Case structure for single-photon detector

Abstract

The utility model discloses a cabinet structure for a single-photon detector, and relates to the technical field of cabinets. The box comprises a first box body, a second box body and a fastener, and the two box bodies are connected through the fastener; the first box body comprises a first shell, a first cover and radiating fins, and an optical fiber interface is arranged on the first shell; the second box body comprises a first cavity, a second cavity and a third cavity which are sequentially distributed from top to bottom, the joint of the first box body and the second box body is provided with first to fifth through holes, the third cavity is provided with a power interface and a communication interface, and the second cavity is provided with a reference signal interface; a sixth through hole is formed in the joint of the third cavity and the second cavity, and a signal output interface is formed in the first cavity; through the two box bodies, the heat dissipation fins on the first box body, the three independent cavities divided by the second box body and the like, the box body for installing the single-photon detector is good in heat dissipation, high in anti-interference capability and convenient to maintain.

Description

Technical Field

[0001] This utility model relates to the field of chassis technology, and in particular to a chassis structure for a single-photon detector. Background Technology

[0002] Single-photon detectors are highly sensitive photoelectric detection devices capable of detecting extremely weak light signals, and have been widely used in quantum communication, single-photon lidar, and fluorescence detection. Currently, most mainstream single-photon detectors on the market adopt a general-purpose instrument chassis design, which leads to the following structural design problems:

[0003] 1. The avalanche photodiode, the core component of a single-photon detector, typically needs to operate at low temperatures to ensure stable detector performance. Currently, avalanche photodiodes are generally cooled using a thermoelectric cooler (TEC). During the cooling process, the TEC generates a significant amount of heat at its hot end. When the TEC is placed inside a chassis, this heat cannot be dissipated effectively and promptly, increasing the cooling power consumption of the single-photon detector and potentially causing instability in the avalanche photodiode's operating temperature, preventing it from reaching the designated temperature, thus affecting detector performance.

[0004] 2. The avalanche signal output by a single-photon detector is an electrical signal with extremely small amplitude, requiring amplification by a high-gain broadband amplifier. However, while amplifying the avalanche signal, the amplifier also amplifies various noises within the detector. Currently, the functional modules of single-photon detectors are generally integrated onto a single PCB board without separate shielding. Power supply noise, radiated noise from the gating signal, processor clock noise, and interference signals in the communication lines on the single-photon detector PCB board all reduce the signal-to-noise ratio of the avalanche signal and affect the performance of the single-photon detector. Furthermore, when a single-photon detector malfunctions or requires an upgrade, the entire PCB board needs to be replaced, leading to high maintenance costs and low maintenance efficiency.

[0005] The existing mainstream single-photon detectors have shortcomings in terms of heat dissipation, anti-interference ability, and ease of maintenance, which have become technical problems that urgently need to be solved. Utility Model Content

[0006] This invention provides a chassis structure for single-photon detectors, solving the technical problems of poor heat dissipation, weak anti-interference ability, and inconvenient maintenance of chassis used in single-photon detectors.

[0007] To solve the above-mentioned technical problems, the technical solution adopted by this utility model is as follows:

[0008] A chassis structure for a single-photon detector includes a first housing, a second housing, and fasteners. The first housing is connected to or separated from the second housing via the fasteners. The first housing includes a first outer shell, a first cover, and heat dissipation fins. The first cover is connected to or separated from the first outer shell, and the heat dissipation fins are fixedly connected to the first outer shell. An optical fiber interface is provided on the first outer shell of the first housing. The second housing includes a first cavity located on the upper layer of the second housing, a second cavity located on the middle layer of the second housing, and a third cavity located on the lower layer of the second housing. A first to fifth through holes are provided at the junction of the first housing and the second housing. A power interface and a communication interface are provided in the third cavity. A reference signal interface is provided in the second cavity. A sixth through hole is provided at the junction of the third cavity and the second cavity. A signal output interface is provided in the first cavity. The third cavity is individually connected to the inner cavity of the first housing via the first, second, and third holes, and is connected to the second cavity via the sixth hole. The second cavity is connected to the inner cavity of the first housing via the fourth hole, and the first cavity is connected to the inner cavity of the first housing via the fifth hole.

