Low-power-consumption closed-loop current sensor
By independently controlling the sensitivity of the Hall element using a low-power closed-loop current sensor, the problems of large measurement errors and high power consumption caused by factors such as magnetic core saturation and hysteresis in traditional current sensors are solved, achieving higher accuracy and stability in measurement.
Patent Information
- Application Number
- CN202520182831.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-06
- Publication Date
- 2026-01-27
- Estimated Expiration
- 2035-02-06
AI Technical Summary
Traditional current sensors are susceptible to magnetic core saturation, hysteresis, temperature changes, and interference from external magnetic fields, resulting in large measurement errors and high power consumption.
A low-power closed-loop current sensor is used. By independently controlling the Hall plate output amplifier in the air gap of the iron core, combined with a flexible circuit board and the Hall effect, a Hall element circuit board, Hall plate, and heat sink are realized to achieve the Hall element technical solution. By using the heat sink and Hall plate technical solution, and by independently controlling the Hall plate in each air gap of the iron core, the sensitivity of the Hall element is adjusted, the influence of position error is reduced, and the accuracy is improved.
It significantly reduces positional errors caused by inconsistent air gap dimensions, improves sensor accuracy and performance, and is suitable for high-precision measurement scenarios, thus expanding its application range.
Smart Images

Figure CN223842012U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of current sensor technology, and in particular to a low-power closed-loop current sensor. Background Technology
[0002] A current sensor is a device that senses the current being measured. Small power supply devices have incorporated an increasing number of new technologies. These include switching power supplies, hard switching, soft switching, voltage regulation, linear feedback voltage regulation, magnetic amplifier technology, digitally controlled voltage regulation, PWM, SPWM, electromagnetic compatibility, and more. Practical needs directly drive the continuous development and progress of power supply technology. To automatically detect and display current, and to provide automatic protection and more advanced intelligent control in the event of overcurrent, overvoltage, or other dangerous conditions, power supply technologies with sensing capabilities, sampling, and protection are becoming increasingly prevalent, leading to the development of sensors for detecting current or voltage.
[0003] Traditional current sensors, such as shunt current transformers and electromagnetic current transformers, are susceptible to factors such as core saturation, hysteresis, temperature changes, and interference from external magnetic fields, leading to significant measurement errors. For example, during high-current measurements, electromagnetic current transformers may experience a significant decrease in measurement accuracy due to core saturation. Furthermore, traditional current sensors consume a large amount of power and generate considerable heat. Therefore, a low-power closed-loop current sensor is urgently needed to address these issues. Utility Model Content
[0004] The purpose of this invention is to address the shortcomings of existing technologies by proposing a low-power closed-loop current sensor. Its advantages include: effectively reducing positional errors caused by inconsistent air gap dimensions, thereby improving the overall accuracy and performance of the sensor.
[0005] To achieve the above objectives, the present invention adopts the following technical solution:
[0006] A low-power closed-loop current sensor includes a housing, a positioning frame fixedly connected to one inner wall of the housing, and a flexible circuit board disposed inside the positioning frame.
[0007] The outer wall of the positioning frame and the inner wall of the housing form a receiving cavity. The receiving cavity contains an iron core protective box coil assembly. A heat sink is snapped into the inside of the housing. A PCB board is provided on one side of the heat sink. A fixing bolt is provided on one side of the PCB board. The PCB board is fixedly connected to the heat sink by the fixing bolt. A Hall plate is provided on one side of the PCB board.
[0008] The above technical solutions can effectively reduce the positional error caused by inconsistent air gap dimensions, thereby improving the overall accuracy and performance of the sensor.
[0009] The present invention is further configured such that a second pin is fixedly connected to one end of the PCB board, and a conductive sheet is fixedly connected to the end of the second pin away from the PCB board.
[0010] The above technical solutions facilitate the fixed connection of the PCB board to external circuits or electrical equipment.
[0011] The present invention is further configured such that a first pin is fixedly connected to the side of the PCB board away from the second pin, and a conductive rod is fixedly connected to the other end of the first pin, and the conductive rod is fixedly connected to the Hall plate.
[0012] The above technical solutions ensure a stable electrical connection between the PCB board and the Hall effect sensor.
[0013] The present invention is further configured such that the iron core protective box coil assembly includes an iron core body, a winding coil and an amplifier, the winding coil is wound on the outer circumferential wall of the iron core body, and an iron core air gap is formed at both ends of the iron core body.
[0014] The above technical solution adjusts the sensitivity of the Hall element by independently controlling the amplification factor of the Hall plate output in each iron core air gap. This sensor aims to reduce the impact of positional errors caused by inaccurate iron core air gap machining on the sensor accuracy.
[0015] The present invention is further configured such that a through slot is provided on one side of the heat sink, and the amplifier passes through the inside of the through slot.
[0016] The above technical solutions prevent the amplifier from obstructing the heatsink during installation.
