Radiator and thermal management system

Abstract

The utility model discloses a radiator and a thermal management system. The radiator comprises a radiator body; the heat conduction piece is connected with the radiator body, the heat conduction piece and the radiator body define a circulation space for circulation of a cooling medium, and the side, facing the circulation space, of the heat conduction piece is provided with a plurality of cooling fins; the side, back on to the radiator body, of the heat conduction piece is configured to be in thermal contact with the heating source so that heat of the heating source can be conducted to the cooling medium in the circulation space through the cooling fins. The heat conduction coefficient of the heat conduction piece is larger than that of the radiator body.

Description

Technical Field

[0001] This disclosure relates to the field of thermal management technology, and in particular to a radiator and a thermal management system. Background Technology

[0002] As chip performance increases, the requirements for chip heat dissipation also become more stringent. To meet these requirements, high thermal conductivity interface materials are typically used for heat conduction, or high-density fins are employed for heat dissipation, resulting in higher costs for chip heat dissipation. Utility Model Content

[0003] To address the aforementioned technical problems, this disclosure provides a heat sink and a thermal management system to solve the problem of high chip heat dissipation costs, thereby saving on the use of high thermal conductivity materials and reducing chip heat dissipation costs.

[0004] The first aspect of this disclosure provides a heat sink, comprising:

[0005] Radiator body;

[0006] A heat conduction component is connected to the radiator body. The heat conduction component and the radiator body together form a flow space for the cooling medium to flow. The side of the heat conduction component facing the flow space has multiple heat dissipation fins. The side of the heat conduction component facing away from the radiator body is configured to be in thermal contact with the heat source so as to conduct the heat from the heat source to the cooling medium in the flow space through the heat dissipation fins.

[0007] Among them, the thermal conductivity of the heat conduction component is greater than that of the heat sink body.

[0008] A second aspect of this disclosure provides a thermal management system, comprising:

[0009] Heat source;

[0010] A housing is encapsulated around the heat source, and the housing has an opening.

[0011] The first aspect of this disclosure provides a radiator in which a heat-conducting element is disposed at an opening and is in thermal contact with a heat source to conduct heat from the heat source to the radiator.

[0012] The radiator and thermal management system disclosed herein are connected to the radiator body via a heat conduction component, which together with the radiator body forms a flow space for the cooling medium to circulate. The heat conduction component has multiple heat dissipation fins on the side facing the flow space. The heat conduction component is made of a material with a thermal conductivity greater than that of the radiator body. This allows the heat conduction component to be made of a material with a higher thermal conductivity, while the radiator body can be made of a material with a conventional thermal conductivity. This reduces the need for high-thermal-conductivity materials in the radiator, thereby lowering the cost of the radiator, specifically reducing the cost of heat dissipation from the heat source. After the side of the heat conduction component facing away from the radiator body comes into contact with the heat source, the heat generated by the heat source can be transferred to the heat dissipation fins through the heat conduction component with a higher thermal conductivity, and then carried away by the cooling medium flowing within the flow space. The higher thermal conductivity of the heat conduction component results in faster heat transfer efficiency, improving the heat dissipation efficiency from the heat source. Attached Figure Description

[0013] Figure 1 This is an exploded structural diagram of a thermal management system provided in some examples of this disclosure;

[0014] Figure 2 This is an exploded structural front view of a thermal management system provided in some examples of this disclosure;

[0015] Figure 3 This is a schematic diagram of the structure of a radiator in a thermal management system provided in some examples of this disclosure;

[0016] Figure 4 This is an exploded structural diagram of a radiator in a thermal management system provided in some examples of this disclosure;

[0017] Figure 5 This is a cross-sectional view of a radiator in a thermal management system provided in some examples of this disclosure;

[0018] Figure 6 This is a schematic diagram of the structure of the thermal management system provided in this disclosure, showing the interaction between the heat conduction element and the heat source;

[0019] Figure 7 It is along Figure 6 Sectional view of line AA in the middle;

[0020] Figure 8 This is a cross-sectional view of the interaction between a heat transfer element and a heat source in a thermal management system provided by some examples in this disclosure;

[0021] Figure 9 This is yet another cross-sectional view of a radiator in a thermal management system provided in some examples of this disclosure;

[0022] Figure 10This is an exploded structural diagram of the interaction between a heat transfer element and a heat source in a thermal management system provided in some examples of this disclosure;

[0023] Figure 11 This is another cross-sectional view of the interaction between a heat transfer element and a heat source in a thermal management system provided in some examples of this disclosure;

[0024] Figure 12 This is yet another cross-sectional view of the interaction between a heat transfer element and a heat source in a thermal management system provided in some examples of this disclosure;

[0025] Figure 13 This is yet another cross-sectional view of a radiator in a thermal management system provided in some examples of this disclosure;

[0026] Figure 14 This is yet another cross-sectional view of a radiator in a thermal management system provided in some examples of this disclosure;

[0027] Figure 15 This is yet another cross-sectional view of a radiator in a thermal management system provided in some examples of this disclosure.

