LED packaging structure and lamp bead

Abstract

The utility model provides an LED packaging structure and a lamp bead, the LED packaging structure comprises a substrate main body and a conductive layer arranged on a first side surface of the substrate main body, and one side, far away from the substrate main body, of the conductive layer is provided with a first groove; a first ink layer is arranged in the first groove, and the first ink layer protrudes out of the first groove. Therefore, the packaging colloid can be prevented from overflowing to the bonding pad pins on the conductive layer in the liquid flowing process, and the problem of poor welding effect caused by overflowing of the packaging colloid is further avoided. Meanwhile, the protruding first ink layer can better block water vapor and tin soldering, and the stability and safety of the internal structure are improved.

Description

TECHNICAL FIELD

[0001] The application relates to the technical field of LED products, in particular to an LED packaging structure and a lamp bead. BACKGROUND

[0002] CHIP (Chip In Package) lamp beads are an advanced LED packaging technology, which realizes smaller size, higher light efficiency and better heat dissipation performance by directly integrating LED chips into a package. CONTENT OF THE UTILITY MODEL

[0003] Therefore, the application provides an LED packaging structure and a lamp bead, which can avoid tin soldering or water vapor from entering the functional area, and improve product quality.

[0004] In order to achieve the above purpose, the application provides the following technical scheme:

[0005] An LED packaging structure comprises a substrate main body, a conductive layer and an encapsulation glue body arranged on a first side of the substrate main body, and a first groove arranged on a side of the conductive layer away from the substrate main body; a first ink layer is arranged in the first groove, and the first ink layer protrudes from the first groove; and the encapsulation glue body covers the conductive layer and the first ink layer.

[0006] Optionally, a second groove is arranged on the first side of the substrate main body, and a groove bottom of the first groove is located in the second groove.

[0007] Optionally, a length of the first groove is smaller than a length of the second groove, and the first ink layer is located in the first groove and the second groove.

[0008] Optionally, 4-6 layers of the first ink layer are sequentially arranged in the first groove.

[0009] Optionally, a size of the first ink layer protruding from the first groove is 0.05-0.15 mm.

[0010] Optionally, a depth of the first groove is 0.03-0.08 mm, and a width of the first groove is 0.05-0.3 mm; and a thickness of the first ink layer is 0.15-0.18 mm.

[0011] Optionally, the conductive layer comprises a first conductive part and a second conductive part oppositely polarized and arranged at intervals, and the first recess and the first ink layer are arranged on the first conductive part and the second conductive part.

[0012] Optionally, the first side of the substrate body is further provided with two second ink layers, and the two second ink layers are connected with the two first ink layers in a ring shape to enclose the outer periphery of the internal functional area.

[0013] Optionally, the extension direction of the first recess and the first ink layer is perpendicular to the arrangement direction of the first conductive part and the second conductive part; and the extension direction of the second ink layer is parallel to the arrangement direction of the first conductive part and the second conductive part.

[0014] Optionally, the encapsulation gel covers one third to one half of the first ink layer.

[0015] A lamp bead comprising the LED packaging structure according to any one of the above.

[0016] The LED packaging structure and the lamp bead provided by the present application can position the first ink layer through the first recess, which is conducive to processing and manufacturing, and has good structural stability and sealing performance. After packaging, the encapsulation gel is arranged on the first side of the substrate body and covers the conductive layer and the first ink layer, and the first ink layer is between the conductive layer and the encapsulation gel. Since the adhesion of the ink and the gel is good, the external moisture and solder can be prevented from entering the internal functional area, which is conducive to improving the product quality and the structural strength of the product. Moreover, the first ink layer protrudes from the first recess, so that the first ink layer protrudes from the surface of the conductive layer. In the process of molding, the protruding first ink layer can block and position the encapsulation gel in the middle of the first side of the substrate body, so as to prevent the encapsulation gel from overflowing to the pad pin on the conductive layer in the liquid flow process, thereby avoiding the problem of poor soldering effect caused by overflow insulation. At the same time, the protruding first ink layer can better block the moisture and solder, and improve the stability and safety of the internal structure. BRIEF DESCRIPTION OF DRAWINGS

[0017] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the drawings needed to be used in the embodiments or prior art description will be briefly introduced below. Obviously, the drawings in the following description are only embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor on the basis of the provided drawings.

