Liquid cooling inversion inductor

Abstract

The utility model relates to a liquid cooling inversion inductor which comprises a liquid cooling shell and an inductor body. The liquid cooling shell comprises a shell body and end covers on the two sides, the shell body is of a U-shaped section structure, a plurality of flow channels penetrating in the length direction are formed in the shell body, the interior of each end cover is of a hollow structure, openings communicated with the flow channels are formed in the inner wall of each end cover, and water nozzles are arranged on the end covers to serve as a water inlet and a water outlet. The shell main body guides the cooling liquid to the periphery of the inductor body through the internal flow channel, so that uniform heat dissipation is realized; the communication structure of the end cover and the flow channel ensures smooth circulation of the cooling liquid; the plurality of ceramic chip groups are arranged between the adjacent inductor bodies and are used for limiting the positions of the inductor bodies; the epoxy plates are arranged on the periphery in the liquid cooling shell and used for heat insulation and insulation. The inductor body comprises a coil, a magnetic core and a baffle plate, is arranged in the U-shaped space of the liquid cooling shell, and is fixed and insulated through a plurality of ceramic chip groups and an epoxy plate. The inductor assembly solves the technical problem that in the prior art, an inductor assembly is low in heat dissipation efficiency.

Description

Technical Field

[0001] This application belongs to the field of inductor component design technology, and particularly relates to a liquid-cooled inverter inductor. Background Technology

[0002] In power electronic equipment, reactors and inductors are core components, primarily used for energy conversion and storage. However, with the rapid development of power technology and the increasing demand for high-performance and high-reliability equipment in various applications, traditional heat dissipation methods for reactors / inductors are facing severe challenges. Existing technologies typically employ air-cooled or self-cooled heat dissipation structures, which can reduce equipment temperature to some extent, but their heat dissipation efficiency is no longer sufficient for high-power, high-temperature operating environments.

[0003] Specifically, the main problems with existing reactor / inductor component heat dissipation technologies include:

[0004] Limited heat dissipation efficiency: As equipment power increases, the heat loss of reactor / inductor components increases significantly, especially with increased switching frequency and expanded power system capacity. Air cooling and self-cooling methods are limited by heat dissipation area and cooling air velocity, making it difficult to quickly and efficiently dissipate heat to the external environment under high power conditions, resulting in excessive temperature rise, with the highest temperature reaching 125℃, close to the upper limit of insulation class H.

[0005] Size and structural limitations: Modern converter cabinet designs tend towards miniaturization and compactness, but reactor / inductor components, as high-heat-generating elements, coexist with other equipment (such as IGBT power modules) in the same cabinet. The high-temperature environment not only restricts the overall layout of the converter cabinet but may also negatively impact the performance and reliability of precision components such as IGBTs due to insufficient heat dissipation.

[0006] Decreased reliability: As power and size increase, the cooling effect of existing air-cooled heat dissipation methods gradually weakens. Meanwhile, reactor / inductor components are in a high-temperature environment for a long time, which may lead to material aging, performance degradation, or even failure, making it difficult to meet the requirements of modern electrical equipment for high reliability and high efficiency. Utility Model Content

[0007] To address the shortcomings of existing technologies, this invention provides a liquid-cooled inverter inductor, solving the technical problem of low heat dissipation efficiency of inductor components in the prior art.

[0008] In one possible implementation, a liquid-cooled inverter inductor is provided, comprising: a liquid-cooled housing, the liquid-cooled housing including a housing body and two end caps; the housing body has a U-shaped cross-section, and the two end caps are disposed at both ends of the opening of the U-shaped structure; the housing body has multiple flow channels running along the length of the U-shaped housing body, the flow channels being arranged along the side walls and bottom of the housing body; the two end caps are fixedly connected to both ends of the housing body, the end caps having a hollow structure inside, and the inner wall of the end caps having openings communicating with the flow channels of the housing body; each of the two end caps is provided with a water nozzle, the water nozzles being connected to the hollow structure... The end caps are internally connected, with two water inlets and outlets respectively; the inductor body, consisting of two or more sets, is placed within the U-shaped space of the liquid-cooled housing. The inductor body includes a coil, a magnetic core, and a baffle. The coil is sleeved on the magnetic core, and the baffle is sleeved on the magnetic core at both ends of the coil; multiple ceramic plate groups are set at the bottom of the liquid-cooled housing between two adjacent inductor bodies. The magnetic core ends of the inductor body are placed on each ceramic plate group, and the ceramic plate groups and the liquid-cooled housing define the position of the inductor body; an epoxy board is set around the inside of the liquid-cooled housing, between the inductor body and the liquid-cooled housing.

