Waterproof smart phone circuit mainboard
By setting up structures such as a closed cover, rotating rod, and sealing strip on the mobile phone motherboard, the short circuit problem of traditional motherboards when exposed to water is solved, achieving sealing and heat dissipation protection and ensuring the stable operation of the chip.
Patent Information
- Application Number
- CN202520390222.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-07
- Publication Date
- 2026-01-23
- Estimated Expiration
- 2035-03-07
AI Technical Summary
Traditional mobile phone motherboards are prone to short circuits when exposed to water, resulting in poor stability and inability to function properly.
A waterproof smartphone circuit board was designed, which uses a structure including a cover, a rotating rod, an adjusting nut, and a sealing strip to achieve sealing and heat dissipation protection for the chip.
It effectively prevents moisture from entering the motherboard, ensuring the chip's sealing and heat dissipation, and ensuring the chip operates normally in a humid environment.
Smart Images
Figure CN223829337U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to mobile phone mainboard technical field, concretely is waterproof intelligent mobile phone circuit mainboard. BACKGROUND
[0002] Mobile phone mainboard is one of mobile phone main parts, and because of too many precise structures, it is very easy to be damaged.
[0003] The traditional mobile phone mainboard is often bonded together with the bottom frame in use, does not have the corresponding sealing structure, if by accident the mobile phone is dropped into the water in the process of using, even if the machine frame has the waterproof function, but under the immersion, water still can enter the inside of the machine frame, thereby causes the influence to the mainboard, leads to the mainboard short circuit, and further influence the stable use of the mainboard, causes the damage phenomenon to the mainboard component inside the mobile phone, leads to the normal use of the mobile phone. UTILITY MODEL CONTENTS
[0004] In view of the deficiency of prior art, the utility model provides waterproof intelligent mobile phone circuit mainboard, has good sealing effect, the advantage that the chip is heat dissipated, solves the problem raised in above -mentioned background art.
[0005] The utility model provides following technical scheme: waterproof intelligent mobile phone circuit mainboard, including mainboard body, the outer wall rotation of mainboard body is connected with the closed cover, the inner chamber of mainboard body is installed with chip, the outer wall of mainboard body is set up with sealing groove, the outer wall of closed cover is fixed with fixed plate, the inner chamber of fixed plate is rotatably connected with rotating rod, the outer wall of rotating rod is connected with adjusting nut, the outer wall of rotating rod is movably sleeved with pressing plate, the outer wall of rotating rod is movably sleeved with drive spring, the outer wall of mainboard body is fixed with locking plate, the outer wall of locking plate is set up with locking groove, the inner chamber of closed cover is fixed with heat dissipation plate.
[0006] As a preferred technical scheme of the utility model: the inner wall shape of sealing groove and the outer wall shape of sealing strip match, the sealing strip is prepared from natural rubber.
[0007] As a preferred technical scheme of the utility model: the outer wall both ends of drive spring are in contact with the bottom of pressing plate and the top of adjusting nut respectively, and drive spring is prepared from high carbon steel.
[0008] As a preferred technical scheme of the utility model: the outer wall shape of rotating rod and the inner wall shape of locking groove match in size, the outer wall of heat dissipation plate and the outer wall of chip contact each other.
[0009] As a preferred technical scheme of the utility model: the number of rotating rod is two, and two rotating rods are rotatably connected to the outer wall both ends of closed cover.
[0010] As a preferred technical scheme of the utility model: the heat dissipation plate is prepared from metal copper, and the outer wall shape and size of the closing cover is matched with the outer wall shape and size of the main plate body.
[0011] Compared with the prior art, the utility model has the following beneficial effects:
[0012] 1. The waterproof intelligent mobile phone circuit main plate is provided with the closing cover arranged on the outer wall of the main plate body, the rotating rod arranged on the outer wall of the closing cover, the driving of the pressing plate is realized by changing the position of the adjusting nut and compressing the driving spring, the pressing plate is attached to the locking plate, the locking of the closing cover is realized, the connection between the closing cover and the main plate body is tight, the sealing protection of the chip on the surface of the main plate body is realized, and the sealing effect of the machine frame itself is realized, and the chip is further protected.
