or tin balls, the operator needs to use a handheld air gun to blow these solder balls or tin balls to the edge outside of the wafer. This process requires the operator to accurately adjust the angle and force of the handheld air gun to ensure that the solder balls or tin balls can be effectively blown away from the wafer surface. However, due to the lack of protective devices around the platform that adsorbs the wafer, when the angle of the handheld air gun accidentally aims at the side of the wafer, the strong airflow may directly act on the wafer, causing the wafer to be blown away, which may damage the wafer and cause scratches or fragments. SUMMARY

[0004] In view of the above-mentioned defects and deficiencies in the prior art, the present application provides a solder ball blowing device. The solder ball blowing device reduces the risk of the wafer being blown away due to improper operation of the operator by fixing the angle between the nozzle and the tool bit, and reduces the possibility of wafer scratches or fragments.

[0005] An embodiment of the present application provides a solder ball blowing device, comprising:

[0006] A tool bit module, the tool bit module comprising a tool bit, the tool bit being used to push off the solder balls to be processed on the wafer;

[0007] A gas supply pipeline, the gas supply pipeline being in communication with a gas source;

[0008] A nozzle, the nozzle having a fixed angle with the tool bit, and the nozzle being fixedly connected with the gas supply pipeline, and being used to blow the solder balls pushed off by the tool bit away from the surface of the wafer.

[0009] As an implementation manner, the included angle between the nozzle and the tool bit is an acute angle.

[0010] As an implementation manner, the included angle between the nozzle and the tool bit is between 30° and 50°.

[0011] As an implementation manner, the tool bit module and the gas supply pipeline are both fixed on a base.

[0012] As an implementation form, the material of the gas supply pipeline is PVC.

[0013] As an implementation form, the material of the nozzle is metal.

[0014] As an implementation form, the gas source is a nitrogen source.

[0015] As an implementation form, a valve is arranged on the gas supply pipeline or the gas source.

[0016] As an implementation form, the diameter of the nozzle gradually decreases along the flow direction of the gas in the nozzle.

[0017] As an implementation form, a bearing table is arranged below the nozzle and the tool head module, the bearing table is used for bearing the wafer, and the bearing table bears the wafer through vacuum adsorption.

[0018] As described above, the solder ball blowing device has the following beneficial effects:

[0019] The solder ball blowing device fixes the angle between the nozzle and the tool head, reduces the intervention of human operation, reduces the risk of wafer being blown away and the product damage rate caused by operation errors, and reduces the possibility of wafer scratch or fragmentation. Since the angle between the nozzle and the tool head is fixed, the solder ball blowing device can provide consistent blowing angle and intensity, avoid unstable operation caused by human factors, and improve the stability and repeatability of the test process. The solder ball blowing device reduces the time of the operator adjusting the angle and intensity of the air gun during the test process, and improves the test efficiency. BRIEF DESCRIPTION OF DRAWINGS

[0020] Figure 1 A structure schematic diagram showing that a handheld air gun blows the solder ball away from the surface of the wafer in the prior art is shown.

[0021] Figure 2 A structure schematic diagram of the solder ball blowing device according to the embodiment of the present application is shown.

[0022] Element number explanation

[0023] 10, bearing platform; 20, wafer; 30, handheld air gun; 100, tool head module; 110, tool head; 200, gas supply pipeline; 300, nozzle; 400, valve. DETAILED DESCRIPTION

[0024] The embodiments of the present application will be described in detail with specific examples. Those skilled in the art can easily understand other advantages and functions of the present application from the content disclosed in the specification. The present application can also be implemented or applied in other different embodiments, and various modifications or changes can be made to the details in the specification without departing from the spirit of the present application.

[0025] Please refer to Figures 1 to 2 . It should be noted that the diagrams provided in the embodiments only schematically illustrate the basic concept of the present application, and only the components related to the present application are shown in the diagrams, not the number, shape and size of the components in actual implementation. The shape, number and proportion of the components in actual implementation can be arbitrarily changed, and the layout of the components can be more complex.

[0026] In the field of semiconductor packaging and testing, the shear strength evaluation of solder balls or tin balls is crucial to ensure the reliability of semiconductor devices. Currently, semiconductor test equipment generally uses vacuum suction function to stabilize the wafer to ensure stability during testing and prevent displacement of the wafer.

[0027] However, as Figure 1 shown, after using the semiconductor test equipment to push off the excess solder balls or tin balls, the operator needs to use the handheld air gun 30 to blow the pushed-off solder balls or tin balls outside the edge of the wafer 20. This process requires the operator to accurately adjust the angle and force of the handheld air cylinder 30 to ensure that the solder balls or tin balls can be effectively blown away from the surface of the wafer 20. However, due to the lack of protective devices around the load platform 10 that sucks the wafer 20, when the angle of the handheld air gun 30 accidentally points to the side of the wafer 20, the strong airflow may directly act on the wafer 20, causing the wafer 20 to be blown away. This situation can damage the wafer 20, causing scratches or fragments (as shown in Figure 1 ).

