Display device

Abstract

The utility model relates to a display device. The display device includes: a substrate including a hole region in which a through hole is defined, a display region surrounding at least a portion of the hole region, and a hole peripheral region between the hole region and the display region; an interlayer insulating layer disposed in the hole peripheral area and the display area on the substrate; a first stacked structure disposed on the interlayer insulating layer and defining a first step portion having a first height in the hole peripheral region; and a second stacked structure disposed on the first stacked structure and defining a second step portion having a second height of 2.8 [mu] m or more in the hole peripheral region or the display region adjacent to the hole peripheral region.

Description

Technical Field

[0001] This utility model relates to a display device. More specifically, it relates to a display device having a perforated area. Background Technology

[0002] A display device is a device that includes a display panel for displaying images for providing visual information to a user.

[0003] Functional modules (e.g., camera modules) can be arranged in the display device, enabling users to perform various functions using the display device. For these functional modules to operate effectively, it is necessary to increase the transmittance of external light incident towards them. Furthermore, recently, to expand the display area of ​​the display device, structures are being developed that arrange the functional modules to overlap with the display area. Utility Model Content

[0004] The purpose of this invention is to provide a display device that improves the performance of the device by reducing the generation of air bubbles.

[0005] However, the purpose of this utility model is not limited to the above-mentioned purpose, and it can be expanded in various ways without departing from the idea and field of this utility model.

[0006] To achieve the aforementioned objective of this utility model, a display device according to an embodiment of this utility model may include: a substrate, including a hole region defining a through hole, a display region surrounding at least a portion of the hole region, and a hole periphery region located between the hole region and the display region; an interlayer insulating layer disposed on the substrate in the hole periphery region and the display region; a first stacking structure disposed on the interlayer insulating layer, and having a first step portion having a first height defined in the hole periphery region; and a second stacking structure disposed on the first stacking structure, and having a second step portion having a second height of about 2.8 μm or more defined in the hole periphery region or in the display region adjacent to the hole periphery region.

[0007] In one embodiment, the first height may be more than about 2.8 μm.

[0008] In one embodiment, the first height and the second height may be substantially the same as each other.

[0009] In one embodiment, the first height and the second height may be different from each other.

[0010] In one embodiment, the display device may further include: a first organic film disposed on the interlayer insulating layer in the periphery region of the hole and the display region; and a second organic film disposed on the first organic film in the periphery region of the hole and the display region.

[0011] In one embodiment, the first stacked structure may include the first organic film and the second organic film, wherein the upper surface of the second organic film, the side surface of the second organic film facing the through hole, and the upper surface of the interlayer insulating layer may together define the first step portion.

[0012] In one embodiment, the display device may further include: a third organic film disposed on the periphery region of the hole and the display region on the second organic film; a pixel defining film disposed on the third organic film; and a separator disposed on the pixel defining film in the display region.

[0013] In one embodiment, the second stacked structure may include the third organic film and the pixel definition film, wherein the upper surface of the pixel definition film, the side surface of the third organic film and the pixel definition film facing the through hole, and the upper surface of the second organic film may together define the second step portion.

[0014] In one embodiment, the second stacked structure may include the pixel defining film and the separator, wherein the upper surface of the separator, the pixel defining film, the side surface of the separator facing the through hole, and the upper surface of the third organic film may together define the second step portion.

[0015] In one embodiment, the third organic membrane may be disposed between the first stacked structure and the second stacked structure.

[0016] In one embodiment, the display device may further include: a pixel defining film disposed on the display area of ​​the second organic film; and a separator disposed on the display area of ​​the pixel defining film.

[0017] In one embodiment, the second stacked structure may include the pixel defining film and the separator, wherein the upper surface of the separator, the pixel defining film, the side surface of the separator facing the through hole, and the upper surface of the second organic film may together define the second stepped portion.

[0018] In one embodiment, the display device may further include: a touch sensing layer disposed on the display area and the periphery area of ​​the hole on the second stacked structure; an optical functional layer disposed on the touch sensing layer on the display area and the periphery area of ​​the hole; a window layer disposed throughout the hole area, the periphery area of ​​the hole and the display area on the optical functional layer; and a light-shielding member disposed within the window layer.

[0019] In one embodiment, the light-shielding component may have a single-layer structure.

[0020] In one embodiment, the light-shielding component may have a multi-layered structure.

[0021] In one embodiment, the touch sensing layer may be in contact with the optical functional layer.

[0022] To achieve the aforementioned objective of this utility model, a display device according to an embodiment of this utility model may include: a substrate, including a hole region defining a through hole, a display region surrounding at least a portion of the hole region, and a hole periphery region located between the hole region and the display region; an interlayer insulating layer disposed on the substrate in the hole periphery region and the display region; a first organic film disposed on the interlayer insulating layer in the hole periphery region and the display region; a second organic film disposed on the first organic film in the hole periphery region and the display region; a third organic film disposed on the second organic film in the hole periphery region and the display region; and a pixel defining film disposed on the third organic film in the hole periphery region and the display region, wherein a first step portion may be defined on the second organic film by means of the upper surface of the second organic film, the side surface of the second organic film covering the first organic film, and the upper surface of the interlayer insulating layer, and a second step portion may be defined on the third organic film and the pixel defining film by means of the upper surface of the pixel defining film, the side surface of the third organic film and the pixel defining film facing the through hole, and the upper surface of the second organic film.

[0023] In one embodiment, the height of each of the first step portion and the second step portion may be more than about 2.8 μm.

[0024] To achieve the aforementioned objective of this utility model, a display device according to an embodiment of this utility model may include: a substrate, including a hole region defining a through hole, a display region surrounding at least a portion of the hole region, and a hole periphery region located between the hole region and the display region; an interlayer insulating layer disposed on the substrate in the hole periphery region and the display region; a first organic film disposed on the interlayer insulating film in the hole periphery region and the display region; a second organic film disposed on the first organic film in the hole periphery region and the display region; and a third organic film disposed on the second organic film in the hole periphery region. The peripheral area and the display area; a pixel defining film disposed on the third organic film in the peripheral area of ​​the hole and the display area; and a separator disposed on the pixel defining film in the display area, wherein a first step portion can be defined on the second organic film by means of the upper surface of the second organic film, the side surface of the second organic film covering the first organic film and the upper surface of the interlayer insulating layer, and a second step portion can be defined on the pixel defining film and the separator by means of the upper surface of the separator, the side surface of the pixel defining film and the separator facing the through hole and the upper surface of the third organic film.

[0025] In one embodiment, the height of each of the first step portion and the second step portion may be more than about 2.8 μm.

