Semiconductor chip packaging device

Abstract

The utility model provides a semiconductor chip packaging device which comprises a base, a lower mold is erected on the top of the base, at least two mold grooves are evenly formed in the top of the lower mold, a demolding mechanism matched with the mold grooves is arranged on the lower mold, a fixing base corresponding to the lower mold is arranged above the lower mold, and the fixing base is arranged on the lower mold. An electric push rod for driving the fixed seat to move up and down is arranged at the top of the fixed seat; according to the utility model, after the fixed seat is matched with the lower die to complete packaging of a chip, the electric push rod drives the fixed seat to move from a third height to a first height, at the first height, the fixed seat pushes the push plate to move upwards, the push plate drives the pull rod and the bottom frame to move upwards, and when the bottom frame moves upwards, the push plate is driven to extend upwards in the die cavity; a semiconductor chip packaged and formed in the mold groove can be pushed out, and automatic demolding is achieved.

Description

Technical Field

[0001] This utility model belongs to the field of chip manufacturing technology, and specifically relates to a semiconductor chip packaging device. Background Technology

[0002] Packaging can be considered the final step in the integrated circuit manufacturing process. It refers to the process of laying out, bonding and fixing chips on different types of frames or substrates, leading out terminals, and fixing them with molding compound to form packages of different shapes.

[0003] In the prior art, such as Chinese utility model patent document CN218783009U, a chip packaging device is disclosed, which uses an electric push rod to push the formed chip for demolding; Chinese utility model patent document CN221304601U discloses a chip packaging device, which uses a motor to drive a worm gear to rotate, and the worm gear to drive a screw to move to demold the formed chip. The above-mentioned prior art all require additional power components to achieve demolding, which increases equipment cost and energy consumption.

[0004] Therefore, it is necessary to design a semiconductor chip packaging device that can simultaneously demold chips from multiple molds without the need for additional driving components, thereby reducing equipment costs and solving the current technical problems. Summary of the Invention

[0005] To address the shortcomings of existing technologies, this invention provides a semiconductor chip packaging device that can simultaneously demold chips from multiple molds without the need for additional driving components, thereby reducing equipment costs.

[0006] The technical solution of this utility model is as follows: a semiconductor chip packaging device, including a base, a lower mold mounted on the top of the base, at least two mold grooves evenly arranged on the top of the lower mold, a demolding mechanism cooperating with the mold grooves on the lower mold, a corresponding fixed seat above the lower mold, and an electric push rod for driving its up and down movement on the top of the fixed seat; the demolding mechanism has a push rod slidably disposed at the bottom of the mold groove, the bottom end of the push rod penetrating the lower mold, a base frame fixedly disposed at the bottom of the push rod, pull rods symmetrically arranged on both sides of the base frame, a push plate disposed at the top of the pull rod, and the push plate located above the fixed seat.

[0007] The lower section of the pull rod is provided with a demolding reset mechanism. The demolding reset mechanism has a support plate fixedly installed on one side of the lower mold. The support plate is slidably fitted on the outside of the pull rod. A spring is fitted on the outside of the pull rod between the support plate and the base frame. A limit ring is fixedly installed on the outside of the pull rod above the support plate.

[0008] One end of the push plate is fixedly connected with the top end of the pull rod, and the other end of the push plate is fixedly provided with an elastic pad at the bottom, and the elastic pad corresponds to the top of the fixed seat.

[0009] The elastic pad is a rubber pad fixedly arranged at the bottom of the push plate.

[0010] The top of the base is fixedly provided with a support, the support is in a "door" shape structure, and the electric push rod is fixedly assembled at the top of the support.

[0011] The top of the fixed seat is symmetrically provided with two parallel guide rods, and the guide rods are in sliding connection with the support.

[0012] The bottom of the lower mold is fixedly provided with a support block, and the support block is fixedly arranged at the top of the base.

[0013] The beneficial effects of the semiconductor chip packaging device are as follows:

[0014] (1) After the fixed seat and the lower mold cooperate to complete the packaging of the chip, the electric push rod drives the fixed seat to move from the third height to the first height, at the first height, the fixed seat pushes the push plate to move upwards, the push plate drives the pull rod and the chassis to move upwards, when the chassis moves upwards, the push plate is stretched upwards in the mold groove, and the semiconductor chip packaged and formed in the mold groove can be pushed out, so that automatic demolding is realized.

[0015] (2) The lower mold has a plurality of mold grooves, and the demolding mechanism can simultaneously demold the chips in the plurality of mold grooves, and the demolding mechanism realizes demolding by lifting the fixed seat, without the need of additionally adding driving components, so that the equipment cost is reduced. BRIEF DESCRIPTION OF DRAWINGS

[0016] Figure 1 It is a structure schematic view of the semiconductor chip packaging device.

