Display device and display module

Abstract

The utility model relates to the technical field of display devices, and discloses a display device and a display module, the display device comprises a substrate, the substrate is provided with a light-emitting chip and a packaging layer, and the packaging layer wraps the light-emitting chip; the packaging layer is a packaging film; the packaging layer comprises a diffusion adhesive layer, a supporting layer and an anti-dazzle layer, the diffusion adhesive layer is adhered to the substrate, the supporting layer is laminated on the diffusion adhesive layer, the anti-dazzle layer is laminated on the supporting layer, and the anti-dazzle layer covers the light-emitting surface of the light-emitting chip and part of the side surface of the light-emitting chip; the packaging layer is provided with a chip accommodating groove which takes the direction from the diffusion adhesive layer to the anti-dazzle layer as the opening direction. According to the utility model, the packaging layer formed by the packaging membrane is adopted, and the chip accommodating groove is arranged, so that the whole structure of the device is thinner, the surface consistency is better, the manufacturing efficiency of the device is effectively improved, and the display effect of the device is optimized.

Description

TECHNICAL FIELD

[0001] The utility model relates to display device technical field especially relates to a display device and display module. BACKGROUND

[0002] With the continuous development of the current society towards digitization and intelligentization, the display function of display device is gradually changing from traditional display to personalized display, and the display performance requirements of display device are gradually increasing, and the structure is also developing towards miniaturization and microtization.

[0003] The display device adopting the MIP (Mini / Micro LED in Package, micro integrated packaging) packaging technology can realize the manufacturing of smaller size display device, but there is still a bottleneck in the process of packaging layer. The current MIP display device usually adopts liquid state molding technology, and the packaging layer is formed by the scheme of traditional bottom filling + transparent adhesive, the overall structure is relatively thick, the surface consistency is poor, the display effect of the device is affected, and due to the complex process technology, the process difficulty and manufacturing cost are high, and the manufacturing efficiency is low. UTILITY MODEL CONTENTS

[0004] The utility model aims at overcoming the insufficient prior art, and provides a display device and display module, which adopts a packaging layer formed by a packaging film, and is provided with a chip receiving groove, so that the overall structure of the device is thinner, the surface consistency is better, the manufacturing efficiency of the device is effectively improved, and the display effect of the device is optimized.

[0005] The utility model provides a kind of display device, the display device includes substrate, and the substrate is provided with light-emitting chip and packaging layer, and the packaging layer covers the light-emitting chip;

[0006] The packaging layer is a packaging film;

[0007] The packaging layer includes diffusion adhesive layer, support layer and anti-glare layer, the diffusion adhesive layer is bonded on the substrate, the support layer is superimposed on the diffusion adhesive layer, and the anti-glare layer is superimposed on the support layer, and the anti-glare layer covers the light-emitting chip light-emitting surface and part of the side surface of the light-emitting chip;

[0008] Chip receiving groove is opened in the packaging layer, and the opening direction of the chip receiving groove is from the diffusion adhesive layer to the anti-glare layer, the groove depth of the chip receiving groove The thickness of the diffusion adhesive layer The thickness of the support layer And the thickness of the anti-glare layer The relationship is: .

[0009] Further, the haze of the encapsulation layer is 50%-99%.

[0010] Further, the material of the diffusion adhesive layer is a mixture of acrylic resin and polymethyl methacrylate.

[0011] The material of the anti-glare layer is acrylic resin.

[0012] Further, the material of the support layer is polyethylene terephthalate.

[0013] Further, the anti-glare layer is doped with scattering particles, and the material of the scattering particles includes at least one of silica, titanium oxide, calcium carbonate, calcium silicate, ferric oxide, carbon black, zinc oxide, barium titanate and aluminum oxide.

[0014] Further, the surface of the anti-glare layer is formed with a micro-concave-convex structure.

[0015] Further, the encapsulation layer further includes a black layer, and the black layer is arranged between the support layer and the anti-glare layer.

[0016] Further, the material of the black layer is a mixture of acrylic resin and black paste.

[0017] Further, the groove depth of the chip receiving groove is related to the thickness of the diffusion adhesive layer , the thickness of the support layer , the thickness of the anti-glare layer and the thickness of the black layer . .