[0026] In a display device according to an embodiment of the present invention, it may include: a first stacked structure having a first stepped portion having a first height defined in the periphery region of the hole; and a second stacked structure having a second stepped portion having a second height defined in the periphery region of the hole or in the display area. Both the first height and the second height may be approximately 2.8 μm or more. Accordingly, the tilt angle of the side surface of the second encapsulation layer facing the hole region can be increased, thereby approaching verticality. Accordingly, additional steps for forming components to compensate for the step difference between the optical functional layer and the touch sensing layer are unnecessary, thus reducing process costs and time. Furthermore, since the light-shielding component can have a single-layer structure, process costs and time can be further reduced.

[0027] However, the effects of this utility model are not limited to those described above, and can be extended in various ways without departing from the concept and scope of this utility model. Attached Figure Description

[0028] Figure 1 This is a plan view of a display device according to an embodiment of the present invention.

[0029] Figure 2 It is shown that it includes Figure 1 The circuit diagram of the pixels in the display device.

[0030] Figure 3 It shows along Figure 1 A cross-sectional view of the section cut by the I-I' line.

[0031] Figure 4 It is shown that it includes Figure 1 A cross-sectional view of an example of a section in the display area of ​​a display panel in a display device.

[0032] Figure 5 This is an enlarged illustration. Figure 3 A cross-sectional view of an example of the cross-section of region A.

[0033] Figure 6 This is an enlarged illustration. Figure 5 A cross-sectional view of region B1.

[0034] Figure 7 This is an enlarged illustration. Figure 3 Another example of a cross-section of region A.

[0035] Figure 8 This is an enlarged illustration. Figure 7 A cross-sectional view of region B2.

[0036] Figure 9 It is shown that it includes Figure 1 Another example of a cross-sectional view of the display area of ​​the display panel in a display device.

[0037] Figure 10 This is an enlarged illustration. Figure 3 Another example of a cross-section of region A.

[0038] Figure 11 This is an enlarged illustration. Figure 10 A cross-sectional view of region B3.

[0039] Explanation of reference numerals in the attached figures:

[0040] Detailed Implementation

[0041] Hereinafter, embodiments of the present invention will be described in more detail with reference to the accompanying drawings. The same reference numerals will be used for the same constituent elements in the drawings, and repeated descriptions of the same components will be omitted.

[0042] Figure 1 This is a plan view of a display device according to an embodiment of the present invention.

[0043] Reference Figure 1 According to an embodiment of the present invention, a display device DD (for example,Figure 4 The substrate (SUB) may include a display area DA, a non-display area NDA, a hole area HA, and a hole periphery area HPA.

[0044] In this specification, a plane can be defined by a first direction DR1 and a second direction DR2. For example, the second direction DR2 can be perpendicular to the first direction DR1. Furthermore, the third direction DR3 can be perpendicular to the plane.

[0045] The display area DA can be defined as an area capable of generating light or displaying an image by adjusting the transmittance of light provided from an external light source. At least one pixel PX can be arranged in the display area DA. Pixel PX can emit light. Pixel PX can be repeatedly arranged along a first direction DR1 and a second direction DR2 intersecting the first direction DR1. Furthermore, pixel PX can include multiple sub-pixels that emit light of different colors from each other. For example, the sub-pixels can include a red sub-pixel that emits red light, a green sub-pixel that emits green light, and a blue sub-pixel that emits blue light.

[0046] The non-display area NDA can be defined as an area where no image is displayed. The non-display area NDA may be adjacent to the display area DA. For example, the non-display area NDA may surround at least a portion of the display area DA. A driving unit electrically connected to the pixel PX may be arranged in the non-display area NDA. For example, the driving unit may include a data driving unit, a gate driving unit, etc.

[0047] At least a portion of the display area DA may not display an image, but may be defined as a component module for sensing light received from the outside (e.g., Figure 3 The component module (CM) is arranged in a hole region HA. The display region DA may surround at least a portion of the hole region HA. Furthermore, the hole region HA may be adjacent to the hole periphery region HPA. Specifically, the hole periphery region HPA may be configured to surround the hole region HA, and the display region DA may be configured to surround the hole periphery region HPA.

[0048] In one embodiment, the planar shape of the aperture region HA can be circular. However, the present invention is not limited to this, and the aperture region HA can have various planar shapes. In one embodiment, the aperture region HA can be located at the upper right end of the display device DD. In another embodiment, the aperture region HA can be located at the upper left end of the display device DD. In yet another embodiment, the aperture region HA can be located at the upper center of the display device DD. In one embodiment, in the aperture peripheral region HPA, multiple wirings can extend along the edge of the aperture region HA. The multiple wirings can pass through the aperture peripheral region HPA and extend to the display region DA, and can be electrically connected to the pixel PX.

[0049] Figure 2 It is shown that it includes Figure 1 The circuit diagram of the pixels in the display device.

[0050] Reference Figure 2 The pixel PX may include a first transistor T1, a second transistor T2, a third transistor T3, a fourth transistor T4, a fifth transistor T5, a sixth transistor T6, a seventh transistor T7, a capacitor CAP, and a light-emitting element LED.

[0051] The first transistor T1 can be connected between the first node N1 and the second node N2. The first transistor T1 may include a source electrode connected to the first node N1, a drain electrode connected to the second node N2, and a gate electrode connected to the third node N3.

[0052] The second transistor T2 can be connected between the data line and the first node N1. The second transistor T2 may include a source electrode for receiving the data voltage DV, a drain electrode connected to the first node N1, and a gate electrode for receiving the first gate signal GS1.

[0053] The third transistor T3 can be connected between the second node N2 and the third node N3. The third transistor T3 may include a source electrode connected to the third node N3, a drain electrode connected to the second node N2, and a gate electrode that receives the first gate signal GS1.

[0054] The fourth transistor T4 can be connected between the initialization voltage line and the third node N3. The fourth transistor T4 may include a source electrode that receives the initialization voltage VINT, a drain electrode connected to the third node N3, and a gate electrode that receives the second gate signal GS2.

[0055] The fifth transistor T5 can be connected between the first power supply providing the high power supply voltage ELVDD and the first node N1. The fifth transistor T5 may include a source electrode that receives the high power supply voltage ELVDD, a drain electrode connected to the first node N1, and a gate electrode that receives the light emission control signal EM.

[0056] The sixth transistor T6 can be connected between the second node N2 and the fourth node N4. The sixth transistor T6 may include a source electrode connected to the second node N2, a drain electrode connected to the fourth node N4, and a gate electrode for receiving the light emission control signal EM.

[0057] The seventh transistor T7 can be connected between the initialization voltage line and the fourth node N4. The seventh transistor T7 may include a source electrode that receives the initialization voltage VINT, a drain electrode connected to the fourth node N4, and a gate electrode that receives the second gate signal GS2.

[0058] Capacitor CAP can be connected between the first power supply and the third node N3. Capacitor CAP may include a first capacitor electrode connected to the third node N3 and a second capacitor electrode that receives the high power supply voltage ELVDD.

