Display panel and display device

Abstract

The utility model provides a display panel and a display device, which are applied to the technical field of display, effectively prevent the phenomenon of light crosstalk between adjacent sub-pixels in the display panel, improve the display quality of the display panel and improve the light emitting efficiency of the display panel. The display panel comprises a driving backboard, a light-emitting chip layer and a retaining wall layer. The light-emitting chip layer is arranged on one side of the driving backboard, and the light-emitting chip layer comprises a plurality of light-emitting chips; the retaining wall layer is arranged on the side, away from the driving backboard, of the light-emitting chip layer, the retaining wall layer comprises a plurality of first openings, each first opening exposes one light-emitting chip in the light-emitting chips, and a first light condensation structure is arranged in each first opening in the first openings.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to the technical field of display, and in particular, to a display panel and a display device. BACKGROUND

[0002] At present, display panels, such as mini LED (mini Light-Emitting Diode) display panels, Micro LED (micro Light-Emitting Diode) display panels and the like, have the advantages of high brightness, clear display and low power consumption, and have been more and more widely applied in various display devices such as mobile phones, tablets, computers and televisions. CONTENT OF THE INVENTION

[0003] The technical problem solved by the present disclosure is how to effectively prevent the phenomenon of light crosstalk between adjacent sub-pixels in the display panel, improve the display quality of the display panel, and improve the light extraction efficiency of the display panel.

[0004] In one aspect, a display panel is provided, comprising a driving backplate, a light-emitting chip layer, and a barrier wall layer; the light-emitting chip layer is arranged on one side of the driving backplate, and the light-emitting chip layer comprises a plurality of light-emitting chips; the barrier wall layer is arranged on a side of the light-emitting chip layer away from the driving backplate, and the barrier wall layer comprises a plurality of first openings, each of the plurality of first openings exposes one of the plurality of light-emitting chips, and each of the plurality of first openings is provided with a first light condensing structure.

[0005] The barrier wall layer of the present disclosure comprises a plurality of first openings, the plurality of first openings form a plurality of deep holes, the first light condensing structure is arranged in the deep hole, and the first light condensing structure makes the light emitted by the corresponding light-emitting chip more concentrated, that is, the first light condensing structure can make the emission angle of the light with a relatively large emission angle smaller, and the part of the light is concentrated to the middle, preventing the part of the light from being emitted into the adjacent sub-pixel due to the relatively large emission angle; after the light emitted by the light-emitting chip passes through the first light condensing structure, even if a small part of the light still has a relatively large emission angle, the barrier wall of the barrier wall layer can shield the part of the light, and the part of the light is emitted out of the display panel after multiple reflections in the barrier wall, effectively preventing the phenomenon of light crosstalk between adjacent sub-pixels in the display panel, and effectively improving the display quality of the display panel; at the same time, the first light condensing structure makes most of the light emitted by the corresponding light-emitting chip can be emitted out of the display panel, and the plurality of deep holes between the barrier walls can realize collimated light emission, more light can be emitted out of the display panel, and the light extraction efficiency of the display panel is improved.

[0006] In some embodiments, an angle between a plane in which a sidewall of at least one of the first openings is located and a plane in which a surface of the light emitting chip layer close to the barrier layer is located is within a preset range.

[0007] In some embodiments, the preset range is 70°-110°.

[0008] In some embodiments, the first light concentrating structure includes a convex lens.

[0009] In some embodiments, the light emitting chip layer includes a first electrode layer, the first electrode layer is close to the barrier layer, and the first electrode layer is arranged in an entire layer; the display panel further includes a heat conduction layer, the heat conduction layer is arranged between the first electrode layer and the barrier layer, the heat conduction layer includes a plurality of second openings, each of the plurality of second openings corresponds to one of the plurality of first openings, respectively.

[0010] The first light concentrating structure is further arranged in the corresponding second opening; wherein a material of the heat conduction layer includes a first metal material, a material of the barrier layer includes a second metal material, and a heat conduction performance of the first metal material is higher than that of the second metal material.

[0011] In some embodiments, a part of the sidewall of at least one of the first openings that is not in contact with the first light concentrating structure is provided with a reflective layer.

[0012] In some embodiments, the plurality of light emitting chips emit light rays of the same color; the display panel further includes a color conversion layer and a color filter layer, the color conversion layer is filled in the plurality of first openings of the barrier layer and is located on a side of the first light concentrating structure away from the light emitting chip layer; the color conversion layer is used to convert the light rays emitted by the plurality of light emitting chips into white light rays; the color filter layer is arranged on a side of the color conversion layer away from the light emitting chip layer, and the color filter layer includes a plurality of filter parts, each of the plurality of filter parts corresponds to one of the plurality of light emitting chips, respectively.

[0013] In some embodiments, the plurality of light emitting chips emit light rays of the same color; the display panel further includes a color conversion layer and a color filter layer, the color conversion layer includes a plurality of color conversion parts, one of the plurality of color conversion parts is located in one of the plurality of first openings and is located on a side of the first light concentrating structure away from the light emitting chip layer; each of the plurality of color conversion parts is used to convert light rays emitted by the corresponding light emitting chip into light rays of a set color; the color filter layer is arranged on a side of the color conversion layer away from the light emitting chip layer, and the color filter layer includes a plurality of filter parts, each of the plurality of filter parts corresponds to one of the plurality of light emitting chips, respectively.

[0014] In some embodiments, the color filter layer further includes a barrier part arranged at intervals of the plurality of filter parts.

[0015] In some embodiments, the display panel further comprises a light condensing layer, the light condensing layer is disposed on the side of the color filter layer away from the light emitting chip layer, and the light condensing layer comprises a plurality of second light condensing structures, each of the plurality of second light condensing structures corresponds to one of the plurality of light emitting chips respectively.

[0016] In some embodiments, the second light condensing structure comprises a convex lens.

[0017] In some embodiments, the display panel further comprises a protective layer, the protective layer is disposed between the color conversion layer and the color filter layer.

[0018] In some embodiments, the driving backboard comprises a substrate, and a material of the substrate is silicon.

[0019] In another aspect, a display device is provided, comprising the display panel and the driving chip as described above, and the driving chip is connected with the display panel. BRIEF DESCRIPTION OF DRAWINGS

[0020] In order to more clearly illustrate the technical solutions in the present disclosure, the following will briefly introduce the drawings needed to be used in some embodiments of the present disclosure. Obviously, the drawings described in the following description are only the drawings of some embodiments of the present disclosure, and other drawings can also be obtained by those skilled in the art according to these drawings. In addition, the drawings in the following description can be regarded as schematic diagrams, and are not limited to the actual size, actual process, actual time sequence, etc. of the products involved in the embodiments of the present disclosure.

