Mobile phone shell texture forming mold structure
By using a hollow rubber ring to design air inlet and outlet holes in the mobile phone case texture molding mold, the problem of material property changes caused by mold temperature rise was solved, stable pressure holding capability was achieved, and molding quality was improved.
Patent Information
- Application Number
- CN202520027015.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-07
- Publication Date
- 2026-01-27
- Estimated Expiration
- 2035-01-07
AI Technical Summary
In existing mobile phone case texture molding molds, the buffer structure's material properties change due to increased mold temperature, affecting the pressure holding effect and reducing the yield rate.
Hollow rubber rings are used as buffer components, and air inlets and outlets are designed. Heat is dissipated by blowing air with a high-pressure air gun, maintaining the shape stability and pressure holding capacity of the buffer components.
Effective heat dissipation prevents the rubber material from deforming due to temperature rise, ensures that the mold maintains stable pressure holding capacity during the die casting process, and improves the yield rate of mobile phone case textures.
Smart Images

Figure CN223834939U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of mobile phone back cover texture processing technology, and in particular to a mobile phone case texture forming mold structure. Background Technology
[0002] One method for texturing phone cases is through mold processing. Injection molds consist of a moving mold (A plate) and a fixed mold (B plate), and typically also include guiding, cooling, and ejection systems. By engraving various textures within the mold cavity, corresponding patterns can be formed on the phone case surface. To maintain texture yield, a pressure-holding buffer structure, such as a simple elastic material like a rubber ring, is usually added between the fixed and moving molds. However, this buffer structure is easily affected by changes in material properties due to increased mold temperature, thus affecting the pressure-holding effect and consequently the pressing of the phone case texture, reducing the yield rate. Utility Model Content
[0003] The purpose of this section is to outline some aspects of embodiments of the present invention and to briefly describe some preferred embodiments. Simplifications or omissions may be made in this section, as well as in the abstract and title of this application, to avoid obscuring the purpose of these documents; however, such simplifications or omissions should not be construed as limiting the scope of the present invention.
[0004] To address the aforementioned problems, this utility model provides the following technical solution:
[0005] A mobile phone case texture molding mold structure includes a fixed mold with a textured groove, a protrusion on a moving mold that cooperates with the textured groove, a buffer component disposed on the fixed mold or the moving mold, the buffer component having an air inlet and an air outlet, and the air inlet being connected to the air outlet through the cavity of the buffer component.
[0006] Based on the above technical solution, the present invention can be further improved as follows.
[0007] As a preferred embodiment of the mobile phone case texture forming mold structure of the present invention, wherein: the upper surface of the fixed mold is provided with an adapter groove, and the outer surface of the buffer part is sealed and fastened in the adapter groove.
[0008] In a preferred embodiment of the mobile phone case texture forming mold structure of this utility model, the air guide end on the fixed mold is connected to the adapter groove, and after the buffer is set, the air guide end is connected to the air inlet.
[0009] In a preferred embodiment of the mobile phone case texture molding mold structure of this utility model, the air inlet is located away from the exhaust outlet.
[0010] In a preferred embodiment of the mobile phone case texture forming mold structure of the present invention, the number of air inlets is one, and the number of exhaust holes is several.
[0011] As a preferred embodiment of the mobile phone case texture forming mold structure of the present invention, the buffer is a rubber ring with a cavity, and a number of partitions of the same material as the buffer are provided at equal intervals in the cavity. Each partition has a connecting hole, and the connecting holes of adjacent partitions are connected.
[0012] The beneficial effects of this utility model are as follows: By improving the rubber ring, the buffer is designed as a hollow rubber ring and installed on the fixed mold or moving mold. By blowing air into the air inlet of the buffer with a high-pressure air gun, heat can be discharged from the exhaust port. This process can quickly restore the shape of the buffer and remove its heat, avoiding changes in the material properties of the rubber buffer due to temperature rise. This ensures that the buffer maintains a stable pressure holding capacity during the die casting process. Attached Figure Description
[0013] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. Among them:
[0014] Figure 1 This is a perspective view of the entire embodiment.
[0015] Figure 2 This is an example. Figure 1 A partial schematic diagram.
[0016] Figure 3 This is a perspective view of the moving model in this embodiment.
[0017] Figure 4 This is a perspective view of the buffer component in this embodiment.
[0018] Figure 5 This is a partial perspective view of the buffer component in this embodiment.
[0019] Figure 6 This is an example. Figure 5 A sectional view.
[0020] In the figure; fixed mold 100, textured groove 101, adapter groove 102, air guide end 103;
[0021] Buffer 200, cavity 200a, air inlet 201, air outlet 202, partition 203, connecting hole 203a;
[0022] Moving mold 300, bump 300a. Detailed Implementation
[0023] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings.
[0024] Many specific details are set forth in the following description in order to provide a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Those skilled in the art can make similar extensions without departing from the spirit of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.
[0025] Secondly, the term "an embodiment" or "embodiment" as used herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of the present invention. The phrase "in one embodiment" appearing in different places in this specification does not necessarily refer to the same embodiment, nor is it a single or selective embodiment that excludes other embodiments.
[0026] Example
[0027] Reference Figures 1 to 5 This is an embodiment of the present utility model, which provides a mobile phone case texture molding mold structure. The fixed mold 100 has a texture groove 101, and the protrusion 300a on the moving mold 300 cooperates with the texture groove 101. The buffer member 200 is disposed on the fixed mold 100 or the moving mold 300. The buffer member 200 has an air inlet 201 and an exhaust 202, and the air inlet 201 is connected to the exhaust 202 through the cavity 200a of the buffer member 200.