[0013] 2. The waterproof intelligent mobile phone circuit main plate is provided with the sealing strip arranged on the closing cover and the heat dissipation plate arranged in the inner cavity of the closing cover, when the closing cover is contacted with the main plate body, the sealing strip can enter the sealing groove, good sealing effect is realized, and the chip in the main plate body is heat-conducted under the action of the heat dissipation plate, so that the heat generated by the chip in the use process can be timely transmitted outward, and the chip can normally operate. BRIEF DESCRIPTION OF DRAWINGS
[0014] Figure 1 It is a three-dimensional structure schematic view of the utility model;
[0015] Figure 2 It is a main plate body structure schematic view of the utility model;
[0016] Figure 3 It is a bottom view structure schematic view of the utility model;
[0017] Figure 4 It is a closing cover structure schematic view of the utility model;
[0018] Figure 5 It is a closing cover structure schematic view of the utility model; Figure 3 It is an enlarged structure schematic view of A in the utility model.
[0019] In the drawing: 1, main plate body; 2, closing cover; 3, chip; 4, sealing groove; 5, sealing strip; 6, fixed plate; 7, rotating rod; 8, adjusting nut; 9, pressing plate; 10, driving spring; 11, locking plate; 12, locking groove; 13, heat dissipation plate. DETAILED DESCRIPTION
[0020] With reference to the drawings of the embodiments of the present application, the technical solutions in the embodiments of the present application will be clearly and completely described, obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of the present application.
[0021] Please refer to Figure 1 Figure 5 The waterproof intelligent mobile phone circuit mainboard comprises a mainboard body 1, a sealing cover 2 is rotatably connected to the outer wall of the mainboard body 1, a chip 3 is installed in the inner cavity of the mainboard body 1, a sealing groove 4 is formed in the outer wall of the mainboard body 1, a fixing plate 6 is fixedly assembled to the outer wall of the sealing cover 2, a rotating rod 7 is rotatably connected to the inner cavity of the fixing plate 6, an adjusting nut 8 is threadedly connected to the outer wall of the rotating rod 7, a pressing plate 9 is movably sleeved to the outer wall of the rotating rod 7, a driving spring 10 is movably sleeved to the outer wall of the rotating rod 7, a locking plate 11 is fixedly assembled to the outer wall of the mainboard body 1, a locking groove 12 is formed in the outer wall of the locking plate 11, and a heat dissipation plate 13 is fixedly assembled to the inner cavity of the sealing cover 2.
[0022] In the above structure, when the chip 3 is used, the sealing cover 2 is rotated to cover the top of the mainboard body 1 as a whole, so that the top of the mainboard body 1 is closed, and the chip 3 is protected, and the chip 3 is sealed in the inner cavity of the mainboard body 1 as a whole.
[0023] In a preferred embodiment: the inner wall shape of the sealing groove 4 matches the outer wall shape of the sealing strip 5, and the sealing strip 5 is made of natural rubber.
[0024] In the above structure, the sealing groove 4 is formed in the top of the mainboard body 1, and the sealing strip 5 is fixedly assembled to the outer wall of the sealing cover 2, the outer wall of the sealing cover 2 is covered on the top of the mainboard body 1 by rotating the sealing cover 2, so that the sealing strip 5 enters the inner cavity of the sealing groove 4, and the mainboard body 1 and the sealing cover 2 are further sealed before the sealing groove 4 and the sealing strip 5.
[0025] In a preferred embodiment: the outer wall of the driving spring 10 is in contact with the bottom of the pressing plate 9 and the top of the adjusting nut 8 at both ends respectively, and the driving spring 10 is made of high carbon steel.
[0026] In the above structure, by adjusting the nut 8 provided on the outer wall of the rotating rod 7, the stroke of the drive spring 10 is compressed by rotating the adjusting nut 8, so that the drive spring 10 can provide greater elastic force to the adjusting nut 8 after being compressed, thereby fixing the sealing cover 2, so that the sealing cover 2 can be stably fixed to the outer wall of the main body 1.
[0027] In a preferred embodiment, the outer wall shape of the rotating rod 7 matches the inner wall shape and size of the locking groove 12, and the outer wall of the heat sink 13 is in contact with the outer wall of the chip 3.
[0028] In the above structure, by using the rotating rod 7 provided on the outer wall of the closed cover 2, and the adjusting nut 8 and the drive spring 10 provided on the outer wall of the rotating rod 7, the position of the adjusting nut 8 is adjusted so that the adjusting nut 8 moves up and down along the outer wall of the rotating rod 7, thereby compressing the drive spring 10, so that the drive spring 10 can apply pressure to the pressure plate 9, ensuring that it can fix the closed cover 2.
[0029] In a preferred embodiment, there are two rotating rods 7, and the two rotating rods 7 are respectively rotatably connected to both ends of the outer wall of the closed cover 2.
