Multi-layer bent heat dissipation structure and radiator

Abstract

The utility model provides a multi-layer bent heat dissipation structure and a radiator. The multi-layer bent heat dissipation structure comprises a heat exchange base and a phase change backflow pipe set. An evaporation cavity is formed in the heat exchange base; the phase change backflow pipe set is arranged outside the heat exchange base in a multi-layer bending mode. A liquid refrigerant outlet end of the phase change return pipe group is communicated with the evaporation cavity so as to guide a liquid refrigerant to flow towards the electronic element, the liquid refrigerant absorbs heat of the electronic element through the heat exchange base and is evaporated to form a gaseous refrigerant, and the gaseous refrigerant is low in density and can move to a position higher than the electronic element; the position of a gaseous refrigerant inlet end of the phase change return pipe group is higher than that of a liquid refrigerant outlet end of the phase change return pipe group, and the phase change return pipe group is communicated with the evaporation cavity so as to guide a gaseous refrigerant to enter the phase change return pipe group to be condensed, and the gaseous refrigerant is slower in flowing speed in the bending flowing process and can fill the whole phase change return pipe group; the unit heat exchange efficiency of the gaseous refrigerant and the phase change backflow pipe set is improved.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to the technical field of electronic component heat dissipation, and in particular to a multi-layer curved heat dissipation structure and a heat sink. BACKGROUND

[0002] When electronic components such as MOS tubes, chips, and IGBTs are in operation, a large amount of heat is accumulated on the surface of the electronic components, which can easily cause the electronic components to overheat and deteriorate in performance. In order to ensure the stable performance of the electronic components during operation, some manufacturers use a heat sink structure such as that disclosed in Chinese patent document CN216161725U to cool the electronic components. However, due to the structural design of the above-mentioned heat sink structure, the contact area between the heat exchange fins and the serpentine pipe is limited, and the unit heat exchange efficiency of the serpentine pipe and the heat exchange fins is low. When the electronic components are in high-power operation, there will still be heat accumulation in the local area of the electronic components. CONTENT OF THE UTILITY MODEL

[0003] The purpose of the present disclosure is to overcome the deficiencies in the prior art and provide a multi-layer curved heat dissipation structure with high unit heat exchange efficiency and a heat sink.

[0004] The purpose of the present disclosure is achieved by the following technical solutions:

[0005] A multi-layer curved heat dissipation structure, comprising:

[0006] A heat exchange base, an evaporation cavity is formed inside the heat exchange base, and the evaporation cavity is used to accommodate a refrigerant; the outside of the heat exchange base is used to mount an electronic component; the heat exchange base is used to conduct the heat energy of the electronic component to the refrigerant, so that the liquid refrigerant evaporates to form gaseous refrigerant;

[0007] The multi-layer curved heat dissipation structure further comprises a phase change return pipe group;

[0008] The phase change return pipe group is arranged in multiple layers and curved on the outside of the heat exchange base, and is used to condense the gaseous refrigerant to form liquid refrigerant; the liquid refrigerant outlet end of the phase change return pipe group is connected to the evaporation cavity to guide the flow of liquid refrigerant to the electronic component; the position of the gaseous refrigerant inlet end of the phase change return pipe group is higher than that of the liquid refrigerant outlet end of the phase change return pipe group, and is connected to the evaporation cavity to guide the gaseous refrigerant into the phase change return pipe group for condensation.

[0009] In some embodiments, the phase change return pipe group extends in a serpentine shape in the direction of gravity, and the gaseous refrigerant inlet end is arranged away from the electronic component.

[0010] In some embodiments, the phase change return pipe group is arranged in a serpentine shape in the same vertical plane.

[0011] In some embodiments, the phase-change return pipe group comprises a refrigerant liquid outlet pipe, a serpentine condensing bend pipe and a refrigerant gas inlet pipe connected in sequence; the refrigerant liquid outlet pipe and the refrigerant gas inlet pipe are both installed outside the heat exchange base, the refrigerant liquid outlet pipe is connected to a position close to the electronic component in the evaporation cavity, and the refrigerant gas inlet pipe is connected to a position higher than the electronic component in the evaporation cavity.