[0028] Explanation of reference numerals in the attached figures:

[0029] 10 - Heat sink; 20 - Heat source; 30 - Encapsulation housing; 40 - Circuit board;

[0030] 11 - Circulation space; 100 - Radiator body; 200 - Heat conduction component;

[0031] 111-First subspace; 112-Second subspace; 201-Heat dissipation fins; 202-Sealing step; 203-First boss; 204-Second boss; 205-Heat-conducting interface layer; 301-Opening; 302-Preset gap;

[0032] 1111 - Flow equalization fin group; 1111a - Flow equalization fin. Detailed Implementation

[0033] To explain this disclosure, exemplary embodiments of the disclosure will now be described in detail with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the disclosure, and not all of them. It should be understood that the disclosure is not limited to exemplary embodiments.

[0034] To enable those skilled in the art to better understand the technical solutions in this disclosure, the technical solutions in the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this disclosure, and not all embodiments. Based on the embodiments in this disclosure, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of this disclosure.

[0035] It should be noted that many specific details are set forth in the following description in order to provide a full understanding of this disclosure. However, this disclosure may also be implemented in other ways different from those described herein. Therefore, the scope of protection of this disclosure is not limited to the specific embodiments disclosed below.

[0036] In the description of this disclosure, it should be understood that the terms "upper," "lower," "horizontal," "bottom," "inner," and "outer" (if any) indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are used only for the convenience of describing this disclosure and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this disclosure. In this disclosure, unless otherwise expressly specified and limited, the first feature being "upper" or "lower" than the second feature may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium.

[0037] In this disclosure, unless otherwise expressly specified and limited, the terms "connected," "linked," and "fixed," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral unit; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. However, specifying a direct connection indicates that the two entities connected are not linked by an intermediate structure, but are simply connected to form a whole. For those skilled in the art, the specific meaning of the above terms in this disclosure can be understood according to the specific circumstances.

[0038] In this disclosure, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature.

[0039] As chip performance increases, so does chip power consumption. This leads to increased heat generation during operation, placing higher demands on heat dissipation.

[0040] Generally, heat dissipation for chips is achieved by having a thermally conductive material contact the heat-generating chip, which then conducts the heat generated by the chip to the outside for dissipation.

[0041] To meet the increasingly demanding heat dissipation requirements of chips, the thermal conductivity of the thermally conductive material is typically increased, thereby improving the efficiency of heat dissipation. Alternatively, the density of the heat sink fins can be increased to enhance heat dissipation efficiency.

[0042] However, increasing the thermal conductivity of the thermally conductive material or increasing the density of the heat sink fins will increase the cost of heat dissipation for the chip, resulting in higher heat dissipation costs.

[0043] Figure 1 This is an exploded structural diagram of a thermal management system provided in some examples of this disclosure. Figure 2 This is an exploded structural front view of a thermal management system provided in some examples of this disclosure.

[0044] In some examples, refer to Figure 1 and Figure 2 As shown, the thermal management system provided in some embodiments of this disclosure may include a heat source 20. The heat source 20 may be the chip described in detail in the foregoing embodiments of this application.

[0045] In some examples, the heat source 20 can be a heat-generating element other than the chip. This embodiment only uses the chip as a specific example of the heat source 20 for illustration and does not limit the specific type of the heat source 20. In some examples, the thermal management system may include a package housing 30. The package housing 30 can be encapsulated around the heat source 20. The package housing 30 can be a capless package housing 30. That is, the package housing 30 can have an opening 301.

[0046] In some examples, refer to Figure 1 and Figure 2 As shown, a circuit board 40 may be housed inside the encapsulation housing 30. A heat source 20 may be disposed on the circuit board 40. The heat source 20 may be electrically connected to the circuitry on the circuit board 40.

[0047] In some examples, circuit board 40 may be an integrated circuit board 40.

[0048] In some examples, circuit board 40 may be a printed circuit board (PCB).

[0049] In some examples, the enclosure 30 may be made of a metal such as aluminum, nickel, or copper.

[0050] In some examples, the enclosure 30 may be supported by an alloy of at least two of aluminum, nickel, or copper.

[0051] It is understood that in some examples of the embodiments of this disclosure, the material of the encapsulation housing 30 is only shown as a specific example and is not intended to limit the specific material of the encapsulation housing 30.

