Lithography machine with fast alignment and alignment system for lithography machine

Abstract

Examples of a lithography machine with fast alignment and an alignment system for a lithography machine are disclosed herein. The machine may include a platform for holding and moving a substrate; and a projection system for projecting an image on the plurality of exposed areas of the substrate. The machine may also include an alignment system positioned adjacent to the projection system. The alignment system may include a plurality of microscope cameras with a fixed focus, each microscope camera configured to detect a respective fiducial in a respective exposed area of the substrate, where at least one microscope camera of the plurality of microscope cameras has a numerical aperture equal to or less than 0.15.

Description

[0001] Cross-references to related applications

[0002] This application claims the benefit of priority to U.S. Patent Application Serial No. 18 / 061,737, filed December 5, 2022, and U.S. Provisional Patent Application Serial No. 63 / 327,075, filed April 4, 2022, the contents of which are incorporated herein by reference in their entirety. Technical Field

[0003] This disclosure relates in general to alignment techniques associated with photolithography. Background Technology

[0004] Photolithography is commonly used to create patterns on substrates such as silicon (semiconductor) wafers or flat panel displays. Generally speaking, photolithography involves transferring a pattern from a photomask (or mask) to a photosensitive surface on a substrate.

[0005] A robot is used to place the substrate onto a substrate platform within a lithography machine to prepare it for processing. Typically, the substrate has one or more reference indicators (e.g., notches or flat portions on the substrate edges) etched or otherwise formed into the substrate's edges. An alignment process is used to align the substrate using these reference indicators. Conventional alignment techniques typically employ high-resolution, high-numerical-aperture (NA) microscopes. However, these NA microscopes have a small depth of focus (e.g., <9 micrometers). This small depth of focus can be problematic because the substrate may not be perfectly flat; for example, it may be warped or bowed. Furthermore, other components within the lithography machine can also increase the inhomogeneity of the substrate processing. Therefore, conventional alignment techniques are not well-equipped to image the reference at varying heights. Summary of the Invention

[0006] This document discloses examples of lithography machines and processing techniques using an alignment system to align exposed areas based on a reference. The alignment system may include multiple microscope cameras with fixed focal lengths. Therefore, the microscope cameras can have low numerical apertures (NA) and do not require independent focus adjustments. Using cameras with lower NAs increases operational speed by eliminating the need to focus each microscope camera individually.

[0007] This disclosure describes a lithography machine with rapid alignment. The lithography machine includes: a platform for holding and moving a substrate; and a projection system for projecting an image onto multiple exposed areas of the substrate. The lithography machine also includes an alignment system positioned adjacent to the projection system, the alignment system comprising multiple microscope cameras with fixed focal points, each microscope camera configured to detect a corresponding reference in a corresponding exposed area of ​​the substrate.

[0008] This disclosure also describes a method for photolithography on a substrate, the method comprising: mounting the substrate on a platform of a photolithography machine; positioning the platform such that an alignment system of the photolithography machine is opposite to a first exposed area of ​​the substrate, wherein the alignment system includes a plurality of microscope cameras having fixed focal points; using the plurality of microscope cameras to capture a first set of images of the first exposed area, each image including a corresponding reference associated with the first exposed area; determining alignment correction information for the first exposed area based on the first set of images; and projecting the images onto the first exposed area based on the alignment correction information.

[0009] This disclosure also describes an alignment system for a lithography machine. The alignment system includes a support structure positioned adjacent to the projection system of the lithography machine. The alignment system also includes a plurality of microscope cameras coupled to the support structure and having fixed focal points, each microscope camera being configured to detect a corresponding reference in a corresponding exposed area of ​​the substrate. Attached Figure Description

[0010] The accompanying drawings illustrate only exemplary embodiments of this disclosure and should not be construed as limiting its scope.

[0011] Figure 1A An example section of a lithography machine is shown.

[0012] Figure 1B An example section of the projection system is shown.

[0013] Figure 1C An example section of the alignment system is shown.

[0014] Figure 2 An example section of a microscope camera is shown.

[0015] Figure 3 A simplified block diagram of the components of a microscope camera is shown.

[0016] Figure 4 An example section of the platform is shown.

[0017] Figure 5 A substrate with multiple exposed areas is shown.