[0012] In some embodiments, the first end of the serpentine condensing bend pipe is fixedly connected to the refrigerant liquid outlet pipe, and the second end of the serpentine condensing bend pipe is fixedly connected to the refrigerant gas inlet pipe; a ventilation gap is formed between the serpentine condensing bend pipe and the heat exchange base.

[0013] In some embodiments, the multi-layer curved heat dissipation structure further comprises a fan unit, the fan unit is located on the side of the serpentine condensing bend pipe away from the heat exchange base; heat dissipation air ducts are formed between adjacent pipe walls in the serpentine condensing bend pipe, each heat dissipation air duct is connected to the ventilation gap, and the blowing port of the fan unit is arranged towards the heat dissipation air duct.

[0014] In some embodiments, the serpentine condensing bend pipe is a flat bend pipe, and the width direction of the serpentine condensing bend pipe is consistent with the air outlet direction of the fan unit.

[0015] In some embodiments, the phase-change return pipe group further comprises a supporting bottom pipe, the supporting bottom pipe is fixedly arranged outside the heat exchange base; the supporting bottom pipe is at the same horizontal height as the refrigerant liquid outlet pipe and is fixedly connected to the serpentine condensing bend pipe at a position away from the refrigerant liquid outlet pipe; the serpentine condensing bend pipe is connected to the evaporation cavity through the supporting bottom pipe.

[0016] In some embodiments, the phase-change return pipe group further comprises a supporting top pipe, the supporting top pipe is fixedly arranged outside the heat exchange base; the supporting top pipe is at the same horizontal height as the refrigerant gas inlet pipe and is fixedly connected to the serpentine condensing bend pipe at a position away from the refrigerant gas inlet pipe; the evaporation cavity is connected to the serpentine condensing bend pipe through the supporting top pipe.

[0017] A heat sink comprising the multi-layer curved heat dissipation structure of any of the above embodiments.

[0018] Compared with the prior art, the present disclosure has at least the following advantages:

[0019] The multi-layer curved heat dissipation structure has the following advantages. The multi-layer curved heat dissipation structure has the phase-change return pipe group, and the liquid refrigerant outlet of the phase-change return pipe group is connected to the evaporation cavity. Therefore, the phase-change return pipe group can guide the liquid refrigerant obtained by condensing the gaseous refrigerant into the evaporation cavity. The liquid refrigerant absorbs the heat of the electronic components through the heat exchange base and evaporates to form gaseous refrigerant. The gaseous refrigerant has a small density and can move to a higher position. In addition, the phase-change return pipe group is arranged in a multi-layer curved manner outside the heat exchange base. The position of the gaseous refrigerant inlet of the phase-change return pipe group is higher than the position of the liquid refrigerant outlet of the phase-change return pipe group. Therefore, the gaseous refrigerant can enter the phase-change return pipe group and flow along the curved path under the action of gravity. The gaseous refrigerant flows more slowly in the process of curved flow and can fill the entire phase-change return pipe group. In this way, the contact area between the gaseous refrigerant and the phase-change return pipe group is increased, and the unit heat exchange efficiency of the multi-layer curved heat dissipation structure is improved. BRIEF DESCRIPTION OF DRAWINGS

[0020] In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the following will briefly introduce the drawings needed to be used in the embodiments. It should be understood that the following drawings only show some of the embodiments of the present disclosure, and therefore should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can also be obtained without creative labor on the basis of these drawings.

[0021] Figure 1 FIG. 1 is a sectional view of a multi-layer curved heat dissipation structure according to an embodiment of the present disclosure;

[0022] Figure 2 FIG. 2 is a front view of the multi-layer curved heat dissipation structure in a working state according to the embodiment shown in FIG. 1; Figure 1

[0023] Figure 3 FIG. 4 is a structural schematic diagram of a multi-layer curved heat dissipation structure according to another embodiment of the present disclosure;

[0024] Figure 4 FIG. 5 is a vertical sectional view of a multi-layer curved heat dissipation structure according to another embodiment of the present disclosure;

[0025] Figure 5 FIG. 6 is a horizontal sectional view of the multi-layer curved heat dissipation structure according to the embodiment shown in FIG. 5; Figure 4

[0026] Figure 6 FIG. 7 is a flowchart of a manufacturing method of a multi-layer curved heat dissipation structure according to another embodiment of the present disclosure.