[0009] In one possible implementation, the ceramic plate assembly is also disposed between the inductor body at both ends and the liquid-cooled housing.

[0010] In one possible implementation, the end cap is connected to the outer casing body by vacuum brazing.

[0011] In one possible implementation, a filter screen is provided on the opening in the inner wall of the end cap.

[0012] In one possible implementation, the ceramic sheet assembly comprises multiple stacked ceramic sheets with thermally conductive adhesive applied between adjacent ceramic sheets.

[0013] In one possible implementation, the inner sidewalls of the end cap and the outer casing body are provided with a grooved structure.

[0014] In one possible implementation, the trench structure is a parallel trench or a grid-like trench, with a trench width of 0.5 mm to 3 mm and a trench depth of 0.5 mm to 2 mm.

[0015] In one possible implementation, a ceramic sheet is placed in the gap between two adjacent magnetic cores.

[0016] Based on the above technical solution, the liquid-cooled inverter inductor of this utility model connects the end cap and the flow channel in the liquid-cooled housing. The water inlet and outlet are controlled by the water nozzle on the end cap, completing the fluid circulation inside the liquid-cooled housing and achieving heat dissipation for the inductor body. The arrangement of the ceramic plate group limits the position of the inductor body and the heat conduction of the inductor body, increasing heat conduction and enhancing structural stability. The vacuum brazing connection between the end cap and the housing body improves the sealing performance and reliability of the component. By setting a filter screen at the opening in the inner wall of the end cap, the flow effect of the coolant is optimized and impurities are prevented from entering, achieving efficient heat dissipation and reliable operation of the liquid-cooled inverter inductor. Attached Figure Description

[0017] The accompanying drawings, which are included to provide a further understanding of the present invention and form part of this application, illustrate exemplary embodiments of the present invention and, together with the description thereof, serve to explain the present invention and do not constitute an undue limitation thereof. In the drawings:

[0018] Figure 1 This is a schematic diagram of the structure of a liquid-cooled inverter inductor according to one embodiment of the present invention;

[0019] Figure 2 This is a schematic diagram of the structure of the liquid-cooled outer shell end cap according to one embodiment of the present invention;

[0020] Figure 3 This is a schematic diagram of the structure of the liquid-cooled outer shell end cap according to another embodiment of the present invention;

[0021] Figure 4 This is a schematic diagram of the structure of the liquid-cooled outer shell body according to one embodiment of the present invention;

[0022] Figure 5 This is a schematic diagram of the structure of the liquid-cooled outer shell body according to another embodiment of the present invention;

[0023] Figure 6 This is a three-dimensional structural schematic diagram of a liquid-cooled inverter inductor according to one embodiment of the present invention.

[0024] Figure 7 This is a schematic diagram of the overall structure of the liquid-cooled housing according to one embodiment of the present invention;

[0025] Figure 8 This is a schematic diagram of the inductor assembly of a liquid-cooled inverter inductor according to one embodiment of the present invention.

[0026] In the picture:

[0027] 10. Liquid-cooled housing; 11. Housing body; 12. End cap; 13. Flow channel; 14. Water nozzle; 15. Opening; 20. Inductor body; 21. Coil; 22. Magnetic core; 23. Baffle; 30. Ceramic plate assembly; 31. Ceramic plate; 32. Thermally conductive adhesive; 40. Epoxy board; 50. Filter screen; 60. Groove structure. Detailed Implementation

[0028] The technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0029] In the description of this application, it should be understood that the terms "center", "lateral", "longitudinal", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0030] The terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first," "second," or "third" may explicitly or implicitly include one or more of that feature.

[0031] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0032] To address the technical problem of low heat dissipation efficiency of inductor components in the prior art, this application provides a liquid-cooled inverter inductor.