[0018] The utility model further provides a display module, the display module includes the display device.

[0019] The utility model provides a kind of display device and display module, adopt to form the encapsulation layer of packaging membrane sheet, compared with the encapsulation layer formed by traditional transparent adhesive as material, the overall structure of device can be made thinner, surface consistency is better;Chip storage groove is arranged in encapsulation layer, and the light-emitting chip on cladding matching substrate is covered, improves structural consistency and stability;The dimensional relationship of chip storage groove and diffusion adhesive layer, support layer and anti-glare layer is arranged, so that the light emitted by light-emitting chip can have enough diffuse reflection effect in anti-glare layer, ensure the display effect of display device;Packaging membrane sheet is formed encapsulation layer using vacuum pressing process mode, the same effect of more steps of traditional liquid state mould pressing process mode can be realized by once pressing, process difficulty is lower;For defective product, only need to carry out high-temperature baking can realize film tearing replacement while not damaging light-emitting chip, manufacturing cost is lower, above-mentioned can effectively improve the manufacturing efficiency of device, optimize the display effect of device. BRIEF DESCRIPTION OF DRAWINGS

[0020] Figure 1 It is the display device structure section view schematic diagram in the utility model embodiment one;

[0021] Figure 2 It is the encapsulation layer structure section view schematic diagram in the utility model embodiment one;

[0022] Figure 3 It is the display device structure section view schematic diagram in the utility model embodiment two;

[0023] Figure 4 It is the encapsulation layer structure section view schematic diagram in the utility model embodiment two. DETAILED DESCRIPTION

[0024] The technical scheme in the utility model embodiments will be described clearly and completely in conjunction with the drawings of the utility model embodiments, and obviously, the described embodiments are only part of the embodiments of the utility model, not all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor belong to the scope of protection of the utility model.

[0025] In the utility model, it should be understood that terms such as "include" or "have" are intended to indicate the existence of features, numbers, steps, acts, components, parts or combinations thereof disclosed in the specification, and do not exclude the possibility of existence or addition of one or more other features, numbers, steps, acts, components, parts or combinations thereof.

[0026] In addition, it should be further pointed out that the embodiments in the utility model and the features in the embodiments can be combined with each other without conflict. The utility model will be described in detail below with reference to the drawings and in conjunction with embodiments.

[0027] Example 1

[0028] This utility model provides a display device, which includes a substrate, on which a light-emitting chip and an encapsulation layer are disposed, and the encapsulation layer covers the light-emitting chip.

[0029] The encapsulation layer is an encapsulation film;

[0030] The encapsulation layer includes a diffusion adhesive layer, a support layer, and an anti-glare layer. The diffusion adhesive layer is bonded to the substrate, the support layer is stacked on the diffusion adhesive layer, and the anti-glare layer is stacked on the support layer. The anti-glare layer covers the light-emitting surface of the light-emitting chip and part of the side surface of the light-emitting chip.

[0031] The encapsulation layer has a chip receiving groove with its opening direction being from the diffusion adhesive layer towards the anti-glare layer, and the depth of the chip receiving groove is... With respect to the thickness of the diffusion adhesive layer The thickness of the support layer and the thickness of the anti-glare layer The relationship is: .

[0032] In one optional implementation of this embodiment, such as Figure 1 As shown, Figure 1 The diagram shows a cross-sectional view of the display device structure in Embodiment 1 of the present invention. The display device includes a substrate 1, on which three light-emitting chips 2 and an encapsulation layer 3 are disposed. The encapsulation layer 3 covers the three light-emitting chips 2.

[0033] Specifically, three light-emitting chips 2 are fixedly soldered onto the front side of the substrate 1, and an encapsulation layer 3 is formed on the front side of the substrate 1. The encapsulation layer 3 covers the front side of the substrate 1 and completely encapsulates the three light-emitting chips 2.

[0034] In an optional implementation of this embodiment, the encapsulation layer 3 is an encapsulation film.

[0035] Specifically, the encapsulation layer 3 is an encapsulation film with a multi-layer structure. The encapsulation film is pressed onto the substrate 1 and subjected to vacuum pressing conditions, including a temperature of 80℃-130℃, a vacuum time of 0.5 min-1 min, a pressure of 0.3 MPa-0.8 MPa, and a pressing time of 1 min-2 min, to bring the encapsulation film into a molten state. Then, a secondary curing is performed, including a secondary curing condition of a temperature of 120℃-160℃ and a time of 1 h-2 h, to harden and form the encapsulation layer 3 disposed on the substrate 1 and covering the light-emitting chip 2.

