Display substrate and display device

Abstract

The utility model provides a display substrate and a display device.The display substrate comprises a substrate with a via hole, a blocking dam located in the peripheral area of the hole, a plurality of isolation columns located on the side, away from a display area, of the blocking dam, and a blocking structure located on the side, away from the blocking dam, of the isolation columns; the thin film packaging layer is positioned on one side, far away from the substrate, of the blocking dam; wherein the hole peripheral area is arranged around the via hole, and the display area is arranged around the hole peripheral area; wherein the thin film packaging layer covers the display area, and extends to one side, deviating from the substrate, of the barrier structure through the barrier dam and the plurality of isolation columns; at least one inorganic layer is arranged between the plurality of isolation columns and the substrate; the blocking structure is used for blocking propagation of cutting cracks.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to a display substrate and a display device. Background Technology

[0002] Most organic light-emitting diode (OLED) displays on the market currently employ an AA-Hole design. However, in the production of rigid products, the edge structure and manufacturing process of the holes are highly susceptible to multi-dimensional performance degradation, particularly encapsulation failure. Utility Model Content

[0003] This application provides a display substrate and a display device, the specific solutions of which are as follows:

[0004] This application provides a display substrate, comprising:

[0005] A substrate with a via is provided, a barrier dam located in the periphery region of the via, a plurality of isolation pillars located on the side of the barrier dam away from the display area, a barrier structure located on the side of the plurality of isolation pillars away from the barrier dam, and a thin film encapsulation layer located on the side of the barrier dam away from the substrate; wherein, the periphery region of the via is arranged around the via, and the display area is arranged around the periphery region of the via.

[0006] The thin-film encapsulation layer covers the display area and extends through the barrier dam and the plurality of isolation pillars to the side of the barrier structure opposite to the substrate; at least one inorganic layer is disposed between the plurality of isolation pillars and the substrate; the barrier structure is used to block the propagation of cutting cracks.

[0007] Optionally, in an embodiment of this application, the barrier structure includes at least one groove formed on the side of the at least one inorganic layer away from the substrate, the at least one groove and an organic layer completely filling the at least one groove together forming the barrier structure; each of the grooves penetrates at least a portion of the film layer of the at least one inorganic layer.

[0008] Optionally, in an embodiment of this application, the barrier structure further includes a first metal layer located between the organic layer and the at least one inorganic layer, the first metal layer covering the at least one groove.

[0009] Optionally, in this embodiment of the application, the at least one inorganic layer is multiple layers, and the barrier structure includes a second metal layer disposed between two adjacent inorganic layers in the multiple inorganic layers.

[0010] Optionally, in this embodiment, the barrier structure further includes an organic layer located on the side of the multilayer inorganic layer facing away from the substrate.

[0011] Optionally, in this embodiment, a plurality of intermittently arranged power-off structures are disposed on the side of the barrier structure away from the barrier dam. The plurality of power-off structures are completely covered by the thin film encapsulation layer, and along the direction perpendicular to the plane of the substrate, the distance between the surface of each power-off structure away from the substrate and the substrate is greater than the distance between the surface of the plurality of isolation pillars away from the substrate and the substrate.

[0012] Optionally, in this embodiment, an organic layer is further included on the side of the at least one inorganic layer facing away from the substrate; the organic layer has a recessed structure in the periphery of the hole located between two adjacent power-off structures; along the direction facing away from the substrate, each power-off structure includes a first sub-part and a second sub-part arranged sequentially, the second sub-part being arranged in the same layer as the plurality of isolation pillars, the first sub-part being arranged in the same layer as the organic layer, and on one side surface of the same power-off structure adjacent to the recessed structure, the edge of the first sub-part coincides with the edge of the recessed structure, and the orthogonal projection of the edge of the second sub-part on the substrate completely falls within the area of ​​the orthogonal projection of the recessed structure on the substrate.

[0013] Optionally, in this embodiment of the application, an etching barrier structure is further included on the side of the plurality of power-off structures away from the barrier dam, the etching barrier structure including a third sub-section disposed in the same layer as the organic layer.

[0014] Optionally, in an embodiment of this application, the etching barrier structure further includes a fourth sub-part disposed on the same layer as the at least one inorganic layer, the fourth sub-part and the third sub-part being disposed opposite to the substrate in sequence, and the orthographic projections of the third sub-part and the fourth sub-part on the substrate overlapping each other.

[0015] Optionally, in this embodiment, the method further includes a plurality of riveting structures located on the side of the etching barrier structure away from the substrate, each riveting structure including a fifth sub-part and a sixth sub-part connected to each other; the fifth sub-part is disposed in the same layer as the plurality of isolation pillars; and the sixth sub-part is disposed in the same layer as the inorganic encapsulation layer in the thin film encapsulation layer.

