Cooling system for semiconductor and semiconductor equipment

Abstract

The utility model provides a cooling system for a semiconductor and a semiconductor device, a filter in the cooling system is fixed in a cavity housing, and a leakage blocking structure is fixed in a gap area between the filter and the cavity housing; the water inlet of the cavity shell is lower than the top surface of the filter; the anti-leakage structure is arranged in the gap area of the cavity shell and the filter, liquid entering the gap area is blocked and filtered, impurities escaping from the gap area are reduced, and blockage of a cooling system or reduction of temperature control capacity is reduced; meanwhile, the triangular prisms and the meniscus cylinders serve as leakage blocking structures, so that liquid passing through the leakage blocking structures flows back, and the risk that impurities escape from gap areas and are not filtered is further reduced; in addition, the water inlet and the water outlet are formed, so that the filtering effect is further improved; and finally, the distribution range of the leakage-proof structure in the gap area is set, so that the water inlet is prevented from being blocked by impurities, the situation that liquid flowing back by the leakage-proof structure cannot be fully filtered by the filter is avoided, and the filtering effect is further improved.

Description

Technical Field

[0001] This utility model belongs to the field of semiconductor equipment, and in particular relates to a cooling system and semiconductor equipment for semiconductors. Background Technology

[0002] Many processes in semiconductor manufacturing have specific requirements for operating temperature. Therefore, most semiconductor process equipment uses a chiller (cooling system) for temperature control. Coolant is usually used as a transfer medium to circulate internally within the chiller's pipes to achieve temperature control of the semiconductor process environment.

[0003] When internal circulation occurs, crystals and impurities will appear in the coolant, requiring the addition of a filter within the chiller. However, in existing chiller designs, the inlet and outlet are at the same level, resulting in most of the coolant only being filtered through the upper part of the filter, leading to poor impurity filtration. Furthermore, a gap exists between the filter and the chiller's chamber wall, allowing some coolant entering from the inlet to bypass the filter and flow directly to the outlet. This allows many impurities to escape directly through the gap. When impurities cannot be completely and promptly filtered within the chiller's internal circulation, it can reduce the coolant's temperature control effect and cause blockages in the chiller's connecting pipes to the machine, leading to machine malfunctions, reduced production efficiency, and decreased chiller stability.

[0004] Therefore, there is an urgent need for a structure that can improve the impurity filtration efficiency of cooling systems in semiconductor devices.

[0005] It should be noted that the above introduction to the technical background is only for the purpose of providing a clear and complete explanation of the technical solutions of this application and facilitating the understanding of those skilled in the art. It should not be assumed that the above technical solutions are known to those skilled in the art simply because these solutions have been described in the background section of this application. Utility Model Content

[0006] In view of the shortcomings of the prior art described above, the purpose of this utility model is to provide a cooling system and semiconductor equipment for semiconductors, so as to solve the problem of poor impurity filtration efficiency of cooling equipment in semiconductor process equipment in the prior art.

[0007] To achieve the above and other related objectives, this utility model provides the following technical solution:

[0008] In a first aspect, the present invention provides a cooling system for semiconductors, the cooling system comprising: a chamber shell, a filter, a leak-proof structure, an inlet water pipe, and an outlet water pipe;

[0009] The filter is fixed inside the chamber shell, and the leak-proof structure is fixed in the gap area between the filter and the chamber shell; the chamber shell includes an inlet and an outlet, the inlet pipe is connected to the inlet, and the outlet pipe is connected to the outlet; the inlet is lower than the top surface of the filter, the outlet is lower than the inlet, and the bottom surface of the filter is lower than the outlet.

[0010] Optionally, the filter is a first cylinder including two circular bases; the leak-proof structure includes a plurality of adjacent triangular prisms, each of the triangular prisms being arranged sequentially along the circumference of the first cylinder within the gap area, the projection of each triangular prism onto the circular base being a triangle, one corner of each triangle facing the outlet, and the opposite side of the corresponding corner facing the inlet; the height of each triangular prism is equal to the length of the filter along the central axis of the filter; the line connecting the chamber shell and the filter through the radius of the circular base is a cross-sectional line, the plane passing through the cross-sectional line and perpendicular to the circular base is a cross-sectional plane, the cross-section of each triangular prism through the corresponding cross-sectional plane is a rectangle, the rectangle with the largest cross-sectional area obtained through the corresponding cross-sectional plane is the largest rectangle, and the largest rectangle coincides with the cross-section of the gap area obtained through the cross-sectional plane.