[0021] Figure 1 A sectional view of a display panel according to some embodiments;

[0022] Figure 2 A plan view of a display panel according to some embodiments;

[0023] Figure 3 A sectional view of a driving backboard according to some embodiments;

[0024] Figure 4 A sectional view of a light emitting chip according to some embodiments;

[0025] Figure 5 A preparation step diagram of a display panel according to some embodiments;

[0026] Figures 6-12 Another sectional view of a display panel according to some embodiments;

[0027] Figure 13 A structural diagram of a display device according to some embodiments. DETAILED DESCRIPTION

[0028] The technical solutions in some embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this disclosure, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments provided in this disclosure are within the scope of protection of this disclosure.

[0029] Unless the context otherwise requires, throughout the specification and claims, the term "comprise" and its other forms, such as the third-person singular "comprises" and the present participle "comprising," are interpreted as open-ended and encompassing, meaning "including, but not limited to." In the description of the specification, terms such as "one embodiment," "some embodiments," "exemplary embodiments," "example," "specific example," or "some examples," etc., are intended to indicate that a particular feature, structure, material, or characteristic associated with that embodiment or example is included in at least one embodiment or example of this disclosure. The illustrative representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics mentioned may be included in any suitable manner in any one or more embodiments or examples.

[0030] Hereinafter, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of embodiments of this disclosure, unless otherwise stated, "a plurality of" means two or more.

[0031] It should be understood that when a layer or element is referred to as being on another layer or substrate, it can mean that the layer or element is directly on the other layer or substrate, or that there is an intermediate layer between the layer or element and the other layer or substrate.

[0032] Exemplary embodiments are described herein with reference to cross-sectional and / or plan view illustrations that are schematic illustrations of idealized embodiments. Variations from the shapes of the illustrations as a result, for example, of manufacturing techniques and / or tolerances, are to be expected. Thus, embodiments should not be construed as limited to the particular shapes of regions illustrated herein but are to include deviations in shapes that result, for example, from manufacturing. For example, an etched region illustrated as a rectangle will, typically, have rounded or curved features. Thus, the regions illustrated in the figures are schematic and their shapes are not intended to illustrate the precise shape of a region that would be formed by a given manufacturing technique and are intended to be merely an aid in understanding the exemplary embodiments.

[0033] With the continuous development of display technology industry, the PPI of display panel is continuously improved. The PPI (pixels per inch) of display panel represents the number of sub-pixels per inch that the display panel has. The higher the PPI value of the display panel is, the higher the density of the display panel to display the picture is, the higher the picture fidelity is, and the richer the picture details are. At present, high PPI has become an important direction of the development of display panel.

[0034] Exemplarily, the display panel includes a plurality of sub-pixels, and the sub-pixel is the smallest unit for the display panel to display a picture. Each sub-pixel can display a single color. For example, the plurality of sub-pixels include first color sub-pixels, second color sub-pixels, and third color sub-pixels, which respectively display red, green, or blue. By adjusting the brightness (gray scale) of different color sub-pixels, the combination and superposition of the colors displayed by different color sub-pixels can realize the display of multiple colors, so as to realize the full-color display of the display panel. The sub-pixel can also display other colors, which are not limited in the present disclosure.

[0035] Exemplarily, the higher the PPI value of the display panel is, the smaller the size of the sub-pixel in the display panel is, and the smaller the distance between adjacent sub-pixels is. Due to the small distance between adjacent sub-pixels, for example, the light in the first color sub-pixel in the display panel can be emitted into the second color sub-pixel and / or the third color sub-pixel adjacent to it, the light in the second color sub-pixel can be emitted into the first color sub-pixel and / or the third color sub-pixel adjacent to it, and the light in the third color sub-pixel can be emitted into the first color sub-pixel and / or the second color sub-pixel adjacent to it, thereby causing the light crosstalk phenomenon between adjacent sub-pixels in the display panel, reducing the display quality of the display panel. At the same time, the light in the sub-pixel is emitted into other sub-pixels, which reduces the light emission efficiency of the sub-pixel, thereby reducing the light emission efficiency of the display panel.

[0036] In some embodiments, as Figure 1As shown, this disclosure provides a display panel 100, including a driving backplate 10, a light-emitting chip layer 20, and a barrier layer 30; the light-emitting chip layer 20 is disposed on one side of the driving backplate 10, and the light-emitting chip layer 20 includes a plurality of light-emitting chips 20-1; the barrier layer 30 is disposed on the side of the light-emitting chip layer 20 away from the driving backplate 10, and the barrier layer 30 includes a plurality of first openings 30-1, each of the plurality of first openings 30-1 exposing one of the plurality of light-emitting chips 20-1, and a first light-concentrating structure 1 is disposed in each of the plurality of first openings 30-1.

[0037] For example, the display panel 100 can be used to display images; the display panel 100 can be, for example, a mini light-emitting diode (Mini LED) display panel, a micro light-emitting diode (Micro LED) display panel, etc., and this disclosure is not limited thereto. This disclosure uses a Micro LED display panel as an example for description.

[0038] For example, such as Figure 2 As shown, the display panel 100 (e.g., a Micro LED display panel) includes a display area AA and a peripheral area BB located on at least one side of the display area AA. For example, the peripheral area BB is located on all four sides of the display area AA and is arranged around the display area AA.

[0039] For example, such as Figure 2 As shown, the display area AA of the display panel 100 can be provided with multiple sub-pixels P and multiple signal lines, such as data signal lines and gate signal lines. Each sub-pixel P includes a pixel driving circuit D and a light-emitting chip 20-1. Each pixel driving circuit D includes at least one transistor. The peripheral area BB of the display panel 100 can be provided with multiple signal lines, such as initialization signal lines, to ensure the normal display of the display panel 100.

[0040] For example, the pixel driving circuit D can be configured to provide an electrical signal (e.g., driving voltage or driving current) to the light-emitting chip 20-1 coupled to the pixel driving circuit D in response to the received scan signal and data signal (e.g., the scan signal output by the scan driving circuit and the data signal output by the data driving circuit), so as to drive the light-emitting chip 20-1 to emit light, thereby enabling the display panel 100 to display an image.

[0041] In some embodiments, such as Figure 1 As shown, the display panel 100 includes a driving backplate 10, a light-emitting chip layer 20, and a barrier layer 30 stacked in sequence.

[0042] In some embodiments, such as Figure 3 As shown, and refer to Figure 1 The driving backplane 10 can be used to set the pixel driving circuit D of the sub-pixel P in the display panel 100, that is, the driving backplane 10 includes multiple pixel driving circuits D. The driving backplane 10 may include multiple metal layers, such as a semiconductor layer 12 (ACT), a gate metal layer 14 (Gate), a source / drain metal layer 16 (SD), a common electrode layer 19-1 (COM), and a pixel electrode layer 19-3 (Pixel) stacked together. Of course, the driving backplane 10 may also include other metal layers, such as a second gate metal layer, and / or a second source / drain metal layer, and / or a third source / drain metal layer, etc., which can be specifically set according to the actual situation, and this disclosure does not limit it.