[0016] Optionally, in this embodiment, a touch functional layer is further provided on the side of the thin film encapsulation layer facing away from the substrate; along the direction facing away from the substrate, the touch functional layer includes a third metal layer, a touch insulating layer and a fourth metal layer disposed sequentially; the third metal layer and / or the fourth metal layer at least cover the area between two adjacent isolation pillars.

[0017] Optionally, in this embodiment, the substrate is a rigid substrate.

[0018] Accordingly, embodiments of this application provide a display device, comprising:

[0019] Display substrate as described in any of the above;

[0020] The sensor is positioned at the location corresponding to the via. Attached Figure Description

[0021] Figure 1 A top view schematic diagram of one type of display substrate provided in an embodiment of this application;

[0022] Figure 2 For along Figure 1 A schematic diagram of one type of cross-sectional structure in the direction shown in MM;

[0023] Figure 3 For along Figure 1 A schematic diagram of one type of cross-sectional structure in the direction shown in the middle NN;

[0024] Figure 4 A schematic diagram of one possible structure of a display substrate including a barrier structure, provided in an embodiment of this application;

[0025] Figure 5 A schematic diagram of one possible structure of a display substrate including a barrier structure, provided in an embodiment of this application;

[0026] Figure 6 A schematic diagram of one possible structure of a display substrate including a barrier structure, provided in an embodiment of this application;

[0027] Figure 7 A schematic diagram of one possible structure of a display substrate including a barrier structure, provided in an embodiment of this application;

[0028] Figure 8 for Figure 1 A magnified view of one of the structures in the Q region;

[0029] Figure 9 An enlarged view of one of the structures of the display substrate provided in the embodiments of this application, which includes an etching barrier structure in the actual fabrication process;

[0030] Figure 10 An enlarged view of one of the structures of the display substrate provided in the embodiments of this application, which includes an etching barrier structure in the actual fabrication process;

[0031] Figure 11 An enlarged view of one of the multiple riveting structures included in the actual fabrication process of the display substrate provided in this application embodiment;

[0032] Figure 12An enlarged view of one of the structures in which a third metal layer is included at the edge of a hole during the actual fabrication process of the display substrate provided in the embodiments of this application;

[0033] Figure 13 An enlarged view of one of the structures in which a fourth metal layer is included at the edge of a hole during the actual fabrication process of the display substrate provided in this application embodiment;

[0034] Explanation of reference numerals in the attached figures:

[0035] 10-Substrate; BB-Peripheral area of ​​the via; 20-Barrier dam; AA-Display area; 30-Isolation pillar; 40-Barrier structure; 50-Thin film encapsulation layer; 60-At least one inorganic layer; H-Via; 70-Groove; 80-Organic layer; 11-Buffer layer; 12-Active layer; 13-First gate insulating layer; 14-First gate layer; 15-Second gate insulating layer; 16-Second gate layer; 17-Interlayer insulating layer; 18-First source / drain layer; 19-Passivation layer; 21-First planarization layer; 22-Second source / drain layer; 23-Second planarization layer; 24-Anode layer; 25-Pixel definition layer; 26-Light emitting layer; 27-Cathode layer; 51-First inorganic encapsulation layer; 52-... 53-Second inorganic encapsulation layer; 90-First metal layer; 61-First inorganic layer; 62-Second inorganic layer; 91-Second metal layer; 92-Power-off structure; 81-Recessed structure; 921-First sub-section; 922-Second sub-section; 93-Etching barrier structure; 931-Third sub-section; 932-Fourth sub-section; L-Notch position; C-Acid etching surface; 94-Riveting structure; 941-Fifth sub-section; 942-Sixth sub-section; 95-Touch function layer; 951-Third metal layer; 952-Touch insulating layer; 953-Fourth metal layer; 96-Touch protective layer; 97-Leveling layer; 98-Filter layer; 99-Adhesive layer; 100-Protective cover. Detailed Implementation

[0036] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this application. Furthermore, the embodiments and features in the embodiments of this application can be combined with each other without conflict. All other embodiments obtained by those skilled in the art based on the described embodiments of this application without creative effort are within the scope of protection of this application.

[0037] Unless otherwise defined, the technical or scientific terms used in this application shall have the ordinary meaning understood by one of ordinary skill in the art to which this application pertains. The terms "first," "second," and similar terms used in this application do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Terms such as "comprising" or "including" mean that the element or object preceding the word encompasses the elements or objects listed following the word and their equivalents, without excluding other elements or objects. Terms such as "connected" or "linked" are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. Terms such as "inner," "outer," "upper," and "lower" are used only to indicate relative positional relationships; when the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0038] It should be noted that the dimensions and shapes of the figures in the accompanying drawings do not reflect actual proportions and are intended only to illustrate the content of this application. Furthermore, the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout.