[0027] Reference signs:

[0028] 10, electronic component;

[0029] 100, heat exchange base; 110, aluminum bottom plate; 120, aluminum cover plate; 101, evaporation cavity; ​​

[0030] 200, phase change reflow pipe group; 210, refrigerant liquid outlet pipe; 220, serpentine condensing pipe; 221, refrigerant gas cavity; 222, refrigerant liquid cavity; 223, layer blocking structure; 2231, capillary flow passage; 224, spherical heat exchange bubble cavity; 2201, ventilation gap; 2202, heat dissipation air duct; 230, refrigerant gas inlet pipe;

[0031] 300, fan unit; 400, supporting bottom pipe; 500, supporting top pipe. DETAILED DESCRIPTION

[0032] For the purpose of promoting the understanding of the present disclosure, the present disclosure will be described in further detail below with reference to the attached drawings. The preferred embodiments of the present disclosure are shown in the drawings. However, the present disclosure can be realized in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that the disclosure of the present disclosure can be more thoroughly and completely understood.

[0033] It should be noted that when an element is referred to as being "on" another element, it can be directly on the other element or intervening elements can also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements can also be present. The terms "vertical", "horizontal", "left", "right" and similar expressions as used herein are for the purpose of illustration only and are not intended to limit the present disclosure.

[0034] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. The terminology used in the description of the disclosure herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the disclosure. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0035] In order to better understand the technical solutions and beneficial effects of the present disclosure, the present disclosure will be further described in detail below in combination with specific embodiments:

[0036] Please refer to Figure 1The multi-layered curved heat dissipation structure of one embodiment comprises a heat exchange base 100 and a phase change return pipe group 200; the inside of the heat exchange base 100 forms an evaporation cavity 101, which is used to contain the refrigerant; the outside of the heat exchange base 100 is used to install electronic components 10; the heat exchange base 100 is used to conduct the heat energy of the electronic components 10 to the refrigerant, so that the liquid refrigerant evaporates to form gaseous refrigerant; the phase change return pipe group 200 is arranged in a multi-layered curved manner on the outside of the heat exchange base 100, and is used to condense the gaseous refrigerant to form liquid refrigerant; the liquid refrigerant outlet end of the phase change return pipe group 200 is communicated with the evaporation cavity 101, so as to guide the liquid refrigerant to flow to the electronic components 10; the position of the gaseous refrigerant inlet end of the phase change return pipe group 200 is higher than that of the liquid refrigerant outlet end of the phase change return pipe group 200, and is communicated with the evaporation cavity 101, so as to guide the gaseous refrigerant to enter the phase change return pipe group 200 to condense. In this embodiment, the refrigerant can be tetrafluoroethane or other commonly used refrigerant, which is not limited here.

[0037] It can be understood that, since the liquid refrigerant outlet end of the phase change return pipe group 200 is communicated with the evaporation cavity 101, the phase change return pipe group 200 can guide the liquid refrigerant obtained by condensing the gaseous refrigerant to the evaporation cavity 101, the liquid refrigerant absorbs the heat of the electronic components 10 through the heat exchange base 100 to evaporate to form gaseous refrigerant, and the gaseous refrigerant with small density can move to a higher position. Since the phase change return pipe group 200 is arranged in a multi-layered curved manner on the outside of the heat exchange base 100, and the position of the gaseous refrigerant inlet end of the phase change return pipe group 200 is higher than that of the liquid refrigerant outlet end of the phase change return pipe group 200, the gaseous refrigerant can enter the phase change return pipe group 200 and flow along the curved path under the action of gravity, and the gaseous refrigerant can fill the whole phase change return pipe group 200 in the process of flowing in a curved manner, so as to increase the contact area between the gaseous refrigerant and the phase change return pipe group 200 and improve the unit heat exchange efficiency of the above multi-layered curved heat dissipation structure.