[0052] In some examples, refer to Figure 1 and Figure 2 As shown, the thermal management system may include a heat sink 10. The heat sink 10 may be disposed at the opening 301 of the housing 30.

[0053] In some examples, the radiator 10 can be in contact with the heat source 20, and the radiator 10 can carry away the heat generated by the heat source 20, thereby dissipating heat from the heat source 20.

[0054] Figure 3 This is a schematic diagram of the structure of a radiator in a thermal management system provided in some examples of this disclosure. Figure 4 This is an exploded structural diagram of a radiator in a thermal management system provided in some examples of this disclosure.

[0055] In some examples, refer to Figure 3 and Figure 4 As shown, the heat sink 10 may include a heat sink body 100. The heat sink body 100 may be made of a conventional thermally conductive material.

[0056] In some examples, the heat sink body 100 can be made of materials such as aluminum or aluminum alloy. This can save on the material cost of the heat sink body 100.

[0057] In some examples, refer to Figure 3 and Figure 4 As shown, the heat sink body 100 may include a heat conduction element 200. The heat conduction element 200 may be connected to the heat sink body 100.

[0058] Figure 5 This is a cross-sectional view of a radiator in a thermal management system provided in some examples of this disclosure.

[0059] In some examples, refer to Figure 5 As shown, after the heat conduction component 200 is connected to the radiator body 100, the heat conduction component 200 and the radiator body 100 can surround and form a flow space 11 for the cooling medium to flow.

[0060] In some examples, refer to Figure 5 As shown, the cooling medium can flow along Figure 5 The direction indicated by the middle arrow a is the flow within the circulation space 11.

[0061] In some examples, refer to Figure 5 As shown, the heat conduction element 200 has multiple heat dissipation fins 201 on the side facing the flow space 11. After the heat conduction element 200 is connected to the heat sink body 100, the multiple heat dissipation fins 201 can be located within the flow space 11.

[0062] In some examples, the heat dissipation fins 201 may extend along the flow direction of the cooling medium. As the cooling medium flows through the flow space 11, it may come into contact with the heat dissipation fins 201, thereby carrying away the heat from the heat dissipation fins 201.

[0063] In some examples, the cooling medium can be a coolant. The coolant can be a water-based coolant, such as pure water, deionized water, aqueous ethylene glycol solution, or aqueous propylene glycol solution.

[0064] In some examples, the cooling medium can be a fluorinated liquid. For example, the cooling medium can be an electronic fluorinated liquid or a decafluoropolymer coolant.

[0065] In some examples, the cooling medium may be insulating oil.

[0066] In some examples, the cooling medium may be a propylene glycol-based coolant.

[0067] In some examples, the cooling medium may be a phase change cooling medium. This disclosure does not limit the specific type of cooling medium.

[0068] Figure 6 This is a schematic diagram of the structure of a thermal management system provided in this disclosure, showing the interaction between a heat transfer element and a heat source. Figure 7 It is along Figure 6 A cross-sectional view along line AA in the middle.

[0069] In some examples, refer to Figure 1 , Figure 2 and Figure 6 As shown, the side of the heat conduction element 200 facing away from the heat sink body 100 can contact the heat source 20. The heat conduction element 200 can be disposed at the opening 301 of the encapsulation housing 30. The heat conduction element 200 can be in thermal contact with the heat source 20. The heat generated by the heat source 20 is conducted to the heat dissipation fins 201 through the heat conduction element 200. The cooling medium flowing in the flow space 11 contacts the heat dissipation fins 201 and carries away the heat from the heat dissipation fins 201, thereby dissipating heat from the heat source 20. In this embodiment of the present disclosure, by providing multiple heat dissipation fins 201, the contact area between the cooling medium and the heat conduction element 200 is increased, improving the efficiency of the cooling medium in dissipating heat from the heat source 20.

[0070] In some examples, the thermal conductivity of the heat conduction element 200 can be greater than that of the heat sink body 100. This can improve the efficiency of heat transfer from the heat source 20 to the cooling medium in the circulation space 11.

[0071] In some examples, as described in the foregoing embodiments of this application, the radiator body 100 may be made of materials such as aluminum or aluminum alloy. The heat conduction element 200 may be made of a material with a thermal conductivity greater than that of aluminum or aluminum alloy. In this way, only the heat conduction element 200 that is in thermal contact with the heat source 20 can be made of a material with a high thermal conductivity, while the rest of the radiator body 100 can be made of a material with a conventional thermal conductivity. This can reduce the overall material cost of the radiator 10, thereby reducing the cost of cooling the heat source 20.

