Non-contact resin warped sheet operation auxiliary device

Abstract

The utility model relates to a non-contact resin warping sheet operation auxiliary device, which comprises a support carrier, an alignment and pressurization module and a flatness detection module, the upper clamp is provided with a gas circuit I used for adsorbing and fixing the resin warping sheet, a pressurizing gas circuit used for controlling application and release of gas pressure after attachment and an electromagnetic control valve, and tight attachment between the resin warping sheet and the supporting carrier is achieved through nitrogen pressurization; the flatness detection module comprises a laser transmitter and a laser receiver, the laser transmitter is installed on the side face of the upper clamp, the laser receiver is arranged on the other side face of the upper clamp, the corresponding positions of the laser transmitter and the laser receiver are assembled at the same horizontal height, and the warping reduction effect of the resin sheet is detected through a laser sensor. According to the non-contact resin warped sheet operation auxiliary device, non-contact and non-damage pressurized bonding of a chip on the front face of the resin warped sheet is achieved by means of gas pressurization.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor packaging integration, and in particular to a non-contact resin warp wafer operation auxiliary device. Background Technology

[0002] With the continuous development of semiconductor technology, fan-out wafer-level packaging (FOWLP) technology, as an advanced packaging method, can significantly improve the integration and performance of the package while reducing costs by directly redistributing and interconnecting on the wafer surface. However, this process has always been a pain point in product processing due to the chemical shrinkage of liquid compression molding compounds during curing and cooling after molding, as well as the warpage caused by the mismatch of the coefficients of thermal expansion (CTE) between the silicon chip, molding material, and substrate. Excessively warped resin wafers present challenges in automated operation during spin coating and processes requiring adsorption and leveling. Therefore, it is necessary to develop novel resin warpage handling auxiliary devices to solve these problems. Utility Model Content

[0003] To solve the above-mentioned technical problems, this utility model provides a non-contact resin warp sheet operation auxiliary device, comprising:

[0004] The support carrier is a high-rigidity transparent glass substrate that matches the thermal expansion coefficient of the wafer material and is reusable, used to support the resin warped wafer.

[0005] Alignment and pressurization module, including:

[0006] A nitrogen pressurization assembly includes an upper clamp, which has an air passage I for adsorbing and fixing the resin warp sheet, a pressurization air passage and an electromagnetic control valve for controlling the application and release of gas pressure after bonding, and achieves tight bonding between the resin warp sheet and the support carrier by nitrogen pressurization.

[0007] The flatness detection module includes a laser emitter and a laser receiver. The laser emitter is installed on one side of the upper clamp, and the laser receiver is set on the other side of the upper clamp. The laser emitter and laser receiver are assembled at the same horizontal height at corresponding positions. The anti-warping effect of the resin sheet is detected by a laser sensor.

[0008] In one embodiment of this utility model, a foamed adhesive layer is provided between the support carrier and the resin warp sheet. The foamed adhesive layer is a temperature-responsive / light-responsive foamed adhesive layer with a low Young's modulus, used to bond the support carrier and the resin warp sheet under specific conditions.

[0009] In one embodiment of this utility model, the alignment and pressurization module further includes a mold slot, which is disposed in the support carrier placement platform and the upper clamp, for the purpose of achieving preliminary alignment.

[0010] In one embodiment of this utility model, the support carrier is placed on a support carrier placement platform. The support carrier placement platform is provided with protrusions for positioning the support carrier and the warped resin sheet. The size of the protrusions is complementary to the wafer notch. The support carrier placement platform and the upper fixture are connected by a sealing ring to ensure the airtightness of the cavity. The sealing ring is used to prevent gas leakage from affecting the pressurization effect.

[0011] In one embodiment of this utility model, the working auxiliary device further includes a resin warp sheet clamp, which is used to fix the resin warp sheet and keep it stable during operation. The resin warp sheet clamp has air holes on its edge for fixing the resin warp sheet when it is loaded.

[0012] In one embodiment of this utility model, the upper clamp is provided with a three-way valve, which has three states: pressurization, pressure holding, and pressure release. Its air path is used to realize the corresponding function. In the pressurization state, nitrogen gas source is used to pressurize the cavity above the resin warp sheet; in the pressure holding state, the pressure is kept stable; in the pressure release state, the pressure in the cavity is released. The upper clamp is provided with an upper clamp cavity pressurization air passage for connecting the nitrogen pressurization component and the pressurization cavity.