[0038] Please refer to Figure 2 In some embodiments, the phase change return pipe group 200 extends in a snake-shaped manner in the direction of gravity, and the gaseous refrigerant inlet end is arranged away from the electronic components 10. It can be understood that, since the gaseous refrigerant with small density is more likely to move to a position away from and higher than the electronic components 10, the gaseous refrigerant inlet end arranged away from the electronic components 10 can access gaseous refrigerant with higher concentration, and the phase change return pipe group 200 extends in a snake-shaped manner in the direction of gravity, so that after the gaseous refrigerant enters the phase change return pipe group 200, the gaseous refrigerant exchanges heat with the phase change return pipe group 200 to gradually condense to form liquid refrigerant, the liquid refrigerant can flow along the snake-shaped path under the action of gravity, and can provide power for the liquid refrigerant away from the electronic components 10 to flow back to the evaporation cavity 101 more smoothly, thereby reducing the residence amount of the liquid refrigerant at the curved position in the phase change return pipe group 200.

[0039] Please see Figure 2 In some embodiments, the phase change return pipe assembly 200 is arranged in a serpentine bend within the same vertical plane. It can be understood that because the phase change return pipe assembly 200 is arranged in a serpentine bend within the same vertical plane, both gaseous and liquid refrigerant can flow smoothly along the direction of gravity within the vertical plane containing the phase change return pipe assembly 200. This simplifies the extension path of the phase change return pipe assembly 200, allowing more refrigerant to flow back into the evaporator chamber 101 for reuse, ultimately improving the refrigerant circulation efficiency within the entire multi-layered curved heat dissipation structure.

[0040] Please refer to the following: Figure 1 and Figure 2 In some embodiments, the phase change reflux pipe assembly 200 includes a refrigerant liquid outlet pipe 210, a serpentine condenser bend pipe 220, and a refrigerant gas inlet pipe 230 connected in sequence; the refrigerant liquid outlet pipe 210 and the refrigerant gas inlet pipe 230 are both installed outside the heat exchange base 100, the refrigerant liquid outlet pipe 210 is connected to a position inside the evaporation chamber 101 close to the electronic component 10, and the refrigerant gas inlet pipe 230 is connected to a position inside the evaporation chamber 101 higher than the electronic component 10. It is understandable that, since the refrigerant liquid outlet pipe 210, the serpentine condenser bend 220, and the refrigerant gas inlet pipe 230 are connected in sequence, and the refrigerant liquid outlet pipe 210 is connected to the evaporator chamber 101 near the electronic component 10, the liquid refrigerant can be guided to the electronic component 10 to ensure sufficient heat exchange between the liquid refrigerant and the electronic component 10. Since the refrigerant gas inlet pipe 230 is connected to the evaporator chamber 101 above the electronic component 10, the gaseous refrigerant accumulated at a higher position in the evaporator chamber 101 can be guided into the serpentine condenser bend 220 for condensation. The serpentine condenser bend 220 can condense the gaseous refrigerant into liquid refrigerant and then redirect the liquid refrigerant back into the evaporator chamber 101 for reuse.

[0041] Please see Figure 3In some embodiments, the first end of the serpentine condensing coil 220 is fixedly connected to the refrigerant liquid outlet pipe 210, and the second end of the serpentine condensing coil 220 is fixedly connected to the refrigerant gas inlet pipe 230. The serpentine condensing coil 220 and the heat exchange base 100 form a ventilation gap 2201. It can be understood that, since the refrigerant liquid outlet pipe 210 and the refrigerant gas inlet pipe 230 are both installed outside the heat exchange base 100, the first end of the serpentine condensing coil 220 is fixedly connected to the refrigerant liquid outlet pipe 210, and the second end of the serpentine condensing coil 220 is fixedly connected to the refrigerant gas inlet pipe 230, so that the serpentine condensing coil 220 can be supported by the refrigerant liquid outlet pipe 210 and the refrigerant gas inlet pipe 230, and the serpentine condensing coil 220 and the heat exchange base 100 are tightly connected together and form the ventilation gap 2201, which not only reduces the heat conduction between the serpentine condensing coil 220 and the heat exchange base 100, but also accelerates the heat dissipation of the serpentine condensing coil 220 itself.

