PCB laminated structure of vehicle-mounted 4D millimeter wave imaging radar

Abstract

The utility model belongs to the technical field of vehicle-mounted 4D millimeter wave imaging radars, and particularly discloses a PCB laminated structure of a vehicle-mounted 4D millimeter wave imaging radar, which is composed of a TOP layer, a local oscillator power layer, a first GND layer, a high-speed signal layer, a power supply layer, a common signal layer, a second GND layer and a BOTTOM layer. According to the utility model, the chip shielding cover does not need to be opened to reserve a local oscillator power division wire outlet channel, and the more complete chip shielding cover is reserved, so that a better shielding effect is achieved, the interference of an external circuit on an antenna chip is shielded, and the detection capability of a radar is further improved; a high-frequency plate and common plate mixed pressing mode is adopted, the transmission requirements of different signals are met, and the problems that in the prior art, the overall size design of a radar is limited, and an antenna chip is interfered are solved.

Description

Technical Field

[0001] This utility model relates to the field of vehicle-mounted 4D millimeter-wave imaging radar technology, and in particular to a PCB board stack-up structure for vehicle-mounted 4D millimeter-wave imaging radar. Background Technology

[0002] In recent years, with the rapid development of automotive 4D millimeter-wave imaging radar, automakers have increasingly higher requirements for radar anti-interference, testing distance, and angle. Radar products with small structures and low costs have a greater competitive advantage in the industry. The substrate used in millimeter-wave radar RF antennas needs to meet high-frequency requirements. This substrate has advantages such as low loss. Commonly used high-frequency substrates on the market include RO3003G2. This substrate is expensive; therefore, radar RF antennas and local oscillator power dividers are generally connected via microstrip lines and are often on the same circuit layer.

[0003] Due to the size limitations of the radar structure, routing the radar RF antenna and the local oscillator power divider on the same plane will increase the size of the PCB substrate and the cost. In addition, the antenna chip shielding cover needs to have an opening to reserve the local oscillator power divider output line channel, resulting in an unsatisfactory shielding effect. Utility Model Content

[0004] The purpose of this utility model is to solve the technical problems existing in the background art. To this end, a PCB board stacked structure for vehicle-mounted 4D millimeter-wave imaging radar is provided.

[0005] To achieve the above objectives, the technical solution adopted by this utility model is as follows:

[0006] A PCB stack-up structure for an automotive 4D millimeter-wave imaging radar includes, from top to bottom, a TOP layer, a local oscillator layer, an isolation layer, and a BOTTOM layer.

[0007] An antenna chip, a chip shield, and an antenna array are arranged on the TOP layer.

[0008] Local oscillator power dividers are arranged on the local oscillator power layer. The local oscillator power dividers are located inside the chip shield and connected to the local oscillator power layer via blind vias in the TOP layer. The local oscillator power dividers are distributed in the area outside the antenna array projection area.

[0009] The following is a further defined technical solution of this utility model: the TOP layer, the main vibration layer, the isolation layer and the BOTTOM layer are all provided with wiring holes.

[0010] The following is a further defined technical solution of this utility model: the isolation layer includes a first GND layer, a high-speed signal layer, a power layer, a normal signal layer and a second GND layer arranged sequentially from top to bottom. The first GND layer is connected to the oscillation power layer, and the second GND layer is connected to the BOTTOM layer.

[0011] The following is a further defined technical solution of this utility model: the TOP layer is set as a high-frequency signal layer, and the vibration power layer is set as a high-frequency signal layer.

[0012] The following is a further defined technical solution of this utility model: the BOTTOM layer is configured as a component and signal trace layer.

[0013] Compared with the prior art, the present invention has the following technical effects:

[0014] The chip shielding cover of this invention does not require an opening to reserve a local oscillator power output channel, thus preserving a more complete chip shielding cover and achieving a better shielding effect. It shields the antenna chip from interference caused by external circuits, thereby improving the radar's detection capability. It adopts a mixed pressing method of high-frequency board material and ordinary board material to meet the transmission requirements of different signals, solving the problems of limited overall radar size design and interference of antenna chips in the prior art.

[0015] The present invention will be further described below with reference to the accompanying drawings and embodiments. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a schematic diagram of an embodiment of the PCB board stacked structure of this utility model;

[0018] Figure 2 This is a schematic diagram of an embodiment of the antenna chip, chip shield, and antenna array layout on the TOP layer of this utility model.

[0019] Figure 3 This is a schematic diagram of an embodiment of the L2 layer local oscillator power distribution layout of this utility model. Detailed Implementation

[0020] To make the above-mentioned objects, features, and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a full understanding of this utility model. However, this utility model can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this utility model. Therefore, this utility model is not limited to the specific embodiments disclosed below.

[0021] In the description of this utility model, it should be understood that the terms "upper", "lower", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0022] In the description of this utility model, it should be understood that the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined with "first" and "second" may explicitly or implicitly include at least one of that feature.

[0023] In this embodiment of the invention, unless otherwise explicitly specified and limited, the terms "connected" and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this embodiment of the invention according to the specific circumstances.

[0024] like Figure 1 As shown, this embodiment provides a PCB stack-up structure for an automotive 4D millimeter-wave imaging radar, which consists of a TOP layer 1, a local oscillator layer 2, a first GND layer 3, a high-speed signal layer 4, a power layer 5, a normal signal layer 6, a second GND layer 7, and a BOTTOM layer 8 connected sequentially from top to bottom. Each of the TOP layer 1, local oscillator layer 2, first GND layer 3, high-speed signal layer 4, power layer 5, normal signal layer 6, second GND layer 7, and BOTTOM layer 8 has a wiring hole 9.