[0018] Figure 6 A flowchart is shown for a method for photolithography with alignment.

[0019] Figure 7 A block diagram of an example machine is shown, on which any one or more of the techniques (e.g., methods) discussed herein can be performed. Detailed Implementation

[0020] The substrate may include a reference. As described herein, a lithography machine with an alignment system can align the exposed area based on the reference. The alignment system may include multiple microscope cameras with fixed focal points. The microscope cameras may have low numerical apertures (NA). Using cameras with low NAs can increase operating speed by eliminating the need to focus each microscope camera individually.

[0021] Figures 1A to 1C An example portion of a lithography machine 100 is shown. The lithography machine may include a projection system 102, an alignment system 104, and a platform for carrying one or more substrates 108. The projection system 102 and the alignment system 104 may be positioned adjacent to each other and may be positioned opposite to the platform 106 (e.g., above the platform).

[0022] The projection system 102 may include one or more projection camera systems. Figure 1B An example portion of projection system 102 is shown. Projection system 102 may include an illuminator 112, a mask platform 114, and a projection lens 116. Projection system 102 may be configured to expose a pattern or image to a corresponding exposure area on a substrate. If multiple projection camera systems are provided, the projection camera systems may be configured to expose their respective patterns or images substantially at the same time (e.g., concurrently or simultaneously).

[0023] The illuminator 112 may include a light source for generating light on top of the masks respectively placed on the mask platform. A UV LED (ultraviolet light-emitting diode) system and associated optics may be used to provide the light source.

[0024] The mask platform 114 may include alignment equipment for aligning a mask placed thereon relative to platform 106. The alignment equipment may include a 6-axis mask chuck, as described, for example, in USP 7,385,671 entitled “High Speed ​​Lithography Machine and Method,” the entire contents of which are incorporated herein by reference, including but not limited to those portions specifically appearing below, with the exception that this application supersedes any part of the foregoing patent in the event of any inconsistency with the foregoing patent. Each axis of the 6-axis chuck may have built-in single-axis, coarse, speed, and position sensors.

[0025] In an example of multiple camera systems, each mask platform can be configured to maintain an independent mask (or photomask or image source) to allow for different patterning. The mask platforms can be aligned independently relative to the platform to account for different variations or patterning on the substrate. Each camera system may have its own set of sensors used to align its photomask (or mask) with the substrate plane to ensure the camera's optical axis is perpendicular to the substrate plane. For example, the sensors for each camera (e.g., six sensors) can use a metrology frame as a reference for proper alignment. The metrology frame can be straight and rigid, and thus provides a reference for flatness, straightness, height, position, etc.

[0026] The mask platform 114 can be independently aligned relative to the platform to accommodate different variations or patterns on the substrate. The projection lens 116 projects the pattern or image from each mask onto the substrate placed on the platform. The projection lens 116 may include one or more optical lenses. The projection lens 116 may include a separate real-time autofocus sensor. The optical characteristics of the projection lens 116 can be adjusted as needed based on the autofocus sensor to focus the projected pattern or image onto the substrate.

[0027] Platform 106 can be positioned below the camera and can support one or more substrates during manufacturing. The platform may include a granite structure. The platform can be movable in the x, y, and θ directions.

[0028] Alignment system 104 can be used to align a substrate, and particularly to align a corresponding exposed area of ​​the substrate before it is exposed by a projection camera system. The alignment system may include multiple microscope cameras 118.1 to 118.4. For example, the alignment system may include four microscope cameras 118.1 to 118.4.

[0029] Alignment system 104 may include support structure 120 supporting the plurality of microscope cameras 118.1 to 118.4. Microscope cameras 118.1 to 118.4 may be movable in the x and y directions, but have a fixed z-position. Therefore, microscope cameras 118.1 to 118.4 have a fixed focus. That is, microscope cameras 118.1 to 118.4 can be moved to adjust their respective focuses without the use of separate actuators. Instead, microscope cameras 118.1 to 118.4 include microscope objectives with low numerical aperture (NA), eliminating the need for independent focus adjustments. In some examples, microscope cameras 118.1 to 118.4 may each have an NA equal to or less than 0.15. A low NA produces a higher depth of focus, eliminating the need for independent focus adjustments on the z-axis. The depth of focus of a microscope camera is related to its NA. Specifically, the depth of focus is related to the square of NA (NA²). 2The ratio is proportional. The use of a lower NA may sacrifice resolution, but provides the benefit of faster processing by eliminating the need to focus each microscope camera individually.

