Etching equipment
By automatically controlling the ventilation device of the etching equipment through a sensing device, the unstable concentration of etching solution and the safety risks caused by manual operation are solved, and the stability and safety of the etching process are achieved.
Patent Information
- Application Number
- CN202520137635.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Priority Date
- 2025-01-14
- Filing Date
- 2025-01-21
- Publication Date
- 2026-01-27
- Estimated Expiration
- 2035-01-21
AI Technical Summary
In existing semiconductor manufacturing processes, the exhaust control valve of etching equipment requires manual operation, which is easily overlooked and forgotten to be turned on or off, resulting in unstable etching solution concentration and posing industrial safety risks.
The number of parts to be etched is counted by a sensing device within a specific time period, and the ventilation device is automatically controlled to start or stop in order to maintain the concentration of etching solution in the etching machine.
It achieves automatic adjustment of etching solution concentration, avoiding human error and safety risks, and ensuring the stability of etching effect.
Smart Images
Figure CN223844225U_ABST
Abstract
Description
Technical Field
[0001] This application relates to a semiconductor device, and more particularly to an etching device for a semiconductor apparatus. Background Technology
[0002] Currently, semiconductor device manufacturing methods require various wet processes, such as etching, cleaning, and electroplating. Taking the etching process as an example, during the etching operation, the machine continuously adds etching solution. At this time, the exhaust control valve needs to be manually opened to maintain the concentration of etching solution in the main chamber of the machine. If the machine continues to add etching solution and the exhaust control valve is not opened, the concentration of etching solution will become too high, resulting in over-etching.
[0003] Conversely, if the etching operation ends and the machine stops adding etching solution, the exhaust control valve must be closed within a certain period of time to maintain the concentration of etching solution in the main chamber of the machine. If the exhaust control valve is not closed, the concentration of etching solution will decrease, resulting in incomplete etching.
[0004] However, at present, the opening and closing of the exhaust control valve are all controlled manually. Not only is it easy to forget to start or close it, but also, the opening and closing of it requires the staff to climb up to the machine platform, which is prone to falling risks.
[0005] Therefore, overcoming the problems of the existing technology has become an urgent issue that needs to be addressed. Utility Model Content
[0006] In view of the various deficiencies of the prior art, this application provides an etching apparatus, including: an etching machine; a ventilation device physically connected to the etching machine for ventilating the air inside the etching machine; and a sensing device signal-connected to the ventilation device for counting the number of parts to be etched entering the etching machine within a specific time period, thereby activating the ventilation device.
[0007] This application also provides an etching method, comprising: using a sensing device to count the number of parts to be etched entering an etching machine within a specific time period; if the number of parts to be etched is greater than or equal to a preset value, the sensing device sends a signal to a ventilation device to activate the ventilation device to perform ventilation operations on the etching machine; and if the number of parts to be etched remains unchanged, the sensing device sends a signal to the ventilation device to stop the ventilation device from performing ventilation operations on the etching machine.
[0008] In the aforementioned etching equipment and etching method, the etching machine includes a main chamber and a feed track, wherein the feed track is connected to the main chamber so that the workpiece to be etched enters the main chamber via the feed track for etching.
[0009] In the aforementioned etching equipment and etching method, the ventilation device is an exhaust device.
[0010] In the aforementioned etching equipment and etching method, the workpiece to be etched is a semiconductor device.
[0011] In the aforementioned etching equipment and etching method, the specific time is 3 minutes, and the ventilation device is activated when the number of the workpieces to be etched is greater than or equal to 3.
[0012] In the aforementioned etching equipment and etching method, the specific time is 3 minutes, and the ventilation device is turned off when the number of the workpieces to be etched remains unchanged.