[0025] The TOP layer 1 uses RO3003G2 high-frequency board material, and the local oscillator layer 2 uses RO4450F high-frequency board material. The local oscillator layer 102 avoids the projection area of ​​the antenna array (which consists of transmitting antenna 103 and receiving antenna 104). The isolation layer (composed of a first GND layer 3, a high-speed signal layer 4, a power layer 5, a normal signal layer 6, and a second GND layer 7) uses ordinary FR4 board material for signal layering and isolation. The BOTTOM layer also uses ordinary FR4 board material. It should be noted that the number of layers in this embodiment can be determined according to the circuit signal design requirements; in this embodiment, there are 8 layers. Figure 1 The arrows in the attached diagram indicate the location of each layer.

[0026] Antenna chip 100, chip shield 101, transmitting antenna 103, and receiving antenna 104 are all arranged on TOP layer 1, such as Figure 2 As shown.

[0027] Local vibration power distribution unit 102 is arranged on local vibration power layer 2 and connected by wiring through blind via 10, as follows. Figure 3 As shown.

[0028] The chip shield 101 of the antenna chip 100 does not need to have an opening to reserve the output channel of the local oscillator power divider 102. The more complete chip shield 101 is retained, resulting in a better shielding effect, shielding the antenna chip 100 from interference from external circuits, thereby improving the radar's detection capability.

[0029] It should be noted that, Figure 2 and Figure 3 The structure shown is only for those skilled in the art to understand the distribution positions of the antenna chip 100, chip shield 101, transmitting antenna 103, receiving antenna 104, and local oscillator power divider 102 in this embodiment. Since the distribution positions of the antenna chip 100, chip shield 101, transmitting antenna 103, receiving antenna 104, and local oscillator power divider 102 can be changed according to specific circuit designs, therefore... Figure 2 and 3 The distribution of the antenna chip 100, chip shield 101, transmitting antenna 103, receiving antenna 104, and local oscillator power divider 102 shown is not within the protection scope of this utility model.

[0030] The following will further describe the specific layer-by-layer planning (from top to bottom) of this embodiment:

[0031] Top: Equipped with antenna chip, chip shielding cover and antenna array, high-frequency signal uses RO3003G2 board material;

[0032] L2: Equipped with local oscillator power divider, high-frequency signal uses RO4450F board material;

[0033] L3: This is the GND layer, which uses copper foil grounding to isolate components. It is made of ordinary FR4 board.

[0034] L4: This is the signal layer, used for high-speed signal connections of the chip, made of ordinary FR4 substrate;

[0035] L5: This is the power layer, used for the chip's operating power connection, made of standard FR4 substrate;

[0036] L6: This is the signal layer, used for general signal connections of the chip, made of standard FR4 substrate;

[0037] L7: This is the GND layer, which uses copper foil grounding to isolate components. It is made of ordinary FR4 board.

[0038] BOT: This refers to the component and signal trace layer, used for common signal connections of chips, and is made of ordinary FR4 board.

[0039] The Top and L2 layers are made of high-frequency materials, which can meet the requirements of low-loss radiation and high-frequency signal transmission of 4D millimeter-wave imaging radar antenna signals. The other layers are still made of ordinary FR4 materials, which are mainly used for low-frequency signal transmission. Therefore, this embodiment adopts a mixed pressing method of high-frequency materials and ordinary materials to meet the transmission requirements of different signals and solve the problems of limited overall radar size design and interference of antenna chips in the prior art.

[0040] The above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model in any way. Any person skilled in the art can make many possible variations and modifications to the technical solution of this utility model using the disclosed methods and techniques, or modify it into equivalent embodiments with equivalent changes, without departing from the scope of the technical solution of this utility model. Therefore, all equivalent changes made based on the shape, structure, and principle of this utility model without departing from its technical solution should be covered within the protection scope of this utility model.

Claims

1. A PCB board stack-up structure for a vehicle-mounted 4D millimeter-wave imaging radar, characterized in that, It includes the TOP layer, local oscillation power layer, isolation layer and BOTTOM layer arranged from top to bottom; An antenna chip, a chip shield, and an antenna array are arranged on the TOP layer. Local oscillator power dividers are arranged on the local oscillator power layer. The local oscillator power dividers are located inside the chip shield and connected to the local oscillator power layer via blind vias in the TOP layer. The local oscillator power dividers are distributed in the area outside the antenna array projection area.

2. The PCB board stack-up structure of a vehicle-mounted 4D millimeter-wave imaging radar as described in claim 1, characterized in that, The TOP layer, local oscillator layer, isolation layer, and BOTTOM layer all have wiring holes.

3. The PCB board stack-up structure of a vehicle-mounted 4D millimeter-wave imaging radar as described in claim 2, characterized in that, The isolation layer includes a first GND layer, a high-speed signal layer, a power layer, a normal signal layer, and a second GND layer arranged sequentially from top to bottom. The first GND layer is connected to the local oscillator layer, and the second GND layer is connected to the BOTTOM layer.

4. The PCB board stack-up structure of a vehicle-mounted 4D millimeter-wave imaging radar as described in claim 1, characterized in that, The TOP layer is set as a high-frequency signal layer, and the local oscillator layer is set as a high-frequency signal layer.

5. The PCB board stack-up structure of a vehicle-mounted 4D millimeter-wave imaging radar as described in claim 1, characterized in that, The BOTTOM layer is configured as a component and signal routing layer.

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