[0017] Figure 2 It is a structure schematic view of the semiconductor chip packaging device. Figure 1 It is an enlarged view of A in the semiconductor chip packaging device.

[0018] Figure 3 It is a structure schematic view of the semiconductor chip packaging device. DETAILED DESCRIPTION

[0019] Various exemplary embodiments of the present application will now be described in detail with reference to the accompanying drawings. The description of the exemplary embodiments is merely illustrative in nature and is in no way intended to limit the application, its application, or uses. The application can be implemented in any of numerous ways, not just the examples described herein. These examples are provided so that this application will be thorough and complete, and will fully convey the scope of the application to those skilled in the art. It should be noted that the relative arrangement of components and steps illustrated in these examples, the components of the materials, numerical expressions, and numerical values are to be interpreted as merely illustrative, unless otherwise specifically stated, and are not to be construed as limiting.

[0020] The terms "first", "second", and similar terms used in the present application do not denote any order, number, or importance, but are only used to distinguish different parts. The terms "comprise", "include" and similar terms mean that the elements before the term encompass the elements listed after the term, and do not exclude the possibility of also encompassing other elements. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships, and when the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0021] As Figures 1 to 3As shown, the semiconductor chip packaging device comprises a base 1, the top of the base 1 is provided with a lower mold 2, the top of the lower mold 2 is uniformly provided with at least two mold grooves 21, the lower mold 2 is provided with a demolding mechanism 7 matched with the mold grooves 21, the upper side of the lower mold 2 is provided with a corresponding fixed seat 4, the top of the fixed seat 4 is provided with an electric push rod 5 driving the up and down movement thereof; the demolding mechanism 7 has a push rod 71 slidingly arranged at the bottom of the mold groove 21, the bottom end of the push rod 71 penetrates the lower mold 2, the bottom of the push rod 71 is fixedly provided with a bottom frame 75, the two sides of the bottom frame 75 are symmetrically provided with pull rods 72, the top end of the pull rod 72 is provided with a push plate 73, and the push plate 73 is located above the fixed seat 4; in this embodiment, the electric push rod 5 drives the fixed seat 4 to move to a first height, a second height and a third height, the heights of the first height, the second height and the third height gradually decrease; when the fixed seat 4 is at the first height, the fixed seat 4 drives the push plate 73 to move upwards, the push plate 73 drives the pull rod 72 and the bottom frame 75 to move upwards, when the bottom frame 75 moves upwards, the push plate 71 is driven to protrude upwards inside the mold groove 21, the semiconductor chip packaged and formed inside the mold groove 21 can be pushed out, and the demolding is realized; when the fixed seat 4 is at the second height, the fixed seat 4 has a certain distance from the push plate 73 and the lower mold 2, and the top end of the push rod 71 is flush with the inner bottom of the mold groove 21 at this time; when the fixed seat 4 is at the third height, the fixed seat 4 abuts against the lower mold 2, and the chip inside the mold groove 21 is packaged; after the fixed seat 4 and the lower mold 2 cooperate to complete the packaging of the chip, the electric push rod 5 drives the fixed seat 4 to move from the third height to the first height at this time, and when the fixed seat 4 is at the first height, the fixed seat 4 drives the push plate 73 to move upwards, the push plate 73 drives the pull rod 72 and the bottom frame 75 to move upwards, when the bottom frame 75 moves upwards, the push plate 71 is driven to protrude upwards inside the mold groove 21, the semiconductor chip packaged and formed inside the mold groove 21 can be pushed out, and the automatic demolding is realized; the lower mold 2 has a plurality of mold grooves 21, the demolding mechanism 7 can simultaneously demold the chips in the plurality of mold grooves 21, the demolding mechanism 7 realizes demolding by lifting the fixed seat 4, without the need for additional driving components, which is conducive to reducing the equipment cost.

[0022] In some embodiments, the lower section of the pull rod 72 is provided with a demolding reset mechanism 8, the demolding reset mechanism 8 has a support plate 81 fixedly arranged on one side of the lower mold 2, the support plate 81 is slidingly sleeved on the outer side of the pull rod 72, a spring 82 is sleeved on the outer side of the pull rod 72 between the support plate 81 and the bottom frame 75, and a limiting ring 83 is fixedly arranged on the outer side of the pull rod 72 above the support plate 81; when the fixed seat 4 is at the first height, the spring 82 is compressed, the spring 82 is gradually reset during the movement of the fixed seat 4 from the first height to the second height, and the bottom frame 75 is driven to move downwards, when the bottom frame 75 drives the push rod 71 to move downwards, the push rod 71 just moves to a position where the top end thereof is flush with the inner bottom of the mold groove 21 when the push rod 71 moves to the bottom of the limiting ring 83 and abuts against the top of the support plate 81.