[0017] The present invention is further configured such that a positioning component is provided on one outer wall of the heat sink, and the number of the positioning components is four. A positioning hole is provided on one side of the PCB board, and the positioning component cooperates with the positioning hole. The heat sink is fixedly connected to the PCB board through the positioning component.
[0018] Through the above technical solution, the four sets of positioning components can effectively reinforce the connection between the heat sink and the PCB board, preventing the heat sink from becoming loose and separating from the PCB board.
[0019] The present invention is further configured such that the positioning component includes a support frame fixedly connected to the outer wall of one side of the heat sink, a circular column fixedly connected to one end of the support frame, an elastic element fixedly connected to one end of the circular column, a positioning head fixedly connected to one end of the elastic element, a support plate fixedly connected to the outer wall of one side of the circular column, and the support plate and the positioning head fixedly connected.
[0020] Through the above technical solution, during the process of the positioning component being inserted into the positioning hole, the elastic element first deforms and then resets, preventing the positioning component from detaching from the positioning hole again, ensuring the stability of the connection between the PCB board and the heat sink, and further improving the heat dissipation effect of the heat sink on the PCB board.
[0021] The beneficial effects of this utility model are as follows:
[0022] 1. A low-power closed-loop current sensor that optimizes the sensitivity of the Hall chip by independently controlling the current, significantly reduces the impact of position error on the measurement results, and improves the measurement accuracy.
[0023] 2. A low-power closed-loop current sensor, the improved sensor exhibits higher stability and reliability under different operating conditions.
[0024] 3. A low-power closed-loop current sensor. This device is suitable for various application scenarios that require high-precision measurement, has high practical value and promotion prospects, and further expands the application scope of the sensor. Attached Figure Description
[0025] Figure 1 This is an exploded structural diagram of a low-power closed-loop current sensor proposed in this utility model.
[0026] Figure 2 This invention proposes a low-power closed-loop current sensor. Figure 1 Enlarged structural diagram at point A;
[0027] Figure 3 This invention proposes a low-power closed-loop current sensor. Figure 1 A magnified structural diagram at point B in the middle.
[0028] In the diagram: 1. Housing; 2. Flexible circuit board; 3. Conductive rod; 4. Iron core housing coil assembly; 4001. Winding coil; 4002. Iron core body; 4003. Amplifier; 4004. Iron core air gap; 5. Heat sink; 6. Positioning assembly; 6001. Positioning head; 6002. Elastic element; 6003. Support plate; 6004. Circular column; 6005. Support frame; 7. PCB board; 8. Positioning hole; 9. Fixing bolt; 10. Positioning frame; 11. Hall plate; 12. First pin; 13. Through slot; 14. Conductive plate; 15. Second pin. Detailed Implementation
[0029] The technical solution of this patent will be further described in detail below with reference to specific embodiments.
[0030] The embodiments of this patent are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this patent, and should not be construed as limiting this patent.
[0031] In the description of this patent, it should be understood that the terms “center,” “upper,” “lower,” “front,” “back,” “left,” “right,” “vertical,” “horizontal,” “top,” “bottom,” “inner,” and “outer,” etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this patent and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this patent.
[0032] In the description of this patent, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "setting" should be interpreted broadly. For example, they can refer to a fixed connection or setting, a detachable connection or setting, or an integral connection or setting. Those skilled in the art can understand the specific meaning of the above terms in this patent according to the specific circumstances.
[0033] Reference Figures 1-3 A low-power closed-loop current sensor includes a housing 1, a positioning frame 10 fixedly connected to the inner wall of one side of the housing 1, and a flexible circuit board 2 disposed inside the positioning frame 10.
[0034] The outer wall of the positioning frame 10 and the inner wall of the housing 1 form a receiving cavity. The iron core protective box coil assembly 4 is installed inside the receiving cavity. The heat sink 5 is snapped into the inside of the housing 1. A PCB board 7 is installed on one side of the heat sink 5. A fixing bolt 9 is installed on one side of the PCB board 7. The PCB board 7 is fixedly connected to the heat sink 5 by the fixing bolt 9. A Hall plate 11 is installed on one side of the PCB board 7.
[0035] Specifically, a second pin 15 is fixedly connected to one end of the PCB board 7, and a conductive sheet 14 is fixedly connected to the end of the second pin 15 away from the PCB board 7, so as to facilitate the fixed connection of the PCB board 7 with external circuits or electrical equipment.
[0036] Specifically, a first pin 12 is fixedly connected to the side of the PCB board 7 away from the second pin 15, and a conductive rod 3 is fixedly connected to the other end of the first pin 12. The conductive rod 3 is fixedly connected to the Hall plate 11 to ensure that a stable electrical connection can be formed between the PCB board 7 and the Hall plate 11.