[0009] A further technical solution is as follows: the first enclosure is used to install an avalanche photodiode, a temperature sensor, and a thermoelectric cooler (TEC); the third cavity is used to install an intelligent control module, a high-voltage module, and a temperature control module for a single-photon detector; the second cavity is used to install a gating signal generation module for a single-photon detector; and the first cavity is used to install an avalanche signal processing module for a single-photon detector. The positive power line of the TEC in the first enclosure passes through a first hole and connects to the intelligent control module in the third cavity; the negative power line of the TEC in the first enclosure passes through a third hole and connects to the intelligent control module in the third cavity; the signal line of the temperature sensor in the first enclosure passes through a second hole and connects to the temperature control module in the third cavity; the high-voltage signal line of the high-voltage module in the third cavity passes through a sixth hole and connects to the gating signal generation module in the second cavity; the signal line of the gating signal generation module in the second cavity passes through a fourth hole and connects to the cathode of the avalanche photodiode in the first enclosure; and the signal line of the avalanche signal processing module in the first cavity passes through a fifth hole and connects to the anode of the avalanche photodiode in the first enclosure.

[0010] A further technical solution is that the hot end of the semiconductor cooler (TEC) is in direct and close contact with the heat sink fins.

[0011] A further technical solution is that the first outer casing and the heat dissipation fins are tightly connected together by bolts.

[0012] A further technical solution is that the first box is made of aluminum or copper, and the second box is made of aluminum or copper.

[0013] A further technical solution is that: the inner cavity of the first box is connected to the third cavity through the first hole, the inner cavity of the first box is connected to the third cavity through the second hole, and the inner cavity of the first box is connected to the third cavity through the third hole.

[0014] The beneficial effects of adopting the above technical solution are as follows:

[0015] A chassis structure for a single-photon detector includes a first housing, a second housing, and fasteners. The first housing is connected to or separated from the second housing via the fasteners. The first housing includes a first outer shell, a first cover, and heat dissipation fins. The first cover is connected to or separated from the first outer shell, and the heat dissipation fins are fixedly connected to the first outer shell. An optical fiber interface is provided on the first outer shell of the first housing. The second housing includes a first cavity, a second cavity, and a third cavity arranged sequentially from top to bottom. A first to fifth through holes are provided at the junction of the first housing and the second housing. A power interface and a communication interface are provided in the third cavity. A reference signal interface is provided in the second cavity. A sixth through hole is provided at the junction of the third cavity and the second cavity. A signal output interface is provided in the first cavity. The third cavity is individually connected to the inner cavity of the first housing via the first, second, and third holes, and is connected to the second cavity via the sixth hole. The second cavity is connected to the inner cavity of the first housing via the fourth hole, and the first cavity is connected to the inner cavity of the first housing via the fifth hole. Its design features two enclosures, heat dissipation fins on the first enclosure, and three independent cavities in the second enclosure, which enable the enclosure used to install the single-photon detector to have good heat dissipation, strong anti-interference ability, and convenient maintenance.

[0016] See the detailed implementation section for further description. Attached Figure Description

[0017] Figure 1 This is a structural diagram of the present invention;

[0018] Figure 2 This is a diagram showing the distribution of the cavities in this utility model;

[0019] Figure 3 This is a diagram showing the distribution of holes in this utility model;

[0020] Figure 4 This is a structural diagram of the third cavity in this utility model;

[0021] Figure 5 This is a structural diagram of the second cavity in this utility model;

[0022] Figure 6 This is a structural diagram of the first cavity in this utility model.

[0023] The components are: 1. First housing, 2. Second housing, 3. Heat dissipation fins, 4. Fiber optic interface, 5-1. First cavity, 5-2. Second cavity, 5-3. Third cavity, 6-1. First hole, 6-2. Second hole, 6-3. Third hole, 6-4. Fourth hole, 6-5. Fifth hole, 6-6. Sixth hole, 7. Power interface, 8. Communication interface, 9. Reference signal interface, 10. Signal output interface. Detailed Implementation

[0024] To address the shortcomings of existing mainstream single-photon detector housing designs in terms of heat dissipation, anti-interference capability, and ease of maintenance, this application proposes a novel housing design for single-photon detectors. This design features efficient heat dissipation, strong anti-interference capability, modular design, and ease of maintenance, providing a reliable solution for the widespread application of single-photon detectors.