[0018] Figure 1 A perspective view of the LED packaging structure shown in some embodiments;

[0019] Figure 2A top view of an LED packaging structure shown for some embodiments;

[0020] Figure 3 A top view of an LED packaging structure shown for some other embodiments;

[0021] Figure 4 A sectional view of an LED packaging structure shown for some embodiments;

[0022] Figure 5 A sectional view of a substrate body and a conductive layer shown for some embodiments;

[0023] Figure 6 A sectional view of a substrate body shown for some embodiments.

[0024] In the figure: 1, substrate body; 11, second groove; 2, conductive layer; 21, first conductive part; 22, second conductive part; 23, first groove; 3, first ink layer; 4, second ink layer; 5, encapsulation gel; 6, extension layer; 7, connecting part; 8, functional layer. DETAILED DESCRIPTION

[0025] The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, but not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the scope of protection of the present application.

[0026] As Figures 1-6 shown, the embodiments of the present application provide an LED packaging structure, which comprises a substrate body 1, a conductive layer 2, an encapsulation gel 5 and a first ink layer 3. Among them, the substrate body 1 has opposite first and second sides, the conductive layer 2 and the first ink layer 3 are arranged on the first side of the substrate body 1, and the light-emitting chip and the encapsulation gel 5 are both encapsulated on the first side of the substrate body 1 during packaging. For example, the substrate body 1 is arranged as a BT plate, and the first and second sides are respectively the upper and lower sides in the Figure 6 .

[0027] The first ink layer 3 is arranged on the first groove 23. Specifically, the first groove 23 is arranged in a strip shape, so that the first ink layer 3 arranged in the first groove 23 is in a strip shape. In this way, the first ink layer 3 is limited by the first groove 23, which is beneficial to processing and manufacturing and has good structural stability and sealing performance. After packaging, the packaging glue 5 is arranged on the first side of the substrate body 1 and covers the conductive layer 2 and the first ink layer 3. The first ink layer 3 is between the conductive layer 2 and the packaging glue 5. Because the adhesion between the ink and the glue is good, the moisture and solder in the external environment can be prevented from entering the internal functional area, which is beneficial to improving the product quality and the structural strength of the product.

[0028] Furthermore, the first ink layer 3 protrudes from the first groove 23, so that the first ink layer 3 protrudes from the surface of the conductive layer 2, that is, a flow-preventing protrusion is formed on the surface of the conductive layer 2 by the first ink layer 3. During the molding process, the protruding first ink layer 3 can block and limit the packaging glue 5 in the middle of the first side of the substrate body 1, so as to prevent the packaging glue 5 from overflowing to the pad pins on the conductive layer 2 during the liquid flow process, thereby avoiding the problem of poor welding effect caused by glue overflow. At the same time, the protruding first ink layer 3 can better block the moisture and solder, thereby improving the stability and safety of the internal structure.

[0029] As shown in FIG. 1, Figure 2 The conductive layer 2 includes a first conductive part 21 and a second conductive part 22. The first conductive part 21 and the second conductive part 22 are arranged in an interval and have opposite polarities. For example, the first conductive part 21 and the second conductive part 22 are arranged as positive and negative electrodes, respectively, and are arranged on opposite sides of the first side of the substrate body 1. Preferably, the substrate body 1 is square, and the first conductive part 21 and the second conductive part 22 are located on the two sides of the substrate body 1 in the length direction. In addition, the first side of the substrate body 1 is provided with a functional layer 8 located between the first conductive part 21 and the second conductive part 22. The functional layer 8 is used to carry a light-emitting chip, and the conductive layer 2 is used to conduct electricity for the light-emitting chip on the functional layer 8.