[0033] See Figure 6 In one possible implementation, a liquid-cooled inverter inductor is provided, comprising a liquid-cooled housing 10, an inductor body 20, a plurality of ceramic plate groups 30, and an epoxy board 40; wherein:

[0034] See Figure 1 , Figure 2 , Figure 3 , Figure 4 and Figure 5 The liquid-cooled housing 10 includes a housing body 11 and two end caps 12 on both sides. The housing body 11 has a U-shaped cross-section, and the two end caps 12 are located at both ends of the opening 15 of the U-shaped structure. The housing body 11 has multiple flow channels 13 that run through the length of the U-shaped housing body. The flow channels 13 are arranged along the side walls and bottom of the housing body 11.

[0035] Two end caps 12 are fixedly connected to both ends of the outer shell body 11. The interior is hollow and the inner wall is provided with an opening 15 that communicates with the flow channel 13 of the outer shell body 11. Water nozzles 14 are provided on the two end caps 12 respectively, which are connected to the interior of the end caps 12 and serve as water inlet and water outlet respectively.

[0036] See Figure 8 Two or more inductor bodies 20 are provided and placed in the U-shaped space of the liquid-cooled housing 10. The inductor body 20 includes a coil 21, a magnetic core 22 and a baffle 23. The coil 21 is sleeved on the magnetic core 22 and the baffle 23 is sleeved on both ends of the coil 21.

[0037] See Figure 7 Multiple ceramic plate groups 30 are disposed at the bottom of the liquid-cooled housing 10 between two adjacent inductor bodies 20, and the magnetic core 22 of the inductor body 20 is placed on each ceramic plate group 30 at both ends to define the position of the inductor body 20.

[0038] The epoxy board 40 is disposed around the inside of the liquid-cooled housing 10, between the inductor body 20 and the liquid-cooled housing 10, to isolate the inductor body and the inner cavity of the liquid-cooled housing and ensure insulation distance.

[0039] The internal perforation of the end cap 12 is connected to the flow channel inside the outer shell 11 through the opening 15. Water enters and exits through the water nozzle, forming a continuous liquid circulation loop. The liquid-cooled outer shell 10 carries away the heat generated by the inductor body 20 during operation through the coolant circulation in the flow channel 13, ensuring the temperature stability of the component. The ceramic plate group 30 provides insulation and heat conduction path, transferring heat from the inductor body 20 to the liquid-cooled outer shell 10, achieving efficient heat dissipation. The epoxy board 40 provides electrical insulation between the inductor body 20 and the outer shell.

[0040] This implementation achieves efficient heat dissipation of the inductor component through the circulation channel formed by the flow channel 13 of the liquid-cooled housing 10 and the internal hollow and opening 15 of the end cap; the ceramic plate group 30 effectively enhances the thermal conductivity and ensures the positional stability of the inductor body 20; the epoxy board 40 improves the insulation and durability of the component, enabling it to operate reliably in high-power scenarios.

[0041] The ceramic sheet assembly 30 can be made of materials with different thermal conductivity, such as aluminum nitride ceramic. The epoxy board 40 can be replaced with other materials with insulating properties, such as polymer insulating sheets, to meet special environmental requirements.

[0042] In one possible implementation, the ceramic plate assembly 30 is also disposed between the inductor body 20 at both ends and the liquid-cooled housing 10.

[0043] The further arrangement of the ceramic plate group 30 expands the support range of the inductor body 20, ensuring the stability of the inductor body 20 in all directions, while enhancing the heat dissipation effect and evenly distributing the heat of the inductor body 20 during operation.

[0044] By adding ceramic plate groups 30 at both ends, the fixing effect of the inductor body 20 is improved, making its positioning in the liquid cooling housing 10 more accurate and optimizing the heat dissipation path.

[0045] The size and shape of the ceramic plate assemblies 30 at both ends can be adjusted according to the size of the inductor body 20 to meet the needs of different structures.

[0046] In one possible implementation, the end cap 12 is connected to the outer casing 11 by vacuum brazing.

[0047] Vacuum brazing involves heating metal components at high temperatures in a vacuum environment, causing brazing filler metal to fill the contact surfaces between the end cap 12 and the outer shell body 11, forming a strong metal connection. This method ensures that the joint is free of air bubbles or voids, improving the structure's sealing performance and pressure resistance.

[0048] Vacuum brazing provides excellent sealing performance, preventing coolant leakage, while improving the durability and vibration resistance of components, making it suitable for liquid-cooled inverter inductors in high-intensity operating environments.

