Vehicle-mounted sound equipment testing device

Abstract

The utility model relates to a vehicle-mounted sound equipment testing device, which belongs to the field of vehicle-mounted audio testing, and comprises an MCU (Microprogrammed Control Unit) module, which is used for coordinating the operation of each module in equipment and ensuring the ordered transmission of data streams, communicates with an A2B module through an I2C (Inter-Integrated Circuit) protocol, and performs audio data transmission and equipment state control with a PC (Personal Computer) through a USB (Universal Serial Bus) interface; the DSP module is used for receiving input signals from the optical fiber interface and the audio analog interface, processing the received audio signals and transmitting the processed signals to the A2B module and the MCU module; the FLASH memory is used for storing data required by equipment operation; and the CAN module is used for enabling the MCU module to communicate with a CAN / CAN-FD bus of the vehicle, receiving a vehicle control signal or sending debugging data to the vehicle. The system is suitable for the fields of vehicle-mounted audio debugging, audio testing and data communication, and can simultaneously acquire and synchronously process control signals and digital audio signals, thereby improving the debugging efficiency and reducing the development period.

Description

TECHNICAL FIELD

[0001] The utility model belongs to the field of vehicle-mounted audio frequency test, especially a kind of vehicle-mounted audio testing device. BACKGROUND

[0002] With the continuous development and complication of car audio system, car audio debugging and testing face more and more technical challenges. The existing car audio development scheme usually relies on algorithm simulation, embedded program tailoring and software compilation and other steps.

[0003] In the prior art, many car audio test devices can usually only complete a single function, such as analysis using CAN protocol or digital audio signal analysis. However, these devices cannot simultaneously perform synchronous acquisition and analysis of control signals and digital audio signals, resulting in difficulties in tracking and troubleshooting during debugging if the control signals and audio data streams are out of synchronization. This problem is particularly prominent in audio debugging, especially during vehicle tuning, where the timing synchronization between audio signals and control signals is very important.

[0004] In addition, the connection protocols between digital audio signals and power amplifiers in car audio systems are diverse, and devices that can support different protocols and have the function of controlling power amplifier output through CAN signals are required during debugging. Existing devices can usually only control digital audio signals or CAN signals individually, and different devices need to be used for connection and operation during debugging, which not only increases the complexity of the device, but also reduces the debugging efficiency.

[0005] Based on the above problems, a vehicle-mounted audio testing device is proposed. UTILITY MODEL CONTENT

[0006] The utility model aims to provide a kind of vehicle-mounted audio testing device, it is applicable to the field of vehicle-mounted audio debugging, audio frequency test and data communication, can simultaneously acquire and synchronously process control signal and digital audio signal, to improve the debugging efficiency and reduce development cycle further.

[0007] To solve the above technical problems, the utility model is realized by the following technical solutions:

[0008] A kind of vehicle-mounted audio testing device, the device includes:

[0009] MCU module is used to coordinate the operation of each module in the device, and ensure the orderly transmission of data stream, the MCU module is communicated with A2B module by I2C protocol, and is communicated with PC by USB interface for audio data transmission and device state (audio and CAN) control, is communicated with DSP chip for state switching by SPI protocol, is communicated with PC for audio data forwarding and transmits and receives CAN data by SAI interface.

[0010] DSP module, for receiving input signals from the optical fiber interface and the audio analog interface, processing the received audio signals, and transmitting the processed signals to the A2B module and the MCU module;

[0011] FLASH memory for storing data required for device operation;

[0012] CAN module for the MCU module to communicate with the CAN / CAN-FD bus of the vehicle, receive vehicle control signals or send debugging data to the vehicle.

[0013] The utility model has the beneficial effects that, compared with the prior art, the utility model has the beneficial effects that:

[0014] 1. It is suitable for vehicle audio debugging, audio testing and data communication fields, can simultaneously collect and synchronously process control signals and digital audio signals, thereby improving debugging efficiency and reducing development cycle;

[0015] 2. Through PC connection, audio signal input, processing and output can be conveniently performed, greatly improving the tuning efficiency and sound quality of the car audio system. The device supports multiple audio formats and interfaces, can be compatible with audio systems of different vehicles, provides personalized tuning solutions, and combines audio signals and CAN messages for power amplifier aging test, and has wide application prospects.