[0011] Optionally, the straight line containing the side of the triangle closest to the water inlet pipe is the first straight line, the point where the first straight line intersects the projection of the inner wall of the chamber shell on the circular base is the first endpoint, the tangent of the projection of the inner wall of the chamber shell on the circular base through the first endpoint is the first tangent, the ray extending from the first endpoint along the first tangent toward the water inlet pipe is the first ray, and the ray extending from the first endpoint along the first straight line toward the filter is the second ray. The included angle between the first ray and the second ray corresponding to each triangle is 30°-45°.

[0012] Optionally, the filter is a first cylinder including two circular bases; the leak-proof structure includes a plurality of adjacent second cylinders, each of the second cylinders being arranged sequentially along the circumference of the first cylinder within the gap region, and the projection of each second cylinder onto the circular base is a circle; the height of each second cylinder is equal to the length of the filter along the central axis of the filter; the line connecting the chamber shell and the filter through the straight line containing the radius of the circular base is a cross-sectional line, and the plane passing through the cross-sectional line and perpendicular to the circular base is a cross-sectional plane; the cross-section obtained by each second cylinder through the corresponding cross-sectional plane is a rectangle, and the rectangle with the largest cross-sectional area obtained through the corresponding cross-sectional plane is the largest rectangle, and the largest rectangle coincides with the cross-section obtained by the gap region through the cross-sectional plane.

[0013] Optionally, the filter is a first cylinder including two circular bases; the leak-proof structure includes multiple adjacent meniscus-shaped cylinders, each of which is arranged sequentially along the circumference of the first cylinder within the gap area. The projection of each meniscus-shaped cylinder onto the circular base is a meniscus including a concave edge and a convex edge, with the convex edge of each meniscus facing the outlet and the concave edge facing the inlet. The line connecting the chamber shell and the filter through the radius of the circular base is a cross-sectional line, and the plane passing through the cross-sectional line and perpendicular to the circular base is a cross-sectional plane. The projection of each meniscus-shaped cylinder onto the corresponding cross-sectional plane is a rectangle, and the rectangle coincides with the projection of the gap area onto the cross-sectional plane.

[0014] Optionally, the filter is a first cylinder including two circular bases, and the projection of the slit area onto the circular base is an annular shape; the straight line containing the projections of the inlet pipe and the outlet pipe onto the circular base passes through a first diameter of the circular base; the leak-proof structure includes a first part and a second part symmetrically distributed along the first diameter, and the total area of ​​the projections of the first part and the second part onto the circular base is 1 / 3 to 1 / 2 of the area of ​​the annular shape.

[0015] Optionally, the minimum distance between the projection endpoints of the first portion and the second portion on the first diameter and the projection endpoint of the inlet on the first diameter is 1 / 4 of the first diameter.

[0016] Optionally, the distance between the projections of the inlet and the outlet onto the central axis of the filter is greater than 1 / 2 of the length of the filter's projection onto the central axis.

[0017] Optionally, the chamber housing further includes a sealing cover and a fixing structure, the sealing cover for sealing the top surface of the filter, and the fixing structure for fixing the filter to the bottom surface of the chamber housing.

[0018] Secondly, the present invention provides a semiconductor device, the semiconductor device including any of the above-described semiconductor cooling systems, the semiconductor cooling system being used to control the temperature of the semiconductor device.

[0019] As described above, the semiconductor cooling system and semiconductor device of this invention have the following beneficial effects:

[0020] This invention provides a leak-blocking structure in the gap area between the chamber shell and the filter. The leak-blocking structure blocks and filters the liquid entering the gap area, reducing the amount of impurities that cannot be filtered out from the gap area. This reduces the risk of cooling system blockage or decreased temperature control capability, improves the reliability and service life of the cooling system, and reduces the frequency of maintenance required for the cooling system. Furthermore, it prevents the backflowed liquid from being fully filtered by the filter, thereby further improving the filtration effect of the filter.

[0021] This invention uses triangular prisms and crescent-shaped prisms as a leak-blocking structure, which causes the liquid passing through the leak-blocking structure to flow back and re-enter the filter for filtration, further reducing the risk of impurities escaping from the gap area without being filtered.