[0049] Other high-strength connection methods, such as laser welding or electron beam welding, can also be used to connect the end cap 12 to the outer shell body 11, but it is necessary to ensure that its sealing and mechanical strength meet the usage requirements.

[0050] In one possible implementation, a filter screen 50 is provided on the opening 15 on the inner wall of the end cap 12.

[0051] The filter screen 50 is installed at the opening 15 on the inner wall of the end cover 12 to filter impurities in the coolant, preventing them from entering the flow channel 13 and potentially clogging the flow channel or affecting the cooling effect.

[0052] By setting up the filter screen 50, the flow channel 13 can be effectively kept clear, the service life of the liquid-cooled inverter inductor can be extended, and the maintenance frequency can be reduced.

[0053] The material of filter screen 50 can be stainless steel mesh, polymer mesh or other corrosion-resistant materials, and its pore size can be adjusted according to the cleanliness of the coolant.

[0054] In one possible implementation, the ceramic sheet assembly 30 includes a plurality of stacked ceramic sheets 31, with thermally conductive adhesive 32 applied between adjacent ceramic sheets 31.

[0055] By stacking ceramic sheets 31 and applying thermally conductive adhesive 32, an efficient heat conduction path is formed. The thermally conductive adhesive 32 fills the gaps between the ceramic sheets 31, improving the heat conduction efficiency while ensuring the structural stability of the ceramic sheet assembly 30.

[0056] The above solution effectively improves the thermal conductivity of the ceramic plate assembly 30 while ensuring its mechanical stability. The use of thermally conductive adhesive 32 further optimizes heat transfer efficiency, making it suitable for scenarios involving long-term high-load operation.

[0057] In one possible implementation, the inner sidewalls of the end cap 12 and the outer casing 11 are provided with a groove structure 60.

[0058] The inductor body 20 and the liquid-cooled housing 10 are finally filled with potting compound to achieve stable installation; the groove structure 60 is formed on the inner wall of the end cap 12 and the housing body 11 to increase the turbulence during the flow of coolant, thereby improving heat exchange efficiency.

[0059] By setting the groove structure 60, the heat exchange efficiency of the coolant is effectively improved, and the heat dissipation performance of the liquid-cooled inverter inductor is optimized.

[0060] In one possible implementation, the groove structure 60 is a parallel groove or a grid-like groove with a groove width of 0.5 mm to 3 mm and a groove depth of 0.5 mm to 2 mm.

[0061] In one possible implementation, a ceramic sheet 31 is placed in the gap between two adjacent magnetic cores 22.

[0062] The ceramic sheet 31 fills the gap between two adjacent magnetic cores 22 to provide an additional heat dissipation path, while also enhancing the electrical insulation between the magnetic cores 22 and preventing electrical interference between the magnetic cores.

[0063] By adding ceramic plates 31 between the magnetic cores 22, the heat dissipation performance and electrical isolation effect of the component are improved, thereby enhancing the operational reliability and safety of the liquid-cooled inverter inductor.

[0064] The ceramic sheet 31 can be replaced with other highly thermally conductive insulating materials, such as boron nitride or aluminum oxide, to optimize heat dissipation and insulation performance.

[0065] The liquid-cooled inverter inductor of this utility model is described in detail below;

[0066] Existing reactors use air-cooled or self-cooled heat dissipation methods. As power increases, the power and size of reactors used in converters also increase. Since reactors are heat-generating components, H-class insulation reactors can experience a maximum temperature rise of 125 degrees Celsius. Converter cabinet designs are increasingly trending towards smaller, more compact sizes. When IGBT (Insulated Gate Bipolar Transistor) power modules and reactors are housed in the same cabinet, the high-heat-generating reactors significantly impact the reliable operation of the IGBT power modules.

[0067] Existing reactors employ air-cooling structures to cool them under high-temperature operating conditions, which provides some heat dissipation. However, with the rapid development of power technology and the increasing demands for high-performance and high-reliability electrical systems in power equipment, the losses of reactors and other distribution components inevitably rise due to the continuous increase in power system capacity and switching frequency. Furthermore, reactor frequency converters are evolving towards larger capacity control, higher reliability, and miniaturization. Therefore, controlling the reactor temperature without significantly increasing its size has become a crucial step. Air-cooled reactors are increasingly unable to meet the heat dissipation requirements for high power applications. To address this, a liquid-cooled inductor is proposed to reduce product temperature rise and decrease product size.