[0039] In related technologies, when using an AA-Hole design for OLED displays, to prevent moisture from entering the display area along the organic layer and causing oxidation of the organic light-emitting material, leading to display failure, multiple Ti-Al-Ti isolation pillar structures are typically placed at the hole edge to disconnect the organic light-emitting material as much as possible and block lateral water and oxygen channels. However, in the manufacturing process of rigid products, various processes and external loads can cause the isolation pillar structure at the hole edge to fail, failing to effectively block moisture and thus leading to display failure. Specific problems are as follows:

[0040] (1) Cracks caused by cutting: When cutting holes in rigid products, cracks at the cut edge will extend inward, causing damage to the encapsulation structure at the edge, resulting in growth black spot (GDSH) risk and reliability risk.

[0041] (2) Damage caused by acid etching: When using acid to process the back glass of the hole, the fluctuation of the acid etching process can easily damage the driving circuit and even corrode the organic light-emitting material, leading to display failure.

[0042] (3) Reliability issues of cathode material connectivity: Since the cathode material in the light-emitting functional layer may still connect at the edge of the hole to form an electrical path, it leads to reliability failure;

[0043] (4) Organic film separation problem: Due to the poor adhesion of the relevant organic film at the edge of the hole, the film at the cut is very easy to separate after cutting. The external force in the subsequent process will cause the film separation to extend inward, resulting in encapsulation failure and GDSH.

[0044] (5) Water vapor intrusion problem caused by gaps in inorganic layer film formation in packaging structure: When the inorganic layer material in the packaging structure is formed on the isolation pillar structure by chemical vapor deposition (CVD), the inorganic layer is very likely to form a gap at the undercut of the isolation pillar structure, forming a channel from top to bottom, which leads to water vapor intrusion, causing GDSH and reliability failure.

[0045] In view of this, embodiments of this application provide a display substrate and a display device to improve the packaging effect of the display substrate and ensure the display effect of the display substrate.

[0046] Combination Figure 1 and Figure 2 As shown, where, Figure 1 This is a top view schematic diagram of one type of display substrate provided in an embodiment of this application. Figure 2 For along Figure 1 A schematic diagram of one cross-sectional structure along the MM direction. Specifically, the display substrate includes:

[0047] The system comprises a substrate 10 with a via H, a barrier dam 20 located in the periphery region BB of the via, a plurality of isolation pillars 30 located on the side of the barrier dam 20 away from the display area AA, a barrier structure 40 located on the side of the plurality of isolation pillars 30 away from the barrier dam 20, and a thin film encapsulation layer 50 located on the side of the barrier dam 20 away from the substrate 10; wherein the periphery region BB is disposed around the via H, and the display area AA is disposed around the periphery region BB.

[0048] The thin-film encapsulation layer 50 covers the display area AA and extends through the barrier dam 20 and the plurality of isolation pillars 30 to the side of the barrier structure 40 away from the substrate 10; at least one inorganic layer 60 is disposed between the plurality of isolation pillars 30 and the substrate 10; the barrier structure 40 is used to block the propagation of cutting cracks.

[0049] In specific implementation, the display substrate includes a substrate 10, a barrier dam 20, multiple isolation pillars 30, a barrier structure 40, and a thin-film encapsulation layer 50. The substrate 10 can be a silicon-based substrate or a glass-based substrate, without limitation. A via H is formed on the substrate 10. The barrier dam 20 is located in the periphery region BB of the via. The multiple isolation pillars 30 are located on the side of the barrier dam 20 facing away from the display area AA. The barrier structure 40 is located on the side of the multiple isolation pillars 30 facing away from the barrier dam 20. The thin-film encapsulation layer 50 is located on the side of the barrier dam 20 facing away from the substrate 10. Furthermore, the periphery region BB surrounds the via H, and the display area AA surrounds the periphery region BB. For example,... Figure 1The diagram shows one possible distribution of the display area AA and the periphery area BB. Furthermore, the plurality of isolation pillars 30 can be two, three, or more. For example, the thin-film encapsulation layer 50 includes a first inorganic encapsulation layer 51, an organic encapsulation layer 52, and a second inorganic encapsulation layer 53 disposed sequentially opposite to the substrate 10.