[0059] The light-emitting element (LED) can be connected between the fourth node N4 and a second power supply providing a low supply voltage (ELVSS). The low supply voltage (ELVSS) can be lower than the high supply voltage (ELVDD). The LED can include a first electrode connected to the fourth node N4 and a second electrode receiving the low supply voltage (ELVSS).

[0060] In one embodiment, each of the first to seventh transistors T1, T2, T3, T4, T5, T6, and T7 may be a PMOS transistor. However, the embodiments of the present invention are not limited thereto. In another embodiment, at least one of the first to seventh transistors T1, T2, T3, T4, T5, T6, and T7 may be an NMOS transistor.

[0061] Although Figure 2 The diagram shows a pixel PX comprising seven transistors and one capacitor, but embodiments of the present invention are not limited thereto. For example, a pixel PX may also comprise two to six transistors or eight or more transistors and two or more capacitors.

[0062] Figure 3 It shows along Figure 1 A cross-sectional view of the section cut by the I-I' line. Figure 4 It is shown that it includes Figure 1 A cross-sectional view of an example of a section in the display area of ​​a display panel in a display device.

[0063] Reference Figure 3 and Figure 4 The display device DD may include a display panel PNL, an optical functional layer OFL, an adhesive layer ADL, a component module CM, a window layer WNL, a light-shielding component BM, and a lower cover layer CL. The display panel PNL may include a substrate SUB, a barrier layer BAR, a buffer layer BUF, a first insulating layer ILD1, a second insulating layer ILD2, an interlayer insulating layer ILD3, a transistor TR, a first organic film VIA1, a first connecting electrode CNE1, a second organic film VIA2, a second connecting electrode CNE2, a third organic film VIA3, a pixel definition film PDL, a separator SPC, a light-emitting element LED, an encapsulation layer ENL, and a touch sensing layer TSL.

[0064] The transistor TR may include an active layer ACT, a gate electrode GE, a source electrode SE, and a drain electrode DE. The light-emitting element LED may include a pixel electrode PE, a light-emitting layer EML, and a common electrode CME. The touch sensing layer TSL may include a first touch insulating layer YILD1, a second touch insulating layer YILD2, a first touch electrode TE1, a third touch insulating layer YILD3, a second touch electrode TE2, and a touch protective layer YPVX.

[0065] The substrate SUB serves as the base for forming the display panel PNL. The substrate SUB can be formed using transparent or opaque materials. Materials include glass, quartz, and plastics. For example, plastics can include polyimide, polyethylene naphthalate, polyethylene terephthalate, polycarbonate, polyetherimide, and polyethersulfone. These can be used individually or in combination.

[0066] A barrier layer (BAR) can be disposed on a substrate (SUB). The barrier layer BAR can reduce the moisture permeability of the substrate SUB and prevent foreign matter from diffusing into the light-emitting element (LED). The barrier layer BAR can include amorphous silicon, silicon oxide, silicon nitride, etc. These can be used alone or in combination.

[0067] Although Figure 4 The diagram shows that each of the substrate SUB and the barrier layer BAR is a single-layer structure, but the embodiments of this utility model are not limited to this. Each of the substrate SUB and the barrier layer BAR can have a multi-layer structure. Furthermore, it can also have a structure in which the substrate SUB and the barrier layer BAR are stacked alternately.

[0068] A buffer layer (BUF) can be disposed on the barrier layer (BAR). The buffer layer (BUF) can prevent metal atoms or impurities from diffusing from the substrate (SUB) to the active layer (ACT). Furthermore, the buffer layer (BUF) can regulate the heat transfer rate during the crystallization process used to form the active layer (ACT).

[0069] The first insulating layer ILD1 can be disposed on the buffer layer BUF. The first insulating layer ILD1 may include an inorganic insulating material. The inorganic insulating material may include silicon nitride, silicon oxide, silicon nitride, etc. These can be used alone or in combination.

[0070] The active layer ACT can be disposed on the first insulating layer ILD1. The active layer ACT can include amorphous silicon, polycrystalline silicon, or oxide semiconductor. The active layer ACT can include doped source and drain regions and a channel region disposed between the source and drain regions.

[0071] A second insulating layer ILD2 may be disposed on the first insulating layer ILD1. The second insulating layer ILD2 may cover the active layer ACT on the first insulating layer ILD1. For example, the second insulating layer ILD2 may have a substantially uniform thickness along the contour of the active layer ACT. Optionally, the second insulating layer ILD2 may also substantially cover the active layer ACT and have a substantially flat upper surface without creating a step difference around the active layer ACT. The second insulating layer ILD2 may include an inorganic insulating material. The inorganic insulating material may include silicon nitrides, silicon oxides, silicon oxynitrides, etc. These may be used alone or in combination.

[0072] The gate electrode GE can be disposed on the second insulating layer ILD2. The gate electrode GE can overlap with the channel region of the active layer ACT. The gate electrode GE can include metals, alloys, conductive metal oxides, conductive metal nitrides, transparent conductive materials, etc.

[0073] An interlayer insulating layer ILD3 may be disposed on the second insulating layer ILD2. The interlayer insulating layer ILD3 may cover the gate electrode GE on the second insulating layer ILD2. For example, the interlayer insulating layer ILD3 may have a substantially uniform thickness along the contour of the gate electrode GE. Alternatively, the interlayer insulating layer ILD3 may also substantially cover the gate electrode GE with a substantially flat upper surface, without creating a step difference around the gate electrode GE.

[0074] In one embodiment, the interlayer insulating layer ILD3 may include an inorganic insulating material. The inorganic insulating material may include silicon nitrides, silicon oxides, silicon oxide nitrides, etc. These may be used alone or in combination.

[0075] The source electrode SE and drain electrode DE can be disposed on the interlayer insulating layer ILD3. The source electrode SE and drain electrode DE can contact the active layer ACT through contact holes penetrating the second insulating layer ILD2 and the interlayer insulating layer ILD3. For example, the source electrode SE can contact the source region of the active layer ACT, and the drain electrode DE can contact the drain region of the active layer ACT. Each of the source electrode SE and drain electrode DE can include a metal, alloy, conductive metal oxide, conductive metal nitride, transparent conductive material, etc.

[0076] The first organic film VIA1 can be disposed on the interlayer insulating layer ILD3. The first organic film VIA1 can be disposed in the display area DA and the periphery area HPA. The first organic film VIA1 can have a substantially flat upper surface. In one embodiment, the first organic film VIA1 can define an opening that exposes a portion of the upper surface of the drain electrode DE. In another embodiment, the first organic film VIA1 can define an opening that exposes a portion of the upper surface of the source electrode SE. The first organic film VIA1 can include an organic insulating material. For example, the organic insulating material can include acrylic resins, epoxy resins, polyimide, polyethylene, etc. These can be used alone or in combination.