[0025] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The following description of at least one exemplary embodiment is merely illustrative and is in no way intended to limit this application or its application or use. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0026] Many specific details are set forth in the following description in order to provide a full understanding of this application. However, this application may also be implemented in other ways different from those described herein. Those skilled in the art can make similar extensions without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0027] like Figures 1-6As shown, this utility model discloses a chassis structure for a single-photon detector, including a first housing 1, a second housing 2, and fasteners. The first housing 1 is connected to or separated from the second housing 2 by the fasteners. The first housing 1 includes a first outer shell, a first cover, and heat dissipation fins 3. The first cover is connected to or separated from the first outer shell, and the heat dissipation fins 3 are fixedly connected to the first outer shell. An optical fiber interface 4 is provided on the first outer shell of the first housing 1. The second housing 2 includes a first cavity 5-1 located in the upper layer of the second housing 2, a second cavity 5-2 located in the middle layer of the second housing 2, and a third cavity 5-3 located in the lower layer of the second housing 2. A through first cavity 5-1 is provided at the junction of the first housing 1 and the second housing 2. From the fifth holes 6-1 to 6-5, a power interface 7 and a communication interface 8 are provided in the third cavity 5-3, a reference signal interface 9 is provided in the second cavity 5-2, a through sixth hole 6-6 is provided at the junction of the third cavity 5-3 and the second cavity 5-2, and a signal output interface 10 is provided in the first cavity 5-1. The third cavity 5-3 is connected to the inner cavity of the first housing 1 through the first hole 6-1, the second hole 6-2 and the third hole 6-3 respectively. The third cavity 5-3 is connected to the second cavity 5-2 through the sixth hole 6-6. The second cavity 5-2 is connected to the inner cavity of the first housing 1 through the fourth hole 6-4. The first cavity 5-1 is connected to the inner cavity of the first housing 1 through the fifth hole 6-5.

[0028] like Figure 1 As shown, the housing for the single-photon detector of this application consists of two housings: a first housing 1 and a second housing 2. The two housings are connected as a single unit by fasteners, specifically bolts, which pass through mounting holes at the joint of the two housings to secure them together. Both housings are made of a high thermal conductivity metal material, such as aluminum or copper, which not only provides sufficient mechanical strength and effective electromagnetic shielding but also utilizes the entire detector housing as a heat dissipation surface, improving heat dissipation efficiency.

[0029] First enclosure 1: Used to install avalanche photodiodes, temperature sensors, and thermoelectric coolers (TECs).

[0030] The first housing 1 includes a first outer shell of high thermal conductivity metal, a first cover, and independent heat dissipation fins 3. The first cover is fixedly connected to the first outer shell by bolts or can be separated from it. The hot end of the thermoelectric cooler (TEC) is in direct and close contact with the heat dissipation fins 3, quickly dissipating heat through an efficient heat conduction path. The outer shell and the heat dissipation fins 3 are tightly connected by bolts, allowing the heat generated by the thermoelectric cooler (TEC) to be further dissipated through the outer shell. The fiber optic interface 4 of the avalanche photodiode is directly fixed to the outer shell of the first housing 1, serving as the optical signal input terminal.

[0031] like Figure 2As shown, the second enclosure 2 is used to install the intelligent control module, high voltage module, temperature control module, gating signal generation module, and avalanche signal processing module of the single-photon detector.

[0032] The second housing 2 includes a second outer shell of high thermal conductivity metal, a second cover, and a cavity inside the second outer shell. The second cover is fixedly connected to or separated from the second outer shell by bolts. At least one side wall of the second outer shell is detachable for easy installation of devices.