[0050] Furthermore, the thin-film encapsulation layer 50 covers the display area AA and extends through the barrier dam 20 and multiple isolation pillars 30 to the side of the barrier structure 40 facing away from the substrate 10. In this way, the thin-film encapsulation layer 50 effectively isolates external water and oxygen, ensuring the performance of the display substrate. In addition, at least one inorganic layer 60 is disposed between the multiple isolation pillars 30 and the substrate 10. Exemplarily, the at least one inorganic layer 60 can be one layer, or two or more layers; the specific number of inorganic layers 60 can be set according to the actual application requirements and is not limited here. Additionally, the barrier structure 40 is used to block the propagation of cutting cracks. Still in conjunction with... Figure 2 In the exemplary embodiment shown, since the barrier structure 40 is located between the plurality of isolation pillars 30 and the via H, and the barrier structure 40 is used to block the propagation of cutting cracks, even when the via H is being cut, the barrier structure 40 can effectively block the propagation of cracks at the edge of the via H (i.e., the edge of the hole) during the cutting process, thereby improving the packaging effect of the display substrate.

[0051] In the embodiments of this application, such as Figure 3 The following is along Figure 1 The diagram shows one possible cross-sectional structure along the NN direction. Specifically, within the display area AA, the display substrate includes, sequentially disposed away from the substrate 10, a buffer layer 11, an active layer 12, a first gate insulating layer 13, a first gate layer 14, a second gate insulating layer 15, a second gate layer 16, an interlayer insulating layer 17, a first source / drain layer 18, a passivation layer 19, a first planarization layer 21, a second source / drain layer 22, a second planarization layer 23, an anode layer 24, a pixel definition layer 25, a light-emitting layer 26, a cathode layer 27, a first inorganic encapsulation layer 51, an organic encapsulation layer 52, a second inorganic encapsulation layer 53, a third metal layer 951, a touch insulating layer 952, a fourth metal layer 953, and a touch protection layer 96. The specific configuration of the film layers involved can be implemented with reference to relevant technologies and will not be detailed here.

[0052] In the embodiments of this application, the barrier structure 40 can be set in the following manner, but is not limited to this.

[0053] In one exemplary embodiment, such as Figures 4 to 6As shown, the barrier structure 40 includes at least one groove 70 formed on the side of the at least one inorganic layer 60 away from the substrate 10, and the at least one groove 70 and an organic layer 80 completely filled in the at least one groove 70 together form the barrier structure 40; each of the grooves 70 penetrates at least a portion of the film layer of the at least one inorganic layer 60.

[0054] In specific implementation, at least one inorganic layer 60 has at least one groove 70 formed on the side facing away from the substrate 10. Exemplarily, the at least one groove 70 can be one, or it can be two or more, without limitation. Figures 4 to 6 In the exemplary embodiment shown, at least three grooves 70 are present. Furthermore, each groove 70 penetrates at least a portion of the film layer of at least one inorganic layer 60. Still in conjunction with Figure 3 In the exemplary embodiment shown, at least one inorganic layer 60 may be at least one of the following: buffer layer 11, first gate insulating layer 13, second gate insulating layer 15, interlayer insulating layer 17, and passivation layer 19. The specific choice can be made according to actual application needs and is not limited here. For example, each groove 70 penetrates a portion of the film layer of at least one inorganic layer 60, such as... Figure 4 and Figure 6 As shown. Exemplarily, each groove 70 penetrates the entire film layer of at least one inorganic layer 60, as... Figure 5 As shown. Furthermore, the barrier structure 40 includes at least one groove 70 formed on the side of at least one inorganic layer 60 facing away from the substrate 10, the at least one groove 70, and an organic layer 80 completely filling the at least one groove 70, together forming the barrier structure 40. Still in combination Figure 3 In the exemplary embodiment shown, the organic layer 80 can be a first planarization layer 21. Figures 4 to 6 In the exemplary embodiment shown, the barrier structure 40 includes portions of an organic layer 80 filled within each groove 70, and portions that completely cover each groove 70. In this way, the propagation of cutting cracks is effectively blocked by at least one groove 70 formed on the side of the substrate 10 by at least one inorganic layer 60 and the corresponding organic layer 80, thereby improving the encapsulation effect.

[0055] In one exemplary embodiment, the barrier structure 40 further includes a first metal layer 90 located between the organic layer 80 and the at least one inorganic layer 60, the first metal layer 90 covering the at least one groove 70.

[0056] Still combined Figure 6 In the exemplary embodiment shown, the barrier structure 40 further includes a first metal layer 90 located between the organic layer 80 and at least one inorganic layer 60, the first metal layer 90 covering at least one groove 70. Still in conjunction Figure 3In the exemplary embodiment shown, the first metal layer 90 is disposed on the same layer as the second source / drain layer 22 within the display area AA. For example, the material of the second source / drain layer 22 can be Ti / Al / Ti. In this way, the first metal layer 90 further strengthens the barrier structure 40, thereby effectively blocking the propagation of cracks and improving the encapsulation effect.

[0057] It should be noted that, in the embodiments of this application, unless otherwise specified, "same layer" refers to the deposition and preparation of the same layer in the process; or, deposition by different processes, but physically located in the same layer.