[0022] This invention can further improve the filtration effect of the filter by setting the inlet lower than the top surface of the filter and the outlet lower than the inlet.

[0023] This invention, by setting the distribution range of the leak-blocking structure within the gap area, avoids the problem of impurities directly clogging the inlet due to the leak-blocking structure being too close to the inlet. It also ensures that the leak-blocking structure can block or backflow the liquid before most of it passes through the filter, and prevents the backflowed liquid from being insufficiently filtered due to the distance between the leak-blocking structure and the inlet. This further improves the filtration effect of the filter. Attached Figure Description

[0024] Figure 1 The diagram shown is a side sectional view of a cooling system in operation in the prior art.

[0025] Figure 2 The diagram shown is a top view of a cooling system in operation in the prior art.

[0026] Figure 3 The diagram shown is a side sectional view of the cooling system in operation, as shown in an example of Embodiment 1 of this utility model.

[0027] Figure 4 The diagram shown is a top view of the cooling system in operation, as illustrated in Example 1 of this utility model.

[0028] Figure 5 The diagram shows a partial enlarged detail of part A in a top view of the cooling system in operation, as shown in an example of Embodiment 1 of this utility model.

[0029] Component designation explanation

[0030] 1. Inlet; 2. Outlet; 3. Coolant; 4. Filter; 5. Chamber shell; 51. Sealing cap; 52. Fixing structure; 6. Leak-proof structure; 61. First straight line; 62. Inner wall of chamber shell; 63. First endpoint; 64. First tangent; 65. First ray; 66. Second ray; 7. Inlet pipe; 8. Outlet pipe; 9. Gap area; θ, included angle. Detailed Implementation

[0031] The following specific examples illustrate the implementation of this utility model. Those skilled in the art can easily understand other advantages and effects of this utility model from the content disclosed in this specification. This utility model can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of this utility model.

[0032] In the detailed description of the embodiments of this utility model, for ease of explanation, the schematic diagrams illustrating the device structure may be partially enlarged without adhering to the general scale, and the schematic diagrams are merely examples and should not limit the scope of protection of this utility model. Furthermore, in actual manufacturing, the three-dimensional spatial dimensions of length, width, and depth should be included.

[0033] For ease of description, spatial relation terms such as “below,” “under,” “lower than,” “below,” “above,” and “upper” may be used herein to describe the relationship between one element or feature shown in the accompanying drawings and other elements or features. It will be understood that these spatial relation terms are intended to include directions other than those depicted in the accompanying drawings for devices in use or operation.

[0034] In the context of this application, the structure described above the first feature may include embodiments in which the first and second features are formed in direct contact, or embodiments in which additional features are formed between the first and second features, such that the first and second features may not be in direct contact.

[0035] It should be noted that the illustrations provided in this embodiment are only schematic representations of the basic concept of the present invention. Therefore, the illustrations only show the components related to the present invention and are not drawn according to the actual number, shape and size of the components in the actual implementation. In the actual implementation, the form, quantity and proportion of each component can be arbitrarily changed, and the layout of the components may also be more complex.

[0036] Many processes in semiconductor manufacturing have specific temperature requirements. Therefore, most semiconductor process equipment uses a chiller (cooling system) for temperature control. Typically, coolant 3 is used as the transport medium and circulates internally within the chiller's pipes to control the temperature of the semiconductor process environment. However, during internal circulation, crystals and impurities can form in the coolant 3, necessitating the addition of a filter 4 within the chiller to filter the coolant 3. However, due to limitations in existing chiller designs, such as... Figures 1-2 As shown, where Figure 1 This is a side sectional view of the cooling system in operation. Figure 2 This is a top view of the cooling system in operation. The inlet 1 and outlet 2 are on the same horizontal plane, causing most of the coolant 3 to be filtered only through the upper part of the filter 4, resulting in poor filtration of impurities. Furthermore, because the filter 4 is typically made of porous and easily deformable material, it is difficult to seal the gap directly. Therefore, a gap exists between the filter 4 and the smooth chamber wall of the chiiller's outer shell 5. This causes some of the coolant 3 entering from the inlet 1 to flow directly to the outlet 2 through the gap between the filter 4 and the chamber shell 5 without being filtered by the filter 4. Consequently, many impurities can escape directly through this gap without passing through the filter 4. When impurities circulate within the chiiller and cannot be completely and promptly filtered, the temperature control effect of the coolant 3 may be reduced, and the pipes connecting the chiiller to the machine may become clogged, leading to abnormal operation of the machine, reduced production efficiency, and decreased chiiller stability.