[0072] The heat sink 10 of the thermal management system provided in this disclosure is connected to the heat sink body 100 via a heat conduction element 200, and together with the heat sink body 100, forms a flow space 11 for the cooling medium to circulate. The heat conduction element 200 has multiple heat dissipation fins 201 on the side facing the flow space 11. The heat conduction element 200 is made of a material with a thermal conductivity greater than that of the heat sink body 100. In this way, the heat conduction element 200 can be made of a material with a higher thermal conductivity, while the heat sink body 100 can be made of a material with a conventional thermal conductivity. This reduces the need for high thermal conductivity materials in the heat sink 10, thereby reducing the cost of the heat sink 10, i.e., reducing the cost of heat dissipation from the heat source by the heat sink 10. After the heat transfer element 200 is placed in contact with the heat source 20 on the side facing away from the heat sink body 100, the heat generated by the heat source 20 can be transferred to the heat sink fins 201 through the heat transfer element 200 with a high thermal conductivity, and carried away by the cooling medium flowing in the flow space 11. The heat transfer element 200 with a high thermal conductivity has a faster heat transfer efficiency and can improve the heat dissipation efficiency of the heat source 20.

[0073] In some examples, the heat conduction element 200 can be hermetically connected to the heat sink body 100 to seal the flow space 11.

[0074] In some examples, the heat conduction element 200 can be welded to the heat sink body 100. For example, the heat conduction element 200 can be welded to the heat sink body 100 by friction welding, soldering or laser welding, thereby making the heat conduction element 200 and the heat sink body 100 sealed together.

[0075] In some examples, the heat transfer element 200 and the radiator body 100 can be sealed together using a sealing ring. For example, a sealing ring can be provided between the heat transfer element 200 and the radiator body 100, and then the connection can be secured and sealed using bolts, screws, or threaded rods.

[0076] In some examples of embodiments of this disclosure, by sealing the heat conduction element 200 to the heat sink body 100, the flow space 11 can be well sealed, thereby improving the cooling effect of the cooling medium on the heat source 20 and ensuring the safety of the thermal management system.

[0077] In some examples, refer to Figures 5-7 As shown, the heat conduction element 200 may have an installation step.

[0078] In some examples, refer to Figure 5 As shown, an installation step can be formed on the side of the heat conduction element 200 facing the heat sink body 100.

[0079] In some examples, the mounting step can be sealed to the radiator body 100. For example, the mounting step can be sealed to the radiator body 100 by methods such as friction welding, soldering, or laser welding, as described in detail in the foregoing embodiments of this disclosure. Of course, the mounting step can also be sealed to the radiator 10 by pressing a sealing ring.

[0080] In some examples, refer to Figure 6 As shown, the mounting step can be set on the edge of the heat conduction element 200 facing the heat sink body 100.

[0081] In some examples of embodiments of this disclosure, by providing an installation step on the heat conduction element 200 and sealingly connecting it to the radiator body 100 through the installation step, the heat conduction element 200 and the radiator body 100 are easily sealed together, ensuring good sealing performance of the flow space 11, improving the cooling effect of the cooling medium on the heat source 20, and ensuring the safety of the thermal management system.

[0082] In some examples, refer to Figure 5 As shown, the heat conduction element 200 has a first boss 203 on the side facing away from the flow space 11.

[0083] In some examples, the first boss 203 and the heat-conducting element 200 can be an integral part. The thermal conductivity of the first boss 203 can be the same as, similar to or approximate to that of the heat-conducting element 200.

[0084] In some examples, the first boss 203 and the heat-conducting element 200 can be separate components. The first boss 203 and the heat-conducting element 200 can be in thermal contact. The first boss 203 and the heat-conducting element 200 can be in close contact, for example, the first boss 203 can be in close contact with the heat-conducting element 200 by welding.

[0085] In some examples, the thermal conductivity of the first boss 203 can be equal to that of the thermal conductivity of the thermal conductive element 200.

[0086] In some examples, the thermal conductivity of the first boss 203 can be greater than that of the thermal conductivity of the thermal conductive element 200.

[0087] In some examples, refer to Figure 7 As shown, the first boss 203 can make thermal contact with the heat source 20.

[0088] In some examples, the first boss 203 can be in close contact with the heat source 20.

[0089] In some examples, the first boss 203 may be in direct contact with the heat source 20. For example, the first boss 203 may be pressed tightly against the surface of the heat source 20.

[0090] Figure 8This is a cross-sectional view of the interaction between a heat transfer element and a heat source in a thermal management system provided by some examples in this disclosure.

[0091] In some examples, refer to Figure 8 As shown, the first protrusion 203 can indirectly contact the heat source 20. For example, the first protrusion 203 can thermally contact the heat source 20 through the thermally conductive interface layer 205.