[0058] In one exemplary embodiment, the at least one inorganic layer 60 is multilayered, and the barrier structure 40 includes a second metal layer 91 disposed between two adjacent inorganic layers in the multilayer inorganic layers.

[0059] Combination Figure 7 In the exemplary embodiment shown, at least one inorganic layer 60 includes two inorganic layers, namely a first inorganic layer 61 and a second inorganic layer 62 disposed sequentially away from the substrate 10, and the barrier structure 40 includes a second metal layer 91 disposed between the first inorganic layer 61 and the second inorganic layer 62. Still in conjunction with... Figure 3 In the exemplary embodiment shown, the second metal layer 91 is disposed on the same layer as the first gate layer 14 within the display area AA. This simplifies the manufacturing process while effectively preventing crack propagation through the second metal layer 91, thus improving the packaging effect.

[0060] Still combined Figure 7 In the exemplary embodiment shown, the barrier structure 40 further includes an organic layer 80 located on the side of the multilayer inorganic layer facing away from the substrate 10. In this way, the propagation of cracks is effectively blocked by the second metal layer 91 and the organic layer 80 located on the side of the multilayer inorganic layer facing away from the substrate 10, thus improving the encapsulation effect.

[0061] In this embodiment, the display substrate further includes a plurality of intermittently arranged power-off structures 92 disposed on the side of the barrier structure 40 away from the barrier dam 20. The plurality of power-off structures 92 are completely covered by the thin film encapsulation layer 50, and along the direction perpendicular to the plane where the substrate 10 is located, the distance between the surface of each power-off structure 92 away from the substrate 10 and the substrate 10 is greater than the distance between the surface of the plurality of isolation pillars 30 away from the substrate 10 and the substrate 10.

[0062] Still combined Figure 2In the exemplary embodiment shown, the display substrate further includes a plurality of intermittently arranged power-off structures 92 disposed on the side of the barrier structure 40 opposite to the barrier dam 20. Exemplarily, the plurality of power-off structures 92 may be two, three, or more, and is not limited thereto. Furthermore, the plurality of power-off structures 92 are completely covered by the thin-film encapsulation layer 50, and along a direction perpendicular to the plane of the substrate 10, the distance between the surface of each power-off structure 92 facing away from the substrate 10 and the substrate 10 is greater than the distance between the surface of each isolation pillar 30 facing away from the substrate 10 and the substrate 10. Correspondingly, the step difference between each power-off structure 92 is greater than the step difference between each isolation pillar 30. In this way, the plurality of power-off structures 92 can effectively isolate the related film layers subsequently covering them. Figure 2 The direction indicated by the middle arrow Z is along the plane perpendicular to the substrate 10. Here, d1 represents the distance between the surface of the power-off structure 92 facing away from the substrate 10 and the substrate 10, and d2 represents the distance between the surface of the isolation pillar 30 facing away from the substrate 10 and the substrate 10, where d1 > d2. Of course, the specific values ​​of the distances between the isolation pillar 30 and the surface of the power-off structure 92 facing away from the substrate 10 can be set according to actual application needs, and are not limited here.

[0063] In this embodiment, the display substrate further includes an organic layer 80 located on the side of the at least one inorganic layer 60 facing away from the substrate 10; the organic layer 80 has a recessed structure 81 located between two adjacent power-off structures 92 in the periphery region BB of the hole; along the direction facing away from the substrate 10, each power-off structure 92 includes a first sub-part 921 and a second sub-part 922 arranged sequentially, the second sub-part 922 is arranged in the same layer as the plurality of isolation pillars 30, the first sub-part 921 is arranged in the same layer as the organic layer 80, and on one side surface of the same power-off structure 92 adjacent to the recessed structure 81, the edge of the first sub-part 921 coincides with the edge of the recessed structure 81, and the orthographic projection of the edge of the second sub-part 922 on the substrate 10 completely falls within the area of ​​the orthographic projection of the recessed structure 81 on the substrate 10.

[0064] In a specific implementation, the display substrate further includes an organic layer 80 located on the side of at least one inorganic layer 60 facing away from the substrate 10. For example, the organic layer 80 is a first planarization layer 21. Figure 8 As shown Figure 1 An enlarged view of one of the structures in region Q is shown to clearly illustrate the specific structural details of the power-off structure 92. Figure 8The other film layers covering the power-off structure 92 are not shown. Specifically, the organic layer 80 has a recessed structure 81 located between two adjacent power-off structures 92 in the periphery region BB of the aperture; along the direction away from the substrate 10, each power-off structure 92 includes a first sub-section 921 and a second sub-section 922 arranged sequentially. The second sub-section 922 is disposed in the same layer as a plurality of isolation pillars 30, and the first sub-section 921 is disposed in the same layer as the organic layer 80. For example, the second sub-section 922 and the plurality of isolation pillars 30 are disposed in the same layer as the second source-drain layer 22, and the first sub-section 921 is disposed in the same layer as the first planarization layer 80.