[0030] Therefore, as described herein, microscope cameras 118.1 to 118.4 can rapidly image and inspect references at various and uncertain heights without requiring focus adjustment on the z-axis, thus enabling rapid alignment. Furthermore, microscope cameras 118.1 to 118.4 can be used to inspect references not only on the top surface of a substrate but also on the bottom surface or intermediate layers (in the case of using an infrared sensor).

[0031] Each microscope camera 118.1 to 118.4 can simultaneously perform x and y detections on the corresponding reference. In the example with four microscope cameras, this results in eight information points being provided simultaneously for each exposed area (two information points per camera). This can lead to faster throughput and better coverage.

[0032] Microscope cameras 118.1 to 118.4 may be top-mounted on support structure 120. In some examples, microscope cameras 118.1 to 118.4 may be arranged in a rectangular array as shown, with each camera located at a corner of the array. Microscope cameras 118.1 to 118.4 may be movable in the x and y directions to accommodate different reference positions for various substrate formulations. The x and y actuators may be equipped with gripping arms for holding each microscope and positioning each microscope camera 118.1 to 118.4. In some examples, one microscope camera 118.1 may be kept stationary, and the other microscope cameras 118.2 to 118.4 may be moved relative to the stationary microscope camera 118.1.

[0033] Figure 2 An example portion of a microscope camera 118 is shown. The microscope camera 118 may include air bearings 202.1 to 202.3 and magnets 204.1 to 204.3 for positioning the microscope camera in the x and y directions. In this example, three air bearings and three magnets are provided, but more or fewer air bearings and magnets may be used. Using the air bearings 202.1 to 202.3 and magnets 204.1 to 204.3, the microscope camera 118 can be held by the magnetically preloaded air bearings. That is, the air in the air bearings 202.1 to 202.3 can be opened to disengage the magnetic hold to move the microscope camera 118 to its designated position, and the air can then be closed to hold the microscope camera in place using the magnets 204.1 to 204.3.

[0034] Figure 3A simplified block diagram of the components of a microscope camera 118 is shown. The microscope camera 118 may include a microscope objective 302 with a low NA as described herein, an optical system 304 with folding mirrors 306.1 to 306.2 and lenses 308.1 to 308.2, a camera 310, and an illuminator 312. The microscope objective 302 may provide an NA equal to or less than 0.15 for the microscope camera. The illuminator 312 may provide bright-field and / or dark-field LED illumination. The camera 310 may be configured as an image sensor, such as a CMOS or CCD sensor. In some examples, the camera 310 may be configured as an infrared sensor, such as an InGaAs sensor.

[0035] Camera 310 is coupled to processor 313, which includes vision system module 314 and image analysis module 316. Processor 313 processes and analyzes images generated by the camera to detect and determine the position of a reference. Processor 313 executes machine vision and edge detection algorithms to determine the position of the reference. Alignment correction information can be calculated based on the positions of other references associated with the plurality of cameras. Based on the alignment correction, platform 106 can be moved via platform control servo 318 to adjust the position of the substrate before exposing the corresponding exposure area.

[0036] The alignment correction information can also be used by the projection system 102 to adjust its components before exposing the corresponding exposure area, as described above. The alignment correction information can be used to adjust x, y offset, θ, magnification, etc.

[0037] Figure 4 An example portion of a platform 106 with a substrate 108 is shown. The substrate 108 can be held in place on the platform 106 using edge clamps 402. For example, a quad edge clamping mechanism can be used. The platform 106 may also include interferometer mirrors 404.1 to 404.2 for providing laser interferometer position feedback for platform movement. As described above, the platform 106 is movable in the x, y, and θ directions. A metrology sensor 406 may also be provided and used for system calibration.