[0043] For example, such as Figure 3 As shown, multiple metal layers on the driving backplane 10 form at least one transistor TFT. For example, the transistor TFT may include a semiconductor pattern T11 disposed on the semiconductor layer 12, a gate pattern T12 disposed on the gate metal layer 14, and a source pattern T13 and a drain pattern T14 disposed on the source and drain metal layers 16.

[0044] In some embodiments, the common electrode layer 19-1 includes a plurality of common electrodes, the pixel electrode layer 19-3 includes a plurality of pixel electrodes, and a pixel driving circuit D includes a common electrode and a pixel electrode. In other embodiments, the common electrode layer 19-1 can be disposed as a single layer, in which case a pixel driving circuit D includes a portion of the common electrode and a pixel electrode.

[0045] In some embodiments, the drive backplane 10 may further include an insulating layer located between adjacent metal layers, the insulating layer serving to isolate the adjacent metal layers. For example, such as Figure 3 As shown, the driving backplane 10 may include a substrate 11, a first gate insulating layer 13 (GI1) located between the semiconductor layer 12 and the gate metal layer 14, a second gate insulating layer 15 (GI2) located between the gate metal layer 14 and the source / drain metal layer 16, a passivation layer 17 (PVX) located between the source / drain metal layer 16 and the common electrode layer 19-1, a planarization layer 18 (PLN), and an electrode insulating layer 19-2 located between the common electrode layer 19-1 and the pixel electrode layer 19-3. The driving backplane 10 may also include other insulating layers, which may be specifically configured according to actual conditions, and are not limited herein.

[0046] In some embodiments, such as Figure 4 As shown, and refer to Figure 1The light-emitting chip layer 20 can be used to set the light-emitting chip 20-1 of the sub-pixel P in the display panel 100, that is, the light-emitting chip layer 20 includes a plurality of light-emitting chips 20-1. The light-emitting chip 20-1 can be a Micro LED light-emitting chip, and can also be a Mini LED light-emitting chip, which is not limited in the present disclosure.

[0047] In some embodiments, as shown in Figure 4 The light-emitting chip 20-1 includes a second electrode 21, an epitaxial layer 22, and a first electrode 23 which are sequentially stacked, wherein the epitaxial layer 22 includes a second semiconductor layer 22-1, a light-emitting layer 22-2, and a first semiconductor layer 22-3 which are sequentially stacked; the second electrode 21 is arranged on the side close to the second semiconductor layer 22-1, and the first electrode 23 is arranged on the side close to the first semiconductor layer 22-3.

[0048] In some embodiments, the second electrode 21 is a P-type electrode, and the second semiconductor layer 22-1 is a P-type semiconductor layer; the first electrode 23 is an N-type electrode, and the first semiconductor layer 22-3 is an N-type semiconductor layer. In other embodiments, the second electrode 21 is an N-type electrode, and the second semiconductor layer 22-1 is an N-type semiconductor layer; the first electrode 23 is a P-type electrode, and the first semiconductor layer 22-3 is a P-type semiconductor layer, which is not limited in the present disclosure. The present disclosure is described by taking the second electrode 21 as a P-type electrode, the second semiconductor layer 22-1 as a P-type semiconductor layer, the first electrode 23 as an N-type electrode, and the first semiconductor layer 22-3 as an N-type semiconductor layer as an example.

[0049] In some embodiments, the light-emitting chip 20-1 can further include a bonding electrode arranged on the side of the second electrode 21 away from the epitaxial layer 22, which can be used to bond and connect the second electrode 21 of the light-emitting chip 20-1 with the pixel driving circuit D.

[0050] Exemplarily, as shown in Figure 1 One light-emitting chip 20-1 of the light-emitting chip layer 20 can be connected with one pixel driving circuit D of the driving backboard 10, for example, the second electrode 21 on the light-emitting chip 20-1 can be connected with the pixel electrode in the pixel driving circuit D, and the first electrode 23 on the light-emitting chip 20-1 can be connected with the common electrode in the pixel driving circuit D.

[0051] Exemplarily, the pixel driving circuit D is used to drive the light-emitting chip 20-1 to emit light. In some embodiments, the plurality of light-emitting chips 20-1 of the display panel 100 can include red light-emitting chips, green light-emitting chips and blue light-emitting chips, which can respectively emit red light, green light and blue light, so that the sub-pixel P where the light-emitting chip 20-1 is located displays red, green and blue, realizing the display of a color picture of the display panel 100. In other embodiments, the plurality of light-emitting chips 20-1 of the display panel 100 can all be light-emitting chips 20-1 of the same color, for example, can all be blue light-emitting chips, which emit blue light, and then the blue light emitted by the blue light-emitting chips is converted into light of other colors, for example, red light or green light, through other film layers (for example, a color conversion layer), so that the sub-pixel P where the light-emitting chip 20-1 is located displays red, green and blue, realizing the display of a color picture of the display panel 100.

[0052] In some embodiments, as shown in Figure 1 , Figure 2 The sub-pixels P on the display panel 100 can be arranged in an array, that is, a plurality of sub-pixels P are arranged in multiple rows and multiple columns. At this time, the plurality of pixel driving circuits D of the driving back plate 10 are arranged in an array, and the plurality of light-emitting chips 20-1 of the light-emitting chip layer 20 are also arranged in an array. The sub-pixels P on the display panel 100 can also be arranged in other forms, which are not limited by the present disclosure.

[0053] In some embodiments, as shown in Figure 1 The gap between the plurality of light-emitting chips 20-1 of the light-emitting chip layer 20 can be provided with an insulating filling layer 24, which separates the adjacent two light-emitting chips 20-1 to avoid short circuit between the adjacent two light-emitting chips 20-1, and at the same time increases the flatness of the light-emitting chip layer 20.

[0054] In some embodiments, as shown in Figure 1 The first electrodes 23 of the plurality of light-emitting chips 20-1 of the light-emitting chip layer 20 can be laid in an entire layer, that is, the first electrodes 23 of all the light-emitting chips 20-1 are connected to each other, which increases the display uniformity of the display panel 100 and also simplifies the preparation process.

[0055] In other embodiments, the first electrodes 23 of the plurality of light-emitting chips 20-1 of the light-emitting chip layer 20 can be separately provided, which are not limited by the present disclosure.