[0028] The existing semiconductor test equipment has certain risks during operation, especially during the process of blowing off the solder balls or tin balls using the handheld air gun 30. Due to the lack of effective protective measures, it may cause damage to the wafer.

[0029] To overcome the above defects, the present application provides a solder ball blowing device. The following embodiments will be described in detail.

[0030] The present embodiment provides a solder ball blowing device, as Figure 2 shown, which includes a tool bit module 100, a gas supply pipeline 200 and a nozzle 300.

[0031] The tool head module 100 includes a tool head 110 for pushing the solder balls to be processed on the wafer 20. The gas supply pipeline 200 is in communication with a gas source, and gas is introduced into the gas supply pipeline 200. The nozzle 300 is fixedly connected to the outlet of the gas supply pipeline 200, and the channel in the nozzle 300 is in communication with the channel in the gas supply pipeline 200, so that the gas in the gas supply pipeline 200 flows into the nozzle 300 and is sprayed out of the nozzle 300; the nozzle 300 and the tool head 110 have a fixed angle, so that the solder balls pushed off by the tool head 110 are blown away from the surface of the wafer 20 to the edge of the wafer 20.

[0032] The solder ball blowing device provided by the embodiment reduces the intervention of human operation, effectively reduces the risk of the wafer 20 being blown away due to operation errors, and thus reduces the damage rate of the wafer 20; since the angle between the nozzle 300 and the tool head 110 is fixed, a consistent blowing angle and force can be provided, avoiding unstable operation due to human factors, and thus reducing the possibility of the wafer 20 being scratched or fragmented; the fixed angle and force ensure the consistency of each blowing operation, improve stability and repeatability, and are crucial for ensuring the reliability of semiconductor devices; the solder ball blowing device can reduce damage to the wafer 20 during the blowing process and improve the quality and reliability of the wafer 20; the solder ball blowing device reduces the time for the operator to adjust the angle and force of the handheld air gun during the test process, simplifies the operation process, and improves efficiency; since the operation is simplified and the efficiency is improved, the dependence on the skills of the operator is reduced, the labor cost is reduced, and the time and resources required for training new operators are also reduced. The solder ball blowing device reduces wafer damage and interruptions during the test process due to operation errors, and improves overall production efficiency. The solder ball blowing device can adapt to different test environments and wafer sizes, enhancing the versatility and adaptability of the device.

[0033] In an optional embodiment, as shown in Figure 2 The angle between the nozzle 300 and the tool head 110 is an acute angle. Setting the angle between the nozzle 300 and the tool head 110 to be an acute angle helps the gas flow sprayed by the nozzle 300 to blow in the direction of blowing the solder balls away from the surface of the wafer 20, rather than directly aiming at the center or side of the wafer 20, which can more effectively blow the solder balls away from the surface of the wafer 20, while reducing the risk of the wafer 20 being blown away and the risk of scratching the wafer 20.

[0034] In an optional embodiment, the angle between the nozzle 300 and the tool head 110 is between 30° and 50°. Optionally, the angle between the nozzle 300 and the tool head 110 can be, for example, 30°, 35°, 40°, 45°, 50°, etc. By setting the angle between the nozzle 300 and the tool head 110 to be between 30° and 50°, the direction of the airflow can be accurately controlled, so that the airflow can more effectively blow the solder balls or the tin balls, while reducing the direct impact of the airflow on the wafer 20, reducing the displacement of the wafer 20 during the blowing process, and maintaining the stability of the wafer 20. The above angle helps to form a more uniform distribution of the airflow on the surface of the wafer 20, reduces the impact of the local airflow, and reduces the risk of damage to the wafer 20. At the same time, since the angle is fixed, the influence of human factors on the blowing effect is reduced, so that each blowing can achieve the expected effect, and the stability of the test process is improved.

[0035] In an optional embodiment, the tool head module 100 and the gas supply pipeline 200 are fixed on the base. By fixing the tool head module 100 and the gas supply pipeline 200 on the base, the positions of the tool head module 100 and the gas supply pipeline 200 can be relatively fixed, which can provide better stability, reduce vibration and displacement during operation, and at the same time, the relative fixation of the positions of the tool head module 100 and the gas supply pipeline 200 is conducive to keeping the angle between the tool head 110 and the nozzle 300 within the above specified range, reducing the error of adjusting the angle between the tool head 110 and the nozzle 300 by human, and reducing the time used for adjusting the angle between the tool head 110 and the nozzle 300, improving the convenience of operation. The fixed angle between the tool head 110 and the nozzle 300 is conducive to the nozzle 300 blowing the airflow to more effectively blow the solder balls or the tin balls, reduce the direct impact of the airflow on the wafer 20, maintain the stability of the wafer 20, reduce the risk of damage to the wafer 20, and reduce the risk of the wafer 20 being blown away.

