Tungsten wire mold code printing equipment
By designing a tungsten wire mold marking device, the automatic marking of the mold is achieved by using a material guiding and flipping printing device, which solves the problem of labor-intensive traditional manual marking and improves production efficiency and the uniformity and aesthetics of mold marking.
Patent Information
- Application Number
- CN202520075023.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-14
- Publication Date
- 2026-01-27
- Estimated Expiration
- 2035-01-14
AI Technical Summary
The traditional marking process for tungsten wire molds is labor-intensive and inconvenient for centralized marking, resulting in low production efficiency.
A marking device for tungsten wire molds was designed, comprising a material guiding device and a flipping printing device. The material guiding device gradually disperses and conveys the molds to the flipping printing device, where laser printers are used for automated marking, and the flipping printing device ensures the consistency and stability of the marking surface on the molds.
It enables automated marking of molds, avoids mold accumulation, improves production efficiency and the uniformity of mold marking, enhances aesthetics, and ensures the stability of mold flipping.
Smart Images

Figure CN223833677U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of mold marking technology, specifically relating to a tungsten wire mold marking device. Background Technology
[0002] The working principle of wire drawing dies is that the metal wire passes through the die and gradually reaches the required size from thick to thin. The core of the wire drawing die is generally made of natural diamond or synthetic diamond (such as GE, PCD, synthetic materials, etc.). After the wire drawing die is produced, the model number and information need to be printed on the die for easier differentiation. Traditionally, marking is done manually. Marking is usually done in batches, so there is no need to set up a separate employee position at the marking machine. However, each batch of marking usually occurs during the busiest time of the workshop, making it very labor-intensive to arrange separate marking personnel. Utility Model Content
[0003] The technical problem to be solved by this utility model is to provide a tungsten wire mold marking device, which has a simple structure and is convenient and practical. The mold is gradually dispersed and transported to the flipping printing device through the material guiding device, so as to avoid the mold accumulating at the flipping printing device and interfering with the mold flipping.
[0004] A tungsten wire mold marking device includes a movable frame, a material guiding device, a flip printing device, and a laser printer. The material guiding device and the flip printing device are mounted on the movable frame. The flip printing device is located at the material outlet of the material guiding device and below the print head of the laser printer. The material guiding device includes a rotary motor, a rotating plate, a vortex guide plate, a fixed frame, a conical platform, an outlet ramp, and a CCD camera. The rotary motor is mounted on the movable frame, and its power rod is connected to the rotating plate. The conical platform is located at the center of the rotating plate. The vortex guide plate is connected to the fixed frame, which is connected to the movable frame. The outlet ramp is connected to the end of the vortex guide plate away from the conical platform and cooperates with the flip printing device. The CCD camera is mounted on the print head of the laser printer.
[0005] Preferably, the flip printing device includes a flip motor, a transmission pulley, a telescopic cylinder, a positioning frame, a driven pulley, a pull rod, a flip plate, an arc-shaped magnet, and a transmission belt. The flip motor is mounted on a movable frame and the power rod is connected to the transmission pulley. The positioning frame is connected to the movable frame. One end of the flip plate is rotatably connected to one side of the positioning frame. The telescopic cylinder is connected to the other side of the positioning frame and the piston rod is connected to the pull rod. One end of the pull rod passes through the positioning frame and the flip plate and is connected to the arc-shaped magnet. The end of the flip plate away from the positioning frame has a magnet telescopic groove and a clearance groove. The driven pulley is connected to the flip plate and is connected to the transmission pulley via the transmission belt.
[0006] Preferably, positioning and flipping grooves are provided on both sides of the magnet telescopic groove.
[0007] Preferably, the material guiding device further includes an annular guide ring, which is disposed above the conical platform and connected to the fixed frame.
[0008] Preferably, a feed hopper is connected to the annular guide ring.
[0009] Beneficial effects:
[0010] (1) The present invention provides a tungsten wire mold coding device, which has a simple structure and is convenient and practical. The mold is gradually dispersed and transported to the flipping printing device through the material guiding device, so as to avoid the mold accumulating at the flipping printing device and interfering with the mold flipping.