[0038] Figure 5 A substrate 108 with multiple exposed areas is shown. In this example, substrate 108 may have four exposed areas (labeled 1 to 4) separated by a copper material for machine handling. Substrate 108 may have a different number of exposed areas, and four are described for illustrative purposes only; other numbers of exposed areas may be provided. Each exposed area may have multiple references (alignment marks). In this example, each exposed area may have four references corresponding to four microscope cameras in an alignment system. The references may be located at the corners of the exposed areas on the top surface of substrate 108. Examples of references include cross shapes, drill holes, drill patterns, etc.

[0039] In some examples, the reference may be located on the bottom surface of the substrate or on an intermediate layer of the substrate. In these examples, the microscope camera may include an infrared sensor as described above for detecting the reference.

[0040] Figure 6 A flowchart of a method 600 for photolithography with alignment is shown. For example, the method can be performed using a photolithography machine 100 on a substrate 108 with four exposed regions as described above.

[0041] At operation 602, the lithography machine can be calibrated and initialized. For example, instructions for manufacturing (e.g., recipes) can be retrieved and loaded. Instructions may include information such as manufacturing layout, exposure time, size of each exposed region, number of exposed regions, layout of exposed regions, and reference position. Instructions for different mask patterns can be pre-stored in memory associated with a controller linked to the lithography machine, and instructions for a specific mask can be retrieved based on the loaded mask. Based on the instructions, the microscope camera in the alignment system can be moved in the x and y directions to match the reference position specified in the recipe.

[0042] At operation 604, the substrate can be loaded onto a machine. For example, a loading robot can place the substrate on a platform. Edge clamps can be used to hold the substrate in place.

[0043] Next, an alignment process can be initiated for each exposed area within the exposed area. At operation 606, the platform can be moved so that the alignment system is above the first exposed area. At operation 608, each microscope camera can capture or photograph an image of a corresponding reference point within the first exposed area. For example, the reference point may be located at a corner of the exposed area, with each microscope camera capturing an image of the corresponding corner of the first exposed area. As described herein, the microscope cameras have low NA (Near Field of Attention), therefore z-axis focusing adjustment is not required. The z-position of the microscope cameras is fixed. The microscope cameras may have a fixed focus.

[0044] At operation 610, the platform can be moved so that the alignment system is above the second exposed area. At operation 612, each microscope camera can capture an image of the corresponding reference in the second exposed area.

[0045] At operation 614, the platform can be moved so that the alignment system is above the third exposure area. At operation 616, each microscope camera can capture an image of the corresponding reference in the third exposure area.

[0046] At operation 618, the platform can be moved so that the alignment system is above the fourth exposure area. At operation 620, each microscope camera can capture an image of the corresponding reference in the fourth exposure area.

[0047] At operation 622, alignment information for each exposed area can be calculated based on images taken at each exposed area. Based on the information extracted from the images, the position of a reference can be determined and compared with a specified position in the recipe.

[0048] At operation 624, alignment correction information can be calculated and stored for each exposed area. This alignment correction information can be correlated with the platform position and projection system settings for each exposed area, as described above. For example, a regression algorithm can be used to determine the alignment correction information.

[0049] Next, the exposure process can be initiated. At operation 626, alignment information for the corresponding exposure area can be used to create patterns on different areas. For example, the platform is moved so that the first exposure area is positioned below the projection system, and alignment correction is performed on that exposure area based on the alignment correction information for the corresponding exposure area. The projection system can then project an image onto its mask to create a pattern on the image on the first exposure area of ​​the substrate. The exposure process then continues to other areas.

[0050] In some implementations, exposure can be applied in a different order than the alignment process to minimize platform movement. For example, the alignment process may be performed in the order of exposure regions 1 to 2 to 3 to 4, while the exposure process may be performed in the order of exposure regions 3 to 4 to 1 to 2 (see [link to implementation]). Figure 5 ).

[0051] After all exposed areas have been fabricated, at operation 628, the platform is moved to the unloading position and the substrate is released and unloaded. For example, a loading robot can remove the substrate from the platform. Another substrate can be loaded onto the machine and the method can be repeated (e.g., to perform alignment and exposure processes).

[0052] The techniques shown and described in this document may be used as follows: Figures 1A to 1C The lithography machine shown is part of or entirely used in any way as described in the following text. Figure 7 The machine in question is 700. Figure 7 A block diagram is shown illustrating an example of a machine 700 including any or more of the technologies (e.g., methods) described herein that can be performed thereon. In various examples, machine 700 may operate as a standalone device or may be connected (e.g., networked) to other machines.