[0036] Here, the traditional MIP device usually adopts a liquid molding scheme, and the package layer is formed by the scheme of underfilling + transparent adhesive, but the traditional packaging method has certain disadvantages: the package layer formed is relatively thick, and the surface consistency of the package layer cannot be finely controlled, which affects the display effect of the device; and the process of the traditional liquid molding scheme is relatively complex, the process difficulty and process cost are relatively high, thereby affecting the manufacturing efficiency of the device;

[0037] Therefore, in the embodiment, the scheme of vacuum pressing + packaging film is adopted, the packaging film with a multi-layer structure is first made, and then the packaging film is pressed on the substrate by vacuum pressing to form a package layer, so that the overall structure of the device is thinner, the surface consistency is better, and only one pressing is needed to replace the multi-process of the traditional liquid molding scheme, the process difficulty is lower; for defective products, after high-temperature baking, the defective packaging film can be torn off without damaging the soldered light-emitting chip, and the packaging film can be replaced, the depreciation cost is lower, the process cost is correspondingly lower, the manufacturing efficiency of the device is effectively improved, and the display effect of the device is optimized.

[0038] In one optional implementation manner of the embodiment, as shown in Figure 1 and Figure 2 , as shown in Figure 2 , a cross-sectional schematic view of the package layer structure in the embodiment of the utility model is shown, Figure 2 , which shows the structure of the packaging film when the package layer is formed without vacuum pressing. The package layer 3 includes a diffusion adhesive layer 31, a support layer 32 and an anti-glare layer 33. The diffusion adhesive layer 31 is bonded to the substrate 1. The support layer 32 is superimposed on the diffusion adhesive layer 31. The anti-glare layer 33 is superimposed on the support layer 32. The anti-glare layer 33 covers the light-emitting surface of the light-emitting chip 2 and part of the side surface of the light-emitting chip 2.

[0039] Specifically, the package layer 3 includes three layers of structure from bottom to top, which are the diffusion adhesive layer 31, the support layer 32 and the anti-glare layer 33. The diffusion adhesive layer 31 is located at the lowermost layer and is bonded to the substrate 1 and in contact with part of the side surface of the light-emitting chip 2, which is used to bond the whole packaging film to the substrate 1 during vacuum pressing and to increase the light-emitting uniformity of the light-emitting chip 2. The support layer 32 is superimposed on the diffusion adhesive layer 31 and in contact with part of the side surface of the light-emitting chip 2, which is used to support the overall mechanical properties of the packaging film, provide the bonding force between the layers of the package layer 3 and improve the stability of the overall structure of the package layer 3. The anti-glare layer 33 is superimposed on the support layer 32 and in contact with part of the side surface of the light-emitting chip 2, and completely covers the entire upper surface light-emitting surface of the light-emitting chip 2, which is used to improve the anti-reflection and anti-glare ability of the package layer 3, improve the light-emitting effect of the light-emitting chip 2, and thereby improve the display effect of the overall device.

[0040] In an optional implementation of the embodiment, the material of the diffusion adhesive layer 31 is a mixture of acrylic resin and polymethyl methacrylate.

[0041] Specifically, in the material of the diffusion adhesive layer 31, the acrylic resin provides adhesion to the substrate 1, and the polymethyl methacrylate provides support for the overall structure of the diffusion adhesive layer 31.

[0042] Further, the material of the diffusion adhesive layer 31 can include at least one of acrylic resin, polymethyl methacrylate, acrylic modified resin, epoxy resin, epoxy modified resin, polyurethane resin, polyurethane modified resin, silicone resin, and silicone modified resin.

[0043] In an optional implementation of the embodiment, the thickness of the diffusion adhesive layer 31 is 7um≤ ≤13um.

[0044] Specifically, the thickness of the diffusion adhesive layer 31 can be one of 7um, 9um, 11um, and 13um, which is determined according to actual design requirements. Here, the thickness of the diffusion adhesive layer is set so that the diffusion adhesive layer has sufficient adhesion to bond the packaging layer to the substrate, improving the stability of the device structure.