[0011] (2) The tungsten wire mold marking equipment of this utility model flips the mold by flipping the printing device so that the marking surface of the mold is on the same side, thereby achieving uniformity in mold production, improving aesthetics and ensuring that users can distinguish the front and back of the mold.
[0012] (3) The tungsten wire mold marking equipment of this utility model ensures the stability of the mold during the flipping by the positioning flipping groove and avoids the mold from being misaligned during the flipping. Attached Figure Description
[0013] Figure 1 This is a schematic diagram of the coding equipment.
[0014] Figure 2 This is a schematic diagram of the material guiding device;
[0015] Figure 3 This is a top view of the material guiding device.
[0016] Figure 4 This is a schematic diagram of the flip-printing device.
[0017] 1-Moving frame, 2-Guiding device, 21-Rotary motor, 22-Rotating plate, 23-Vortex guide plate, 24-Fixed frame, 25-Conical platform, 26-Annular guide ring, 27-Outlet inclined plate, 3-Flipping printing device, 31-Flipping motor, 32-Transmission pulley, 33-Telescopic cylinder, 34-Positioning frame, 35-Transmission pulley, 36-Pull rod, 37-Flipping plate, 38-Arc magnet, 39-Magnet telescopic groove, 310-Positioning flipping groove, 311-Avoiding groove. Detailed Implementation
[0018] The embodiments of this utility model are further described below with reference to the accompanying drawings.
[0019] Example 1
[0020] like Figures 1 to 4As shown; a tungsten wire mold marking device includes a movable frame 1, a material guiding device 2, a flip printing device 3, and a laser printer. The material guiding device 2 and the flip printing device 3 are mounted on the movable frame 1. The flip printing device 3 is located at the outlet of the material guiding device 2 and below the print head of the laser printer. The material guiding device 2 includes a rotary motor 21, a rotating plate 22, a vortex guide plate 23, a fixed frame 24, a conical platform 25, an outlet inclined plate 27, and a CCD camera. The rotary motor 21 is mounted on the movable frame 1, and its power rod is connected to the rotating plate 22. The conical platform 25 is located at the center of the rotating plate 22. The vortex guide plate 23 is connected to the fixed frame 24, which is connected to the movable frame 1. The outlet inclined plate 27 is connected to the end of the vortex guide plate 23 away from the conical platform 25 and cooperates with the flip printing device 3. The CCD camera is mounted on the print head of the laser printer. The flip printing device 3 includes a flip motor 31 and a transmission pulley 32. The system comprises a telescopic cylinder 33, a positioning frame 34, a drive pulley 35, a pull rod 36, a flap 37, an arc-shaped magnet 38, and a drive belt. The flipping motor 31 is mounted on the movable frame 1, and its power rod is connected to the drive pulley 32. The positioning frame 34 is connected to the movable frame 1. One end of the flap 37 is rotatably connected to one side of the positioning frame 34. The telescopic cylinder 33 is connected to the other side of the positioning frame 34, and its piston rod is connected to the pull rod 36. One end of the pull rod 36 passes through the positioning frame 34 and the flap 37, and is connected to the arc-shaped magnet 38. A magnet 38 is connected, and the end of the flip plate 37 away from the positioning frame 34 is provided with a magnet telescopic groove 39 and a clearance groove 311. The drive pulley 35 is connected to the flip plate 37 and is connected to the drive pulley 32 through a drive belt. Positioning flip grooves 310 are provided on both sides of the magnet telescopic groove 39. The material guiding device 2 also includes an annular guide ring 26, which is set above the conical platform 25 and connected to the fixed frame 24. A feed hopper is connected to the annular guide ring 26.