[0077] The first connecting electrode CNE1 may be disposed on the first organic film VIA1. In one embodiment, the first connecting electrode CNE1 may contact the drain electrode DE through the opening that exposes the upper surface of the drain electrode DE. In another embodiment, the first connecting electrode CNE1 may contact the source electrode SE (not shown) through the opening that exposes the upper surface of the source electrode SE. The first connecting electrode CNE1 may include a metal, alloy, conductive metal oxide, conductive metal nitride, transparent conductive material, etc.

[0078] A second organic film VIA2 may be disposed on the first organic film VIA1. The second organic film VIA2 may be disposed in the display area DA and the periphery area HPA. The second organic film VIA2 may have a substantially flat upper surface. An opening may be defined in the second organic film VIA2 to expose a portion of the upper surface of the first connecting electrode CNE1. The second organic film VIA2 may include an organic insulating material. For example, the organic insulating material may include acrylic resins, epoxy resins, polyimide, polyethylene, etc. These may be used alone or in combination.

[0079] The second connecting electrode CNE2 can be disposed on the second organic film VIA2. The second connecting electrode CNE2 can contact the first connecting electrode CNE1 through the opening defined in the second organic film VIA2. The second connecting electrode CNE2 can include metals, alloys, conductive metal oxides, conductive metal nitrides, transparent conductive materials, etc.

[0080] In one embodiment, the first connecting electrode CNE1 and the second connecting electrode CNE2 can physically and / or electrically connect the drain electrode DE and the pixel electrode PE. In another embodiment, the first connecting electrode CNE1 and the second connecting electrode CNE2 can physically and / or electrically connect the source electrode SE and the pixel electrode PE.

[0081] A third organic film VIA3 may be disposed on the second organic film VIA2. The third organic film VIA3 may be disposed in the display area DA and the periphery area HPA. The third organic film VIA3 may have a substantially flat upper surface. An opening may be defined in the third organic film VIA3 to expose a portion of the upper surface of the second connecting electrode CNE2. The third organic film VIA3 may include an organic insulating material. For example, the organic insulating material may include acrylic resins, epoxy resins, polyimide, polyethylene, etc. These may be used alone or in combination.

[0082] The pixel electrode PE can be disposed on the third organic film VIA3. The pixel electrode PE can contact the second connecting electrode CNE2 through the opening defined in the third organic film VIA3. The pixel electrode PE can include metals, alloys, conductive metal oxides, conductive metal nitrides, transparent conductive materials, etc. These can be used alone or in combination. For example, the pixel electrode PE can include silver and indium tin oxide.

[0083] A pixel definition film (PDL) can be disposed on a third organic film (VIA3). The PDL can be disposed within the display area (DA) and the periphery area (HPA). The PDL can partially cover the pixel electrode (PE). Furthermore, the PDL can have openings that expose at least a portion of the pixel electrode (PE). For example, the openings in the PDL can expose the central portion of the pixel electrode (PE), and the PDL can cover the edges of the pixel electrode (PE). The PDL can include an organic insulating material such as polyimide.

[0084] In one embodiment, the pixel definition film (PDL) may include a light-shielding material. The light-shielding material may include carbon black, carbon nanotubes, a resin or paste containing a black dye, metal particles, etc. The metal particles may include nickel, aluminum, molybdenum, chromium, etc. These can be used alone or in combination. When the pixel definition film (PDL) includes the light-shielding material, external light reflection caused by metal structures (e.g., pixel electrodes, PE, etc.) disposed at the bottom of the pixel definition film (PDL) can be reduced.

[0085] The separator SPC can be disposed on the pixel definition film PDL. In one embodiment, the separator SPC can be formed together with the pixel definition film PDL during the halftone mask process for manufacturing the display device DD. In one embodiment, the separator SPC may include an organic insulating material or an inorganic insulating material. In one embodiment, the separator SPC may include a material different from the pixel definition film PDL.

[0086] The light-emitting layer (EML) can be disposed on the pixel electrode (PE). For example, the EML can be disposed on the pixel electrode (PE) exposed by the opening in the pixel definition film (PDL). The EML can include an organic light-emitting material. The organic light-emitting material can include low-molecular-weight organic compounds or polymeric organic compounds. However, the present invention is not limited thereto, and the EML can also include materials such as quantum dots.

[0087] The common electrode (CME) can be disposed on the emissive layer (EML). The CME can cover the EML, pixel definition layer (PDL), and separator (SPC). The CME can include metals, alloys, conductive metal oxides, conductive metal nitrides, transparent conductive materials, etc. For example, the CME can include aluminum, platinum, silver, magnesium, gold, chromium, tungsten, titanium, etc. These can be used individually or in combination.

[0088] The first encapsulation layer ENL1 can be disposed on the common electrode CME. The first encapsulation layer ENL1 can cover the light-emitting element LED. The first encapsulation layer ENL1 can have a substantially uniform thickness along the contour of the common electrode CME. The first encapsulation layer ENL1 can include an inorganic insulating material. For example, the inorganic insulating material can include silicon nitride, silicon oxide, silicon oxide nitride, etc. These can be used alone or in combination.

[0089] A second encapsulation layer, ENL2, may be disposed on top of the first encapsulation layer, ENL1. The second encapsulation layer, ENL2, may have a substantially flat upper surface without creating a step difference around the first encapsulation layer, ENL1. The second encapsulation layer, ENL2, may include an organic insulating material. For example, the organic insulating material may include acrylic resins, epoxy resins, polyimides, polyethylene, etc. These may be used alone or in combination.

[0090] A third encapsulation layer, ENL3, can be disposed on top of the second encapsulation layer, ENL2. The third encapsulation layer, ENL3, can have a substantially uniform thickness and a substantially flat upper surface. The third encapsulation layer, ENL3, may include an inorganic insulating material. For example, the inorganic insulating material may include silicon nitride, silicon oxide, silicon oxynitride, etc. These can be used alone or in combination. The encapsulation layer, ENL, can protect the LED light-emitting element from external impurities by sealing the display area, DA.

[0091] The first touch insulating layer YILD1 can be disposed on the third encapsulation layer ENL3. The first touch insulating layer YILD1 may include inorganic insulating material and / or organic insulating material.

[0092] The second touch insulating layer YILD2 can be disposed on the first touch insulating layer YILD1. The second touch insulating layer YILD2 can cover the first touch insulating layer YILD1. The second touch insulating layer YILD2 may include inorganic insulating materials and / or organic insulating materials.

[0093] The first touch electrode TE1 can be disposed on the second touch insulating layer YILD2. The first touch electrode TE1 may include metal oxides, conductive metal nitrides, transparent conductive materials, etc. For example, the first touch electrode TE1 may include aluminum, copper, titanium, molybdenum, indium tin oxide, etc. These can be used individually or in combination. In one embodiment, the first touch electrode TE1 may have a single-layer structure. In another embodiment, the first touch electrode TE1 may have a multi-layer structure.

[0094] The third touch insulating layer YILD3 may be disposed on the first touch electrode TE1. The third touch insulating layer YILD3 may cover the first touch electrode TE1. The third touch insulating layer YILD3 may include inorganic insulating materials and / or organic insulating materials.