[0036] In an optional embodiment, the material of the gas supply pipeline 200 is PVC. Since PVC has excellent corrosion resistance, it can resist the corrosion of various chemicals, maintain the stability and durability of the gas supply pipeline 200, and compared with the metal material of the gas supply pipeline 200, it can prolong the service life. The PVC material is usually lighter in weight than the metal material, which is convenient for installation. Moreover, PVC has good electrical insulation performance, which can ensure the safety of electrical insulation.

[0037] In an optional embodiment, the material of the nozzle 300 is metal. The strength of the metal material is usually higher, which can withstand greater pressure and impact, and can ensure the stability of the nozzle 300 under high load conditions.

[0038] In an optional embodiment, the gas source is a nitrogen source. Since nitrogen is a chemically inert gas, nitrogen cannot react with other substances, and using a nitrogen source can prevent the solder balls or the surface of the wafer 20 from being oxidized or otherwise chemically reacted, thereby protecting the quality and performance of the wafer 20. The inertness of nitrogen can prevent oxygen and moisture from coming into contact with the wafer 20, thereby reducing the risk of oxidation and contamination, which is crucial for maintaining the cleanliness of the surface of the wafer 20 and improving the yield.

[0039] In an optional embodiment, a valve 400 is provided on the gas supply pipeline 200 or on the gas source. By opening the valve 400, the solder balls on the surface of the wafer 20 can be blown away directly using the nozzle 300, which can save time and avoid the problem of wafer 20 breakage caused by the angle of the gas flow. A flow regulating valve can be provided near the valve 400 to control the flow rate and pressure of the gas in the gas supply pipeline 200, thereby controlling the blowing force of the nozzle 300, more effectively blowing away the solder balls, and at the same time, adjusting the impact force of the gas flow on the wafer 20 in the horizontal direction, reducing the displacement of the wafer 20 during the blowing process, and maintaining the stability of the wafer 20.

[0040] In an optional embodiment, the diameter of the nozzle 300 gradually decreases along the flow direction of the gas inside the nozzle 300. When the fluid passes through the nozzle 300 with gradually decreasing diameter, the flow rate will increase significantly. This design helps to increase the jet speed of the gas, which is very advantageous for the need of high-speed gas to blow away the solder balls on the surface of the wafer 20. Moreover, the nozzle 300 with gradually decreasing diameter can provide more concentrated gas flow, improving the accuracy and control ability of the jet, which is very important for accurately blowing away the solder balls without damaging the surface of the wafer 20. At the same time, inside the nozzle 300, the flow resistance of the fluid will decrease with the decrease of the flow cross-sectional area, reducing energy loss and facilitating the use of more energy to blow away the solder balls, thereby improving efficiency.

[0041] In an optional embodiment, as shown in Figure 2 A carrying table 10 is provided below the tool head module 100 and the nozzle 300, and the carrying table 10 is used to carry the wafer 20, and the wafer 20 is carried by vacuum suction. Using vacuum suction to carry the wafer 20 can provide stable suction force to ensure the stability of the wafer 20 during processing, and can be suitable for wafers 20 of different sizes and types, with high flexibility. Moreover, vacuum suction is a non-contact fixing method, which effectively avoids mechanical damage and contamination to the surface of the wafer 20.

[0042] The above embodiments only exemplarily illustrate the principles and effects of the present application, and are not used to limit the present application. Any person skilled in the art can modify or change the above embodiments without departing from the spirit and scope of the present application. Therefore, all equivalent modifications or changes completed by those skilled in the art without departing from the spirit and technical thought disclosed by the present application should be covered by the claims of the present application.

Claims

1. A solder ball blowing apparatus characterized by comprising: The utility model relates to a wafer ball pushing device, which comprises: a cutter head module, the cutter head module comprising a cutter head for pushing off the solder balls to be processed on a wafer; a gas supply pipeline in communication with a gas source; a nozzle having a fixed angle between the nozzle and the cutter head, and the nozzle is fixedly connected with the gas supply pipeline for blowing off the solder balls pushed off by the cutter head from the surface of the wafer. The included angle between the nozzle and the cutter head is an acute angle.

2. The solder ball sweeping device according to claim 1, characterized by The included angle between the nozzle and the cutter head is between 30° and 50°.

3. The solder ball blowing apparatus according to claim 1 or 2, characterized by The cutter head module and the gas supply pipeline are both fixed on a base.

4. The solder ball sweeping device according to claim 1, characterized by The material of the gas supply pipeline is PVC.

5. The solder ball sweeping device according to claim 1, wherein The material of the nozzle is metal.

6. The solder ball sweeping device according to claim 1, wherein The gas source is a nitrogen source.

7. The solder ball sweeping device according to claim 1, wherein A valve is arranged on the gas supply pipeline or the gas source.

8. The solder ball sweeping device according to claim 1, wherein The diameter of the nozzle gradually decreases along the flow direction of the gas in the nozzle.

9. The solder ball sweeping device according to claim 1, wherein A bearing table is arranged below the cutter head module and the nozzle, the bearing table is used for bearing the wafer, and the bearing table bears the wafer through vacuum adsorption.

10. The solder ball sweeping device according to claim 1, wherein ​

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