[0030] In the first conductive part 21 and the second conductive part 22, at least one is provided with the first groove 23 to arrange the first ink layer 3. Here, the first groove 23 and the first ink layer 3 are arranged on the first conductive part 21 and the second conductive part 22, and the first ink layer 3 protruding from the first conductive part 21 and the second conductive part 22 is arranged on both sides of the packaging glue 5 to prevent flow and block, which has good flow-preventing effect and sealing performance.

[0031] It should be noted that the second side of the substrate body 1 is provided with an extension layer 6, the extension layer 6 and the conductive layer 2 are symmetrically arranged relative to the substrate body 1, and the extension layer 6 and the conductive layer 2 are connected at the edge of the substrate body 1 through the connecting part 7. In this way, by arranging the extension layer 6, the structural strength and the conductive performance of the conductive layer 2 can be improved. Preferably, the extension layer 6, the conductive layer 2 and the connecting part 7 are made of the same metal material and are integrally formed.

[0032] In some embodiments, the first side of the substrate body 1 is also provided with two second ink layers 4, the second ink layers 4 are coated on the first side of the substrate body 1 and cover the first conductive part 21 and the second conductive part 22, so that the two ends of the second ink layer 4 are connected with the two first ink layers 3 respectively, and the two first ink layers 3 and the two second ink layers 4 are connected end to end to form a ring and surround the outer periphery of the functional layer 8 (the functional layer 8 and the light emitting chip constitute an internal functional area), thereby improving the sealing performance and the connection strength of the four sides of the functional layer 8, and avoiding the penetration of water vapor and soldering in any direction into the internal functional area.

[0033] As shown in Figure 2 , the two second ink layers 4 are respectively located at the opposite two side edges of the first side of the substrate body 1, and the extension direction of the second ink layer 4 is parallel to the arrangement direction of the first conductive part 21 and the second conductive part 22. Moreover, the extension direction of the first groove 23 and the first ink layer 3 is perpendicular to the arrangement direction of the first conductive part 21 and the second conductive part 22. In this way, the two first ink layers 3 and the two second ink layers 4 form a square, which is convenient for processing and coating and has good structural strength.

[0034] It should be noted that the second ink layer 4 is coated on the surface of the substrate body 1 and the conductive layer 2, and does not need to be arranged in the groove. If the groove is opened, it will affect the flow of the packaging glue 5, and bubbles will be formed in the groove, which will easily burst during the reflow soldering process, causing the product to be dead.

[0035] In some embodiments, as shown in Figures 5-6As shown, the first side of the substrate body 1 is provided with a second groove 11, and the conductive layer 2 covers the second groove 11 and extends into the inside of the second groove 11, so that the conductive layer 2 away from one side of the substrate body 1 forms the first groove 23, and the first side of the substrate body 1 and the inside of the second groove 11 are both provided with the conductive layer 2. In this way, compared with directly processing the first groove 23 on the conductive layer 2, the second groove 11 is processed on the substrate body 1 in advance, and the first groove 23 is formed at the same time when the conductive layer 2 is arranged, which is simple and reliable in processing method, and is conducive to improving the depth of the first groove 23 and the thickness of the first ink layer 3, and will not be limited by the thickness of the conductive layer 2, and will not affect the structural stability of the conductive layer 2. Moreover, in structure, the conductive layer 2 is embedded in the first side of the substrate body 1 through the first groove 23, which can improve the connection strength of the conductive layer 2 and the substrate body 1.

[0036] It should be noted that, when processing, the conductive layer 2 on the first side of the substrate body 1 is processed by electroplating, the thickness of the conductive layer 2 is 0.05mm, the thickness of the conductive layer 2 on the first side is consistent with the thickness of the conductive layer 2 in the second groove 11, that is, the depth of the first groove 23 can be consistent with the depth of the second groove 11, and the width of the first groove 23 is smaller than the width of the second groove 11.