[0053] In a networked deployment, Machine 700 can operate as a server machine, a client machine, or both in a server-client network environment. In the example, Machine 700 can act as a peer-to-peer (P2P) (or other distributed) network environment. Machine 700 can be a personal computer (PC), tablet device, set-top box (STB), personal digital assistant (PDA), mobile phone, web appliance, network router, switch, or bridge, or any machine capable of (sequentially or otherwise) executing instructions specifying the actions to be taken by that machine. Furthermore, although only a single machine is shown, the term "machine" should also be understood to include any collection of multiple machines, such as those in cloud computing, Software as a Service (SaaS), or other computer cluster configurations, that individually or jointly execute one or more sets of instructions to perform any of the methods described herein.

[0054] Examples as described herein may include logic or multiple components or mechanisms, or may be operated by logic or multiple components or mechanisms. A circuit system is a collection of circuits implemented in a tangible entity including hardware (e.g., simple circuits, gates, logic, etc.). The membership of a circuit system may change over time and with potential hardware variations. A circuit system includes members that can perform a specified operation individually or in combination during operation. In one example, the hardware of the circuit system may be immutably designed to perform a specific operation (e.g., hardwired). In one example, the hardware including the circuit system may include variable-connected physical components (e.g., execution units, transistors, simple circuits, etc.) including computer-readable media that are physically modified (e.g., magnetically, electronically, such as via a change in physical state or a transformation of another physical property) to encode instructions for a specific operation. When connecting physical components, the underlying electrical characteristics of the hardware composition may, for example, change from insulating to conductive or vice versa. Instructions enable embedded hardware (e.g., execution units or loading mechanisms) to form members of a circuit system in the hardware via variable connections to perform a specific operation during operation. Therefore, when the device is operational, the computer-readable medium is communicatively coupled to other components of the circuit system. In one example, any physical component may be used in more than one member of more than one circuit system. For instance, in operation, an execution unit may be used at one point in a first circuit of a first circuit system and reused at different times by a second circuit of the first circuit system or by a third circuit of the second circuit system.

[0055] Machine 700 (e.g., a computer system) may include a hardware-based processor 701 (e.g., a central processing unit (CPU), graphics processing unit (GPU), hardware processor core, or any combination thereof), main memory 703, and static memory 705, some or all of which may communicate with each other via interconnect 730 (e.g., a bus). Machine 700 may also include a display device 709, an input device 711 (e.g., an alphanumeric keypad), and a user interface (UI) navigation device 713 (e.g., a mouse). In the example, display device 709, input device 711, and UI navigation device 713 may include at least a portion of a touchscreen display. Furthermore, machine 700 may be additionally equipped with a storage device 720 (e.g., a drive unit), a signal generation device 717 (e.g., a speaker), a network interface device 750, and one or more sensors 715 (such as a global positioning system (GPS) sensor, compass, accelerometer, or other sensors). Machine 700 may include output controller 719, such as a serial controller or interface (e.g., Universal Serial Bus (USB)), a parallel controller or interface, or other wired or wireless (e.g., infrared (IR) controller or interface, near field communication (NFC), etc.), which is coupled to communicate or control one or more peripheral devices (e.g., printer, card reader, etc.).

[0056] Storage device 720 may include a machine-readable medium on which one or more sets of data structures or instructions 724 (e.g., software or firmware) embodying or utilized by any or more of the techniques or functions described herein are stored. Instructions 724 may also reside wholly or at least partially within main memory 703, static memory 705, mass storage device 707, or hardware-based processor 701 during execution by machine 700. In this example, one or any combination of hardware-based processor 701, main memory 703, static memory 705, or storage device 720 may constitute a machine-readable medium.

[0057] Although machine-readable media is considered as a single medium, the term “machine-readable media” can include a single medium or multiple media (e.g., a centralized or distributed database, and / or associated caches and servers) configured to store the one or more instructions 724.