[0037] Example 1:

[0038] This embodiment provides a cooling system for semiconductors, such as... Figures 3-4 As shown, where Figure 3 This is a side sectional view of the cooling system during operation. Figure 4 This is a top view of the cooling system in operation. The cooling system includes: a chamber shell 5, a filter 4, a leak-proof structure 6, an inlet water pipe 7, and an outlet water pipe 8.

[0039] The filter 4 is fixed inside the chamber shell 5, and the leak-proof structure 6 is fixed in the gap area 9 between the filter 4 and the chamber shell 5; the chamber shell 5 includes an inlet 1 and an outlet 2, the inlet pipe 7 is connected to the inlet 1, and the outlet pipe 8 is connected to the outlet 2; the inlet 1 is lower than the top surface of the filter 4, the outlet 2 is lower than the inlet 1, and the bottom surface of the filter 4 is lower than the outlet 2.

[0040] This invention provides a leak-blocking structure 6 within the gap region 9 between the chamber shell 5 and the filter 4. This structure blocks and filters the liquid entering the gap region 9, reducing the escape of unfiltered impurities and lowering the risk of cooling system blockage or reduced temperature control capability. This improves the reliability and lifespan of the cooling system and reduces the frequency of maintenance required. Furthermore, by setting the inlet 1 lower than the top surface of the filter 4 and the outlet 2 lower than the inlet 1, the contact path of the liquid passing through the filter 4 is increased, further enhancing the filtration effect of the filter 4.

[0041] In one embodiment, such as Figure 4 As shown, the filter 4 is a first cylinder including two circular bases; the leak-proof structure 6 includes multiple adjacent triangular prisms, each of which is arranged sequentially along the circumference of the first cylinder within the gap region 9. The projection of each triangular prism onto the circular base is a triangle, with one corner of each triangle pointing towards the outlet 2 and the opposite side of the corresponding corner pointing towards the inlet 1. The height of each triangular prism is equal to the length of the filter 4 along its central axis. The line connecting the chamber shell 5 and the filter 4 through the radius of the circular base is a cross-sectional line, and the plane passing through the cross-sectional line and perpendicular to the circular base is a cross-sectional plane. The cross-section of each triangular prism obtained through the corresponding cross-sectional plane is a rectangle, and the rectangle with the largest cross-sectional area obtained through the corresponding cross-sectional plane is the largest rectangle. The largest rectangle coincides with the cross-section of the gap region 9 obtained through the cross-sectional plane.

[0042] This invention uses a triangular prism as a leak-blocking structure 6, so that even if the liquid passing through the leak-blocking structure 6 is not blocked by it, it will flow back and re-enter the filter 4 for filtration, further reducing the risk of impurities escaping from the gap area 9 without being filtered; at the same time, the chamfered structure of the triangular prism is easy to manufacture, which is conducive to improving its application in actual production.

[0043] Specifically, when the liquid flows through the triangular prism, the uneven geometry of the side of the triangular prism near the water inlet pipe 7 and the side away from the water inlet pipe 7 can change the direction and speed of the liquid flow, causing the liquid to form a boundary layer separation on the surface of the triangular prism. This separation leads to the formation of a low-velocity region behind the triangular prism structure, resulting in a backflow phenomenon.

[0044] In one embodiment, such as Figure 5 The image shown is Figure 4 The enlarged detail view of the leak-proof structure in part A shows that the straight line closest to the water inlet pipe 7 in the triangle is the first straight line 61. The point where the first straight line 61 intersects the projection of the inner wall of the chamber shell 62 on the circular bottom surface is the first endpoint 63. The tangent line of the projection of the inner wall of the chamber shell 62 on the circular bottom surface through the first endpoint 63 is the first tangent line 64. The ray extending from the first endpoint 63 along the first tangent line 64 toward the water inlet pipe 7 is the first ray 65. The ray extending from the first endpoint 63 along the first straight line 61 toward the filter 4 is the second ray 66. The included angle θ between the first ray 65 and the second ray 66 corresponding to each triangle is 30°-45°.