[0045] In an optional implementation of the embodiment, the material of the support layer 32 is polyethylene terephthalate.

[0046] Specifically, the polyethylene terephthalate has good mechanical properties and excellent structural stability, and is used to provide the mechanical properties of the support layer 32, ensuring the bonding force and overall stability of the multi-layer structure of the packaging layer 3.

[0047] In an optional implementation of the embodiment, the thickness of the support layer 32 is 33um≤

[0048] ≤40um. Specifically, the thickness of the support layer 32 can be one of 33um, 35um, 37um, and 40um, which is determined according to actual design requirements.

[0049] Here, the thickness of the support layer is set so that the support layer has sufficient mechanical properties to support the overall structure of the packaging layer, improving the overall stability of the structure of the packaging layer.

[0050]

[0051] ​​​​In an optional implementation of the embodiment, the material of the anti-glare layer 33 is acrylic resin.

[0052] Specifically, the anti-glare layer 33 made of acrylic resin can achieve the anti-reflection and anti-glare performance after surface treatment.

[0053] Further, the material of the anti-glare layer 33 can be at least one of acrylic resin, polymethyl methacrylate, acrylic modified resin, epoxy resin, epoxy modified resin, polyurethane resin, polyurethane modified resin, silicone resin, and silicone modified resin.

[0054] In an optional implementation of the embodiment, the anti-glare layer 33 is doped with scattering particles, and the material of the scattering particles includes at least one of silicon dioxide, titanium oxide, calcium carbonate, calcium silicate, ferric oxide, carbon black, zinc oxide, barium titanate, and aluminum oxide.

[0055] Specifically, by doping micro-nano scattering particles such as silicon dioxide and aluminum oxide in the anti-glare layer 33, a non-uniform coating structure is formed to scatter incident light and optimize the display effect.

[0056] In an optional implementation of the embodiment, the surface of the anti-glare layer 33 is formed with a micro-concave-convex structure.

[0057] Specifically, the micro-concave-convex structure is formed on the surface of the anti-glare layer 33 by a coating process (such as micro-concave coating) or post-processing, which breaks the regular reflection path of light and realizes diffuse reflection of light, thereby optimizing the display effect of the device.

[0058] In an optional implementation of the embodiment, the thickness of the anti-glare layer 33 is The value range of the thickness of the anti-glare layer 33 is: 120um≤ ≤130um.

[0059] Specifically, the thickness of the anti-glare layer 33 can be one of 120um, 122um, 124um, 126um, 128um, and 130um, which is determined according to actual design requirements.

[0060] Here, the thickness of the anti-glare layer is set so that the light emitted by the light-emitting chip has a long enough diffuse reflection path in the anti-glare layer, thereby further ensuring the display effect of the display device.

[0061] In an optional implementation of the embodiment, the haze value of the encapsulation layer is in the range of 50%-99%, and can be one of 50%, 60%, 70%, 80%, 90%, and 99%, which is determined according to actual design requirements. ​

[0062] Specifically, haze refers to the percentage of transmitted light intensity that deviates from the incident light by more than 2.5° from the total transmitted light intensity. The greater the haze, the lower the gloss and transparency. A high-haze encapsulation layer causes light to diffusely reflect inside the device, transforming the point light source of the display device into a surface light source. This avoids the "dot matrix" effect of individual display devices being visible to the naked eye, making the display image more uniform and softer, and effectively optimizing the display effect.

[0063] Here, the haze value of the encapsulation layer is selected to be in the range of 50%-99%, which is a high haze value. This allows the light emitted by the light-emitting chip to produce a strong diffuse reflection phenomenon in the encapsulation layer, forming a "flatness" on the light-emitting surface of the display device and optimizing the display effect.

[0064] In an optional implementation of this embodiment, the encapsulation layer 3 has a chip storage groove 4 with the opening direction being from the diffusion adhesive layer 31 to the anti-glare layer 33.