[0037] As shown in the figure, Figure 3 In some schemes, the side length of the conductive layer 2 is smaller than the side length of the substrate body 1, the length of the first groove 23 is smaller than the length of the second groove 11, and the first ink layer 3 is located in the first groove 23 and the second groove 11. After electroplating the conductive layer 2, the first ink layer 3 is arranged in the second groove 11, and at the same time, the first ink layer 3 covers the groove bottom of the first groove 23 in the second groove 11. For example, the second groove 11 extends from one side of the substrate body 1 to the other side, and the first ink layer 3 also extends from one side of the substrate body 1 to the other side. In this way, the contact area between the first ink layer 3 and the encapsulation glue 5 can be increased, and the connection strength and sealing strength between the encapsulation glue and the substrate body 1 can be improved.

[0038] Of course, in other schemes, the length of the first groove 23 can also be equal to the length of the second groove 11, as shown in the figure, Figures 1-2 The conductive layer 2 extends from one side of the substrate body 1 to the other side, so that the extension paths of the first groove 23 and the second groove 11 coincide, and at this time, the first ink layer 3 is only located in the first groove 23.

[0039] In some preferred embodiments, the first ink layer 3 has 4-6 layers (e.g., 5 layers), which are sequentially coated into the first groove 23. During processing, one layer of the first ink layer 3 is first coated into the first groove 23. After the coated first ink layer 3 has cured, another layer of the first ink layer 3 is coated, and so on, until the height of the first ink layer 3 is greater than the height of the conductive layer 2 and reaches the preset standard. In this way, the structural strength of the first ink layer 3 can be improved through a multi-layer coating structure.

[0040] In this design, the first ink layer 3 protrudes from the first groove 23 by 0.01-0.015 mm, meaning the height difference between the first ink layer 3 and the conductive layer 2 is set to 0.05-0.15 mm. This improves both the blocking effect of the first ink layer 3 and its processing speed, thus enhancing processing efficiency.

[0041] In the specific design, the depth of the first groove 23 is set to 0.03-0.08 mm, and the width is set to 0.05-0.3 mm; the thickness of the first ink layer 3 is set to 0.15-0.18 mm. By deepening and widening the first groove 23, the thickness of the first ink layer 3 can be increased, giving it better structural stability and connection strength, thereby improving sealing performance.

[0042] like Figure 4 As shown, an encapsulating colloid 5 is disposed on the first side of the substrate body 1. The encapsulating colloid 5 covers the conductive layer 2, the functional layer 8, and the first ink layer 3. The encapsulating colloid 5 covers one-third to one-half of the first ink layer 3, so that part of the first ink layer 3 is covered and the other part is exposed. Considering the adhesion and sealing performance of the colloid and the ink, the bonding surface between the encapsulating colloid 5 and the first ink layer 3 occupies one-third to one-half of the first ink layer 3. Compared with full coverage or just connecting to the first ink layer 3, this can better exhibit its special characteristics, that is, it has better connection strength and sealing performance.

[0043] This application provides an LED chip including the LED packaging structure described in the above embodiments. With this configuration, during the molding process, the protruding first ink layer 3 can block and limit the encapsulating colloid 5 to the center of the first side of the substrate body 1, preventing the encapsulating colloid 5 from overflowing onto the solder pads and pins on the conductive layer 2 during liquid flow, thereby avoiding poor soldering results due to insulation overflow. Simultaneously, the protruding first ink layer 3 can better block moisture and solder, improving the stability and safety of the internal structure.