[0045] Specifically, "the direction along the first tangent 64 toward the water inlet pipe 7" refers to the direction along the first tangent 64 and pointing towards the water inlet pipe 7 as a whole. Figure 5 The direction of the first ray 65 shown is not the direction parallel to the water inlet pipe 7; "the direction along the first straight line 61 toward the filter 4" refers to the direction along the first straight line 61 and pointing towards the filter 4 as a whole. Figure 5 The direction of the second ray 66 shown is not the direction parallel to filter 4.

[0046] By setting the positional relationship between the face of the triangular prism in the leak-blocking structure 6 near the water inlet pipe 7 and the inner wall 62 of the chamber shell, this utility model can further optimize the backflow effect of the leak-blocking structure 6 on the liquid entering the gap area 9 and improve the filtration effect of the filter 4.

[0047] Specifically, the leakage-blocking structure 6 can also be configured as other suitable structures that can block and / or backflow as needed, all of which are within the protection scope of this utility model.

[0048] In one embodiment, such as Figure 4As shown, the filter 4 is a first cylinder including two circular bottom surfaces, and the projection of the slit region 9 on the circular bottom surface is an annular shape; the straight line where the projections of the water inlet pipe 7 and the water outlet pipe 8 on the circular bottom surface are located passes through the first diameter of the circular bottom surface; the leak-proof structure 6 includes a first part and a second part symmetrically distributed along the first diameter, and the total projection area of ​​the first part and the second part on the circular bottom surface is 1 / 3 to 1 / 2 of the area of ​​the annular shape.

[0049] In one embodiment, the minimum distance between the projection endpoints of the first portion and the second portion on the first diameter and the projection endpoint of the inlet 1 on the first diameter is 1 / 4 of the first diameter.

[0050] This invention, through the distribution and area of ​​the leak-blocking structure 6 within the gap area 9, avoids the problem of impurities directly clogging the inlet 1 due to the leak-blocking structure 6 being too close to the inlet 1. It also ensures that the leak-blocking structure 6 can block or backflow the liquid before most of it passes through the filter 4, and prevents the leak-blocking structure 6 from being too far from the inlet 1, which would prevent the backflowed liquid from being fully filtered by the filter 4. This further improves the filtration effect of the filter 4.

[0051] In one embodiment, the distance between the projections of the inlet 1 and the outlet 2 onto the central axis of the filter 4 is greater than 1 / 2 of the projected length of the filter 4 onto the central axis.

[0052] This invention further optimizes the filtration efficiency of liquid passing through filter 4 by setting the height distance between inlet 1 and outlet 2.

[0053] In one embodiment, such as Figure 4 As shown, the chamber housing 5 also includes a sealing cover 51 and a fixing structure 52. The sealing cover 51 is used to seal the top surface of the filter 4, and the fixing structure 52 is used to fix the filter 4 to the bottom surface of the chamber housing 5.

[0054] In the prior art, since the inlet 1 and outlet 2 are both located above the filter 4, the top surface of the filter 4 is a channel for liquid to pass through. By setting the inlet 1 and outlet 2 below the top surface of the filter 4, a sealing cover 51 can be set on the top surface of the filter 4, thereby further reducing the risk that liquid will enter the gap area 9 when passing through the filter 4 and will not be effectively filtered.

[0055] Specifically, the chamber shell 5 includes a chamber wall, a sealing cover 51, and a fixing structure 52. The chamber shell 5 shown in the figure is mainly the chamber wall.

[0056] This utility model also provides a semiconductor device, which includes any of the above-described semiconductor cooling systems, and the semiconductor cooling system is used to control the temperature of the semiconductor device.

[0057] This invention, by incorporating the semiconductor cooling system into semiconductor equipment, can significantly improve the stability of temperature control in semiconductor equipment, reduce problems such as blockage of temperature control pipes or machine malfunctions, thereby reducing maintenance frequency and improving semiconductor process efficiency.