[0068] The products include liquid-cooled housings, inductors, potting compounds, and ceramic plates. The inductor body consists of a coil, magnetic core, and baffle. Figure 8 As can be seen, the coil leads are bent to concentrate the two leads in one area, reducing the opening of the mounting components. The liquid cooling system consists of a central outer shell and end caps on both sides. Flow channels are located in the left, right, and bottom cavities of the main body, and corresponding openings are present on the side walls of the end caps. The end caps are hollow inside, with a water nozzle welded to the wall. The two end caps are vacuum-brazed to the outer shell, forming a complete liquid-cooled outer shell. The heat sink carries away the heat generated by the inductor through the two water nozzles. Simultaneously, four protrusions inside the shell form three small cavities for placing and limiting the inductors. Ceramic plates are placed between each pair of inductors to effectively dissipate heat from the magnetic core, preventing heat accumulation. Several green epoxy boards are affixed around the inside of the shell to isolate the inductors and prevent direct contact between the inductors and the shell, which could lead to poor withstand voltage.

[0069] Finally, it should be noted that the various embodiments in this specification are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.

[0070] The above embodiments are only used to illustrate the technical solutions of this application and not to limit them; although this application has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications can still be made to the specific implementation of this application or equivalent substitutions can be made to some technical features without departing from the spirit of the technical solutions of this application, and all such modifications and substitutions should be covered within the scope of the technical solutions claimed in this application.

Claims

1. A liquid-cooled inverter inductor, characterized in that, include: The liquid-cooled housing (10) includes a housing body (11) and two end caps (12) on both sides; the housing body (11) has a U-shaped cross-section, and the two end caps (12) are located at both ends of the opening (15) of the U-shaped structure; The outer shell body (11) is provided with multiple flow channels (13) that run through the length of the U-shaped outer shell body. The flow channels (13) are arranged along the side wall and bottom of the outer shell body (11). Two end caps (12) are fixedly connected to both ends of the outer shell body (11). The inside of the end caps (12) is a hollow structure, and the inner wall of the end caps (12) is provided with an opening (15) that communicates with the flow channel (13) of the outer shell body (11). Water nozzles (14) are provided on the two end caps (12), and the water nozzles (14) are connected to the interior of the hollow end caps (12). The two water nozzles (14) are the water inlet and the water outlet, respectively. The inductor body (20) is provided in two or more sets and placed in the U-shaped space of the liquid-cooled shell (10). The inductor body (20) includes a coil (21), a magnetic core (22) and a baffle (23). The coil (21) is sleeved outside the magnetic core (22), and the baffle (23) is sleeved on both ends of the coil (21) on the magnetic core (22). Multiple ceramic plate groups (30) are disposed at the bottom of the liquid-cooled housing (10) between two adjacent inductor bodies (20). The magnetic core (22) of the inductor body (20) is placed on each ceramic plate group (30) at both ends. The ceramic plate groups (30) and the liquid-cooled housing (10) define the position of the inductor body (20). An epoxy board (40) is disposed around the inside of the liquid-cooled housing (10) and positioned between the inductor body (20) and the liquid-cooled housing (10).

2. The liquid-cooled inverter inductor according to claim 1, characterized in that, The ceramic plate assembly (30) is also disposed between the inductor body (20) at both ends and the liquid cooling shell (10).

3. The liquid-cooled inverter inductor according to claim 1 or 2, characterized in that, The end cap (12) is connected to the outer shell body (11) by vacuum brazing.

4. The liquid-cooled inverter inductor according to claim 3, characterized in that, A filter screen (50) is provided on the opening (15) on the inner wall of the end cap (12).

5. The liquid-cooled inverter inductor according to any one of claims 1 to 4, characterized in that, The ceramic plate assembly (30) includes multiple stacked ceramic plates (31) with thermally conductive adhesive (32) applied between adjacent ceramic plates (31).

6. The liquid-cooled inverter inductor according to claim 5, characterized in that, The inner walls of the end cap (12) and the outer shell body (11) are provided with groove structures (60).

7. The liquid-cooled inverter inductor according to claim 6, characterized in that, The groove structure (60) is a parallel groove or a grid-like groove with a groove width of 0.5 mm to 3 mm and a groove depth of 0.5 mm to 2 mm.

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