[0056] In some embodiments, as shown in Figure 1As shown, the barrier wall layer 30 is arranged on the side of the light emitting chip layer 20 away from the driving backboard 10, and the barrier wall layer 30 is provided with a plurality of first openings 30-1, each of which exposes one light emitting chip 20-1, thereby forming a barrier wall 30-2 between any two adjacent light emitting chips 20-1; that is, the orthogonal projection of the barrier wall 30-2 on the driving backboard 10 is between the orthogonal projections of any two adjacent light emitting chips 20-1 on the driving backboard 10.

[0057] In some embodiments, the material of the barrier wall layer 30 may, for example, be a metal material such as aluminum, nickel, silver, etc. having a light reflecting function. The thickness of the barrier wall layer 30 in the direction perpendicular to the display panel 100 needs to ensure that the light emitted by the light emitting chip 20-1 is incident in the area corresponding to the sub-pixel P after being reflected by the barrier wall 30-2, and the thickness of the barrier wall layer 30 in the direction perpendicular to the display panel 100 may, for example, be 3-5 um.

[0058] In some embodiments, as shown in FIG. 2, each first opening 30-1 of the barrier wall layer 30 is provided with a first light collecting structure 1. Figure 1

[0059] In some embodiments, as shown in FIG. 2, the first light collecting structure 1 may, for example, include a convex lens, and the diameter / height of the convex lens of the first light collecting structure 1 may, for example, be 5:1-3:1. The first light collecting structure 1 may also include other structures as long as the effect of light collection can be achieved. Figure 1

[0060] In some embodiments, as shown in FIG. 2, the preparation of the display panel 100 described above may, for example, be achieved by the following preparation method: Figure 5

[0061] S1. Forming, on a silicon substrate Si or a sapphire substrate, a raw first semiconductor layer 22-3', a raw light emitting layer 22-2', a raw second semiconductor layer 22-1', and a second electrode layer in sequence, patterning the second electrode layer to form a plurality of second electrodes 21.

[0062] S2. Bonding and connecting the plurality of second electrodes 21 and the plurality of pixel driving circuits on the driving backboard 10, respectively.

[0063] For example, the second electrode 21 may, for example, be bonded and connected with the pixel electrode of the pixel driving circuit D.

[0064] S3. Removing the silicon substrate Si or the sapphire substrate, and etching the raw first semiconductor layer 22-3', the raw light emitting layer 22-2', and the raw second semiconductor layer 22-1' to form a plurality of epitaxial layers 22, one epitaxial layer 22 corresponding to one second electrode 21.

[0065] ​​​Exemplarily, the silicon substrate or the sapphire substrate can be removed by etching or laser lift off (LLO) technology.

[0066] S4, forming an insulating filling layer 24 above the plurality of epitaxial layers 22, and patterning the insulating filling layer 24 so that at least a part of each epitaxial layer 22 is exposed.

[0067] Exemplarily, the insulating filling layer 24 fills between any two adjacent second electrodes 21 and any two adjacent epitaxial layers 22.

[0068] S5, forming a first electrode layer 23' above the insulating filling layer 24, thereby forming a plurality of light emitting chips 20-1.

[0069] Exemplarily, the material of the first electrode layer 23' can be a transparent material, for example, an indium tin oxide (ITO) material or an indium zinc oxide (IZO) material.

[0070] Exemplarily, the first electrode layer 23' can be provided in an integral layer, and the first electrode layer 23' is the first electrode 23 of all the light emitting chips 20-1; or the first electrode layer 23' can be patterned to form a plurality of first electrodes 23, one first electrode 23 corresponding to one epitaxial layer 22. The disclosure is described by way of example of the first electrode layer 23' provided in an integral layer.

[0071] S6, forming a first light concentrating structure layer 1' above the first electrode layer 23', and coating photoresist O above the first light concentrating structure layer 1', and exposing the first electrode layer 23' at the interval positions of the light emitting chips 20-1 by exposure, development and etching.

[0072] Exemplarily, the material of the first light concentrating structure layer 1' can be silicon nitride (SiN) or silicon oxide (SiO) or a composite material of silicon nitride (SiN) and silicon oxide (SiO).

[0073] Exemplarily, in this step, the thickness of the coated photoresist O in the direction perpendicular to the display panel 100 can be relatively thick, and the specific thickness can be set according to actual conditions; and the photoresist O is not removed in this step.

[0074] S7, forming a barrier layer 30 above the exposed first electrode layer 23'.

[0075] Exemplarily, the barrier layer 30 can be a metal material, and the barrier layer 30 can be formed by electroforming process, and the exposed first electrode layer 23' can be used as a seed layer of the barrier layer 30.

[0076] Exemplarily, in the direction perpendicular to the display panel 100, the height of the barrier wall layer 30 is substantially the same as the sum of the height of the first light condensing structure layer 1' and the height of the photoresist O coated above the first light condensing structure layer 1'.

[0077] S8, the coated photoresist O is removed to form a plurality of first openings 30-1 of the barrier wall layer 30, and a plurality of first light condensing structure layers 1' exposed in the plurality of first openings 30-1 are etched to form a plurality of first light condensing structures 1.

[0078] Exemplarily, the edge effect of deep hole etching can be utilized to form the first light condensing structure 1 into a convex lens structure protruding upward.

[0079] Exemplarily, the barrier wall layer 30 of the present disclosure includes a plurality of first openings 30-1, the plurality of first openings 30-1 form a plurality of deep holes, the first light condensing structure 1 (convex lens structure) is arranged in the deep hole, and the first light condensing structure 1 makes the light emitted by the corresponding light emitting chip 20-1 more condensed, that is, the first light condensing structure 1 can make the emission angle of the light with a relatively large emission angle among the light emitted by the light emitting chip 20-1 smaller, the part of light is condensed to the middle, preventing the part of light from being emitted into the adjacent sub-pixel P due to the relatively large emission angle, effectively preventing the light crosstalk phenomenon between the adjacent sub-pixels P in the display panel 100, and effectively improving the display quality of the display panel 100; and the first light condensing structure 1 makes most of the light emitted by the corresponding light emitting chip 20-1 can be emitted out of the display panel 100, improving the light efficiency of the display panel 100.

[0080] At the same time, after the light emitted by the light emitting chip 20-1 passes through the first light condensing structure 1, even if a small part of the light still has a relatively large emission angle, the barrier wall 30-2 of the barrier wall layer 30 can shield this part of light, and this part of light is emitted out of the display panel 100 after multiple reflections in the barrier wall 30-2, preventing this part of light from being emitted into the adjacent sub-pixel P due to the relatively large emission angle, effectively preventing the light crosstalk phenomenon between the adjacent sub-pixels P in the display panel 100, and effectively improving the display quality of the display panel 100; and the plurality of deep holes between the barrier walls 30-2 can realize collimated light emission, and more light can be emitted out of the display panel 100, improving the light efficiency of the display panel 100.