[0013] In one embodiment of this utility model, the laser emitter and laser receiver work together to determine the pressure bonding effect by emitting and receiving laser signals, and transmit the signals to the electromagnetic control valve to control its opening and closing, thereby achieving precise control of the pressure process.

[0014] Compared with the prior art, the above-mentioned technical solution of this utility model has the following advantages: The non-contact resin warp sheet operation auxiliary device of this utility model achieves non-contact and damage-free pressure bonding of the front chip of the resin warp sheet by means of gas pressurization; and it does not require a temperature control module and a vacuum operation environment, reducing equipment complexity and cost, simplifying the disassembly process, and allowing the support carrier to be reused multiple times. Attached Figure Description

[0015] To make the content of this utility model easier to understand, the present utility model will be further described in detail below with reference to specific embodiments and accompanying drawings.

[0016] Figure 1 This is a schematic diagram of the auxiliary device for resin warp sheet operation of this utility model;

[0017] Figure 2 This is a schematic diagram of the air circuit state of the three-way valve described in this utility model;

[0018] Figure 3 This is a schematic diagram of the auxiliary process for the operation of the resin warp sheet described in this utility model.

[0019] As shown in the figure: 1. Support carrier, 2. Pressurized air path, 3. Laser emitter, 4. Laser receiver, 5. Support carrier placement platform, 6. Upper clamp. Detailed Implementation

[0020] like Figure 1 As shown, this embodiment provides a non-contact resin warp sheet operation auxiliary device, including:

[0021] Support carrier 1, which is a high-rigidity transparent glass substrate that matches the thermal expansion coefficient of the wafer material and is reusable, is used to support the resin warped sheet; a foamed adhesive layer is provided between the support carrier 1 and the resin warped sheet, which is a temperature-responsive / light-responsive foamed adhesive layer with low Young's modulus, used to bond the support carrier 1 and the resin warped sheet under specific conditions.

[0022] Alignment and pressurization module, including:

[0023] The nitrogen pressurization assembly includes an upper clamp 6, which has an air passage I for adsorbing and fixing the resin warp sheet, a pressurization air passage 2 for controlling the application and release of gas pressure after bonding, and an electromagnetic control valve. The close bonding between the resin warp sheet and the support carrier 1 is achieved by nitrogen pressurization.

[0024] The mold slot is located in the support carrier placement platform 5 and the upper clamp 6, and is used to achieve preliminary alignment.

[0025] The flatness detection module includes a laser emitter 3 and a laser receiver 4. The laser emitter 3 is mounted on one side of the upper clamp 6, and the laser receiver 4 is located on the other side of the upper clamp 6. The laser emitter 3 and laser receiver 4 are assembled at the same horizontal height at corresponding positions. The anti-warping effect of the resin sheet is detected by a laser sensor. The laser emitter 3 and laser receiver 4 work together to determine the pressure bonding effect by emitting and receiving laser signals, and transmit the signals to the electromagnetic control valve to control its on / off state, thereby achieving precise control of the pressure process.

[0026] The support carrier 1 is placed on the support carrier placement platform 5. The support carrier placement platform 5 is provided with protrusions for positioning the support carrier and the warped resin sheet. The size of the protrusions is complementary to the wafer notch. The support carrier placement platform 5 and the upper clamp 6 are connected by a sealing ring to ensure the airtightness of the cavity. The sealing ring is used to prevent gas leakage from affecting the pressurization effect.

[0027] A resin warp sheet clamp is used to fix the resin warp sheet and keep it stable during operation. The edge of the resin warp sheet clamp is provided with air holes for fixing the resin warp sheet when it is loaded.

[0028] like Figure 2 As shown, the upper clamp 6 is equipped with a three-way valve, which has three states: pressurization, pressure holding, and pressure release, namely ①, ②, and ③, respectively. Its air path is used to realize the corresponding function. In the pressurization state, nitrogen gas is used to pressurize the cavity above the resin warp sheet; in the pressure holding state, the pressure is kept stable; in the pressure release state, the pressure in the cavity is released. The upper clamp 6 is also equipped with an upper clamp cavity pressurization air passage for connecting the nitrogen pressurization component and the pressurization cavity.