[0016] Of course, any product implementing the utility model does not necessarily need to achieve all the advantages described above at the same time. BRIEF DESCRIPTION OF DRAWINGS

[0017] Figure 1 is a structural diagram of the embodiment of the present disclosure;

[0018] Figure 2 is a circuit diagram of the MCU module of the embodiment of the present disclosure;

[0019] Figure 3 is a circuit diagram of the display module of the embodiment of the present disclosure;

[0020] Figure 4 is a Flash storage circuit diagram of the embodiment of the present disclosure. DETAILED DESCRIPTION

[0021] A vehicle audio testing device is a device for vehicle audio system debugging and testing. The device proposed by the present disclosure includes multiple modules, which synchronously collect, process vehicle audio signals, control signals and environmental noise and other factors, and are monitored and analyzed through a PC, thereby improving efficiency during development and debugging, reducing development cycle and labor cost.

[0022] Specifically, as Figure 1As shown, the device includes, MCU module (control unit), DSP module (digital signal processor), A2B module, FLASH memory, CAN module, fiber input interface, audio analog input interface, USB interface, display module;

[0023] The MCU module (control unit) is the core control center of the device, coordinates the operation of each module in the device, and ensures the orderly transmission of data flow.

[0024] The MCU module controls the DSP module, sends audio processing instructions and obtains processing status.

[0025] The MCU module communicates with the A2B module through the I2C protocol.

[0026] The MCU module is provided with a USB interface, which communicates with the PC through the USB interface, including audio data transmission and device state control, ensuring the time and data synchronization of the device and the PC.

[0027] In some embodiments, the USB interface includes the following;

[0028] USB digital sound card: PC as audio data source or audio data analysis terminal;

[0029] USB control and synchronization: realize the comprehensive control of PC to the device, and synchronize the time and CAN data.

[0030] The MCU module is provided with a CAN bus interface, and the CAN bus interface communicates with the CAN module; the CAN module communicates with the CAN / CAN-FD bus of the vehicle, receives the vehicle control signal or sends the debugging data to the vehicle.

[0031] The MCU module is connected with the display module, and the display module can be a display screen or an LED indicator,

[0032] The display module displays the current running state of the device by controlling the LED indicator or the display screen according to the input information of the MCU module.

[0033] FLASH memory, used for saving the data required for device running, the data can be DSP audio processing algorithm, MCU program code or configuration parameters, etc.;

[0034] The MCU module communicates with the FLASH memory to read or write the device firmware and the parameters required for running.

[0035] FLASH memory, high integration, supports multiple protocols, can provide flexible device control and data management functions.

[0036] DSP module (digital signal processor); for receiving input signals through fiber interface and audio analog interface, processing received audio signals, and converting processed audio signals into data format that can be transmitted through A2B bus.

[0037] It should be understood that the audio signal processing method includes but is not limited to audio filtering, mixing, equalization, gain control, noise generation and the like; the method is to generate single frequency point signals (1KHz, 3KHz, pink noise, white noise, etc.) through chip hardware, and process audio algorithms including but not limited to selection of various channel sound sources, audio channel mute, audio channel volume processing, EQ module processing and the like.

[0038] Further, in some disclosures, the DSP module is respectively provided with an interface for communication of the MCU module and the A2B module.

[0039] In this way, high-performance real-time audio processing can be realized, complex audio algorithms can be supported, and high-fidelity audio scenarios can be adapted.

[0040] The A2B module; high-speed transmission of audio signals through A2B bus, supporting multi-channel, high-fidelity audio communication.

[0041] Further, the A2B module is provided with A2B_A and A2B_B: which can be used for bidirectional communication respectively.

[0042] In this way, the problems in traditional audio communication can be reduced, and the connection structure can be simplified.

[0043] The device is suitable for vehicle audio debugging, audio testing and data communication field, and has powerful functions and clear module division.

[0044] In some specific embodiments, as shown in Figure 2 The specific model of the MCU module control chip is STM32F446VETx, and the specific settings are as follows:

[0045] The DSPI / O of the DSP module is set at the 3, 4 and 5 pins corresponding to the interface of the MCU module control chip.

[0046] The A2B I / O of the A2B module is set at the 38, 39 and 40 pins corresponding to the interface of the MCU module control chip.

[0047] The LCD SPI interface of the display module is set at the 42, 43, 44 and 45 pins corresponding to the communication interface of the MCU module control chip, and a 100Ω resistor is connected in the middle.