[0065] Specifically, such as Figure 2 As shown, the encapsulation layer 3 has three openings, with the opening direction being from the diffusion adhesive layer 31 to the anti-glare layer 33. That is, the opening is etched from the diffusion adhesive layer 31, penetrates the diffusion adhesive layer 31 and the support layer 32, and extends into the chip storage groove 4 in the anti-glare layer 33. The chip storage groove 4 is used to cover and match the light-emitting chip 2 when the encapsulation film is pressed onto the substrate 1, so that the encapsulation film is tightly bonded to the substrate 1 and the light-emitting chip 2 fixedly soldered on the substrate 1, thereby improving structural consistency and stability.

[0066] Furthermore, based on the position and height of the light-emitting chip 2 on the substrate 1, a corresponding chip storage groove is formed on the encapsulation film in advance. The depth of the chip storage groove corresponds to the height of the light-emitting chip 2, and after the encapsulation film is pressed together, the chip storage groove and the light-emitting chip correspond one-to-one.

[0067] In an optional implementation of this embodiment, the depth of the chip receiving slot 4 is... With respect to the thickness of the diffusion adhesive layer 31 The thickness of the support layer 32 and the thickness of the anti-glare layer 33 The relationship is: .

[0068] Specifically, the depth of the chip storage slot 4 is set according to the height of the light-emitting chip 2. And correspondingly adjust the thickness of the diffusion adhesive layer 31. The thickness of the support layer 32 and the thickness of the anti-glare layer 33 Adjustments will be made.

[0069] By setting the relationship between the depth of the chip receiving slot 4 and the thickness of the diffusion adhesive layer 31, the thickness of the support layer 32, and the thickness of the anti-glare layer 33, the bonding force between the encapsulation layer 3 and the substrate 1 and the light-emitting chip 2 is ensured, thereby improving the stability of the overall device structure.

[0070] Specifically, settings That is, the plane at the bottom of the chip storage slot 4 is located in the area where the anti-glare layer 33 is located, ensuring that after the chip storage slot 4 is fitted with the light-emitting chip 2, the light emitted from the light-emitting surface of the light-emitting chip 2 passes through the bottom of the chip storage slot 4 and directly enters the anti-glare layer 33, where it undergoes subsequent diffuse reflection, avoiding light loss caused by light entering the diffusion adhesive layer 31 or the support layer 32; The light emitted from the light-emitting surface of the light-emitting chip 2, after passing through the bottom of the chip storage groove 4, still has a sufficient thickness, namely at least half the thickness, of the anti-glare layer 33 to diffuse the emitted light. The above-mentioned size relationship is set to ensure that the light emitted by the light-emitting chip 2 has a sufficient diffuse reflection effect in the anti-glare layer 33, thereby ensuring the display effect of the device.

[0071] In one optional implementation of this embodiment, the light-emitting chip 2 is a conventional chip; or the light-emitting chip 2 is a flip chip.

[0072] Specifically, in this embodiment, all three light-emitting chips 2 are flip chips.

[0073] In an optional implementation of this embodiment, the light-emitting chip 2 is a red light chip, a green light chip, or a blue light chip.

[0074] Specifically, in this embodiment, of the three light-emitting chips 2, one is a red light chip, one is a green light chip, and one is a blue light chip.

[0075] Furthermore, this embodiment applies to a device scheme for fully flip-chip red, green, and blue chips.

[0076] In summary, Embodiment 1 of this utility model provides a display device that employs an encapsulation layer formed by an encapsulation film. Compared to traditional encapsulation layers formed using transparent adhesive, the overall structure of the device can be thinner and has better surface consistency. A chip receiving groove is provided in the encapsulation layer to cover the light-emitting chip on the matching substrate, improving structural consistency and stability. The dimensional relationship between the chip receiving groove and the diffusion adhesive layer, support layer, and anti-glare layer is designed so that the light emitted by the light-emitting chip has sufficient diffuse reflection effect in the anti-glare layer, ensuring the display effect of the display device. The encapsulation film is formed using a vacuum pressing process, achieving the same effect as the multi-step traditional liquid molding process in a single pressing, thus reducing process difficulty. For defective products, only high-temperature baking is required to remove the film for replacement without damaging the light-emitting chip, resulting in lower manufacturing costs. In summary, this effectively improves the manufacturing efficiency of the device and optimizes its display effect.