[0081] In some embodiments, as shown in Figure 1 , Figure 6 , Figure 7 Exemplarily, the angle α between the plane where the side wall 30-11 of at least one first opening 30-1 in the plurality of first openings 30-1 is located and the plane where the surface of the light emitting chip layer 20 close to the barrier wall layer 30 is located is within a preset range.

[0082] Exemplarily, the surface of the light emitting chip layer 20 close to the barrier wall layer 30 can be the surface of the first electrode layer 23'.

[0083] Exemplarily, the angle a between the plane where the sidewall 30-11 of the first opening 30-1 is located and the plane where the surface of the first electrode layer 23' is located is within a preset range. That is, in the sectional view of the first opening 30-1 in the direction perpendicular to the display panel 100, the angle a between the left and right side edges and the bottom edge of the sectional view is within the preset range.

[0084] In some embodiments, the preset range is 70°-110°. For example, the angle a between the plane where the sidewall 30-11 of the first opening 30-1 is located and the plane where the surface of the light emitting chip layer 20 close to the barrier wall layer 30 is located can be 75°, 80°, 85°, 90°, 95°, 100°, 105°, etc.

[0085] Exemplarily, as shown in FIG. 1A, the sectional view of the first opening 30-1 in the direction perpendicular to the display panel 100 can be a rectangle, and at this time, the angle a between the left and right side edges and the bottom edge of the sectional view is 90°. That is, the angle a between the plane where the sidewall 30-11 of the first opening 30-1 is located and the plane where the surface of the light emitting chip layer 20 close to the barrier wall layer 30 is located is 90°. Figure 1 Exemplarily, as shown in FIG. 1B, the sectional view of the first opening 30-1 in the direction perpendicular to the display panel 100 can be a trapezoid, and at this time, the angle a between the left and right side edges and the bottom edge of the sectional view can be 70° or 75° or 80° or 85°. That is, the angle a between the plane where the sidewall 30-11 of the first opening 30-1 is located and the plane where the surface of the light emitting chip layer 20 close to the barrier wall layer 30 is located can be 70° or 75° or 80° or 85°.

[0086] Figure 6 Exemplarily, as shown in FIG. 1C, the sectional view of the first opening 30-1 in the direction perpendicular to the display panel 100 can be an inverted trapezoid, and at this time, the angle a between the left and right side edges and the bottom edge of the sectional view can be 95° or 100° or 105° or 110°. That is, the angle a between the plane where the sidewall 30-11 of the first opening 30-1 is located and the plane where the surface of the light emitting chip layer 20 close to the barrier wall layer 30 is located can be 95° or 100° or 105° or 110°.

[0087] Exemplarily, as shown in FIG. 1C, the sectional view of the first opening 30-1 in the direction perpendicular to the display panel 100 can be an inverted trapezoid, and at this time, the angle a between the left and right side edges and the bottom edge of the sectional view can be 95° or 100° or 105° or 110°. That is, the angle a between the plane where the sidewall 30-11 of the first opening 30-1 is located and the plane where the surface of the light emitting chip layer 20 close to the barrier wall layer 30 is located can be 95° or 100° or 105° or 110°. Figure 7 Exemplarily, as shown in FIG. 1C, the sectional view of the first opening 30-1 in the direction perpendicular to the display panel 100 can be an inverted trapezoid, and at this time, the angle a between the left and right side edges and the bottom edge of the sectional view can be 95° or 100° or 105° or 110°. That is, the angle a between the plane where the sidewall 30-11 of the first opening 30-1 is located and the plane where the surface of the light emitting chip layer 20 close to the barrier wall layer 30 is located can be 95° or 100° or 105° or 110°.

[0088] ​Exemplarily, the angle a between the plane where the side wall 30-11 of the plurality of first openings 30-1 is located and the plane where the surface of the light-emitting chip layer 20 close to the barrier wall layer 30 is located can be equal; the angle a between the plane where the side wall 30-11 of the plurality of first openings 30-1 is located and the plane where the surface of the light-emitting chip layer 20 close to the barrier wall layer 30 is located can also be unequal, which is not limited in the present disclosure.

[0089] Exemplarily, when the angle a between the plane where the side wall 30-11 of the plurality of first openings 30-1 is located and the plane where the surface of the light-emitting chip layer 20 close to the barrier wall layer 30 is located is 70°-110°, the barrier wall 30-2 is approximately perpendicular to the light-emitting chip layer 20, and most of the light emitted by the light-emitting chip 20-1 will be emitted out of the display panel 100 after being reflected by the barrier wall 30-2, so that the light-emitting efficiency of the display panel 100 is significantly improved.

[0090] When the angle a between the plane where the side wall 30-11 of the plurality of first openings 30-1 is located and the plane where the surface of the light-emitting chip layer 20 close to the barrier wall layer 30 is located is less than 70°, at this time, the barrier wall 30-2 is in the shape of an inverted trapezoid, and the angle a between the side wall 30-11 of the barrier wall 30-2 and the first electrode layer 23' is relatively large, so that part of the light emitted by the light-emitting chip 20-1 will be reflected back to the light-emitting chip 20-1 after being reflected by the barrier wall 30-2, thereby causing the light-emitting efficiency of the display panel 100 to be relatively low.

[0091] When the angle a between the plane where the side wall 30-11 of the plurality of first openings 30-1 is located and the plane where the surface of the light-emitting chip layer 20 close to the barrier wall layer 30 is located is greater than 110°, at this time, the barrier wall 30-2 is in the shape of a trapezoid, and the angle a between the side wall 30-11 of the barrier wall 30-2 and the first electrode layer 23' is relatively large, so that part of the light emitted by the light-emitting chip 20-1 will still have a relatively large reflection angle after being reflected by the barrier wall 30-2, and this part of light can still be incident into the adjacent sub-pixel P, thereby failing to solve the problem of crosstalk between the sub-pixels P of the display panel 100.

[0092] In some embodiments, as Figure 8As shown, the light-emitting chip layer 20 includes a first electrode layer 23', the first electrode layer 23' is close to the barrier wall layer 30, and the first electrode layer 23' is arranged in an entire layer; the display panel 100 further includes a heat conduction layer 40, the heat conduction layer 40 is arranged between the first electrode layer 23' and the barrier wall layer 30, the heat conduction layer 40 includes a plurality of second openings 40-1, each of the plurality of second openings 40-1 corresponds to one of the plurality of first openings 30-1; the first light condensing structure 1 is further arranged in the corresponding second opening 40-1; wherein the material of the heat conduction layer 40 includes a first metal material, the material of the barrier wall layer 30 includes a second metal material, and the heat conduction performance of the first metal material is higher than that of the second metal material.

[0093] Exemplarily, as shown in Figure 8 The first electrode layer 23' of the light-emitting chip layer 20 can be arranged in an entire layer.