[0092] In some examples, the thermally conductive interface layer 205 can be a thermally conductive interface material with a certain deformation. In this way, the deformation of the thermally conductive interface layer 205 can fill the tiny gaps formed by the roughness between the first protrusion 203 and the surface of the heat source 20, thereby reducing the thermal resistance of heat conduction between the first protrusion 203 and the heat source 20, and facilitating the transfer of heat generated by the heat source 20 to the first protrusion 203.

[0093] In some examples, the thermal interface layer 205 may include a thermally conductive gel or a silicone grease-based thermal interface material.

[0094] In this embodiment, a first protrusion 203 is provided on the side of the heat conduction member 200 facing away from the flow space 11, and the first protrusion 203 is in thermal contact with the heat source 20. In this way, the heat generated by the heat source 20 can be quickly transferred to the heat conduction member 200 through the first protrusion 203, and then quickly transferred to the heat dissipation fins 201 through the heat conduction member 200, and carried away by the cooling medium flowing in the flow space 11, so as to quickly dissipate heat from the heat source 20.

[0095] Figure 9 This is another cross-sectional view of a radiator in a thermal management system provided in some examples of this disclosure. Figure 10 This is an exploded structural diagram of the heat conduction component and the heat source in a thermal management system provided in some examples of this disclosure. Figure 11 This is another cross-sectional view of the thermal management system provided in this disclosure, showing the interaction between a heat transfer element and a heat source.

[0096] In some examples, refer to Figures 9-11 As shown, the heat conduction element 200 may have a second boss 204 on the side facing away from the flow space 11.

[0097] In some examples, the second boss 204 can be integrated with the heat conduction element 200.

[0098] In some examples, the second boss 204 can be a separate component from the heat conduction element 200.

[0099] In some examples, refer to Figure 10As shown, a preset gap 302 can exist between the heat source 20 and the encapsulation housing 30. That is, when the heat source 20 is encapsulated, a preset gap 302 can be provided between the heat source 20 and the inner wall of the encapsulation housing 30. Thus, in the event of vibration of the heat source 20, the preset gap 302 can provide a certain buffer space for the vibration provided by the heat source 20, preventing the heat source 20 from colliding with the inner wall of the encapsulation housing 30.

[0100] In some examples, refer to Figure 11 As shown, the second boss 204 can be inserted into the preset gap 302.

[0101] In some examples, after the heat source 20 is encapsulated without a cover by the encapsulation housing 30, the heat conduction element 200 can be disposed at the opening 301 of the encapsulation housing 30, thereby sealing the opening 301 of the encapsulation housing 30 through the heat conduction element 200, thus achieving the encapsulation of the heat source 20.

[0102] In some examples, the heat-conducting element 200 can be connected to the encapsulation housing 30 by adhesive bonding.

[0103] In some examples, a thermally conductive interface layer 205 may be coated within a predetermined gap 302 between the heat-conducting element 200 and the encapsulation housing 30.

[0104] In some examples, the thermal interface layer 205 may include thermally conductive adhesive, thermally conductive gel, or silicone grease-based thermal interface material.

[0105] For example, thermally conductive adhesive can be applied to a preset gap 302 between the heat source 20 and the package housing 30, and the heat conduction component 200 is connected to the package housing 30 and the heat source 20 through the thermally conductive adhesive.

[0106] In some embodiments of this disclosure, a second protrusion 204 is provided on the side of the heat conduction member 200 facing away from the flow space 11. The second protrusion 204 can be inserted into the preset gap 302 between the heat source 20 and the encapsulation housing 30. This reduces the amount of thermally conductive adhesive needed to fill the preset gap 302, thus reducing the use of thermally conductive adhesive and lowering the heat dissipation cost of the heat source 20. Furthermore, by inserting the second protrusion into the preset gap 302, the heat dissipated by the heat source 20 can be transferred from the second protrusion 204 to the heat conduction member 200 and then carried away by the cooling medium flowing in the flow space, increasing the thermal contact area between the heat conduction member 200 and the heat source 20, and improving the heat dissipation efficiency of the heat source 20.

[0107] In addition, the second protrusion 204 is inserted into the preset gap 302 between the heat source 20 and the encapsulation housing 30. Thus, there is thermally conductive adhesive and the second protrusion 204 between the heat source 20 and the encapsulation housing 30. When the heat source 20 vibrates, the second protrusion 204 can limit the vibration of the thermally conductive adhesive, which can reduce the loss of thermally conductive adhesive caused by vibration and improve the stability of the connection between the heat conduction component 200 and the heat source 20.