[0013] As can be seen from the above, the etching equipment and etching method of this application mainly utilize a sensing device connected to the etching machine and the ventilation device to automatically start the ventilation device when a predetermined number of parts to be etched enter the etching machine within a specific time period, or to automatically shut down the ventilation device when no parts to be etched enter the etching machine within a specific time period, so as to maintain the concentration of etching solution in the etching machine. Attached Figure Description
[0014] Figure 1 This is a flowchart of the etching method of this application.
[0015] Figure 2 This is a schematic diagram of the etching equipment of this application.
[0016] Figure 3 A flowchart illustrating the implementation of the etching method of this application.
[0017] Explanation of reference numerals in the attached figures
[0018] 2. Etching equipment
[0019] 21 Etching machine
[0020] 211 Feed Track
[0021] 212 Main Room
[0022] 22 Sensing Devices
[0023] 23. Ventilation device
[0024] 3. Parts to be etched
[0025] Steps S11 to S14
[0026] Steps S31 to S34
[0027] Steps S331~S338
[0028] n quantity
[0029] t refers to a specific time. Detailed Implementation
[0030] The following specific embodiments illustrate the implementation of this application. Those skilled in the art can easily understand other advantages and effects of this application from the content disclosed in this specification.
[0031] It should be understood that the structures, proportions, sizes, etc., depicted in the accompanying drawings are merely for illustrative purposes to aid those skilled in the art in understanding and reading the content disclosed herein, and are not intended to limit the scope of this application. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in proportions, or adjustments to size, without affecting the effectiveness and purpose of this application, should still fall within the scope of the technical content disclosed herein. Furthermore, the terms such as "above," "first," "second," and "one" used in this specification are merely for clarity of description and are not intended to limit the scope of this application. Changes or adjustments to their relative relationships, without substantially altering the technical content, should also be considered within the scope of this application's implementation.
[0032] Please also refer to Figure 1 and Figure 2 ,in, Figure 1 This is a flowchart of the etching method of this application, which includes steps S11 to S14; Figure 2 This is a schematic diagram of the etching apparatus 2 of this application, which includes an etching machine 21, a sensing device 22 and a ventilation device 23.
[0033] In step S11: a loading operation is performed, in which the part to be etched 3 is sent to the feed track 211 of the etching machine 21. The part to be etched 3 is, for example, a semiconductor device such as a wafer or a substrate.
[0034] In step S12: a sensing operation is performed. The sensing device 22 calculates the number (n) of the workpieces 3 to be etched on the feed track 211 within a specific time (t). For example, a sensor is set on the feed track 211. The sensor can detect whether the number of workpieces 3 to be etched passing through the feed track 211 has reached a set value or has not changed, so as to determine whether to proceed to step S13 or step S14.
[0035] In step S13: If the number of the workpieces 3 to be etched on the feed track 211 is greater than or equal to a preset value (e.g., n ≥ 3) within a specific time (e.g., t = 3 minutes), the sensing device 22 sends a signal to the ventilation device 23 physically connected to the etching machine 21 to start the ventilation device 23, and the etching machine 21 continues to supply etching solution to perform etching operation on the workpieces 3 to be etched. At this time, due to the start of the ventilation device 23, the gas in the main chamber 212 of the etching machine 21 can be ventilated to maintain the concentration of etching solution in the main chamber 212 of the etching machine 21.
[0036] In step S14: Relatively speaking, within a specific time (e.g., t = 3 minutes), if the number of the workpieces 3 to be etched on the feed track 211 does not change (e.g., n = 0), the sensing device 22 sends a signal to the ventilation device 23 to close the ventilation device 23, and the etching machine 21 stops supplying etching solution. At this time, due to the closure of the ventilation device 23, the gas exchange operation in the main chamber 212 of the etching machine 21 is stopped, and the concentration of etching solution in the main chamber 212 of the etching machine 21 can be maintained.
[0037] This application also discloses an etching apparatus 2, including: an etching machine 21, a ventilation device 23 physically connected to the etching machine 21, and a sensing device 22 signal-connected to the ventilation device 23.