[0094] Exemplarily, as shown in Figure 8 The heat conduction layer 40 of the display panel 100 includes a plurality of second openings 40-1, one second opening 40-1 corresponds to one first opening 30-1; thereby forming a heat conduction part 40-2 between the barrier wall 30-2 and the first electrode layer 23'.

[0095] Exemplarily, as shown in Figure 8 The second opening 40-1 is located on the side of the first opening 30-1 close to the light-emitting chip layer 20, and the second opening 40-1 and the first opening 30-1 can be combined into one deep hole. One first light condensing structure 1 is located in one second opening 40-1 and also located in the first opening 30-1 corresponding to the second opening 40-1, that is, the first light condensing structure 1 fills the second opening 40-1 completely, and the first light condensing structure 1 is also located on the side of the first opening 30-1 close to the second opening 40-1.

[0096] Exemplarily, the material of the heat conduction layer 40 can include a first metal material, for example, can be copper, aluminum, etc. The material of the barrier wall layer 30 can include a second metal material, for example, can be aluminum, nickel, silver, etc.

[0097] Exemplarily, the heat conduction performance of the first metal material of the heat conduction layer 40 is higher than the heat conduction performance of the second metal material of the barrier wall layer 30, the heat conduction part 40-2 in the heat conduction layer 40 has better heat conduction performance, and heat accumulated on the barrier wall 30-2 in the process of manufacturing the display panel 100 or in the process of using the display panel 100 can be conducted to the first electrode layer 23' to reduce the temperature of the barrier wall 30-2 and the temperature around the color conversion layer between the barrier walls 30-2, thereby avoiding the failure of the color conversion layer; and the heat conduction part 40-2 of the heat conduction layer 40 can be used as a seed layer for electroforming the barrier wall layer 30; at the same time, the barrier wall 30-2 is located above the heat conduction part 40-2, and the heat conduction part 40-2 can increase the distance from the surface of the barrier wall 30-2 away from the light emitting chip layer 20 to the light emitting chip layer 20, which is equivalent to increasing the height of the barrier wall 30-2, so that the display panel 100 can be manufactured with a higher barrier wall 30-2, further preventing the problem of crosstalk, and meanwhile, the light extraction efficiency can be improved.

[0098] In some embodiments, as shown in FIG. 1A, the display panel 100 comprises a plurality of first openings 30-1, and each first opening 30-1 is filled with a barrier wall 30-2. Figure 8 Exemplarily, as shown in FIG. 1A, the side wall 30-11 of at least one of the plurality of first openings 30-1 is provided with a reflective layer 50 on a portion of the side wall 30-11 that is not in contact with the first light condensing structure 1.

[0099] Exemplarily, as shown in FIG. 1A, the side wall 30-11 of at least one of the plurality of first openings 30-1 is provided with a reflective layer 50 on a portion of the side wall 30-11 that is not in contact with the first light condensing structure 1. Figure 8 Exemplarily, as shown in FIG. 1A, the side wall 30-11 of at least one of the plurality of first openings 30-1 is provided with a reflective layer 50 on a portion of the side wall 30-11 that is not in contact with the first light condensing structure 1.

[0100] In some embodiments, as shown in FIG. 1A, the display panel 100 comprises a plurality of first openings 30-1, and each first opening 30-1 is filled with a barrier wall 30-2.

[0101] Figure 9 , Figure 10 ​As shown, the plurality of light emitting chips 20-1 emit light rays of the same color; the display panel 100 further comprises a color conversion layer 60 and a color filter layer 80, the color conversion layer 60 comprises a plurality of color conversion portions 60-1, one color conversion portion 60-1 of the plurality of color conversion portions 60-1 is located in one first opening 30-1 of the plurality of first openings 30-1 and is located on the side of the first light collecting structure 1 away from the light emitting chip 20-1; each color conversion portion 60-1 of the plurality of color conversion portions 60-1 is used to convert the light rays emitted by the corresponding light emitting chip 20-1 into light rays of a set color; the color filter layer 80 is arranged on the side of the color conversion layer 60 away from the light emitting chip layer 20, and the color filter layer 80 comprises a plurality of filter portions 80-1, each filter portion 80-1 of the plurality of filter portions 80-1 corresponds to one light emitting chip 20-1 of the plurality of light emitting chips 20-1.

[0102] Exemplarily, the plurality of light emitting chips 20-1 can all be light emitting chips 20-1 of the same color, emitting light rays of the same color; for example, the plurality of light emitting chips 20-1 can all be blue light emitting chips, all emitting blue light rays.

[0103] In some embodiments, as shown in Figure 9 , Figure 10 The display panel 100 can further comprise a color conversion layer 60, the color conversion layer 60 comprises a plurality of color conversion portions 60-1, for example, the plurality of color conversion portions 60-1 can comprise red color conversion portions, green color conversion portions and blue color conversion portions, one color conversion portion 60-1 is filled in one first opening 30-1 and is located on the side of the first opening 30-1 away from the light emitting chip 20-1.

[0104] Exemplarily, when the plurality of light emitting chips 20-1 are all blue light emitting chips, the color conversion portion 60-1 (red color conversion portion) converts the blue light rays emitted by the blue light emitting chip into red light rays; the color conversion portion 60-1 (green color conversion portion) converts the blue light rays emitted by the blue light emitting chip into green light rays; and the color conversion portion 60-1 (blue color conversion portion) can be of a transparent material, so that the blue light rays emitted by the blue light emitting chip can pass through.

[0105] In some embodiments, as shown in Figure 9 , Figure 10As shown, the display panel 100 can further include a color filter layer 80, the color filter layer 80 is located on the side of the color conversion layer 60 away from the light-emitting chip layer 20, and the color filter layer 80 includes a plurality of filter parts 80-1, which can include red filter parts, green filter parts, and blue filter parts, for example. The red filter parts correspond to the red color conversion parts (the red filter parts are located above the red color conversion parts), the green filter parts correspond to the green color conversion parts (the green filter parts are located above the green color conversion parts), and the blue filter parts correspond to the blue color conversion parts (the blue filter parts are located above the blue color conversion parts). The red filter parts, the green filter parts, and the blue filter parts allow red light, green light, and blue light to pass through, respectively.

[0106] In some embodiments, as shown in Figure 9 , Figure 10 the blue light emitted by the light-emitting chip 20-1 (blue light-emitting chip) is converted into red light and green light through the red color conversion part and the green color conversion part, respectively. After passing through the red filter part and the green filter part, the red light and the green light make the corresponding sub-pixel P display more pure red or green. The blue light emitted by the light-emitting chip 20-1 (blue light-emitting chip) passes through the blue color conversion part and is filtered by the blue filter part, making the corresponding sub-pixel P display more pure blue. At the same time, a small part of the blue light that is not converted into red light or green light by the color conversion part 60-1 (red color conversion part or green color conversion part) can be filtered out by the corresponding filter part 80-1 on the color filter layer 80, effectively preventing the leakage of blue light and ensuring the purity of the color displayed by each sub-pixel P.