[0108] Figure 12 This is yet another cross-sectional view of the thermal management system provided in this disclosure, showing the interaction between a heat transfer element and a heat source.

[0109] In some examples, refer to Figure 12 As shown, after the second protrusion 204 is inserted into the preset gap 302, a gap is formed between the second protrusion 204 and the side wall of the heat source 20, and a gap is formed between the second protrusion 204 and the encapsulation housing 30.

[0110] In some examples, the gap between the second boss 204 and the heat source 20 can be coated with a thermally conductive interface layer 205, the gap between the second boss 204 and the package housing 30 can be coated with a thermally conductive interface layer 205, and the gap between the first boss 203 and the heat source 20 can be coated with a thermally conductive interface layer 205.

[0111] It is understood that in some examples of this disclosure, the thermal interface layer 205 may be the same as, similar to or similar to the thermal interface layer 205 described in detail in the foregoing embodiments of this disclosure, and this disclosure will not repeat the description in detail.

[0112] In some examples, refer to Figure 1 , Figure 3 and Figure 4 As shown, the second boss 204 can surround the outer periphery of the first boss 203. That is, the side of the heat conduction member 200 facing away from the flow space 11 can simultaneously have the first boss 203 and the second boss 204.

[0113] In some examples, refer to Figure 8 As shown, the second boss 204 protrudes from the side of the first boss 203 that is opposite to the side of the radiator body 100.

[0114] In some examples, refer to Figure 8As shown, the side of the second protrusion 204 facing away from the heat sink body 100 can have a first distance L1 between it and the heat sink body 100. The side of the first protrusion 203 facing away from the heat sink body 100 can have a second distance L2 between it and the heat sink body 100. The first distance can be greater than the second distance. In this way, after the first protrusion 203 makes thermal contact with the heat source 20, the second protrusion 204 can be inserted into the preset gap 302 between the heat source 20 and the encapsulation housing 30.

[0115] In some examples, the heat-conducting component may include a copper component. The heat sink body 100 may include an aluminum component.

[0116] In some examples, the heat conductor 200 can be made of pure copper.

[0117] In some examples, the heat conduction element 200 may be a copper alloy component.

[0118] It is understood that in some examples of the embodiments of this disclosure, the specific material of the heat conduction element 200 is only shown as an example and is not intended to limit the specific material of the heat conduction element 200.

[0119] In some examples of embodiments of this disclosure, copper components are used as heat conduction components 200, which can improve the heat conduction efficiency of heat conduction components 200, thereby improving the heat dissipation efficiency of heat source 20.

[0120] Figure 13 This is yet another cross-sectional view of a radiator in a thermal management system provided in some examples of this disclosure.

[0121] In some examples, refer to Figure 5 , Figure 9 and Figure 13 As shown, the circulation space 11 may include a first subspace 111. The first subspace 111 may be formed in the heat sink body 100.

[0122] In some examples, the overall structure of the radiator body 100 can be a hollow tubular structure, and through holes can be opened in the tube wall of the hollow tubular structure. The heat conduction element 200 can be sealed at the through holes, thereby sealing the radiator body 100.

[0123] In some examples, circulation space 11 may include a second subspace 112.

[0124] In some examples, after the heat conduction element 200 is sealed at the through hole, it can be combined with the heat sink body 100 to form a second subspace 112. That is, the second subspace 112 can be a portion of the flow space 11 corresponding to the heat conduction element 200.

[0125] In some examples, refer to Figure 5 , Figure 9and Figure 13 As shown, the second subspace 112 can be connected to the first subspace 111. This facilitates the flow of cooling medium within the first subspace 111 and the second subspace 112.

[0126] In some examples, the flow cross-section of the second subspace 112 can be smaller than that of the first subspace 111. This allows the cooling medium flow rate in the second subspace 112 to be greater than that in the first subspace 111.

[0127] In some examples of embodiments of this disclosure, the flow cross-section of the second subspace 112 is set to be smaller than that of the first subspace 111. After the cooling medium flows into the second subspace 112, the flow cross-section is reduced, which increases the flow speed of the cooling medium in the second subspace 112. This increases the flow rate of the cooling medium in the second subspace 112 and the rate at which the cooling medium flows through the heat dissipation fins 201. As a result, the efficiency of the cooling medium in removing heat from the heat dissipation fins 201 is improved, thus improving the heat dissipation effect on the heat source 20.

[0128] In some examples, refer to Figure 5 As shown, the cooling medium can flow along the arrangement direction of the first subspace 111 and the second subspace 112. For example, the cooling medium can flow along... Figure 5 The direction indicated by the middle arrow a is from the first subspace 111 to the second subspace 112.