[0065] Furthermore, on one side surface of the same power-off structure 92 adjacent to the recessed structure 81, the edge of the first sub-part 921 coincides with the edge of the recessed structure 81, and the orthographic projection of the edge of the second sub-part 922 onto the substrate 10 completely falls within the area of ​​the orthographic projection of the recessed structure 81 onto the substrate 10. In this way, the corresponding edges of the first sub-part 921 and the second sub-part 922 corresponding to the same power-off structure 92 form an undercut structure. This simplifies the process and, even when the cathode material in the light-emitting functional layer covers multiple power-off structures 92, effectively disconnects the corresponding cathode material. This effectively avoids the reliability failure problem caused by the cathode material forming an electrical path at the hole edge, thereby improving the performance of the display substrate.

[0066] In the embodiments of this application, it is still combined with Figure 2 In the exemplary embodiment shown, the display substrate further includes an etching barrier structure 93 located on the side of the plurality of power-off structures 92 away from the barrier dam 20, and the etching barrier structure 93 includes a third sub-part 931 disposed in the same layer as the organic layer 80.

[0067] In practical implementation, the display substrate also includes an etching barrier structure 93 located on the side of the multiple power-off structures 92 facing away from the barrier dam 20. For example... Figure 9 The diagram shown is an enlarged view of one possible structure including the etching barrier structure 93 in the actual fabrication process. The etching barrier structure 93 includes a third sub-section 931 disposed on the same layer as the organic layer 80. The reference numeral L indicates the cut location, and the reference numeral C indicates the acid etching surface. For example, the etching barrier structure 93 is disposed on the same layer as the first planarization layer 80. In this way, when the back side of the substrate 10 at the via H is opened using acid, the third sub-section 931 disposed on the same layer as the organic layer 80 at the cut location can, to a certain extent, prevent the acid from corroding the organic light-emitting material in the light-emitting functional layer, thereby ensuring the display effect of the display substrate.

[0068] In one exemplary embodiment, the etching barrier structure 93 further includes a fourth sub-part 932 disposed on the same layer as the at least one inorganic layer 60. The fourth sub-part 932 and the third sub-part 931 are disposed opposite to the substrate 10, and the orthographic projections of the third sub-part 931 and the fourth sub-part 932 on the substrate 10 overlap each other.

[0069] like Figure 10 The diagram shown is an enlarged view of one possible structure including the etch barrier structure 93 in the actual fabrication process. The etch barrier structure 93 further includes a fourth sub-section 932 disposed co-layered with at least one inorganic layer 60. The fourth sub-section 932 and the third sub-section 931 are sequentially disposed away from the substrate 10. In other words, the etch barrier structure 93 includes a third sub-section 931 disposed co-layered with the organic layer 80, and a fourth sub-section 932 disposed co-layered with at least one inorganic layer 60. This improves the acid corrosion resistance of the film structure related to the hole edge, ensuring the display effect of the display substrate.

[0070] In the embodiments of this application, it is still combined with Figure 2 In the exemplary embodiment shown, the display substrate further includes a plurality of riveting structures 94 located on the side of the etching barrier structure 93 away from the substrate 10. Each riveting structure 94 includes a fifth sub-part 941 and a sixth sub-part 942 connected to each other. The fifth sub-part 941 is disposed in the same layer as the plurality of isolation pillars 30. The sixth sub-part 942 is disposed in the same layer as the inorganic encapsulation layer in the thin film encapsulation layer 50.

[0071] In specific implementations, the display substrate also includes multiple riveting structures 94 located on the side of the etching barrier structure 93 facing away from the substrate 10. For example, the multiple riveting structures 94 can be two, or three or more, and this is not limited thereto. Figure 11 The diagram shown is an enlarged view of one of the structures including multiple riveting structures 94 in the actual fabrication process. Specifically, each riveting structure 94 includes a fifth sub-section 941 and a sixth sub-section 942 connected to each other; wherein, the fifth sub-section 941 is disposed in the same layer as multiple isolation pillars 30; and the sixth sub-section 942 is disposed in the same layer as the inorganic encapsulation layer in the thin film encapsulation layer 50. It should be noted that the "inorganic encapsulation layer" here includes the first inorganic encapsulation layer 51 and the second inorganic encapsulation layer 53. For example, the groove corresponding to the undercut of the fifth sub-section 941 is riveted together with the protrusion of the inorganic encapsulation layer formed into a film. In this way, the adhesion strength of the relevant film layers at the cut is improved, and it is difficult to separate the relevant film layers even under the external force of subsequent processes, thereby improving the encapsulation effect.