[0095] The second touch electrode TE2 can be disposed on the third touch insulating layer YILD3. The second touch electrode TE2 may include metal oxides, conductive metal nitrides, transparent conductive materials, etc. For example, the second touch electrode TE2 may include aluminum, copper, titanium, molybdenum, indium tin oxide, etc. These can be used individually or in combination. In one embodiment, the second touch electrode TE2 may have a single-layer structure. In another embodiment, the second touch electrode TE2 may have a multi-layer structure.

[0096] The touch protective layer YPVX can be disposed on the third touch insulating layer YILD3. The touch protective layer YPVX can cover the third touch insulating layer YILD3 and the second touch electrode TE2. The touch protective layer YPVX may include an organic insulating material.

[0097] The optical functional layer (OFL) can be disposed on the display panel PNL. The optical functional layer (OFL) can be in contact with the touch sensing layer (TSL). Specifically, the optical functional layer (OFL) can be disposed on the touch protective layer (YPVX). That is, a refractive layer with a high refractive index may not be disposed between the optical functional layer (OFL) and the touch protective layer (YPVX).

[0098] An optical functional layer (OFL) can block external light incident on the display panel (PNL). In one embodiment, the optical functional layer OFL can be a polarizing layer. The polarizing layer can extend in one direction. The direction in which the polarizing layer extends can be the absorption axis of the absorbed light, and the direction perpendicular to the extension direction can be the transmission axis of the transmitted light. However, the optical functional layer OFL according to the embodiments of the present invention is not limited to a polarizing layer, and the display device DD can also have a structure that does not include a polarizing layer. In this case, the optical functional layer OFL can also be a color filter, etc.

[0099] The adhesive layer (ADL) can be disposed on the optical functional layer (OFL). The adhesive layer (ADL) can bond the optical functional layer (OFL) and the window layer (WNL). In one embodiment, the adhesive layer (ADL) may include pressure-sensitive adhesive (PSA), optically clear adhesive (OCA), optically clear resin (OCR), etc. These can be used individually or in combination.

[0100] The lower cover layer CL can be arranged below the display panel PNL. The lower cover layer CL can support other components (e.g., the display panel PNL, etc.) below the display device DD. The lower cover layer CL can include metal, glass, polymer, etc. This invention is not limited to this; a housing covering the back of the display device DD and electronic components housed within the housing can be attached to the lower cover layer CL.

[0101] A through-hole H can be defined along the thickness direction of the lower cover layer CL, display panel PNL, optical functional layer OFL, and adhesive layer ADL. The hole region HA can be defined by the through-hole H. The hole periphery region HPA can be the region adjacent to the end of the through-hole H. The lower cover layer CL, display panel PNL, optical functional layer OFL, and adhesive layer ADL can be arranged in the hole periphery region HPA and the display region DA.

[0102] In one embodiment, the planar shape of the through hole H can be circular. However, the present invention is not limited to this, and the planar shape of the through hole H can be polygonal.

[0103] The component module CM can be placed below the lower cover layer CL corresponding to the aperture region HA. The component module CM can receive light transmitted through the aperture region HA.

[0104] In one embodiment, examples of component modules CM include a camera module, a face recognition sensor module, a pupil recognition sensor module, an accelerometer module, a proximity sensor module, an infrared sensor module, and an illuminance sensor module. The camera module may be a module that captures (or recognizes) images of objects located on the front surface of the display device. The face recognition sensor module may be a module that senses the user's face. The pupil recognition sensor module may be a module that senses the user's pupils. The accelerometer module and the geomagnetic sensor module may be modules that determine the operation of the display device. The proximity sensor module and the infrared sensor module may be modules that sense the proximity of the front surface of the display device. The illuminance sensor module may be a module that measures the external brightness level.

[0105] The window layer WNL can be disposed on the adhesive layer ADL. The window layer WNL can be disposed in the hole region HA, the hole periphery region HPA, and the display region DA. Specifically, the window layer WNL can extend throughout the hole region HA, the hole periphery region HPA, the display region DA, and the non-display region NDA (e.g., Figure 2 The non-display area (NDA) is arranged accordingly.

[0106] In one embodiment, the window layer WNL can be an ultra-thin glass. For example, the window layer WNL may include soda lime glass, alkaline aluminosilicate glass, borosilicate glass, lithium aluminosilicate glass, etc. These can be used alone or in combination. However, the window layer WNL of this invention is not limited to these and may include various materials such as plastics.

[0107] The light-shielding component BM can be disposed on the adhesive layer ADL. The light-shielding component BM can be disposed in the hole region HA, the hole periphery region HPA, and the display region DA. The light-shielding component BM can be disposed within the window layer WNL. The light-shielding component BM can be formed on the adhesive layer ADL. A hole penetrating along the thickness direction in the hole region HA can also be defined in the light-shielding component BM. The light-shielding component BM can include light-shielding materials such as carbon black or organic pigments, thereby enabling the light-shielding component BM to block light.

[0108] In one embodiment, the light-shielding component BM can have a single-layer structure. In this case, the time and cost of manufacturing the display device DD can be reduced. However, the present invention is not limited thereto, and the light-shielding component BM according to embodiments of the present invention can also have a multi-layer structure.

[0109] Figure 5 This is an enlarged illustration. Figure 3 A cross-sectional view of an example of the cross-section of region A. Figure 6 This is an enlarged illustration. Figure 5 A cross-sectional view of region B1.

[0110] Reference Figure 5 and Figure 6 Display device DD (e.g., Figure 1 The display device (DD) may include a first dam DM1, a second dam DM2 and a third dam DM3, a first metal layer MTL1, a second metal layer MTL2, an alignment mark AMK, a crack sensing layer CDL, a first stacked structure LS1 and a second stacked structure LS2.

[0111] The first dam DM1, the second dam DM2, and the third dam DM3 can be arranged in the periphery region HPA of the holes on the interlayer insulation layer ILD3. The first dam DM1, the second dam DM2, and the third dam DM3 can be spaced apart from each other. The first dam DM1 can be arranged adjacent to the display area DA, and the third dam DM3 can be arranged adjacent to the hole area HA. ​​Furthermore, the second dam DM2 can be located between the first dam DM1 and the third dam DM3.

[0112] In one embodiment, on a plane, a third dam DM3 may surround a borehole region HA, a second dam DM2 may surround a third dam DM3, and a first dam DM1 may surround a second dam DM2.

[0113] The first dam DM1 may include a first part DM1a, a second part DM1b, a third part DM1c, and a fourth part DM1d. The first part DM1a may be arranged on the interlayer insulation layer ILD3. The second part DM1b may be arranged on the first part DM1a. The third part DM1c may be arranged on the second part DM1b. The fourth part DM1d may be arranged on the third part DM1c.