[0028] Specifically, the buffer 200 is a hollow rubber ring installed on the fixed mold 100 or the moving mold 300. By blowing air through the air inlet 201 of the buffer 200 with a high-pressure air gun, its heat is discharged from the exhaust port 202. This process allows the buffer 200 to quickly recover its shape and removes its heat, preventing the rubber buffer 200 from changing its material properties due to temperature rise. This ensures that the buffer 200 maintains a stable pressure holding capacity during die casting in both the fixed mold 100 and the moving mold 300.
[0029] like Figure 1 , Figure 2As shown, for example, the upper surface of the fixed mold 100 is provided with an adapter groove 102, and the outer surface of the buffer member 200 is sealed and fastened in the adapter groove 102. The adapter groove 102 is located outside the textured groove 101, and at least half of the buffer member 200 is disposed inside the adapter groove 102. The buffer member 200 can be fixed to the fixed mold 100 by itself being fastened in the adapter groove 102, or by adhesive or other means.
[0030] like Figure 2 As shown, for example, the air guide end 103 on the fixed mold 100 is connected to the adapter groove 102. After the buffer 200 is set, the air guide end 103 is connected to the air inlet 201. The air guide end 103 can be a round hole opened on the side of the fixed mold 100, or a conduit can be installed on the round hole for connecting with the high-pressure air gun, so that the airflow enters the buffer 200 through the air inlet 201 and flows out from the exhaust hole.
[0031] like Figure 4 As shown, for example, the air inlet 201 is far from the exhaust port 202, which allows the airflow to flow completely in the cavity 200a of the buffer 200, which can greatly improve the heat dissipation and restore the shape of the buffer 200.
[0032] like Figure 4 , Figure 5 As shown, for example, the number of air inlets 201 is one, and the number of exhaust outlets 202 is several, which can improve exhaust efficiency and thus not affect the processing of the product;
[0033] like Figure 6 As shown, for example, the buffer 200 is a rubber ring with a cavity 200a. Several spacers 203 of the same material as the buffer 200 are provided at equal intervals in the cavity 200a. Each spacer 203 has a connecting hole 203a. The connecting holes 203a of adjacent spacers 203 are interconnected. By setting spacers 203 at equal intervals in the cavity 200a of the buffer 200, the compressive toughness and overall strength of the buffer 200 can be enhanced. At the same time, the connecting holes 203a on the spacers 203 are interconnected, allowing airflow to pass through without affecting the heat dissipation of the buffer 200.
[0034] It is important to note that the constructions and arrangements of this application shown in several different exemplary embodiments are merely illustrative. Although only a few embodiments are described in detail in this disclosure, those who consult this disclosure will readily understand that many modifications are possible (e.g., changes in the size, dimensions, structure, shape and proportion of various elements, as well as parameter values (e.g., temperature, pressure, etc.), mounting arrangements, use of materials, color, orientation, etc.) without substantially departing from the novel teachings and advantages of the subject matter described in this application). For example, an element shown as integrally formed may be composed of multiple parts or elements, the position of elements may be inverted or otherwise altered, and the nature or number or position of discrete elements may be changed or altered. Therefore, all such modifications are intended to be included within the scope of this utility model. The order or sequence of any process or method steps may be changed or reordered according to alternative embodiments. In the claims, any "device plus function" clause is intended to cover the structure described herein that performs the function, and not only structural equivalents but also equivalent structures. Without departing from the scope of this invention, other substitutions, modifications, alterations, and omissions may be made in the design, operation, and arrangement of the exemplary embodiments. Therefore, this invention is not limited to the specific embodiments, but extends to various modifications that still fall within the scope of the appended claims.
Claims
1. A mobile phone case texture molding mold structure, characterized in that: include, The fixed mold (100) has a textured groove (101), and the protrusion (300a) on the moving mold (300) cooperates with the textured groove (101). The buffer (200) is set on the fixed mold (100) or the moving mold (300). The buffer (200) has an air inlet (201) and an exhaust hole (202), and the air inlet (201) is connected to the exhaust hole (202) through the cavity (200a) of the buffer (200).
2. The mobile phone case texture forming mold structure as described in claim 1, characterized in that: The upper surface of the fixed mold (100) is provided with an adapter groove (102), and the outer surface of the buffer (200) is sealed and locked in the adapter groove (102).
3. The mobile phone case texture forming mold structure as described in claim 2, characterized in that: The air guide end (103) on the fixed mold (100) is connected to the adapter groove (102). After the buffer (200) is set, the air guide end (103) is connected to the air inlet (201).
4. The mobile phone case texture forming mold structure as described in claim 3, characterized in that: The air inlet (201) is located away from the exhaust port (202).
5. The mobile phone case texture forming mold structure as described in claim 4, characterized in that: The number of air inlets (201) is one, and the number of exhaust outlets (202) is several.
6. The mobile phone case texture forming mold structure as described in claim 3, characterized in that: The buffer (200) is a rubber ring with a cavity (200a). Several partitions (203) of the same material as the buffer (200) are arranged at equal intervals in the cavity (200a). Each partition (203) has a connecting hole (203a), and the connecting holes (203a) of adjacent partitions (203) are connected.