[0048] The CAN module is set at the 83, 84, 85, 86 and 87 pins corresponding to the communication interface of the MCU module control chip, and a 0Ω resistor is connected in the middle.

[0049] The SAI interface is located on pins 58, 59, and 60 of the MCU module control chip, with a 0Ω resistor connected in series between them.

[0050] The Power I / O interface is located on pin 62 of the MCU module control chip.

[0051] The SPI interface of the DSP module and the corresponding interface of the MCU module control chip are set at pins 29, 30, 31, and 32, and a 100Ω resistor is connected in series in between.

[0052] The SPI interface of the DSP module and the corresponding interface of the MCU module control chip are set at pins 29, 30, 31, and 32, and a 100Ω resistor is connected in series in between.

[0053] The I2C interface of the MCU module is located at pins 47, 51, 52, 53, 54, 15, and 16 of the MCU module control chip.

[0054] In some specific implementations, such as Figure 3 As shown, the display module communicates with the MCU using the MCU_SPI4_LCD_MOSI interface. The circuit includes basic power supply, reset, SPI signal connection, and backlight LED driving section.

[0055] In some specific implementations, such as Figure 4 As shown, the specific model of the Flash chip is W25Q128JVS1Q, and pins 1, 2, 3, 5, and 6 of the Flash chip are connected to pins 66, 79, 65, 80, and 78 of the MCU module control chip, respectively.

[0056] In the description of this specification, references to terms such as "an embodiment," "example," "specific example," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

Claims

1. A vehicle audio testing device, characterized in that, The device includes: The MCU module is used to coordinate the operation of various modules within the device and ensure the orderly transmission of data streams. The MCU module communicates with the A2B module via the I2C protocol, transmits audio data and controls the device status with the PC via the USB interface, switches states with the DSP module via the SPI protocol, forwards audio data via the SAI interface, and transmits and receives CAN data. The DSP module is used to receive input signals from the optical fiber interface and the audio analog interface, process the received audio signals, and transmit the processed signals to the A2B module and the MCU module. FLASH memory is used to store the data required for device operation; The CAN module is used for communication between the MCU module and the vehicle's CAN / CAN-FD bus to receive vehicle control signals or send debugging data to the vehicle.

2. The vehicle audio testing device according to claim 1, characterized in that, The device includes a display module for displaying the current operating status of the device, which may be a display screen or an LED indicator.

3. The vehicle audio testing device according to claim 1, characterized in that, The MCU module communicates with the PC via a USB interface, which includes a USB digital sound card interface and a USB control and synchronization interface.

4. The vehicle audio testing device according to claim 1, characterized in that, The MCU module and the display module communicate via an SPI interface.

5. The vehicle audio testing device according to claim 1, characterized in that, The A2B module includes the A2B_A and A2B_B interfaces.

6. The vehicle audio testing device according to claim 1, characterized in that, The control chip of the MCU module is an STM32F446VETx, and the MCU module includes SPI, I2C, CAN and USB interfaces.

7. The vehicle audio testing device according to claim 6, characterized in that, The pin settings of some of the control chips in the MCU module are as follows: The DSPI / O interface of the DSP module and the corresponding interface of the MCU module control chip are set at pins 3, 4, and 5; The A2B I / O interface of the A2B module and the corresponding interface of the MCU module control chip are set on pins 38, 39, and 40. The communication interface between the LCD module's SPI interface and the MCU module's control chip is located at pins 42, 43, 44, and 45, with a 100Ω resistor connected in series between them. The communication interfaces between the CAN module and the MCU module control chip are located at pins 83, 84, 85, 86, and 87, with a 0Ω resistor connected in series in between. The SAI interface is located on pins 58, 59, and 60 of the MCU module control chip, with a 0Ω resistor connected in series in between. The Power I / O interface is located on pin 62 of the MCU module control chip; The DSP module's SPI interface and the corresponding interface of the MCU module's control chip are located at pins 29, 30, 31, and 32, with a 100Ω resistor connected in series between them. The I2C interface of the MCU module is located at pins 47, 51, 52, 53, 54, 15, and 16 of the MCU module control chip.

8. The vehicle audio testing device according to claim 6, characterized in that, The specific model of the Flash chip is W25Q128JVS1Q. Pins 1, 2, 3, 5, and 6 of the Flash chip are connected to pins 66, 79, 65, 80, and 78 of the MCU module control chip, respectively.

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