[0114] The first part DM1a can be formed by the same process as the second organic membrane VIA2. In other words, the first part DM1a can be disposed on the same layer as the second organic membrane VIA2 and can include the same material as the second organic membrane VIA2.

[0115] The second portion DM1b can be formed using the same process as the third organic membrane VIA3. In other words, the second portion DM1b can be disposed on the same layer as the third organic membrane VIA3 and can include the same material as the third organic membrane VIA3. The second portion DM1b can cover the upper surface and side surfaces of the first portion DM1a. However, the embodiments of this invention are not limited thereto, and the second portion DM1b may also only cover the upper surface of the first portion DM1a.

[0116] The third part DM1c can be formed using the same process as the pixel definition film PDL. In other words, the third part DM1c can be disposed on the same layer as the pixel definition film PDL and can include the same material as the pixel definition film PDL. The third part DM1c can cover the upper surface and side surfaces of the second part DM1b. However, the embodiments of this utility model are not limited thereto, and the third part DM1c may also only cover the upper surface of the second part DM1b.

[0117] The fourth part DM1d can be formed using the same process as the separator SPC. In other words, the fourth part DM1d can be disposed on the same layer as the separator SPC and can include the same material as the separator SPC. The fourth part DM1d can cover the upper surface of the third part DM1c. However, the embodiments of this utility model are not limited thereto, and the fourth part DM1d can also cover the upper surface and side surfaces of the third part DM1c.

[0118] The second dam DM2 may include a first part DM2a, a second part DM2b, a third part DM2c, and a fourth part DM2d. The first part DM2a may be arranged on the interlayer insulation layer ILD3. The second part DM2b may be arranged on the first part DM2a. The third part DM2c may be arranged on the second part DM2b. The fourth part DM2d may be arranged on the third part DM2c.

[0119] The first part DM2a can be formed by the same process as the second organic membrane VIA2. In other words, the first part DM2a can be disposed on the same layer as the second organic membrane VIA2 and can include the same material as the second organic membrane VIA2.

[0120] The second portion DM2b can be formed using the same process as the third organic membrane VIA3. In other words, the second portion DM2b can be disposed on the same layer as the third organic membrane VIA3 and can include the same material as the third organic membrane VIA3. The second portion DM2b can cover the upper and side surfaces of the first portion DM2a. However, the embodiments of this invention are not limited thereto, and the second portion DM2b may also only cover the upper surface of the first portion DM2a.

[0121] The third part DM2c can be formed using the same process as the pixel definition film PDL. In other words, the third part DM2c can be disposed on the same layer as the pixel definition film PDL and can include the same material as the pixel definition film PDL. The third part DM2c can cover the upper surface and side surfaces of the second part DM2b. However, the embodiments of this utility model are not limited thereto, and the third part DM2c may also only cover the upper surface of the second part DM2b.

[0122] The fourth part DM2d can be formed using the same process as the separator SPC. In other words, the fourth part DM2d can be disposed on the same layer as the separator SPC and can include the same material as the separator SPC. The fourth part DM2d can cover the upper surface of the third part DM2c. However, the embodiments of this utility model are not limited thereto, and the fourth part DM2d can also cover the upper surface and side surfaces of the third part DM2c.

[0123] The third dam DM3 may be adjacent to the aperture region HA. For example, the third dam DM3 may be closer to the aperture region HA than the first dam DM1 and the second dam DM2. The third dam DM3 may include a first portion DM3a and a second portion DM3b. The first portion DM3a may be disposed on the interlayer insulating layer ILD3. The second portion DM3b may be disposed on the first portion DM3a. The first portion DM3a may be formed by the same process as the second organic film VIA2. In other words, the first portion DM3a may be disposed on the same layer as the second organic film VIA2 and may include the same material as the second organic film VIA2. The second portion DM3b may be formed by the same process as the third organic film VIA3. In other words, the second portion DM3b may be disposed on the same layer as the third organic film VIA3 and may include the same material as the third organic film VIA3.

[0124] The first metal layer MTL1 and the second metal layer MTL2 can be disposed in the via periphery region HPA. Specifically, within the via periphery region HPA, the first metal layer MTL1 and the second metal layer MTL2 can be closer to the via region HA relative to the second encapsulation layer ENL2. The first metal layer MTL1 and the second metal layer MTL2 can overlap with the first dam DM1, the second dam DM2, and the third dam DM3.

[0125] A first metal layer MTL1 can be disposed on a second touch insulating layer YILD2. In one embodiment, the first metal layer MTL1 can be disposed on a first touch electrode TE1 (e.g., Figure 4 The first touch electrode TE1 is formed using the same process. In other words, the first metal layer MTL1 and the first touch electrode TE1 can be arranged on the same layer and can include the same material. However, the present invention is not limited thereto; the first metal layer MTL1 and the first touch electrode TE1 can also include different materials or can be arranged on different layers.

[0126] The second metal layer MTL2 can be disposed on the third touch insulating layer YILD3. In one embodiment, the second metal layer MTL2 can be disposed on the second touch electrode TE2 (e.g., Figure 4The second touch electrode TE2 is formed using the same process. In other words, the second metal layer MTL2 and the second touch electrode TE2 can be arranged on the same layer as each other and can include the same material. However, the present invention is not limited thereto; the second metal layer MTL2 and the second touch electrode TE2 can also include different materials as each other, or they can be arranged on different layers as each other.

[0127] The alignment mark AMK and the crack sensing layer CDL can overlap with the second encapsulation layer ENL2. Specifically, the alignment mark AMK and the crack sensing layer CDL can be arranged between the first dam DM1 and the display area DA. In other words, the alignment mark AMK and the crack sensing layer CDL can not overlap with the first dam DM1, the second dam DM2, and the third dam DM3.

[0128] Alignment marks AMK can be disposed on the second touch insulating layer YILD2. Alignment marks AMK can be formed using the same process as the first touch electrode TE1. In other words, the first metal layer MTL1 and the first touch electrode TE1 can be disposed on the same layer and can comprise the same material. However, the present invention is not limited thereto; the first metal layer MTL1 and the first touch electrode TE1 can also comprise different materials, or can be disposed on different layers. Alignment marks AMK can improve the quality of materials used in the manufacture of display devices (e.g., ...). Figure 1 The accuracy of the laser process in the display device (DD) can be improved, and cutting defects in the display device (DD) can be reduced.

[0129] The crack sensing layer CDL can be disposed on the third touch insulating layer YILD3. The crack sensing layer CDL can be formed using the same process as the second touch electrode TE2. In other words, the crack sensing layer CDL and the second touch electrode TE2 can be disposed on the same layer as each other and can comprise the same material. The crack sensing layer CDL can perform the function of sensing cracks generated in the HPA region surrounding the hole of the display device DD.