[0042] For reference Figure 3 With Figure 4 In some embodiments, the multi-layer curved heat dissipation structure further comprises a fan unit 300, which is located on the side of the serpentine condensing coil 220 away from the heat exchange base 100. Adjacent walls in the serpentine condensing coil 220 form heat dissipation air ducts 2202, and each heat dissipation air duct 2202 is connected to the ventilation gap 2201. The blowing port of the fan unit 300 is arranged towards the heat dissipation air duct 2202. It can be understood that, since each heat dissipation air duct 2202 formed by adjacent walls in the serpentine condensing coil 220 is connected to the ventilation gap 2201, by arranging the blowing port of the fan unit 300 towards the heat dissipation air duct 2202, the heat emitted by the serpentine condensing coil 220 can be blown into the ventilation gap 2201 by the wind blown out of the blowing port of the fan unit 300, thereby further improving the condensing effect of the serpentine condensing coil 220. In this embodiment, the fan unit 300 is a plurality of heat dissipation fans arranged side by side, and thus is not described here.

[0043] For reference Figure 3 With Figure 4 In some embodiments, the serpentine condensing coil 220 is a flat coil, and the width direction of the serpentine condensing coil 220 is consistent with the air outlet direction of the fan unit 300. It can be understood that, since the serpentine condensing coil 220 is a flat coil, after the gaseous refrigerant enters the serpentine condensing coil 220, the gaseous refrigerant can have more contact area with the serpentine condensing coil 220 to improve the heat exchange efficiency. At the same time, since the width direction of the serpentine condensing coil 220 is consistent with the air outlet direction of the fan unit 300, the heat emitted by the walls of the serpentine condensing coil 220 can be carried away along the width direction of the serpentine condensing coil 220 by the wind blown out of the fan unit 300, thereby improving the heat dissipation efficiency.

[0044] Generally, due to the difference in the distribution of the gaseous refrigerant into the serpentine condensing coil 220, the heat dissipation efficiency of the gaseous refrigerant at different positions is different, which further causes the coexistence of gaseous refrigerant and liquid refrigerant in the same section of the serpentine condensing coil 220, and the mixture of gaseous refrigerant and liquid refrigerant is prone to heat exchange, which affects the overall heat exchange efficiency of the serpentine condensing coil 220 on the gaseous refrigerant.

[0045] In order to reduce the heat exchange between the gaseous refrigerant and the liquid refrigerant, please refer to Figure 4 In some embodiments, the serpentine condensing coil 220 is arranged downwardly inclined along the width direction from the side close to the fan unit 300 to the side close to the heat exchange base 100, and the air supply direction of the heat dissipation air duct 2202 is arranged towards the direction of the electronic components 10. It can be understood that, due to the downwardly inclined arrangement of the serpentine condensing coil 220 along the width direction from the side close to the fan unit 300 to the side close to the heat exchange base 100, the side of the serpentine condensing coil 220 close to the fan unit 300 is higher than the side of the serpentine condensing coil 220 close to the heat exchange base 100 in the horizontal direction. After the gaseous refrigerant in the same section of the serpentine condensing coil 220 is condensed into liquid refrigerant, the liquid refrigerant will flow along the width direction of the serpentine condensing coil 220 to the heat exchange base 100 under the action of gravity, while the gaseous refrigerant will be enriched on the side of the same section of the serpentine condensing coil 220 close to the fan unit 300 due to its lighter density, so as to be better cooled by the air blown by the fan unit 300, thereby separating the gaseous refrigerant and the liquid refrigerant in the same section of the serpentine condensing coil 220, and reducing the heat exchange between the gaseous refrigerant and the liquid refrigerant. At the same time, due to the arrangement of the air supply direction of the heat dissipation air duct 2202 towards the direction of the electronic components 10, the air supply direction of the heat dissipation air duct 2202 forms an inclined angle with the plane where the heat exchange base 100 is located, so that the air flowing along the heat dissipation air duct 2202 will be more hindered by the heat exchange base 100 and discharged more towards the direction close to the electronic components 10, thereby further improving the heat dissipation effect on the electronic components 10.