[0033] The second enclosure 2 is divided into three independent spaces: the upper first cavity 5-1, the middle second cavity 5-2, and the lower third cavity 5-3. The PCB board of the single-photon detector is further divided into multiple modules, including an intelligent control module, a high-voltage module, a temperature control module, a gating signal generation module, and an avalanche signal processing module, each installed in one of the three spaces. Since each space is an independent shielded space, electromagnetic interference between different spaces can be effectively reduced.

[0034] like Figure 3 As shown, the component installed in the first housing 1 is connected to the component in the second housing 2 through the through hole between the first housing 1 and the second housing 2, as detailed below:

[0035] The positive power supply of the semiconductor cooler TEC is connected to the third cavity 5-3 of the lower layer of the second housing 2 through the first hole 6-1.

[0036] The signal line of the temperature sensor is connected to the third cavity 5-3 of the lower layer of the second housing 2 through the second hole 6-2.

[0037] The negative power supply of the semiconductor cooler TEC is connected to the third cavity 5-3 of the lower layer of the second housing 2 through the third hole 6-3.

[0038] The cathode of the avalanche photodiode is connected to the second cavity 5-2 in the middle layer of the second housing 2 through the fourth hole 6-4.

[0039] The anode of the avalanche photodiode is connected to the first cavity 5-1 on the upper layer of the second housing 2 through the fifth hole 6-5.

[0040] like Figure 4 As shown, the third cavity 5-3 in the lower layer of the second housing 2 is used to install the intelligent control module, high voltage module and temperature control module of the single-photon detector.

[0041] The third cavity 5-3 under the second housing 2 has two external interfaces: a power interface 7 and a communication interface 8, which are used for power connection and communication connection with the host computer, respectively.

[0042] like Figure 2As shown, the signal line of the temperature sensor installed in the first housing 1 is input through the second hole 6-2 to the third cavity 5-3 in the lower layer of the second housing 2 and connected to the temperature control module.

[0043] like Figure 1 As shown, the positive power supply of the semiconductor cooler TEC installed in the first housing 1 is input through the first hole 6-1 to the third cavity 5-3 in the lower layer of the second housing 2 and connected to the intelligent control module. The negative power supply of the semiconductor cooler TEC installed in the first housing 1 is input through the third hole 6-3 to the third cavity 5-3 in the lower layer of the second housing 2 and connected to the intelligent control module.

[0044] like Figure 5 As shown, the second cavity 5-2 in the middle layer of the second housing 2 is used to install the gate control signal generation module. The high-voltage signal of the high-voltage module in the third cavity 5-3 in the lower layer of the second housing 2 is connected to the gate control signal generation module in the second cavity 5-2 in the middle layer of the second housing 2 through the sixth hole 6-6.

[0045] The second cavity 5-2 in the middle layer of the second housing 2 has an external interface, reference signal interface 9, used to input a reference signal to the single-photon detector. The high-voltage signal of the high-voltage module in the third cavity 5-3 in the lower layer of the second housing 2 is connected to the gating signal generation module of the second cavity 5-2 in the middle layer of the second housing 2 via the sixth hole 6-6. The gating signal generation module of the second cavity 5-2 in the middle layer of the second housing 2 is then connected to the cathode of the avalanche photodiode in the first housing 1 via the fourth hole 6-4.

[0046] like Figure 6 As shown, the first cavity 5-1 on the upper layer of the second housing 2 is used to install the avalanche signal processing module. The first cavity 5-1 on the upper layer of the second housing 2 has an external interface, a signal output interface 10, for signal output from the avalanche signal processing module. The avalanche signal processing module in the second housing 2 is connected to the anode of the avalanche photodiode in the first housing 1 through the fifth hole 6-5.

[0047] Compared to the above embodiment, the second housing 2 includes a second outer shell of high thermal conductivity metal and a cavity within the second outer shell. One side wall of the second outer shell is a detachable, movable side wall for easy installation of devices. The movable side wall of the second outer shell is fixedly connected to or separated from the fixed side wall of the second outer shell by bolts. A cover is not required.