[0072] In this embodiment, the display substrate further includes a touch function layer 95 disposed on the side of the thin film encapsulation layer 50 away from the substrate 10; along the direction away from the substrate 10, the touch function layer 95 includes a third metal layer 951, a touch insulating layer 952 and a fourth metal layer 953 disposed sequentially; the third metal layer 951 and / or the fourth metal layer 953 at least cover the area between two adjacent isolation pillars 30.

[0073] In a specific implementation, the display substrate also includes a touch functional layer 95 disposed on the side of the thin-film encapsulation layer 50 facing away from the substrate 10. For example, the various film layers of the touch functional layer 95 can be directly fabricated on the thin-film encapsulation layer 50, and the touch functional layer 95 is disposed within the film layer structure, thus eliminating the need for a separate touch substrate. This ensures both a thin and lightweight design of the display substrate and its touch functionality. Furthermore, along the direction facing away from the substrate 10, the touch functional layer 95 includes a third metal layer 951, a touch insulating layer 952, and a fourth metal layer 953 disposed sequentially. For example, an organic insulating material can be used to prepare the touch insulating layer 952. The specific arrangement of the touch functional layer 95 is described in related technologies and will not be detailed here. Additionally, the third metal layer 951 and / or the fourth metal layer 953 at least cover the area between two adjacent isolation pillars 30. In this way, even if there is a gap at the undercut of the isolation pillar 30 when the inorganic layer material is filmed on the isolation pillar 30 in the packaging structure, the gap can be effectively blocked by the third metal layer 951 and / or the fourth metal layer 953, which can effectively prevent water vapor from entering along the plane perpendicular to the substrate 10, thereby improving the packaging effect.

[0074] In one exemplary embodiment, still combined Figure 2 As shown, the third metal layer 951 at least covers the area between two adjacent isolation pillars 30. For example, as... Figure 12 The image shown is an enlarged view of one of the structures in the actual fabrication process, which includes a third metal layer 951 at the edge of the hole.

[0075] In one exemplary embodiment, combined with Figure 13 As shown, the fourth metal layer 953 covers at least the area between two adjacent isolation pillars 30.

[0076] In one exemplary embodiment, the third metal layer 951 and the fourth metal layer 953 at least cover the area between two adjacent isolation pillars 30.

[0077] It should be noted that, in this embodiment, the display substrate may further include a post spacer (PS) layer (not shown in the figure) disposed on the side of the second planarization layer 23 facing away from the substrate 10. For example, the barrier dam 20 in this embodiment may be composed of a first planarization layer 21, a second planarization layer 23, a pixel definition layer 25, and a post spacer layer. Furthermore, unless otherwise specified, the plurality of isolation pillars 30, barrier structures 40, at least one groove 70, plurality of power-off structures 92, etching barrier structures 93, and plurality of riveting structures 94 in this embodiment are all disposed around the via H.

[0078] In addition, in this embodiment, the display substrate, besides including the aforementioned film layer structures, may also include a touch protection layer 96 and a leveling layer 97 located on the side of the touch functional layer 95 facing away from the substrate 10, thereby effectively filling the step differences in the relevant film layer structures while protecting the touch functional layer 95. For example, the leveling layer 97 can be prepared using inkjet printing. The display substrate may also include a filter layer 98, an adhesive layer 99, and a protective cover plate 100 sequentially disposed on the side of the leveling layer 97 facing away from the substrate 10. For example, the filter layer 98 can be a polarizer or a color filter. Polarizers are generally thicker. When the filter layer 98 uses a color filter, a Color Filter On Encapsulation (COE) technology is employed, thereby ensuring a thinner and lighter design for the display substrate. Of course, the display substrate provided in this embodiment may include other film layer structures besides those described above, depending on the actual application requirements, and is not limited here.

[0079] In this embodiment, the substrate 10 is a rigid substrate. Exemplarily, the substrate 10 can be a silicon-based substrate or a glass-based substrate, and is not limited thereto. This improves the structural stability of the display substrate.

[0080] Based on the same inventive concept, this application also provides a display device, which includes:

[0081] The display substrate as described in any of the preceding items;

[0082] The sensor is positioned at the location corresponding to the via H.

[0083] For example, the sensor is at least one of a camera, an optical sensor, a handset, or other similar devices.

[0084] Since the principle by which this display device solves the problem is similar to that of the aforementioned display substrate, the implementation of this display device can refer to the implementation of the aforementioned display substrate, and the repeated parts will not be described again.

[0085] In specific implementation, the display device provided in this application embodiment can be any product or component with display function, such as a mobile phone, tablet computer, television, monitor, laptop computer, digital photo frame, or navigator. Other essential components of this display device are understood by those skilled in the art and will not be described in detail here, nor should they be construed as limiting this application.