[0023] In some embodiments, one end of the push plate 73 is fixedly connected with the top end of the pull rod 72, and the other end of the push plate 73 is fixedly provided with an elastic pad 74 corresponding to the top of the fixed seat 4. During the process of moving to the first height on the fixed seat 4, the fixed seat 4 will first contact the elastic pad 74, and the elastic pad 74 can play a certain buffering effect on the fixed seat 4. Specifically, the elastic pad 74 is a rubber pad fixedly arranged at the bottom of the push plate 73.

[0024] In some embodiments, the top of the base 1 is fixedly provided with a bracket 9, the bracket 9 is in a "door" shape structure, the electric push rod 5 is fixedly assembled at the top of the bracket 9, the bracket 9 provides support for the electric push rod 5, and the output end of the electric push rod 5 is connected with the fixed seat 4. By controlling the extension and contraction of the electric push rod 5, the fixed seat 4 can be driven to move between the first height, the second height and the third height.

[0025] In some embodiments, the top of the fixed seat 4 is symmetrically provided with two parallel guide rods 6, and the guide rods 6 are in sliding connection with the bracket 9. The bracket 9 is fixedly provided with a linear bearing sleeved outside the guide rods 6.

[0026] In some embodiments, the bottom of the two ends of the lower mold 2 is fixedly provided with a support block 3, and the support block 3 is fixedly arranged at the top of the base 1. The support block 3 provides support for the two ends of the lower mold 2, so that the top of the lower mold 2 has enough space for the push rod 71 to move up and down.

[0027] In some embodiments, the bracket 9 is provided with three proximity switches corresponding to the first height, the second height and the third height of the fixed seat 4. When the fixed seat 4 moves to the first height, the second height and the third height, the corresponding proximity switch is triggered, thereby realizing the height control of the fixed seat 4.

[0028] So far, the embodiments of the present application have been described in detail. In order to avoid obscuring the concept of the present application, some details known in the art are not described. Those skilled in the art can fully understand how to implement the technical solutions disclosed herein according to the above description.

[0029] The above-described embodiments only express some implementation manners of the present application, and the description is more specific and detailed, but it should not be understood as a limitation on the scope of the utility model patent. It should be pointed out that for those skilled in the art, without departing from the concept of the present application, a number of modifications and improvements can be made, which all belong to the protection scope of the present application. Therefore, the protection scope of the utility model patent should be subject to the appended claims.

Claims

1. A semiconductor chip packaging device, characterized in that: The device includes a base, a lower mold mounted on the top of the base, at least two mold slots evenly arranged on the top of the lower mold, a demolding mechanism that cooperates with the mold slots on the lower mold, a corresponding fixed seat above the lower mold, and an electric push rod that drives it to move up and down on the top of the fixed seat. The demolding mechanism has a push rod that is slidably disposed at the bottom of the mold groove. The bottom end of the push rod passes through the lower mold. A base frame is fixedly disposed at the bottom of the push rod. Pull rods are symmetrically disposed on both sides of the base frame. A push plate is disposed at the top of the pull rod. The push plate is located above the fixed seat.

2. The semiconductor chip packaging apparatus according to claim 1, characterized in that: The lower section of the pull rod is provided with a demolding reset mechanism. The demolding reset mechanism has a support plate fixedly installed on one side of the lower mold. The support plate is slidably fitted on the outside of the pull rod. A spring is fitted on the outside of the pull rod between the support plate and the base frame. A limit ring is fixedly installed on the outside of the pull rod above the support plate.

3. The semiconductor chip packaging apparatus according to claim 1, characterized in that: One end of the push plate is fixedly connected to the top of the pull rod, and an elastic pad is fixedly provided at the bottom of the other end of the push plate, the elastic pad corresponding to the top of the fixed seat.

4. The semiconductor chip packaging apparatus according to claim 3, characterized in that: The elastic pad is a rubber pad that is fixedly installed at the bottom of the push plate.

5. The semiconductor chip packaging apparatus according to claim 1, characterized in that: A bracket is fixedly installed on the top of the base. The bracket has a "door" shaped structure, and the electric actuator is fixedly assembled on the top of the bracket.

6. The semiconductor chip packaging apparatus according to claim 5, characterized in that: The top of the fixed base is symmetrically provided with two parallel guide rods, which are slidably connected to the bracket.

7. The semiconductor chip packaging apparatus according to claim 1, characterized in that: Support blocks are fixedly installed at both ends of the lower mold, and the support blocks are fixedly installed on the top of the base.

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