[0046] Further, in order to improve the cooling effect of the fan unit 300 on the gaseous refrigerant, please refer to Figure 4 In some embodiments, a spherical heat exchange bubble cavity 224 is formed at the side end of the serpentine condensing coil 220 close to the fan unit 300. It can be understood that, since the spherical heat exchange bubble cavity 224 is located at the side end of the serpentine condensing coil 220 close to the fan unit 300, the gaseous refrigerant will be more enriched in the spherical heat exchange bubble cavity 224, i.e. the air blown by the fan unit 300 can act more on the gaseous refrigerant, thereby improving the condensation effect of the serpentine condensing coil 220 on the gaseous refrigerant.

[0047] Generally, because the flow rate of gaseous refrigerant in the serpentine condensing bend 220 is usually greater than the flow rate of liquid refrigerant, it is easy for the uncondensed gaseous refrigerant to enter the evaporation cavity 101 near the electronic component 10 before the condensed liquid refrigerant, resulting in the formation of bubbles near the electronic component 10 in the evaporation cavity 101, which occupies the contact area of the liquid refrigerant with the electronic component 10, thereby reducing the heat exchange efficiency of the electronic component 10.

[0048] In order to reduce the influence of bubbles on the heat exchange efficiency of the electronic component 10, please refer to Figure 4 and Figure 5 In some embodiments, the serpentine condensing bend 220 is sequentially provided with a refrigerant gas cavity 221 and a refrigerant liquid cavity 222 along the width direction; the refrigerant gas cavity 221 is arranged near the fan unit 300, and the refrigerant liquid cavity 222 is arranged near the heat exchange base 100; a plurality of capillary flow channels 2231 are formed on the inner bottom side wall of the serpentine condensing bend 220; the plurality of capillary flow channels 2231 are arranged along the length direction of the serpentine condensing bend 220 and collectively form a layer barrier structure 223; the layer barrier structure 223 gradually inclines from the refrigerant liquid cavity 222 to the refrigerant gas cavity 221, and the first end of each capillary flow channel 2231 is communicated with the refrigerant liquid cavity 222; the second end of each capillary flow channel 2231 extends along the width direction of the serpentine condensing bend 220 and is communicated with the refrigerant gas cavity 221, so as to hinder and guide the gaseous refrigerant in the refrigerant gas cavity 221. It can be understood that because the layer barrier structure 223 composed of a plurality of capillary flow channels 2231 gradually inclines from the refrigerant liquid cavity 222 to the refrigerant gas cavity 221, that is, the width of the refrigerant liquid cavity 222 gradually increases along the refrigerant return direction while the width of the refrigerant gas cavity 221 gradually decreases, the layer barrier structure 223 can form a hindrance to reduce the flow rate of the gaseous refrigerant during the flow of the gaseous refrigerant towards the refrigerant liquid outlet pipe 210, and the gaseous refrigerant is hindered and condensed into liquid refrigerant. Because the second end of each capillary flow channel 2231 extends along the width direction of the serpentine condensing bend 220 and is communicated with the refrigerant gas cavity 221, the second end of each capillary flow channel 2231 can guide the formed liquid refrigerant to the refrigerant liquid cavity 222 by capillary action to accelerate the collection and flow rate of the liquid refrigerant, finally reduce the difference in flow rate between the gaseous refrigerant and the liquid refrigerant, and reduce the uncondensed gaseous refrigerant entering the evaporation cavity 101 near the electronic component 10. Specifically, the capillary flow channel 2231 is a capillary microchannel with a channel equivalent diameter of 10 μm to 1000 μm.