[0058] The term "machine-readable medium" can include any medium capable of storing, encoding, or carrying instructions for execution by machine 700 and enabling machine 700 to perform any one or more of the technologies disclosed herein, or any medium capable of storing, encoding, or carrying data structures used by or associated with such instructions. Examples of non-limiting machine-readable media can include solid-state memory, as well as optical and magnetic media. Therefore, machine-readable media are not transiently propagating signals. Specific examples of large-scale machine-readable media can include: non-volatile memory, such as semiconductor memory devices (e.g., electrically programmable read-only memory (EPROM), electrically erasable programmable read-only memory (EEPROM)) and flash memory devices; magnetic or other phase-change or state-changing memory circuits; magnetic disks, such as internal hard disks and removable hard disks; magneto-optical disks; and CD-ROM and DVD-ROM disks.

[0059] Instructions 724 can also be transmitted or received on the communication network 721 using a transmission medium via network interface device 750 using any of a variety of transmission protocols (e.g., Frame Relay, Internet Protocol (IP), Transmission Control Protocol (TCP), User Datagram Protocol (UDP), Hypertext Transfer Protocol (HTTP), etc.). Example communication networks may include local area networks (LANs), wide area networks (WANs), packet data networks (e.g., the Internet), mobile phone networks (e.g., cellular networks), conventional telephone (POTS) networks, and wireless data networks (e.g., known as Wi-Fi). ® The Institute of Electrical and Electronics Engineers (IEEE) 802.22 standard series, known as WiMax ® The IEEE 802.26 series of standards, the IEEE 802.27.4 series of standards, peer-to-peer (P2P) networks, etc. In the example, network interface device 750 may include one or more physical jacks (e.g., Ethernet, coaxial, or telephone jacks) or one or more antennas for connecting to communication network 721. In the example, network interface device 750 may include multiple antennas for wireless communication using at least one of single-input multiple-output (SIMO), multiple-input multiple-output (MIMO), or multiple-input single-output (MISO) technologies. The term "transmission medium" should be understood to include any intangible medium capable of storing, encoding, or carrying instructions for execution by machine 700, and includes digital or analog communication signals or other intangible media that facilitate communication of such software.

[0060] Various precautions

[0061] Each of the above non-limiting aspects may be independent or may be arranged or combined in various ways with one or more of the other aspects or other topics described in this document.

[0062] The above detailed description includes reference to the accompanying drawings, which form a part of this detailed description. The drawings illustrate, by way of example, specific embodiments in which the invention may be practiced. These specific embodiments are also generally referred to as "examples." Such examples may include elements other than those shown or described. However, the inventors also contemplate examples that provide only those elements shown or described. Furthermore, the inventors contemplate examples using any combination or arrangement of those elements (or one or more aspects thereof) relative to a particular example (or one or more aspects thereof) or relative to other examples (or one or more aspects thereof) shown or described in the text.

[0063] In the event of any inconsistency between the usage in this document and any other document incorporated herein by reference, the usage in this document shall prevail.

[0064] In this document, the terms “a” or “an” are used as commonly found in patent documents to include one or more, independent of any other instances or uses of “at least one” or “one or more.” In this document, unless otherwise specified, the term “or” is used to indicate non-exclusivity or to make “A or B” include “A but not B,” “B but not A,” and “A and B.” In this document, the terms “comprising” and “in which” are used as their commonly understood English equivalents to the corresponding terms “including” and “wherein.” Furthermore, the terms “comprising” and “including” are open-ended, meaning that a system, apparatus, article, composition, formulation, or process that includes elements other than those listed after such terms in one aspect is still considered to fall within the scope of that aspect. Furthermore, the terms “first,” “second,” and “third,” etc., are used merely as labels and are not intended to impose numerical requirements on their objects.

[0065] The examples of methods described herein may be implemented, at least in part, by a machine or computer. Some examples may include computer-readable or machine-readable media encoded with instructions for configuring an electronic device to perform the methods described in the examples above. Specific implementations of such methods may include code, such as microcode, assembly language code, high-level language code, etc. Such code may include computer-readable instructions for performing various methods. The code may form part of a computer program product. Furthermore, in one example, such as during execution or at other times, the code may be tangibly stored on one or more volatile, non-transitory, or non-volatile tangible computer-readable media. Examples of such tangible computer-readable media may include, but are not limited to, hard disks, removable disks, removable optical disks (e.g., high-density disks and digital video disks), magnetic tape cassettes, memory cards or sticks, random access memory (RAM), read-only memory (ROM), etc.