[0058] Example 2:

[0059] This embodiment provides a cooling system for semiconductors. Other features of the cooling system are basically the same as those in Embodiment 1, except that:

[0060] In this embodiment, the filter 4 is a first cylinder including two circular bottom surfaces; the leak-proof structure 6 includes a plurality of adjacent second cylinders, each of the second cylinders being arranged sequentially along the circumference of the first cylinder within the gap region 9, and the projection of each second cylinder onto the circular bottom surface being a circle; the height of each second cylinder is equal to the length of the filter 4 along the central axis of the filter 4; the line connecting the chamber shell 5 and the filter 4 through the straight line containing the radius of the circular bottom surface is a cross-sectional line, and the plane passing through the cross-sectional line and perpendicular to the circular bottom surface is a cross-sectional plane, the cross-section obtained by each second cylinder through the corresponding cross-sectional plane is a rectangle, and the rectangle with the largest cross-sectional area obtained through the corresponding cross-sectional plane is the largest rectangle, and the largest rectangle coincides with the cross-section obtained by the gap region 9 through the cross-sectional plane.

[0061] This invention uses a second cylinder as a leak-blocking structure 6, which can also block liquid entering the gap area 9. However, compared with Example 1, it is difficult to achieve a significant backflow effect. Therefore, the effect of its leak-blocking structure 6 is worse than that of Example 1.

[0062] Example 3:

[0063] This embodiment provides a cooling system for semiconductors. Other features of the cooling system are basically the same as those in Embodiment 1, except that:

[0064] In this embodiment, the filter 4 is a first cylinder including two circular bottom surfaces; the leak-proof structure 6 includes a plurality of adjacent crescent-shaped cylinders, each of which is arranged sequentially along the circumference of the first cylinder within the gap region 9. The projection of each crescent-shaped cylinder onto the circular bottom surface is a crescent shape including a concave edge and a convex edge. The convex edge of each crescent shape faces the outlet 2, and the concave edge of each crescent shape faces the inlet 1. The line connecting the chamber shell 5 and the filter 4 through the straight line containing the radius of the circular bottom surface is a cross-sectional line. The plane passing through the cross-sectional line and perpendicular to the circular bottom surface is a cross-sectional plane. The projection of each crescent-shaped cylinder onto the corresponding cross-sectional plane is a rectangle, and the rectangle coincides with the projection of the gap region 9 onto the cross-sectional plane.

[0065] This invention uses a crescent-shaped column as a leak-blocking structure 6, which causes the liquid passing through the leak-blocking structure 6 to flow back and re-enter the filter 4 for filtration. At the same time, the crescent-shaped column has a stronger blocking ability, which can further reduce the risk of impurities escaping from the gap area 9 without being filtered. However, the manufacturing process may be more complex, and those skilled in the art can choose according to their needs.

[0066] In summary, the semiconductor cooling system and semiconductor equipment of this invention, by incorporating a leak-blocking structure in the gap area between the chamber shell and the filter, effectively blocks and filters the liquid entering the gap area, reducing the escape of unfiltered impurities and lowering the risk of cooling system blockage or reduced temperature control capability. This improves the reliability and service life of the cooling system and reduces the frequency of maintenance required. Furthermore, the use of triangular prisms and meniscus as the leak-blocking structure allows the liquid passing through it to flow back into the filter for further filtration. This reduces the risk of impurities escaping through the gaps without being filtered. Furthermore, by setting the inlet lower than the top of the filter and the outlet lower than the inlet, the filtration efficiency can be further improved. Finally, by adjusting the distribution of the leak-blocking structure within the gaps, the problem of impurities directly clogging the inlet due to the structure being too close to it is avoided. This ensures that the leak-blocking structure can block or backflow the liquid before most of it has passed through the filter, preventing backflow from being adequately filtered due to the distance between the leak-blocking structure and the inlet, thus further improving the filtration efficiency.

[0067] Therefore, this utility model effectively overcomes the various shortcomings of the prior art and has high industrial application value.

[0068] The above embodiments are merely illustrative of the principles and effects of this utility model and are not intended to limit the scope of this utility model. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of this utility model. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in this utility model should still be covered by the claims of this utility model.

Claims

1. A cooling system for semiconductors, characterized in that, The cooling system includes: a chamber shell, a filter, a leak-proof structure, an inlet water pipe, and an outlet water pipe; The filter is fixed inside the chamber shell, and the leak-proof structure is fixed in the gap area between the filter and the chamber shell; the chamber shell includes an inlet and an outlet, the inlet pipe is connected to the inlet, and the outlet pipe is connected to the outlet; the inlet is lower than the top surface of the filter, the outlet is lower than the inlet, and the bottom surface of the filter is lower than the outlet.