[0049] Further, in order to further reduce the flow rate of the gaseous refrigerant and increase the flow rate of the liquid refrigerant, please refer to Figure 4 and Figure 5In some embodiments, the second end of the capillary flow passage 2231 extends into the refrigerant gas cavity 221 with a plurality of condensed gas wicks (not shown in the figure), and a capillary flow channel (not shown in the figure) is provided in the refrigerant liquid cavity 222 away from the first end of the capillary flow passage 2231, and the capillary flow channel extends from the refrigerant gas inlet pipe 230 to the refrigerant liquid outlet pipe 210. It can be understood that, since the second end of the capillary flow passage 2231 extends into the refrigerant gas cavity 221 with a plurality of condensed gas wicks, the gaseous refrigerant in the refrigerant gas cavity 221 can be hindered and captured by the condensed gas wicks, so as to further reduce the flow rate of the gaseous refrigerant and accelerate the condensation of the gaseous refrigerant. Meanwhile, since the capillary flow channel is provided in the refrigerant liquid cavity 222 away from the first end of the capillary flow passage 2231, the capillary action of the capillary flow channel can further accelerate the movement of the liquid refrigerant from the refrigerant gas inlet pipe 230 to the refrigerant liquid outlet pipe 210. In the present embodiment, the capillary flow channel has a diameter of 10 μm to 1000 μm, and the condensed gas wicks are metal micro wicks.

[0050] Please refer to Figure 2 In some embodiments, the phase change return pipe set 200 further comprises a supporting bottom pipe 400 fixedly arranged outside the heat exchange base 100; the supporting bottom pipe 400 is located at the same horizontal level as the refrigerant liquid outlet pipe 210, and is fixedly connected to the serpentine condensation elbow pipe 220 away from the refrigerant liquid outlet pipe 210; the serpentine condensation elbow pipe 220 is connected to the evaporation cavity 101 through the supporting bottom pipe 400. It can be understood that, since the refrigerant liquid outlet pipe 210 is fixedly connected to the first end of the serpentine condensation elbow pipe 220, the supporting bottom pipe 400 is fixedly connected to the serpentine condensation elbow pipe 220 away from the refrigerant liquid outlet pipe 210, and the supporting bottom pipe 400 is located at the same horizontal level as the refrigerant liquid outlet pipe 210, the phase change return pipe set 200 can be jointly borne by the refrigerant liquid outlet pipe 210 and the supporting bottom pipe 400. Meanwhile, since the serpentine condensation elbow pipe 220 is connected to the evaporation cavity 101 through the supporting bottom pipe 400, the liquid refrigerant can be guided out to the vicinity of the electronic component 10 through the supporting bottom pipe 400 for heat exchange.

[0051] Please refer to Figure 2 and Figure 3In some embodiments, the phase-change return pipe group 200 further comprises a supporting top pipe 500 fixedly arranged outside the heat exchange base 100; the supporting top pipe 500 is located at the same horizontal level as the refrigerant gas inlet pipe 230 and is fixedly connected to the serpentine condensing bent pipe 220 at a position away from the refrigerant gas inlet pipe 230; the evaporation cavity 101 is connected to the serpentine condensing bent pipe 220 through the supporting top pipe 500. It can be understood that, since the refrigerant gas inlet pipe 230 is fixedly connected to the second end of the serpentine condensing bent pipe 220, the supporting top pipe 500 is fixedly connected to the serpentine condensing bent pipe 220 at a position away from the refrigerant gas inlet pipe 230, and the supporting top pipe 500 is located at the same horizontal level as the refrigerant gas inlet pipe 230, the phase-change return pipe group 200 can be collectively lifted by the refrigerant gas inlet pipe 230 and the supporting top pipe 500. At the same time, since the evaporation cavity 101 is connected to the serpentine condensing bent pipe 220 through the supporting top pipe 500, the gaseous refrigerant can be guided into the phase-change return pipe group 200 through the supporting top pipe 500 for condensation.

[0052] Referring to Figure 6 The present disclosure further provides a multi-layer curved heat dissipation structure manufacturing method, which is applied to manufacturing the multi-layer curved heat dissipation structure of any of the above-mentioned embodiments, and comprises some or all of the following steps:

[0053] Obtaining a heat-conducting plate material group and a heat-conducting pipe material group;

[0054] Referring to Figure 1 In this embodiment, the heat-conducting plate material group comprises an aluminum bottom plate 110 and an aluminum cover plate 120, and the heat-conducting pipe material group comprises copper pipes, i.e. a refrigerant liquid outlet pipe 210, a condensing main pipe and a refrigerant gas inlet pipe 230.