[0130] A first stacked structure LS1 and a second stacked structure LS2 can be arranged in a direction away from the borehole region HA from the first dam DM1. The first stacked structure LS1 and the second stacked structure LS2 can be arranged throughout the borehole perimeter region HPA and the display region DA. The first stacked structure LS1 can be arranged on the interlayer insulating layer ILD3. The second stacked structure LS2 can be arranged on the first stacked structure LS1.

[0131] The first stacked structure LS1 may include a first organic film VIA1 and a second organic film VIA2. That is, the first stacked structure LS1 can be defined as a structure consisting of the first organic film VIA1 and the second organic film VIA2 stacked together, which may be separated from the first dam DM1 and extend from the periphery region HPA to the display region DA.

[0132] A first step portion STP1 can be defined in the first stacked structure LS1. Specifically, the upper surface VIA2-U of the second organic film VIA2, the side surface VIA2-S of the second organic film VIA2 facing the through hole H, and the upper surface ILD3-U of the interlayer insulating layer ILD3 can together define the first step portion STP1.

[0133] The first stepped portion STP1 may be located in the periphery region HPA of the hole. The first stepped portion STP1 may have a first height H1 in the periphery region HPA of the hole. In one embodiment, the first height H1 may be more than about 2.8 μm. Preferably, the first height H1 may be from about 2.8 μm to about 4.0 μm.

[0134] The second stacked structure LS2 may include a third organic film VIA3 and a pixel definition film PDL. That is, the second stacked structure LS2 can be defined as a structure consisting of the third organic film VIA3 and the pixel definition film PDL stacked together. This structure may be separated from the first dam DM1 and extend from the periphery region HPA to the display region DA. A second stepped portion STP2 may be defined in the second stacked structure LS2. Specifically, the upper surface PDL-U of the pixel definition film PDL, the side surface VIA3-S of the third organic film VIA3 facing the through-hole H, the side surface PDL-S of the pixel definition film PDL facing the through-hole H, and the upper surface VIA2-U of the second organic film VIA2 may together define the second stepped portion STP2.

[0135] The second stepped portion STP2 can be located in the periphery region HPA of the hole. The second stepped portion STP2 can have a second height H2 in the periphery region HPA of the hole. In one embodiment, the second height H2 can be more than about 2.8 μm. Preferably, the second height H2 can be from about 2.8 μm to about 4.0 μm.

[0136] In one embodiment, the first height H1 and the second height H2 can be substantially the same. In another embodiment, the first height H1 and the second height H2 can be different from each other. For example, the second height H2 can be greater than the first height H1. However, the present invention is not limited thereto, and the second height H2 can be less than the first height H1.

[0137] Figure 7 This is an enlarged illustration. Figure 3Another example of a cross-section of region A. Figure 8 This is an enlarged illustration. Figure 7 A cross-sectional view of region B2.

[0138] In addition to the second step STP2, refer to Figure 7 and Figure 8 Explanation of the display device and reference Figure 5 and Figure 6 The display device described is substantially the same. In the following text, omissions or simplifications are used in conjunction with... Figure 5 and Figure 6 The content described herein is repeated.

[0139] Reference Figure 7 and Figure 8 The second stacked structure LS2 may include a pixel-defining film PDL and a separator SPC. That is, the second stacked structure LS2 can be defined as a structure stacked from the pixel-defining film PDL and the separator SPC, which may be separated from the first dam DM1 and extend from the periphery region HPA to the display region DA. A second stepped portion STP2 may be defined in the second stacked structure LS2. Specifically, the upper surface SPC-U of the separator SPC, the side surface PDL-S of the pixel-defining film PDL facing the through-hole H, the side surface SPC-S of the separator SPC facing the through-hole H, and the upper surface VIA3-USPC-U of the third organic film VIA3 can together define the second stepped portion STP2.

[0140] A third organic membrane VIA3 can be disposed between the first stacked structure LS1 and the second stacked structure LS2. At least one stepped portion can also be defined on the third organic membrane VIA3. The upper surface VIA3-U of the third organic membrane VIA3, the side surface VIA3-S of the third organic membrane VIA3 facing the through hole H, and the upper surface VIA2-U of the second organic membrane VIA2 can together define the stepped portion. In one embodiment, the height of the stepped portion can be less than the first height H1 and the second height H2.

[0141] The second stepped portion STP2 can be located in the display area DA. The second stepped portion STP2 can have a second height H2 in the display area DA. In one embodiment, the second height H2 can be about 2.8 μm or more. Preferably, the second height H2 can be about 2.8 μm to about 4.0 μm. However, the second stepped portion STP2 according to the embodiments of the present invention is not limited thereto; the second stepped portion STP2 can also be arranged in the hole periphery area HPA.

[0142] Figure 9 It is shown that it includes Figure 1Another example of a cross-sectional view of the display area of ​​the display panel in a display device.

[0143] Reference Figure 9 The display device described is not arranged Figure 4 Apart from the structure of the third organic film VIA3 and the second connecting electrode CNE2, it is similar to the reference. Figure 4 The display device described is substantially the same. In the following text, omissions or simplifications are used in conjunction with... Figure 4 The content described herein is repeated.

[0144] Reference Figure 9 The pixel definition film (PDL) can be disposed on the second organic film (VIA2). For example, the PDL can partially cover the second organic film (VIA2). In other words, no layer needs to be disposed between the PDL and the second organic film (VIA2). Figure 4 The third organic film VIA3 and the second connecting electrode CNE2. Accordingly, the pixel electrode PE can contact the first connecting electrode CNE1 through an opening defined in the first organic film VIA1.

[0145] Figure 10 This is an enlarged illustration. Figure 3 Another example of a cross-section of region A. Figure 11 This is an enlarged illustration. Figure 10 A cross-sectional view of region B3.

[0146] In addition to the first dam DM1, the second dam DM2, the third dam DM3, the third organic membrane VIA3, and the second step STP2, refer to Figure 10 and Figure 11 Explanation of the display device and reference Figure 5 and Figure 6 The display device described is substantially the same. In the following text, omissions or simplifications are used in conjunction with... Figure 5 and Figure 6 The content described herein is repeated.

[0147] Reference Figure 10 and Figure 11The first dam DM1 may include a first portion DM1a, a second portion DM1b, and a third portion DM1c. The first portion DM1a can be formed using the same process as the second organic film VIA2. In other words, the first portion DM1a can be disposed on the same layer as the second organic film VIA2 and can include the same material as the second organic film VIA2. The second portion DM1b can be formed using the same process as the pixel definition film PDL. In other words, the second portion DM1b can be disposed on the same layer as the pixel definition film PDL and can include the same material as the pixel definition film PDL. The third portion DM1c can be formed using the same process as the spacer SPC. In other words, the third portion DM1c can be disposed on the same layer as the spacer SPC and can include the same material as the spacer SPC.