[0077] Example 2

[0078] This utility model provides a display device, which includes a substrate, on which a light-emitting chip and an encapsulation layer are disposed, and the encapsulation layer covers the light-emitting chip.

[0079] The encapsulation layer is an encapsulation film;

[0080] The encapsulation layer includes a diffusion adhesive layer, a support layer, and an anti-glare layer. The diffusion adhesive layer is bonded to the substrate, the support layer is stacked on the diffusion adhesive layer, and the anti-glare layer is stacked on the support layer. The anti-glare layer covers the light-emitting surface of the light-emitting chip and part of the side surface of the light-emitting chip.

[0081] The encapsulation layer has a chip receiving groove with its opening direction being from the diffusion adhesive layer towards the anti-glare layer, and the depth of the chip receiving groove is... With respect to the thickness of the diffusion adhesive layer The thickness of the support layer and the thickness of the anti-glare layer The relationship is: .

[0082] It should be noted that the structure of the display device in this embodiment is basically the same as that of the display device in Embodiment 1, with the following differences:

[0083] In one optional implementation of this embodiment, such as Figure 3 and Figure 4 As shown, Figure 3 This diagram shows a cross-sectional view of the display device structure in Embodiment 2 of the present invention. Figure 4A cross-sectional schematic diagram of the encapsulation layer structure in Embodiment 2 of this utility model is shown. The encapsulation layer 3 further includes a black layer 34, which is disposed between the support layer 32 and the anti-glare layer 33.

[0084] Specifically, in this embodiment, the encapsulation layer 3 includes a four-layer structure, which from bottom to top are a diffusion adhesive layer 31, a support layer 32, a black layer 34 and an anti-glare layer 33, wherein the black layer 34 is used to provide ink color.

[0085] Furthermore, in this embodiment, all three light-emitting chips 3 are upright chips, or at least one of the three light-emitting chips 3 is an upright chip.

[0086] Specifically, considering the device solution using a standard chip, wire bonding is required for the standard chip. Therefore, wire bonding pads need to be set on the substrate 1. The presence of wire bonding pads will affect the consistency of the background color of the substrate 1, thereby affecting the display effect of the device. Therefore, in this embodiment, a black layer 34 is set in the encapsulation layer 3 to improve the overall black color of the device, and improve the contrast and surface consistency of the device, so as to ensure the display effect of the device.

[0087] In an optional implementation of this embodiment, the black layer 34 is made of a mixture of acrylic resin and black pigment.

[0088] Specifically, the acrylic resin is the main structural material of the black layer 34, and the black pigment is used to provide the ink color.

[0089] Furthermore, the black pigment paste includes at least one of carbon black, carbon nanotubes, graphene, and graphite.

[0090] In an optional implementation of this embodiment, the thickness of the black layer 34 is... The range of values ​​for is: 3um≤ ≤7um.

[0091] Specifically, the thickness of the black layer 34 The possible values ​​are 3um, 4um, 5um, 6um, and 7um, which are determined according to the actual design requirements.

[0092] The thickness of the black layer is set here to ensure that it provides sufficient overall ink effect, thereby improving the contrast and surface consistency of the device and ensuring the display effect of the device.

[0093] In an optional implementation of this embodiment, the depth of the chip receiving slot 4 is... With respect to the thickness of the diffusion adhesive layer 31 The thickness of the support layer 32 The thickness of the anti-glare layer 33 and the thickness of the black layer 34 The relationship is: .

[0094] It should be noted that by setting the above height relationship, the black layer 34 is ensured not to cover the light-emitting surface of the upper surface of the light-emitting chip 2, and the black layer 34 will not affect the light-emitting surface of the light-emitting chip 2.

[0095] In summary, Embodiment 2 of this utility model provides a display device that employs an encapsulation layer formed by an encapsulation film. Compared to traditional encapsulation layers formed using transparent adhesive, the overall structure of the device can be thinner and has better surface consistency. A chip receiving groove is provided in the encapsulation layer to cover the light-emitting chip on the matching substrate, improving structural consistency and stability. The dimensional relationship between the chip receiving groove and the diffusion adhesive layer, support layer, and anti-glare layer is designed so that the light emitted by the light-emitting chip has sufficient diffuse reflection effect in the anti-glare layer, ensuring the display effect of the display device. The encapsulation film is formed using a vacuum pressing process, achieving the same effect as the multi-step traditional liquid molding process in a single pressing, thus reducing process difficulty. Defective products only require high-temperature baking to remove the film and replace it without damaging the light-emitting chip, resulting in lower manufacturing costs. The addition of a black layer further improves the contrast and surface consistency of the device. In summary, this effectively improves the manufacturing efficiency of the device and optimizes its display effect.