[0066] The above description is intended to be illustrative and not limiting. For example, the examples above (or one or more aspects thereof) may be used in combination with each other. Other specific embodiments may be used, as will be apparent to those skilled in the art after reading the above description. A summary of the specification is provided to enable the reader to quickly determine the essence of the technical disclosure. It should be understood at the time of submission that it is not intended to interpret or limit the scope or meaning of any aspect. Furthermore, in the above specific embodiments, various features may be combined together to simplify the disclosure. This should not be construed as meaning that any unclaimed disclosed features are necessary for any claim. Rather, the subject matter of the invention may be present in all features of fewer specific embodiments than those in a particular disclosure. Therefore, the following aspects are thus incorporated into the specific embodiments as examples or specific embodiments, wherein each aspect is independently as a separate specific embodiment, and it is contemplated that such specific embodiments may be combined or arranged with each other in various combinations or arrangements.

Claims

1. A lithography machine with rapid alignment, characterized in that, The lithography machine includes: Platform, the platform being used to hold and move the substrate; A projection system for projecting an image onto multiple exposed areas of the substrate; and An alignment system, positioned adjacent to the projection system, includes multiple microscope cameras with fixed focal points, each configured to detect a corresponding reference in a corresponding exposed area of ​​the substrate. At least one of the plurality of microscope cameras has a numerical aperture equal to or less than 0.

15.

2. The lithography machine according to claim 1, characterized in that, Each of the plurality of microscope cameras includes a CMOS image sensor.

3. The lithography machine according to claim 1, characterized in that, The plurality of microscope cameras includes four microscope cameras arranged in a rectangular array.

4. The lithography machine according to claim 1, characterized in that, The lithography machine also includes at least one air bearing and at least one magnet for positioning the plurality of microscope cameras.

5. The lithography machine according to claim 1, characterized in that, The lithography machine also includes: A processor is configured to receive images from the plurality of microscope cameras, determine the position of a reference point based on the images, and determine alignment correction information. The processor uses machine vision and edge detection algorithms to determine the position of the reference. The platform is configured to be moved based on the position of the reference point, and In this system, at least one component of the projection system is adjusted based on the alignment correction information.

6. The lithography machine according to claim 1, characterized in that, Each microscope camera includes a single microscope objective to provide a single fixed focal position, wherein each of the plurality of microscope cameras is configured to use the corresponding fixed focal point to detect a reference at different heights relative to the platform and the plurality of microscope cameras.

7. The lithography machine according to claim 6, characterized in that, Each microscope camera has a numerical aperture equal to or less than 0.

15.

8. The lithography machine according to claim 1, characterized in that, The alignment system is configured to capture reference images of multiple regions. Alignment information is generated for each of the plurality of regions based on the reference image, and the projection system is configured to project the image onto each of the plurality of regions based on the respective alignment information after capturing all reference images of the plurality of regions.

9. An alignment system for a photolithography machine, characterized in that, The system includes: A support structure, positioned adjacent to the projection system of the lithography machine; and Multiple microscope cameras are coupled to the support structure and have fixed focal points. Each microscope camera is configured to detect a corresponding reference in a corresponding exposed area of ​​the substrate. At least one of the plurality of microscope cameras has a numerical aperture equal to or less than 0.

15.

10. The alignment system according to claim 9, characterized in that, Each of the plurality of microscope cameras includes a CMOS image sensor.

11. The alignment system according to claim 9, characterized in that, Each microscope camera includes a single microscope objective to provide a single fixed focal position, wherein each of the plurality of microscope cameras is configured to use the corresponding fixed focal point to detect a reference at different heights relative to the platform and the plurality of microscope cameras.

12. The alignment system according to claim 11, characterized in that, Each microscope camera has a numerical aperture equal to or less than 0.

15.

13. The alignment system according to claim 9, characterized in that, The alignment system is configured to capture reference images of multiple regions. Alignment information is generated for each of the plurality of regions based on the reference image, and The projection system is configured to project the image onto each of the plurality of regions based on the respective alignment information after capturing all reference images of the plurality of regions.

Images