[0148] The second dam DM2 may include a first portion DM2a, a second portion DM2b, and a third portion DM2c. The first portion DM2a can be formed using the same process as the second organic film VIA2. In other words, the first portion DM2a can be disposed on the same layer as the second organic film VIA2 and can include the same material as the second organic film VIA2. The second portion DM2b can be formed using the same process as the pixel definition film PDL. In other words, the second portion DM2b can be disposed on the same layer as the pixel definition film PDL and can include the same material as the pixel definition film PDL. The third portion DM2c can be formed using the same process as the spacer SPC. In other words, the third portion DM2c can be disposed on the same layer as the spacer SPC and can include the same material as the spacer SPC.

[0149] The third dam DM3 may include a first portion DM3a and a second portion DM3b. The first portion DM3a can be formed using the same process as the second organic film VIA2. In other words, the first portion DM3a can be disposed on the same layer as the second organic film VIA2 and can include the same material as the second organic film VIA2. The second portion DM3b can be formed using the same process as the pixel definition film PDL. In other words, the second portion DM3b can be disposed on the same layer as the pixel definition film PDL and can include the same material as the pixel definition film PDL.

[0150] As described above, a pixel-defining film (PDL) can be disposed on the second organic film VIA2. Accordingly, no PDL needs to be disposed between the first stacked structure LS1 and the second stacked structure LS2. Figure 4 The third organic membrane, VIA3.

[0151] The second stacked structure LS2 may include a pixel-defining film PDL and a separator SPC. That is, the second stacked structure LS2 can be defined as a structure stacked from the pixel-defining film PDL and the separator SPC, which can be separated from the first dam DM1 and extend from the periphery region HPA to the display region DA. A second stepped portion STP2 may be defined in the second stacked structure LS2. Specifically, the upper surface SPC-U of the separator SPC, the side surface PDL-S of the pixel-defining film PDL facing the through-hole H, the side surface SPC-S of the separator SPC facing the through-hole H, and the upper surface VIA2-U of the second organic film VIA2 can together define the second stepped portion STP2.

[0152] With the separator SPC located in the display area DA, the second stepped portion STP2 can also be located in the display area DA. The second stepped portion STP2 can have a second height H2 in the display area DA. In one embodiment, the second height H2 can be about 2.8 μm or more. Preferably, the second height H2 can be about 2.8 μm to about 4.0 μm. However, the second stepped portion STP2 according to embodiments of the present invention is not limited thereto; the second stepped portion STP2 can also be arranged in the hole periphery area HPA.

[0153] As described above, the display device DD may include: a first stacked structure LS1, which defines a first step portion STP1 with a first height H1 in the hole periphery region HPA; and a second stacked structure LS2, which defines a second step portion STP2 with a second height H2 in the hole periphery region HPA or the display area DA.

[0154] If at least one of the heights, H1 of the first step STP1 and H2 of the second step STP2, is less than approximately 2.8 μm, bubbles may form between the adhesive layer ADL and the optical functional layer OFL in the hole periphery region HPA adjacent to the hole region HA. Consequently, the adhesion of the window layer WNL, etc., formed on the adhesive layer ADL decreases, and peeling of the window layer WNL, etc., may occur.

[0155] According to an embodiment of the present invention, the first height H1 of the first stepped portion STP1 and the second height H2 of the second stepped portion STP2 of the display device DD can both be approximately 2.8 μm or more. Accordingly, the tilt angle of the side surface of the second encapsulation layer ENL2 facing the hole region HA can be increased, thereby approaching verticality. Therefore, the additional process of forming a component (e.g., a refractive layer with a high refractive index) for compensating for the step difference between the optical functional layer OFL and the touch sensing layer TSL is unnecessary, thus reducing process costs and time. Furthermore, since the light-shielding component BM can have a single-layer structure, process costs and time can be further reduced.

[0156] Industrial availability

[0157] This invention can be applied to display devices and electronic devices including such display devices. For example, it can be applied to high-resolution smartphones, portable phones, smart tablets, smartwatches, tablet PCs, vehicle navigation systems, televisions, computer monitors, laptops, etc.

[0158] The above description refers to exemplary embodiments of the present invention. However, it will be understood by those skilled in the art that various modifications and alterations can be made to the present invention without departing from the spirit and scope of the present invention as set forth in the claims.

Claims

1. A display device, characterized in that, include: The substrate includes a hole region defining a through hole, a display region surrounding at least a portion of the hole region, and a hole periphery region located between the hole region and the display region; An interlayer insulating layer is disposed on the substrate in the area surrounding the hole and in the display area; A first stacked structure is arranged on the interlayer insulating layer and a first step portion with a first height is defined in the region surrounding the hole; as well as A second stacked structure is arranged on the first stacked structure, and a second stepped portion with a second height of 2.8 μm or more is defined in the periphery region of the hole or in the display area adjacent to the periphery region of the hole.

2. The display device as claimed in claim 1, characterized in that, The first height and the second height are the same as each other, and both are greater than 2.8 μm.

3. The display device as claimed in claim 1, characterized in that, The first altitude and the second altitude are different from each other.

4. The display device as claimed in claim 1, characterized in that, Also includes: A first organic film is disposed on the interlayer insulating layer in the periphery region of the hole and the display region; as well as A second organic film is disposed on the periphery region of the pore and the display region of the first organic film.

5. The display device as claimed in claim 4, characterized in that, The first stacked structure includes the first organic film and the second organic film. The upper surface of the second organic film, the side surface of the second organic film facing the through hole, and the upper surface of the interlayer insulating layer together define the first step portion.

6. The display device as claimed in claim 4, characterized in that, Also includes: A third organic film is disposed on the second organic film in the area surrounding the pores and in the display area; A pixel definition film is disposed on the third organic film; as well as A separator is arranged in the display area on the pixel definition film.

7. The display device as claimed in claim 6, characterized in that, The second stacked structure includes the third organic film and the pixel definition film. The upper surface of the pixel defining film, the third organic film, the side surface of the pixel defining film facing the through hole, and the upper surface of the second organic film together define the second stepped portion.

8. The display device as claimed in claim 6, characterized in that, The second stacked structure includes the pixel definition film and the separator. The upper surface of the separator, the pixel defining film, the side surface of the separator facing the through hole, and the upper surface of the third organic film together define the second stepped portion. The third organic membrane is disposed between the first stacked structure and the second stacked structure.

9. The display device as claimed in claim 4, characterized in that, Also includes: A pixel-defining film is disposed in the display area on the second organic film; as well as Separators are arranged in the display area on the pixel definition film. The second stacked structure includes the pixel definition film and the separator. The upper surface of the separator, the pixel defining film, the side surface of the separator facing the through hole, and the upper surface of the second organic film together define the second stepped portion.

10. The display device as claimed in claim 1, characterized in that, Also includes: A touch sensing layer is disposed on the display area and the area surrounding the hole on the second stacked structure; An optical functional layer is disposed on the touch sensing layer in the display area and the area surrounding the hole; A window layer is arranged covering the hole area, the area surrounding the hole, and the display area on the optical functional layer; as well as A light-shielding component is arranged within the window layer.

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