[0096] Example 3

[0097] This utility model provides a display module in embodiment three, which includes the display device in embodiment one or two.

[0098] In summary, Embodiment 3 of this utility model provides a display module, which includes the display device of Embodiment 1 or 2. It employs an encapsulation layer formed by an encapsulation film. Compared to the traditional encapsulation layer formed by transparent adhesive, the overall structure of the device can be thinner and has better surface consistency. A chip receiving groove is provided in the encapsulation layer to cover the light-emitting chip on the matching substrate, improving structural consistency and stability. The dimensional relationship between the chip receiving groove and the diffusion adhesive layer, support layer, and anti-glare layer is designed so that the light emitted by the light-emitting chip has sufficient diffuse reflection effect in the anti-glare layer, ensuring the display effect of the display device. The encapsulation film is formed by a vacuum pressing process, achieving the same effect as the multi-step traditional liquid molding process in a single pressing, thus reducing process difficulty. For defective products, only high-temperature baking is required to remove the film for replacement without damaging the light-emitting chip, resulting in lower manufacturing costs. In summary, this effectively improves the manufacturing efficiency of the device and optimizes its display effect.

[0099] The above provides a detailed description of a display device and display module provided by the embodiments of this utility model. Specific examples have been used to illustrate the principle and implementation of this utility model. The description of the above embodiments is only for the purpose of helping to understand the method and core idea of ​​this utility model. At the same time, for those skilled in the art, there will be changes in the specific implementation and application scope based on the idea of ​​this utility model. Therefore, the content of this specification should not be construed as a limitation of this utility model.

Claims

1. A display device, characterized in that, The display device includes a substrate, on which a light-emitting chip and an encapsulation layer are disposed, and the encapsulation layer covers the light-emitting chip. The encapsulation layer is an encapsulation film; The encapsulation layer includes a diffusion adhesive layer, a support layer, and an anti-glare layer. The diffusion adhesive layer is bonded to the substrate, the support layer is stacked on the diffusion adhesive layer, and the anti-glare layer is stacked on the support layer. The anti-glare layer covers the light-emitting surface of the light-emitting chip and part of the side surface of the light-emitting chip. The encapsulation layer has a chip receiving groove with its opening direction being from the diffusion adhesive layer towards the anti-glare layer, and the depth of the chip receiving groove is... With respect to the thickness of the diffusion adhesive layer The thickness of the support layer and the thickness of the anti-glare layer The relationship is: .

2. The display device as claimed in claim 1, characterized in that, The haze value of the encapsulation layer ranges from 50% to 99%.

3. The display device as described in claim 1, characterized in that, The diffusion adhesive layer is made of a mixture of acrylic resin and polymethyl methacrylate; The anti-glare layer is made of acrylic resin.

4. The display device as claimed in claim 1, characterized in that, The support layer is made of polyethylene terephthalate.

5. The display device as claimed in claim 1, characterized in that, The anti-glare layer is doped with scattering particles, and the material of the scattering particles includes at least one of silicon dioxide, titanium dioxide, calcium carbonate, calcium silicate, ferric oxide, carbon black, zinc oxide, barium titanate, and aluminum oxide.

6. The display device as claimed in claim 1, characterized in that, The surface of the anti-glare layer has a micro-uneven structure.

7. The display device as claimed in claim 1, characterized in that, The encapsulation layer also includes a black layer disposed between the support layer and the anti-glare layer.

8. The display device as claimed in claim 7, characterized in that, The black layer is made of a mixture of acrylic resin and black pigment.

9. The display device as claimed in claim 7, characterized in that, The depth of the chip storage slot With respect to the thickness of the diffusion adhesive layer The thickness of the support layer The thickness of the anti-glare layer and the thickness of the black layer The relationship is: .

10. A display module, characterized in that, The display module includes the display device according to any one of claims 1-9.

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