[0037] Specifically, the iron core housing coil assembly 4 includes an iron core body 4002, a winding coil 4001, and an amplifier 4003. The winding coil 4001 is wound on the outer circumference of the iron core body 4002. Iron core air gaps 4004 are formed at both ends of the iron core body 4002. The sensitivity of the Hall element is adjusted by independently controlling the amplification factor output by the Hall plate 11 in each iron core air gap 4004. This sensor aims to reduce the impact of positional errors caused by inaccurate processing of the iron core air gap 4004 on the accuracy of the sensor.
[0038] Specifically, a through slot 13 is provided on one side of the heat sink 5, and the amplifier 4003 passes through the inside of the through slot 13 to prevent the amplifier 4003 from blocking the heat sink 5 during installation.
[0039] Specifically, a positioning component 6 is provided on one outer wall of the heat sink 5. There are four sets of positioning components 6. A positioning hole 8 is opened on one side of the PCB board 7. The positioning component 6 cooperates with the positioning hole 8. The heat sink 5 is fixedly connected to the PCB board 7 through the positioning component 6. The four sets of positioning components 6 can play a good role in reinforcing the connection between the heat sink 5 and the PCB board 7, and prevent the heat sink 5 from falling off due to loose connection.
[0040] Specifically, the positioning component 6 includes a support frame 6005 fixedly connected to the outer wall of one side of the heat sink 5. One end of the support frame 6005 is fixedly connected to a circular column 6004, and one end of the circular column 6004 is fixedly connected to an elastic element 6002. One end of the elastic element 6002 is fixedly connected to a positioning head 6001. A support plate 6003 is fixedly connected to the outer wall of one side of the circular column 6004. The support plate 6003 is fixedly connected to the positioning head 6001. During the process of the positioning component 6 being inserted into the positioning hole 8, the elastic element 6002 first deforms and then resets, preventing the positioning component 6 from detaching from the positioning hole 8 again. This ensures the stability of the connection between the PCB board 7 and the heat sink 5 and further improves the heat dissipation effect of the heat sink 5 on the PCB board 7.
[0041] Working principle: The sensitivity of the Hall element is adjusted by independently controlling the amplification factor of the Hall plate 11 output in each iron core air gap 4004. This sensor is designed to reduce the impact of positional errors caused by inaccurate machining of the iron core air gap 4004 on the accuracy of the sensor.
[0042] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.
Claims
1. A low-power closed-loop current sensor, comprising a housing (1), characterized in that, A positioning frame (10) is fixedly connected to one side of the inner wall of the housing (1), and a flexible circuit board (2) is provided inside the positioning frame (10). The outer wall of the positioning frame (10) and the inner wall of the housing (1) form a receiving cavity. The inner cavity is provided with an iron core protective box coil assembly (4). The inner cavity of the housing (1) is fitted with a heat sink (5). A PCB board (7) is provided on one side of the heat sink (5). A fixing bolt (9) is provided on one side of the PCB board (7). The PCB board (7) is fixedly connected to the heat sink (5) by the fixing bolt (9). A Hall plate (11) is provided on one side of the PCB board (7).
2. The low-power closed-loop current sensor according to claim 1, characterized in that, One end of the PCB board (7) is fixedly connected to a second pin (15), and the end of the second pin (15) away from the PCB board (7) is fixedly connected to a conductive sheet (14).
3. A low-power closed-loop current sensor according to claim 2, characterized in that, The PCB board (7) has a first pin (12) fixedly connected to the side away from the second pin (15), and a conductive rod (3) is fixedly connected to the other end of the first pin (12). The conductive rod (3) is fixedly connected to the Hall plate (11).
4. A low-power closed-loop current sensor according to claim 3, characterized in that, The iron core housing coil assembly (4) includes an iron core body (4002), a winding coil (4001) and an amplifier (4003). The winding coil (4001) is wound on the outer circumference of the iron core body (4002), and an iron core air gap (4004) is formed at both ends of the iron core body (4002).
5. A low-power closed-loop current sensor according to claim 4, characterized in that, A through slot (13) is provided on one side of the heat sink (5), and the amplifier (4003) passes through the inside of the through slot (13).
6. A low-power closed-loop current sensor according to claim 5, characterized in that, A positioning component (6) is provided on one side of the outer wall of the heat sink (5). There are four sets of positioning components (6). A positioning hole (8) is opened on one side of the PCB board (7). The positioning component (6) cooperates with the positioning hole (8). The heat sink (5) is fixedly connected to the PCB board (7) through the positioning component (6).
7. A low-power closed-loop current sensor according to claim 6, characterized in that, The positioning component (6) includes a support frame (6005) fixedly connected to the outer wall of one side of the heat sink (5). One end of the support frame (6005) is fixedly connected to a circular column (6004). One end of the circular column (6004) is fixedly connected to an elastic element (6002). One end of the elastic element (6002) is fixedly connected to a positioning head (6001). One side of the outer wall of the circular column (6004) is fixedly connected to a support plate (6003). The support plate (6003) is fixedly connected to the positioning head (6001).