[0048] Compared to the above embodiment, the second housing 2 includes a second outer shell of high thermal conductivity metal, a first partition and a second partition. The first partition and the second partition are located inside the second outer shell. The first partition and the second partition are detachably connected to the second outer shell separately. The first partition and the second partition divide the second outer shell into three corresponding cavities.

Claims

1. A chassis structure for a single-photon detector, characterized in that: The enclosure includes a first housing (1), a second housing (2), and fasteners. The first housing (1) is connected to or separated from the second housing (2) by fasteners. The first housing (1) includes a first outer shell, a first cover, and heat dissipation fins (3). The first cover is connected to or separated from the first outer shell, and the heat dissipation fins (3) are fixedly connected to the first outer shell. An optical fiber interface (4) is provided on the first outer shell of the first housing (1). The second housing (2) includes a first cavity (5-1) located on the upper layer of the second housing (2), a second cavity (5-2) located in the middle layer of the second housing (2), and a third cavity (5-3) located on the lower layer of the second housing (2). A through hole (6-1) to (6-5) is provided at the junction of the first housing (1) and the second housing (2). In the third cavity... (5-3) is provided with a power interface (7) and a communication interface (8). A reference signal interface (9) is provided in the second cavity (5-2). A sixth through hole (6-6) is provided at the junction of the third cavity (5-3) and the second cavity (5-2). A signal output interface (10) is provided in the first cavity (5-1). The third cavity (5-3) is connected to the inner cavity of the first housing (1) through the first hole (6-1), the second hole (6-2) and the third hole (6-3) respectively. The third cavity (5-3) is connected to the second cavity (5-2) through the sixth hole (6-6). The second cavity (5-2) is connected to the inner cavity of the first housing (1) through the fourth hole (6-4). The first cavity (5-1) is connected to the inner cavity of the first housing (1) through the fifth hole (6-5).

2. The chassis structure for a single-photon detector according to claim 1, characterized in that: The first housing (1) is used to install an avalanche photodiode, a temperature sensor, and a thermoelectric cooler (TEC). The third cavity (5-3) is used to install the intelligent control module, high-voltage module, and temperature control module of the single-photon detector. The second cavity (5-2) is used to install the gating signal generation module of the single-photon detector. The first cavity (5-1) is used to install the avalanche signal processing module of the single-photon detector. The positive power line of the thermoelectric cooler (TEC) in the inner cavity of the first housing (1) passes through the first hole (6-1) and connects to the intelligent control module in the third cavity (5-3). The negative power line of the thermoelectric cooler (TEC) in the inner cavity of the first housing (1) passes through the third hole (6-3) and connects to the third cavity. The intelligent control module in (5-3) is connected, the signal line of the temperature sensor in the inner cavity of the first box (1) passes through the second hole (6-2) and is connected to the temperature control module in the third cavity (5-3), the high voltage signal line of the high voltage module in the third cavity (5-3) passes through the sixth hole (6-6) and is connected to the gate control signal generation module in the second cavity (5-2), the signal line of the gate control signal generation module in the second cavity (5-2) passes through the fourth hole (6-4) and is connected to the cathode of the avalanche photodiode in the inner cavity of the first box (1), and the signal line of the avalanche signal processing module in the first cavity (5-1) passes through the fifth hole (6-5) and is connected to the anode of the avalanche photodiode in the inner cavity of the first box (1).

3. The chassis structure for a single-photon detector according to claim 2, characterized in that: The hot end of the semiconductor cooler TEC is in close contact with the heat sink fins (3).

4. The chassis structure for a single-photon detector according to claim 1, characterized in that: The first outer shell is tightly connected to the heat dissipation fins (3) by bolts.

5. The chassis structure for a single-photon detector according to claim 1, characterized in that: The first box (1) is made of aluminum or copper, and the second box (2) is made of aluminum or copper.

6. The chassis structure for a single-photon detector according to claim 1, characterized in that: The inner cavity of the first box (1) is connected to the third cavity (5-3) through the first hole (6-1), the inner cavity of the first box (1) is connected to the third cavity (5-3) through the second hole (6-2), and the inner cavity of the first box (1) is connected to the third cavity (5-3) through the third hole (6-3).

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