[0044] The above describes the basic principles of the present application in combination with specific embodiments, but it should be noted that the advantages, benefits, effects and the like mentioned in the present application are only examples and are not limiting, and these advantages, benefits, effects and the like cannot be considered as necessary for each embodiment of the present application. In addition, the above specific details disclosed are only for the purpose of illustration and understanding, and are not limiting, and the above details do not limit the present application to be necessarily implemented with the above specific details.

[0045] The block diagrams of the devices, apparatuses, equipment, systems involved in the present application are only illustrative examples and are not intended to require or imply the connection, arrangement, configuration shown in the block diagrams. As those skilled in the art will recognize, these devices, apparatuses, equipment, systems can be connected, arranged, configured in any manner. Words such as "include", "contain", "have" and the like are open-ended words, mean "including but not limited to", and can be used interchangeably. The words "or" and "and" used herein mean the word "and / or", and can be used interchangeably unless the context clearly indicates otherwise. The word "such as" used herein means the phrase "such as but not limited to", and can be used interchangeably.

[0046] It should also be noted that in the devices, equipment and methods of the present application, each component or each step can be decomposed and / or recombined. These decompositions and / or recombinations should be considered as equivalent solutions of the present application.

[0047] The above description of the disclosed aspects is provided so that any person skilled in the art can make or use the present application. Various modifications to these aspects will be apparent to those skilled in the art, and the general principles defined herein can be applied to other aspects without departing from the scope of the present application. Therefore, the present application is not intended to be limited to the aspects shown herein, but is intended to be accorded the widest scope consistent with the principles and novel features disclosed herein.

[0048] It should be understood that the adjectives "first", "second", "third", "fourth", "fifth" and "sixth" used in the embodiments of the present application are only used for clearer description of the technical solutions, and cannot be used to limit the protection scope of the present application.

[0049] The above description has been given for the purpose of illustration and description. Furthermore, this description is not intended to limit the embodiments of the present application to the forms disclosed herein. Although a number of example aspects and embodiments have been discussed above, those skilled in the art will recognize certain variations, modifications, changes, additions and sub-combinations thereof.

Claims

1. An LED package structure, characterized in that, The substrate body and the conductive layer and the encapsulation glue body arranged on the first side of the substrate body, the conductive layer is provided with a first groove away from the side of the substrate body; the first groove is provided with a first ink layer, and the first ink layer protrudes from the first groove, and the encapsulation glue body covers the conductive layer and the first ink layer.

2. The LED package structure of claim 1, wherein, The first side of the substrate body is provided with a second groove, and the groove bottom of the first groove is located in the second groove.

3. The LED package structure of claim 2, wherein, The length of the first groove is less than the length of the second groove, and the first ink layer is located in the first groove and the second groove.

4. The LED package structure of claim 1, wherein, The first groove is sequentially provided with 4-6 layers of the first ink layer.

5. The LED package structure of claim 1, wherein, The size of the first ink layer protruding from the first groove is 0.05-0.15mm.

6. The LED package structure of claim 5, wherein, The depth of the first groove is 0.03-0.08mm, and the width is 0.05-0.3mm; the thickness of the first ink layer is 0.15-0.18mm.

7. The LED package structure of claim 1, wherein, The conductive layer comprises a first conductive part and a second conductive part with opposite polarity and arranged at intervals, and the first conductive part and the second conductive part are provided with the first groove and the first ink layer.

8. The LED package structure of claim 7, wherein, The first side of the substrate body is also provided with two second ink layers, and the two second ink layers are connected with the two first ink layers to enclose the outer periphery of the internal functional area.

9. The LED package structure of claim 8, wherein, The extension direction of the first groove and the first ink layer is perpendicular to the arrangement direction of the first conductive part and the second conductive part; the extension direction of the second ink layer is parallel to the arrangement direction of the first conductive part and the second conductive part.

10. The LED package structure of claim 1, wherein, The encapsulation glue body covers one third to one half of the first ink layer.

11. A lamp bead, characterized by The LED packaging structure comprises the LED packaging structure according to any one of claims 1-10.

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