[0129] In some examples, refer to Figure 5 As shown, along the first direction, the radial dimension of the second subspace 112 can be smaller than the radial dimension of the first subspace 111.

[0130] In some examples, the first direction may intersect with the flow direction of the cooling medium.

[0131] In some examples, the first direction can be Figure 5 The direction indicated by the middle arrow b. The first direction can be perpendicular or approximately perpendicular to the flow direction of the cooling medium.

[0132] In some examples, refer to Figure 5 and Figure 9 As shown, the sidewall of the heat sink body 100 facing away from the heat conduction element 200, corresponding to the heat conduction element 200, can be narrowed in the direction towards the heat conduction element 200, thereby reducing the flow cross section of the second subspace 112.

[0133] In some examples, refer to Figure 13 As shown, the heat conduction element 200 can be extended into the flow space 11, so that the heat conduction element 200 occupies part of the flow space 11, thereby reducing the flow cross section of the second subspace 112.

[0134] In some examples of embodiments of this disclosure, the radial dimension of the second subspace 112 is set to be smaller than the radial dimension of the first subspace 111 by means of a first direction intersecting the flow direction of the cooling medium; thus, it is convenient to reduce the flow cross section of the second subspace 112, thereby increasing the flow velocity of the cooling medium in the second subspace 112.

[0135] Figure 14 This is yet another cross-sectional view of a radiator in a thermal management system provided in some examples of this disclosure.

[0136] In some examples, the cooling medium can flow from the first subspace 111 to the second subspace 112. (See reference...) Figure 14 As shown, multiple flow equalization fin groups 1111 can be provided in the first subspace 111.

[0137] In some examples, the flow equalization fin group 1111 may include two, three, four or more. This disclosure does not limit the specific number of flow equalization fin groups 1111.

[0138] In some examples, multiple flow equalization fin groups 1111 can be arranged along the flow direction of the cooling medium. In this way, when the cooling medium flows through each flow equalization fin group 1111, it will be evenly distributed by the flow equalization fin group 1111, making the flow of the cooling medium in the flow space 11 more uniform.

[0139] In some examples, where the flow space 11 has a curved arc, the flow equalization fin assembly 1111 can guide the flow of the cooling medium, thus preventing the cooling medium from concentrating on one side of the flow space 11.

[0140] In some examples of this disclosure, by setting multiple flow-equalizing fin groups 1111 in the first subspace 111, the flow-equalizing fin groups 1111 play a role in equalizing the flow of the cooling medium in the flow space 11, so that the cooling medium can be evenly distributed in the second subspace 112 when it reaches the second subspace 112, thereby being able to contact all the heat dissipation fins 201 in the second subspace 112, and carrying away the heat on all the heat dissipation fins 201, which can improve the cooling and heat dissipation effect on the heat source 20.

[0141] In some examples, refer to Figure 14 As shown, the flow equalization fin assembly 1111 may include a plurality of flow equalization fins 1111a. The plurality of flow equalization fins 1111a may be arranged along the second direction.

[0142] In some examples, refer to Figure 14 As shown, the second direction can be Figure 14 The direction indicated by the middle arrow c. The second direction can intersect with the flow direction of the cooling medium.

[0143] In some examples, the second direction may intersect with the first direction. The first direction can be... Figure 14 The direction perpendicular to the paper.

[0144] In some examples of embodiments of this disclosure, by arranging multiple flow equalization fins 1111a side by side along the second direction, the flow equalization fins 1111a can uniformly distribute the cooling medium in the flow space 11, thereby improving the uniformity of the cooling medium flow in the flow space 11, and thus uniformly carrying away the heat from the heat dissipation fins 201 in the second subspace 112, thereby improving the heat dissipation and cooling effect on the heat source 20.

[0145] In some examples, refer to Figure 14 As shown, along the flow direction of the cooling medium, the flow equalization fins 1111a of two adjacent flow equalization fin groups 1111 can be aligned.

[0146] Figure 15 This is yet another cross-sectional view of a radiator in a thermal management system provided in some examples of this disclosure.

[0147] In some examples, refer to Figure 15 As shown, along the flow direction of the cooling medium, the flow-equalizing fins 1111a of two adjacent flow-equalizing fin groups 1111 can be staggered. In this way, in the flow direction of the cooling medium, after the cooling medium is evenly distributed in the previous flow-equalizing fin group 1111a, it can be evenly distributed again in the next flow-equalizing fin group 1111a, which improves the uniformity of the cooling medium flow in the flow space 11 and enhances the cooling effect of the cooling medium on the heat source 20.