[0029] At the same time, such as Figure 3 As shown, this embodiment also provides a method for implementing the resin warpage sheet operation auxiliary device, including:

[0030] Step ① First, place the substrate with the temperature / laser foaming adhesive layer attached onto the support carrier platform.

[0031] Step 2: Place the resin warp sheet under the resin warp sheet fixture and secure it.

[0032] Step 3: Move the upper clamp and resin warp sheet downwards until they fit against the support carrier placement platform.

[0033] Step 4: Apply pressurized nitrogen gas to the cavity above the resin warp sheet for pressurized bonding.

[0034] Step 5: Turn on the laser sensor to check the pressure bonding effect in real time. After the warpage meets the standard, the laser receiver transmits a signal to the air-pressurizing solenoid valve to stop pressurizing. After holding the pressure for 2 minutes, the pressure is released.

[0035] After the warp reduction process is completed, the resin sheet is removed and recycled by heating / laser irradiation after the required processing is finished.

[0036] In summary, the described auxiliary device solves the problem of automating the processing of resin warped wafers by using reusable wafer support carriers and foamed adhesive layers. It achieves contactless and damage-free processing of the front-side chip of the resin warped wafer through gas pressurization, and enables low-cost processing with reusable support carriers. It is hoped that this technology will be widely applied and promoted.

[0037] Obviously, the above embodiments are merely illustrative examples for clear explanation and are not intended to limit the implementation. Those skilled in the art will recognize that other variations or modifications can be made based on the above description. It is neither necessary nor possible to exhaustively list all possible implementations here. However, obvious variations or modifications derived therefrom are still within the protection scope of this invention.

Claims

1. A non-contact resin warp sheet operation auxiliary device, characterized in that, include: Support carrier (1), wherein the support carrier (1) is a high-rigidity transparent glass substrate that matches the thermal expansion coefficient of the wafer material and is reusable, used to support the resin warped wafer; Alignment and pressurization module, including: The nitrogen pressurization assembly includes an upper clamp (6), which has an air passage I for adsorbing and fixing the resin warp sheet, a pressurization air passage (2) for controlling the application and release of gas pressure after bonding, and an electromagnetic control valve. The close bonding between the resin warp sheet and the support carrier (1) is achieved by nitrogen pressurization. The flatness detection module includes a laser emitter (3) and a laser receiver (4). The laser emitter (3) is mounted on the side of the upper clamp (6), and the laser receiver (4) is located on the other side of the upper clamp (6).

2. The non-contact resin warp sheet operation auxiliary device according to claim 1, characterized in that: A foamed adhesive layer is provided between the support carrier (1) and the resin warp sheet. The foamed adhesive layer is a temperature-responsive / light-responsive foamed adhesive layer with a low Young's modulus, used to bond the support carrier (1) and the resin warp sheet under specific conditions.

3. The non-contact resin warp sheet operation auxiliary device according to claim 1, characterized in that: The alignment and pressurization module also includes a mold slot, which is located in the support carrier placement platform (5) and the upper clamp (6).

4. The non-contact resin warp sheet operation auxiliary device according to claim 1, characterized in that: The support carrier (1) is placed on the support carrier placement platform (5). The support carrier placement platform (5) is provided with protrusions for positioning the support carrier and the warped resin sheet. The size of the protrusions is complementary to the wafer notch. The support carrier placement platform (5) and the upper clamp (6) are sealed by a sealing ring to ensure the airtightness of the cavity.

5. The non-contact resin warp sheet operation auxiliary device according to claim 1, characterized in that: The auxiliary device also includes a resin warp sheet clamp, which is used to fix the resin warp sheet and keep it stable during operation. The resin warp sheet clamp has air holes on its edge.

6. The non-contact resin warp sheet operation auxiliary device according to claim 1, characterized in that: The upper clamp (6) is provided with a three-way valve, which has three states: pressurization, pressure holding and pressure release. The upper clamp (6) is provided with an upper clamp cavity pressurization port for connecting the nitrogen pressurization assembly and the pressurization cavity.

7. The non-contact resin warp sheet operation auxiliary device according to claim 1, characterized in that: The laser emitter (3) and laser receiver (4) work together to determine the pressure bonding effect by emitting and receiving laser signals, and transmit the signals to the electromagnetic control valve to control its opening and closing, thereby achieving precise control of the pressure process.

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