[0030] In the above structure, by installing rotating rods 7 at both ends of the outer wall of the sealing cover 2, and connecting the rotating rods 7 to the locking plate 11 respectively, the main board body 1 and the sealing cover 2 are fixed under the action of the rotating rods 7, and the sealing strip 5 is installed and fixed in the inner cavity of the sealing groove 4 to seal the gap between the main board body 1 and the sealing cover 2.
[0031] In a preferred embodiment, the heat sink 13 is made of copper, and the shape and size of the outer wall of the cover 2 match the shape and size of the outer wall of the motherboard body 1.
[0032] In the above structure, by setting the heat sink 13 in the inner cavity of the sealing cover 2, when the sealing cover 2 is connected to the motherboard body 1 and the inner cavity of the motherboard body 1 is sealed, the outer wall of the sealing strip 5 will enter the inner cavity of the fixing plate 6, and the outer wall of the heat sink 13 will contact the outer wall of the chip 3. Thus, the heat generated by the chip 3 is dissipated outward under the action of the heat sink 13, thereby achieving heat dissipation of the chip 3 and preventing the chip 3 from overheating.
[0033] Working principle: During normal use of the above device, by rotating the sealing cover 2, the sealing cover 2 covers the top of the main board body 1, allowing the outer wall of the sealing strip 5 to enter the inner cavity of the sealing groove 4. Then, by rotating the rotating rod 7, the outer wall of the rotating rod 7 enters the inner cavity of the locking plate 11, and the outer wall of the rotating rod 7 contacts the inner wall of the locking groove 12. Then, by adjusting the position of the adjusting nut 8, the adjusting nut 8 moves upward along the outer wall of the rotating rod 7, thereby compressing the drive spring 10 during the movement of the adjusting nut 8, thus ensuring the drive spring... The elastic force of 10 can act on the bottom of the pressure plate 9, thereby driving the pressure plate 9 and fixing the rotating rod 7 in the inner cavity of the locking groove 12. This allows the motherboard body 1 and the sealing cover 2 to be connected together, thereby achieving sealing and waterproofing of the chip 3. When the sealing cover 2 is attached to the outer wall of the chip 3, the outer wall of the heat sink 13 will be attached to the outer wall of the chip 3. Under the action of the heat sink 13, the chip 3 is conducted heat, allowing the heat of the chip 3 to be transferred to the heat sink 13 and released outward under the action of the heat sink 13, thereby achieving the function of heat dissipation and ensuring the stable working state of the chip 3.
[0034] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.
Claims
1. A waterproof smartphone circuit board, comprising a board body (1), characterized in that: The outer wall of the motherboard body (1) is rotatably connected to a sealing cover (2). A chip (3) is installed in the inner cavity of the motherboard body (1). A sealing groove (4) is opened on the outer wall of the motherboard body (1). A fixing plate (6) is fixedly assembled on the outer wall of the sealing cover (2). A rotating rod (7) is rotatably connected to the inner cavity of the fixing plate (6). An adjusting nut (8) is threadedly connected to the outer wall of the rotating rod (7). A pressure plate (9) is movably sleeved on the outer wall of the rotating rod (7). A drive spring (10) is movably sleeved on the outer wall of the rotating rod (7). A locking plate (11) is fixedly assembled on the outer wall of the motherboard body (1). A locking groove (12) is opened on the outer wall of the locking plate (11). A heat sink (13) is fixedly assembled in the inner cavity of the sealing cover (2).
2. The waterproof smartphone circuit board according to claim 1, characterized in that: The inner wall shape of the sealing groove (4) matches the outer wall shape of the sealing strip (5), which is made of natural rubber.
3. The waterproof smartphone circuit board according to claim 1, characterized in that: The two ends of the outer wall of the drive spring (10) are in contact with the bottom of the pressure plate (9) and the top of the adjusting nut (8), respectively, and the drive spring (10) is made of high carbon steel.
4. The waterproof smartphone circuit board according to claim 1, characterized in that: The outer wall shape of the rotating rod (7) matches the inner wall shape and size of the locking groove (12), and the outer wall of the heat sink (13) is in contact with the outer wall of the chip (3).
5. The waterproof smartphone circuit board according to claim 1, characterized in that: There are two rotating rods (7), and the two rotating rods (7) are respectively rotatably connected to the two ends of the outer wall of the closed cover (2).
6. The waterproof smartphone circuit board according to claim 1, characterized in that: The heat sink (13) is made of copper, and the shape and size of the outer wall of the cover (2) match the shape and size of the outer wall of the motherboard body (1).