[0148] In some examples, refer to Figure 14 and Figure 15 As shown, the flow gap between adjacent flow equalization fins 1111a is larger than the flow gap between adjacent heat dissipation fins 201. Thus, the flow velocity of the cooling medium between adjacent heat dissipation fins 201 can be greater than the flow velocity between adjacent flow equalization fins 1111a. Within the first subspace 111, the cooling medium can be sufficiently evenly distributed at a lower flow velocity, ensuring uniform distribution within the flow space 11. Within the second subspace 112, the higher flow velocity of the cooling medium can quickly remove heat from the heat dissipation fins 201, improving the cooling effect on the heat source 20.

[0149] The basic principles of this disclosure have been described above with reference to specific embodiments. However, the advantages, benefits, and effects mentioned in this disclosure are merely examples and not limitations, and should not be considered as essential features of each embodiment of this disclosure. Furthermore, the specific details disclosed above are for illustrative and facilitative purposes only, and are not limitations. These details do not limit the scope of this disclosure to the necessity of employing the aforementioned specific details for implementation.

[0150] Various modifications and variations can be made to this disclosure without departing from the spirit and scope of this application. Therefore, if such modifications and variations fall within the scope of the claims of this disclosure and their equivalents, this disclosure is also intended to include such modifications and variations.

Claims

1. A radiator, characterized in that, include: Radiator body; A heat-conducting element is connected to the radiator body. The heat-conducting element and the radiator body together form a flow space for the cooling medium to flow. The side of the heat-conducting element facing the flow space has multiple heat dissipation fins. The side of the heat-conducting element facing away from the radiator body is configured to be in thermal contact with a heat source so as to conduct the heat from the heat source to the cooling medium in the flow space through the heat dissipation fins. The thermal conductivity of the heat-conducting component is greater than that of the heat sink body.

2. The radiator according to claim 1, characterized in that, The heat-conducting element is sealed to the radiator body to seal the flow space.

3. The radiator according to claim 2, characterized in that, The heat conduction element has an installation step, which is sealed to the radiator body.

4. The radiator according to claim 1, characterized in that, The heat-conducting element has a first protrusion on the side facing away from the flow space, and the first protrusion is configured to make thermal contact with the heat source.

5. The radiator according to any one of claims 1-4, characterized in that, The heat conduction element has a second protrusion on the side facing away from the flow space, and the second protrusion is configured to be inserted into a preset gap between the heat source and the encapsulation housing of the heat source.

6. The radiator according to claim 5, characterized in that, The second boss surrounds the outer periphery of the first boss of the heat conduction member, and the side of the second boss facing away from the heat sink body protrudes from the side of the first boss facing away from the heat sink body.

7. The radiator according to any one of claims 1-4, characterized in that, The heat-conducting component includes a copper component.

8. The radiator according to any one of claims 1-4, characterized in that, The circulation space includes: The first subspace is formed within the heat sink body; The second subspace is formed by the heat conduction component and the heat sink body together, and the second subspace is connected to the first subspace. The flow cross-section of the second subspace is smaller than that of the first subspace, so that the flow velocity of the cooling medium in the second subspace is greater than that in the first subspace.

9. The radiator according to claim 8, characterized in that, The cooling medium flows along the arrangement direction of the first subspace and the second subspace; Along the first direction, the radial dimension of the second subspace is smaller than the radial dimension of the first subspace, and the first direction intersects the flow direction of the cooling medium.

10. The radiator according to claim 8, characterized in that, The cooling medium flows from the first subspace to the second subspace, and the first subspace is provided with a plurality of flow equalization fin groups; the plurality of flow equalization fin groups are arranged along the flow direction of the cooling medium.

11. The radiator according to claim 10, characterized in that, The flow equalization fin assembly includes a plurality of flow equalization fins, which are arranged side by side along a second direction. The second direction intersects the flow direction of the cooling medium and also intersects with the first direction.

12. The radiator according to claim 11, characterized in that, Along the flow direction of the cooling medium, the flow equalization fins of two adjacent flow equalization fin groups are staggered.

13. The radiator according to claim 11, characterized in that, The flow gap between adjacent flow equalization fins is greater than the flow gap between adjacent heat dissipation fins.

14. A thermal management system, characterized in that, include: Heat source; A housing is encapsulated around the heat source, and the housing has an opening. The radiator according to any one of claims 1-13, wherein the heat conduction element of the radiator is disposed at the opening, and the heat conduction element is in thermal contact with the heat source to conduct the heat from the heat source to the radiator.

15. The thermal management system according to claim 14, characterized in that, There is a preset gap between the heat source and the encapsulation shell; The heat conduction component has a second protrusion on the side facing away from the heat sink's flow space, and the second protrusion is inserted into the preset gap.

Images