[0021] The wire drawing die is placed into the feeding hopper and slides onto the rotating plate 22 along the inclined surface of the conical platform 25. Simultaneously, the rotating motor 21 starts the rotating plate 22, causing it to rotate. The wire drawing die on the rotating plate 22 moves along the vortex guide plate 23 until it moves towards the flip printing device 3. The annular guide ring 26 prevents the wire drawing die from tilting and rolling vertically. As the wire drawing die approaches the flip printing device 3 along the guide inclined plate 27, the telescopic cylinder 33 drives the pull rod 36 to extend and retract. The pull rod 36 drives the arc magnet 38 to approach and attract the wire drawing die. Then, the telescopic cylinder 33 drives the arc magnet 38 to retract, allowing the wire drawing die to enter the positioning flip groove 310. The flip motor 31 then drives the transmission pulley 32 to rotate, transmitting... The drive pulley 32 drives the drive pulley 35 to rotate via the drive belt. The drive pulley 35 drives the flip plate 37 to rotate 180 degrees, causing the printing surface of the wire drawing die to rotate and face the laser printer head. Then the laser printer marks the wire drawing die. After the marking is completed, the telescopic cylinder 33 drives the arc magnet 38 to continue to retract, causing the wire drawing die to lose the attraction force of the arc magnet 38 and fall out. This cycle is repeated to complete the marking work. The marking is confirmed by the CCD camera on the surface of the wire drawing die. The dimensions of the wire drawing die are usually marked on the surface with a paint pen during production to facilitate the determination of the die processing hole positions after each process switch. The avoidance groove 311 can avoid this.
[0022] The specific embodiments of this utility model have been described in detail above, but they are merely examples, and this utility model is not limited to the specific embodiments described above. For those skilled in the art, any equivalent modifications and substitutions to this utility model are also within the scope of this utility model. Therefore, all equivalent changes and modifications made without departing from the spirit and scope of this utility model are covered within the scope of this utility model.
Claims
1. A tungsten wire mold marking device, characterized in that: The device includes a movable frame (1), a material guiding device (2), a flip-printing device (3), and a laser printer. The material guiding device (2) and the flip-printing device (3) are mounted on the movable frame (1). The flip-printing device (3) is located at the discharge port of the material guiding device (2) and below the print head of the laser printer. The material guiding device (2) includes a rotary motor (21), a rotating plate (22), a vortex guide plate (23), a fixed frame (24), a conical platform (25), an outlet inclined plate (27), and a CCD camera. The camera is mounted on the rotating frame (1) and the power rod is connected to the rotating plate (22). The conical platform (25) is set at the center of the rotating plate (22). The vortex guide plate (23) is connected to the fixed frame (24). The fixed frame (24) is connected to the moving frame (1). The guide plate (27) is connected to the end of the vortex guide plate (23) away from the conical platform (25) and cooperates with the flip printing device (3). The CCD camera is mounted on the printer head of the laser printer.
2. The tungsten wire mold marking equipment as described in claim 1, characterized in that: The flip printing device (3) includes a flip motor (31), a transmission pulley (32), a telescopic cylinder (33), a positioning frame (34), a transmission pulley (35), a pull rod (36), a flip plate (37), an arc magnet (38), and a transmission belt. The flip motor (31) is mounted on the movable frame (1), and the power rod is connected to the transmission pulley (32). The positioning frame (34) is connected to the movable frame (1). One end of the flip plate (37) is rotatably connected to the positioning frame (35). 4) On one side, the telescopic cylinder (33) is connected to the other side of the positioning frame (34) and the piston rod is connected to the pull rod (36). One end of the pull rod (36) passes through the positioning frame (34) and the flap (37) and is connected to the arc magnet (38). The flap (37) is provided with a magnet telescopic groove (39) and a clearance groove (311) at the end away from the positioning frame (34). The drive pulley (35) is connected to the flap (37) and is connected to the drive pulley (32) through the drive belt.
3. The tungsten wire mold marking equipment as described in claim 2, characterized in that: Positioning and flipping grooves (310) are provided on both sides of the magnet telescopic groove (39).
4. The tungsten wire mold marking equipment as described in claim 3, characterized in that: The material guiding device (2) also includes an annular guide ring (26), which is disposed above the conical platform (25) and connected to the fixing frame (24).
5. The tungsten wire mold marking equipment as described in claim 4, characterized in that: The annular guide ring (26) is connected to a feed hopper.