2. The semiconductor cooling system according to claim 1, characterized in that: The filter is a first cylinder with two circular bases; the leak-proof structure includes multiple adjacent triangular prisms, each of which is arranged sequentially along the circumference of the first cylinder within the gap area. The projection of each triangular prism onto the circular base is a triangle, with one corner of each triangle pointing towards the outlet and the opposite side of the corresponding corner pointing towards the inlet. The height of each triangular prism is equal to the length of the filter along its central axis. The line connecting the outer shell of the chamber and the filter through the radius of the circular base is a cross-sectional line, and the plane passing through the cross-sectional line and perpendicular to the circular base is a cross-sectional plane. The cross-section of each triangular prism through its corresponding cross-sectional plane is a rectangle, and the rectangle with the largest cross-sectional area obtained through its corresponding cross-sectional plane is the largest rectangle. The largest rectangle coincides with the cross-section of the gap area obtained through the cross-sectional plane.

3. The semiconductor cooling system according to claim 2, characterized in that: The straight line closest to the water inlet pipe in the triangle is the first straight line. The point where the first straight line intersects the projection of the inner wall of the chamber shell on the circular base is the first endpoint. The tangent of the projection of the inner wall of the chamber shell on the circular base through the first endpoint is the first tangent. The ray extending from the first endpoint along the first tangent toward the water inlet pipe is the first ray. The ray extending from the first endpoint along the first straight line toward the filter is the second ray. The included angle between the first ray and the second ray corresponding to each triangle is 30°-45°.

4. The semiconductor cooling system according to claim 1, characterized in that: The filter is a first cylinder with two circular bases; the leak-proof structure includes multiple adjacent second cylinders, each second cylinder arranged sequentially along the circumference of the first cylinder within the gap region, and the projection of each second cylinder onto the circular base is a circle; the height of each second cylinder is equal to the length of the filter along its central axis; the line connecting the chamber shell and the filter through the radius of the circular base is a cross-sectional line, and the plane passing through the cross-sectional line and perpendicular to the circular base is a cross-sectional plane; the cross-section obtained by each second cylinder through the corresponding cross-sectional plane is a rectangle, and the rectangle with the largest cross-sectional area obtained through the corresponding cross-sectional plane is the largest rectangle, which coincides with the cross-section obtained by the gap region through the cross-sectional plane.

5. The semiconductor cooling system according to claim 1, characterized in that: The filter is a first cylinder with two circular bases; the leak-proof structure includes multiple adjacent meniscus-shaped cylinders, each of which is arranged sequentially along the circumference of the first cylinder within the gap area. The projection of each meniscus-shaped cylinder onto the circular base is a crescent shape including a concave edge and a convex edge. The convex edge of each meniscus faces the outlet, and the concave edge faces the inlet. The line connecting the outer shell of the chamber and the filter through the radius of the circular base is a cross-sectional line, and the plane passing through the cross-sectional line and perpendicular to the circular base is a cross-sectional plane. The projection of each meniscus-shaped cylinder onto the corresponding cross-sectional plane is a rectangle, and the rectangle coincides with the projection of the gap area onto the cross-sectional plane.

6. The semiconductor cooling system according to claim 1, characterized in that: The filter is a first cylinder comprising two circular bases, and the projection of the slit area onto the circular base is an annular shape; the straight line containing the projections of the inlet pipe and the outlet pipe onto the circular base passes through the first diameter of the circular base; the leak-proof structure comprises a first part and a second part symmetrically distributed along the first diameter, and the total area of ​​the projections of the first part and the second part onto the circular base is 1 / 3 to 1 / 2 of the area of ​​the annular shape.

7. The semiconductor cooling system according to claim 6, characterized in that: The minimum distance between the projection endpoints of the first part and the second part on the first diameter and the projection endpoint of the inlet on the first diameter is 1 / 4 of the first diameter.

8. The semiconductor cooling system according to claim 1, characterized in that: The distance between the projections of the inlet and outlet onto the central axis of the filter is greater than 1 / 2 of the length of the filter's projection onto the central axis.

9. The semiconductor cooling system according to claim 1, characterized in that: The chamber housing also includes a sealing cover and a fixing structure. The sealing cover is used to seal the top surface of the filter, and the fixing structure is used to fix the filter to the bottom surface of the chamber housing.

10. A semiconductor device, characterized in that, The semiconductor device includes a semiconductor cooling system according to any one of claims 1-9, the semiconductor cooling system being used for temperature control of the semiconductor device.

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