[0086] Although preferred embodiments of this application have been described, those skilled in the art, upon learning the basic inventive concept, can make other changes and modifications to these embodiments. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments as well as all changes and modifications falling within the scope of this application.

[0087] Obviously, those skilled in the art can make various modifications and variations to this application without departing from the spirit and scope of this application. Therefore, if such modifications and variations fall within the scope of the claims of this application and their equivalents, this application also intends to include such modifications and variations.

Claims

1. A display substrate, wherein, include: A substrate with a via is provided, a barrier dam located in the periphery region of the via, a plurality of isolation pillars located on the side of the barrier dam away from the display area, a barrier structure located on the side of the plurality of isolation pillars away from the barrier dam, and a thin film encapsulation layer located on the side of the barrier dam away from the substrate; wherein, the periphery region of the via is arranged around the via, and the display area is arranged around the periphery region of the via. The thin-film encapsulation layer covers the display area and extends through the barrier dam and the plurality of isolation pillars to the side of the barrier structure opposite to the substrate; at least one inorganic layer is disposed between the plurality of isolation pillars and the substrate; the barrier structure is used to block the propagation of cutting cracks.

2. The display substrate as claimed in claim 1, wherein, The barrier structure includes at least one groove formed on the side of the at least one inorganic layer away from the substrate, the at least one groove and an organic layer completely filling the at least one groove together forming the barrier structure; each of the grooves penetrates at least a portion of the film layer of the at least one inorganic layer.

3. The display substrate as described in claim 2, wherein, The barrier structure further includes a first metal layer located between the organic layer and the at least one inorganic layer, the first metal layer covering the at least one groove.

4. The display substrate as claimed in claim 1, wherein, The at least one inorganic layer is multilayered, and the barrier structure includes a second metal layer disposed between two adjacent inorganic layers in the multilayered inorganic layers.

5. The display substrate as claimed in claim 4, wherein, The barrier structure also includes an organic layer located on the side of the multilayer inorganic layer opposite to the substrate.

6. The display substrate according to any one of claims 1-5, wherein, It also includes a plurality of intermittently arranged power-off structures disposed on the side of the barrier structure away from the barrier dam. The plurality of power-off structures are completely covered by the thin film encapsulation layer, and along the direction perpendicular to the plane where the substrate is located, the distance between the surface of each power-off structure away from the substrate and the substrate is greater than the distance between the surface of the plurality of isolation pillars away from the substrate and the substrate.

7. The display substrate as claimed in claim 6, wherein, It also includes an organic layer located on the side of the at least one inorganic layer facing away from the substrate; the organic layer has a recessed structure in the periphery of the hole located between two adjacent power-off structures; along the direction facing away from the substrate, each power-off structure includes a first sub-part and a second sub-part arranged sequentially, the second sub-part is arranged in the same layer as the plurality of isolation pillars, the first sub-part is arranged in the same layer as the organic layer, and is adjacent to the recessed structure on one side surface of the same power-off structure, the edge of the first sub-part coincides with the edge of the recessed structure, and the orthogonal projection of the edge of the second sub-part on the substrate completely falls within the area of ​​the orthogonal projection of the recessed structure on the substrate.

8. The display substrate as claimed in claim 7, wherein, It also includes an etched barrier structure located on the side of the plurality of power-off structures away from the barrier dam, the etched barrier structure including a third sub-section disposed in the same layer as the organic layer.

9. The display substrate as claimed in claim 8, wherein, The etching barrier structure further includes a fourth sub-part disposed on the same layer as the at least one inorganic layer. The fourth sub-part and the third sub-part are disposed opposite to the substrate in sequence, and the orthographic projections of the third sub-part and the fourth sub-part on the substrate overlap each other.

10. The display substrate as claimed in claim 8 or 9, wherein, It also includes a plurality of riveting structures located on the side of the etching barrier structure away from the substrate, each of the riveting structures including a fifth sub-section and a sixth sub-section connected to each other; the fifth sub-section is disposed in the same layer as the plurality of isolation pillars; the sixth sub-section is disposed in the same layer as the inorganic encapsulation layer in the thin film encapsulation layer.

11. The display substrate according to any one of claims 1-5 and 7-9, wherein, It also includes a touch function layer disposed on the side of the thin film encapsulation layer away from the substrate; along the direction away from the substrate, the touch function layer includes a third metal layer, a touch insulating layer and a fourth metal layer disposed sequentially; the third metal layer and / or the fourth metal layer at least cover the area between two adjacent isolation pillars.

12. The display substrate according to any one of claims 1-5 and 7-9, wherein, The substrate is a rigid substrate.

13. A display device, wherein, include: The display substrate as described in any one of claims 1-11.

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