[0107] In some embodiments, as shown in Figure 9 , Figure 10 the plurality of light-emitting chips 20-1 emit light of the same color; the display panel 100 further includes a color conversion layer 60 and a color filter layer 80. The color conversion layer 60 is filled in the plurality of first openings 30-1 of the barrier wall layer 30 and is located on the side of the first light condensing structure 1 away from the light-emitting chip layer 20. The color conversion layer 60 is used to convert the light emitted by the plurality of light-emitting chips 20-1 into white light. The color filter layer 80 is arranged on the side of the color conversion layer 60 away from the light-emitting chip layer 20, and the color filter layer 80 includes a plurality of filter parts 80-1. Each filter part 80-1 of the plurality of filter parts 80-1 corresponds to one light-emitting chip 20-1 of the plurality of light-emitting chips 20-1.

[0108] For example, the plurality of light-emitting chips 20-1 can all be blue light-emitting chips and emit blue light.

[0109] In some embodiments, as shown in Figure 9 , Figure 10As shown, the display panel 100 can further include a color conversion layer 60, the color conversion layer 60 including a plurality of color conversion portions 60-1, which can be white color conversion portions for example, one color conversion portion 60-1 (white color conversion portion) being filled in one first opening 30-1 and being located on the side of the first opening 30-1 away from the light emitting chip 20-1; the color conversion portion 60-1 (white color conversion portion) converting the blue light emitted by the plurality of blue light emitting chips into white light.

[0110] Exemplarily, the blue light emitted by each blue light emitting chip has different wavelengths, and the conversion efficiency of the blue light into red light or green light is greatly different after the blue light of different wavelengths passes through the color conversion portions 60-1 of other colors, such as red color conversion portions or green color conversion portions, which will result in a great difference in the final color brightness displayed by the display panel 100.

[0111] The color conversion portion 60-1 of the present solution is a white color conversion portion, and the conversion efficiency of the blue light of different wavelengths into white light is less different after the blue light passes through the white color conversion portion, which reduces the sensitivity of the color conversion portion 60-1 of the color conversion layer 60 to the wavelength of the blue light for example, effectively reduces the final color brightness difference displayed by the display panel 100, and meanwhile, the white light of one sub-pixel P can be incident into the area of the adjacent sub-pixel P after the blue light is converted into white light, and the problem of crosstalk of light of different colors does not occur.

[0112] In some embodiments, as shown in Figure 9 、 Figure 10 The display panel 100 can further include a color filter layer 80, the color filter layer 80 being located on the side of the color conversion layer 60 away from the light emitting chip layer 20, the color filter layer 80 including a plurality of filter portions 80-1, which can include red filter portions, green filter portions and blue filter portions for example, the red filter portions, the green filter portions and the blue filter portions allowing red light, green light and blue light to pass through respectively.

[0113] In some embodiments, as shown in Figure 9 、 Figure 10As shown, each filter part 80-1 corresponds to one light emitting chip 20-1, and the blue light emitted by the light emitting chip 20-1 (blue light emitting chip) is converted into white light by the color conversion part 60-1 (white color conversion part), and then the white light passes through the multiple filter parts 80-1 (red filter part, green filter part, blue filter part) of the color filter layer 80, and the red filter part, the green filter part and the blue filter part respectively allow red light, green light and blue light to pass through, so that full-color display of the display panel 100 can be realized; at the same time, a small part of the blue light that is not converted into white light by the color conversion part 60-1 (white color conversion part) can be filtered out by the filter part 80-1 of the color filter layer 80, so as to ensure the purity of the display color of each sub-pixel P.

[0114] In some embodiments, as shown in Figure 9 , Figure 10 , the color filter layer 80 further includes a blocking part 80-2 arranged at intervals between the multiple filter parts 80-1.

[0115] For example, as shown in Figure 9 , Figure 10 , one filter part 80-1 corresponds to one light emitting chip 20-1, and a blocking part 80-2 can be arranged between adjacent two filter parts 80-1, that is, the orthographic projection of the blocking part 80-2 on the light emitting chip layer 20 is located between the adjacent two light emitting chips 20-1.

[0116] For example, the blocking part 80-2 can be a black matrix, which can be used for light shielding. When the light emitted by the light emitting chips 20-1 of the adjacent two sub-pixels P is emitted to the corresponding filter part 80-1, part of the light has a large emission angle, and the light emitted by the light emitting chip 20-1 of one sub-pixel P will be emitted to the filter part 80-1 corresponding to the light emitting chip 20-1 of the other sub-pixel P, at this time, the problem of color mixing will occur between the adjacent two sub-pixels P. The blocking part 80-2 blocks the light emitted by one sub-pixel P and having a large emission angle when emitted to the corresponding filter part 80-1, effectively avoiding the problem of color mixing, and improving the contrast of red, blue and green.

[0117] In some embodiments, as shown in Figure 9 , Figure 10 , the display panel 100 further includes a light condensing layer 90, the light condensing layer 90 is arranged on the side of the color filter layer 80 away from the light emitting chip layer 20, and the light condensing layer 90 includes multiple second light condensing structures 2, each second light condensing structure 2 of the multiple second light condensing structures 2 corresponds to one light emitting chip 20-1 of the multiple light emitting chips 20-1.

[0118] For example, as shown in Figure 11 , Figure 12As shown, an inorganic planar layer can be formed on the side of the color filter layer 80 away from the light-emitting chip layer 20, and the inorganic planar layer can be made of an inorganic material, for example. A light-concentrating layer 90 can be disposed on the inorganic planar layer, and the light-concentrating layer 90 can be made of an organic material, for example.

[0119] In some embodiments, as shown in Figure 11 、 Figure 12 The second light-concentrating structure 2 can include a convex lens, for example. The convex lens can be formed by exposure and post-baking, and the ratio of the diameter to the height of the convex lens can be 2:1-4:1.

[0120] Exemplarily, the second light-concentrating structure 2 can improve the light-emitting efficiency of the corresponding sub-pixel P, thereby improving the light-emitting efficiency of the display panel 100.

[0121] In some embodiments, as shown in Figure 11 、 Figure 12 、 Figure 9 、 Figure 10 The display panel 100 further includes a protective layer 70 disposed between the color conversion layer 60 and the color filter layer 80.