[0038] The etching machine 21 includes a main chamber 212 and a feed track 211. The feed track 211 is connected to the main chamber 212 so that the workpiece 3 to be etched can enter the main chamber 212 via the feed track 211 for etching. The workpiece 3 to be etched is, for example, a semiconductor device such as a wafer or substrate.
[0039] The ventilation device 23 is, for example, an exhaust device, which is physically connected to the etching machine 21 and performs ventilation operations, such as exhaust replacement operations, on the gas in the main chamber 212 of the etching machine 21.
[0040] The sensing device 22 is connected to the ventilation device 23 to count the number of parts 3 to be etched entering the etching machine 21 within a specific time period, and to actuate (such as start or stop) the ventilation device 23 accordingly.
[0041] Please see Figure 3 The flowchart illustrates an example of the etching method of this application, which includes steps S31 to S34.
[0042] In step S31: Perform a packaging operation to form a packaging colloid on the semiconductor device.
[0043] In step S32: a marking operation is performed to form laser markings on the encapsulating colloid.
[0044] In step S33: an etching operation is performed, in which the semiconductor device (the part to be etched) is sent to the etching machine to remove the metal protective layer using etching solution, exposing the electrical contacts. This includes step S331, loading the part (to be etched) using a robotic arm or manually; step S332, sending the part to be etched to the feed track of the etching machine; step S333, sensing and calculating the number of parts to be etched passing through the feed track to provide a basis for actuating (starting or stopping) the ventilation device; step S334, sending the part to be etched into the main chamber of the etching machine for etching; step S335, treating the part to be etched with etching solution; step S336, performing a water washing operation; step S337, performing a drying or blow-drying operation; and step S338, unloading the part using a robotic arm or manually.
[0045] In step S34: Perform high-pressure cleaning to remove process residues and impurities.
[0046] In summary, the etching equipment of this application mainly utilizes a sensing device connected to the etching machine and the ventilation device to automatically start the ventilation device when a predetermined number of parts to be etched enter the etching machine within a specific time period, or to automatically shut down the ventilation device when no parts to be etched enter the etching machine within a specific time period, so as to maintain the concentration of etching solution in the etching machine and avoid the risks of negligence and forgetting to operate the ventilation device when it is manually started or stopped.
[0047] The above embodiments are used to illustrate the principles and effects of this application, and are not intended to limit this application. Those skilled in the art can modify the above embodiments without departing from the spirit and scope of this application. Therefore, the scope of protection of this application should be as set forth in the following claims.
Claims
1. An etching apparatus, characterized in that, include: Etching machine; A ventilation device is physically connected to the etching machine to ventilate the air inside the etching machine. as well as A sensing device is connected to the ventilation device to count the number of parts to be etched entering the etching machine within a specific time period, and to activate the ventilation device accordingly.
2. The etching equipment as described in claim 1, characterized in that, The etching machine includes a main chamber and a feed track.
3. The etching equipment as described in claim 2, characterized in that, The feed track is connected to the main chamber, allowing the workpiece to be etched to enter the main chamber via the feed track for etching.
4. The etching equipment as described in claim 1, characterized in that, The ventilation device is an exhaust system.
5. The etching apparatus as described in claim 1, characterized in that, The part to be etched is a semiconductor device.
6. The etching apparatus as described in claim 1, characterized in that, If the number of the workpiece to be etched is greater than or equal to a preset value within a specific time period, the sensing device sends a signal to the ventilation device to activate the ventilation device.
7. The etching apparatus as described in claim 1, characterized in that, If the number of the workpiece to be etched does not change within a specific time period, the sensing device sends a signal to the ventilation device to shut down the ventilation device.
8. The etching apparatus as described in claim 1, characterized in that, The ventilation device is activated when the specific time is 3 minutes and the number of parts to be etched is greater than or equal to 3.
9. The etching apparatus as described in claim 1, characterized in that, The ventilation device is turned off when the specific time is 3 minutes and the number of parts to be etched remains unchanged.