[0122] Exemplarily, as shown in Figure 11 、 Figure 12 、 Figure 9 、 Figure 10 The color conversion part 60-1 can be prepared by printing, for example, and a protective layer 70 can be disposed above the color conversion part 60-1 to encapsulate the color conversion part 60-1, and the protective layer 70 is used to protect the color conversion part 60-1; the material of the protective layer 70 can be silicon nitride SiN, or a composite material of silicon nitride SiN and silicon oxide SiO, for example.

[0123] In some embodiments, the drive backplane 10 includes a substrate 11 made of silicon.

[0124] Exemplarily, each film layer of the display panel 100 can be prepared on the silicon substrate 11.

[0125] Exemplarily, the PPI of the display panel 100 can be greater than 3000 PPI, and the display panel 100 can be a super-high PPI and super-high brightness display panel.

[0126] On the other hand, as shown in Figure 11 A display device 1000 is provided, which includes the display panel 100 and the drive chip 200 described above, and the drive chip 200 is connected to the display panel 100.

[0127] Exemplarily, the display device 1000 can be any device that displays, regardless of whether it is moving (e.g., a video) or stationary (e.g., a still image), and regardless of whether it is textual or graphical. The display device 1000 includes, but is not limited to, a television, a mobile phone, a wearable device, a Personal Digital Assistant (PDA), an Augmented Reality (AR) device, a Virtual Reality (VR) device, a handheld or portable computer, a GPS receiver / navigator, a camera, an MP4 video player, a camcorder, a game console, a clock, a calculator, a television monitor, a flat panel display, a computer monitor, a vehicle display (e.g., an odometer display, etc.), a navigation instrument, a cockpit controller and / or display, a display of a camera view (e.g., a display of a rear view camera in a vehicle), an electronic photograph, an electronic billboard or sign, a projector, a building structure, a packaging and an aesthetic structure (e.g., a display of an image for a piece of jewelry), and / or the like.

[0128] Exemplarily, as shown in FIG. 1, the display device 1000 includes a display panel 100 and at least one driving chip 200 (Integrated Circuit, IC); the display panel 100 is coupled with the driving chip 200, and the driving chip 200 is configured to provide an electrical signal, e.g., a control signal, to the display panel 100. Figure 12 Figure 13 Figure 13

[0129] Exemplarily, the driving chip 200 can be a central processing unit, a digital signal processor, a single-chip microcomputer, a programmable logic controller, and / or the like. For example, the driving chip 200 can further include a memory, and can further include a power module and / or the like, and can achieve power supply and signal input / output functions through additionally arranged wires, signal lines, and / or the like. For example, the driving chip 200 can further include a hardware circuit and a computer executable code, and / or the like. The hardware circuit can include a conventional Very Large Scale Integration (VLSI) circuit or a gate array, and existing semiconductors such as logic chips, transistors, and / or other discrete elements; the hardware circuit can also include a field programmable gate array, a programmable array logic, a programmable logic device, and / or the like.

[0130] In the description of the present specification, specific features, structures, materials, or characteristics can be combined in any one or more embodiments or examples in a suitable manner.

[0131] The above description is merely specific embodiments of the present disclosure, but the protection scope of the present disclosure is not limited thereto, and any person skilled in the art can think of changes or replacements within the technical range disclosed by the present disclosure, which should be covered within the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be subject to the protection scope of the claims.​

Claims

1. A display panel, characterized in that, include: Drive backplane; A light-emitting chip layer is disposed on one side of the driving backplate, and the light-emitting chip layer includes a plurality of light-emitting chips; A barrier layer is disposed on the side of the light-emitting chip layer away from the driving backplate. The barrier layer includes a plurality of first openings, each of which exposes one of the plurality of light-emitting chips. A first light-concentrating structure is disposed within each of the plurality of first openings.

2. The display panel according to claim 1, characterized in that, The angle between the plane containing the sidewall of at least one of the plurality of first openings and the plane containing the surface of the light-emitting chip layer near the barrier layer is within a preset range.

3. The display panel according to claim 2, characterized in that, The preset range is 70° to 110°.

4. The display panel according to claim 1, characterized in that, The first focusing structure includes a convex lens.

5. The display panel according to any one of claims 1 to 4, characterized in that, The light-emitting chip layer includes a first electrode layer, which is close to the barrier layer and is disposed throughout the entire layer. The display panel also includes: A thermally conductive layer is disposed between the first electrode layer and the baffle layer. The thermally conductive layer includes a plurality of second openings, each of which corresponds to one of the plurality of first openings. The first light-concentrating structure is also disposed within the corresponding second opening. The thermally conductive layer is made of a first metal material, and the barrier layer is made of a second metal material. The thermal conductivity of the first metal material is higher than that of the second metal material.

6. The display panel according to any one of claims 1 to 4, characterized in that, A reflective layer is provided on the sidewall of at least one of the plurality of first openings, in the portion of which is not in contact with the first light-concentrating structure.

7. The display panel according to any one of claims 1 to 4, characterized in that, The multiple light-emitting chips emit light of the same color; The display panel also includes: A color-converting layer is provided, which fills the plurality of first openings in the barrier layer and is located on the side of the first light-concentrating structure away from the light-emitting chip; the color-converting layer is used to convert the light emitted by the plurality of light-emitting chips into white light. A color filter layer is disposed on the side of the color conversion layer away from the light-emitting chip layer. The color filter layer includes a plurality of filter portions, each of which corresponds to one of the plurality of light-emitting chips.

8. The display panel according to any one of claims 1 to 4, characterized in that, The multiple light-emitting chips emit light of the same color; The display panel also includes: A color conversion layer, comprising a plurality of color conversion sections, wherein one of the plurality of color conversion sections is located within one of the plurality of first openings and is located on the side of the first light-concentrating structure away from the light-emitting chip; each of the plurality of color conversion sections is used to convert the light emitted by the corresponding light-emitting chip into light of a set color; A color filter layer is disposed on the side of the color conversion layer away from the light-emitting chip layer. The color filter layer includes a plurality of filter portions, each of which corresponds to one of the plurality of light-emitting chips.

9. The display panel according to claim 7, characterized in that, The color filter layer also includes partitions disposed at the intervals between the plurality of filter portions.

10. The display panel according to claim 7, characterized in that, Also includes: A light-concentrating layer is disposed on the side of the color filter layer away from the light-emitting chip layer. The light-concentrating layer includes a plurality of second light-concentrating structures, each of which corresponds to one of the plurality of light-emitting chips.

11. The display panel according to claim 10, characterized in that, The second focusing structure includes a convex lens.

12. The display panel according to claim 7, characterized in that, Also includes: A protective layer is disposed between the color conversion layer and the color filter layer.

13. The display panel according to any one of claims 1 to 4, characterized in that, The drive backplane includes a substrate, the substrate being made of silicon.

14. A display device, characterized in that, include: The display panel according to any one of claims 1 to 13; The driver chip is connected to the display panel.

Images