[0055] Performing evaporation cavity milling and pinning post-assembly operation on the heat-conducting plate material group to obtain the heat exchange base 100;

[0056] Referring to Figure 1 In this embodiment, the evaporation cavity milling and pinning post-assembly operation comprises: performing milling operation on the aluminum bottom plate 110 by using a numerical control machine tool to form an evaporation groove on the aluminum bottom plate 110; performing milling operation on the aluminum cover plate 120 by using a numerical control machine tool to match the aluminum bottom plate 110 and the aluminum cover plate 120; performing oil removal operation on the milled and pinned aluminum bottom plate 110 and the aluminum cover plate 120 to remove the residues of cutting fluid and lubricating oil coated on the aluminum bottom plate 110 and the aluminum cover plate 120 before milling and pinning, so as to reduce the welding defects caused by the residues, such as uneven plating, blistering or peeling, etc.; assembling the aluminum cover plate 120 on the aluminum bottom plate 110 to close the evaporation groove to form the evaporation cavity 101, thereby obtaining the heat exchange base 100.

[0057] Performing milling and bending post-assembly operation on the heat-conducting pipe material group to obtain the phase-change return pipe group 200;

[0058] Referring toFigure 2 In the embodiment, the bending and assembling operation includes: using a numerical control machine tool to perform pin milling on the refrigerant liquid outlet pipe 210 and the refrigerant gas inlet pipe 230, so that the refrigerant liquid outlet pipe 210 and the refrigerant gas inlet pipe 230 are matched with the heat exchange base 100; performing oil removal on the refrigerant liquid outlet pipe 210 and the refrigerant gas inlet pipe 230 after pin milling, to remove the residues of cutting fluid and lubricating oil coated before pin milling of the refrigerant liquid outlet pipe 210 and the refrigerant gas inlet pipe 230, so as to reduce subsequent welding defects caused by the residues, such as uneven plating, blistering or peeling, etc.; after the condensation main pipe is bent in a serpentine shape, the condensation main pipe is rolled to obtain a flat bent pipe, and the flat bent pipe has a larger contact area with the refrigerant to improve the unit heat exchange efficiency; wherein the flat bent pipe is the serpentine condensation bent pipe 220; the refrigerant liquid outlet pipe 210, the serpentine condensation bent pipe 220 and the refrigerant gas inlet pipe 230 are assembled to obtain the phase change return pipe group 200.

[0059] After the heat exchange base 100 and the phase change return pipe group 200 are assembled, a brazing operation is performed to connect the evaporation cavity 101 of the heat exchange base 100 to the phase change return pipe group 200 to form an evaporation-condensation loop.

[0060] In the embodiment, the brazing operation after assembly includes: assembling the heat exchange base 100 and the phase change return pipe group 200 to connect the evaporation cavity 101 to the phase change return pipe group 200 to form an evaporation-condensation loop; and integrally brazing the heat exchange base 100 and the phase change return pipe group 200 to connect them into one body.

[0061] A vacuum refrigerant injection and sealing operation is performed on the evaporation-condensation loop to obtain a multi-layer curved heat dissipation structure.

[0062] In the embodiment, the vacuum refrigerant injection and sealing operation includes: performing a vacuum operation on the evaporation-condensation loop to form a negative pressure environment in the evaporation-condensation loop, so that the refrigerant has a lower boiling point and is more easily evaporated and circulated at a low temperature, for example, the refrigerant is evaporated and circulated at 35-40°C; slowly filling the refrigerant through the low-pressure side of the evaporation-condensation loop, and when the evaporation-condensation loop is in a negative pressure state, the air and moisture in the evaporation-condensation loop are evacuated to maintain the vacuum degree, which not only facilitates the filling of the refrigerant, but also effectively ensures the normal operation of the phase change cycle of the refrigerant; and performing a sealing operation on the evaporation-condensation loop to obtain a multi-layer curved heat dissipation structure, and by sealing the connection position of the heat exchange base 100 and the phase change return pipe group 200, the air tightness of the evaporation-condensation loop is improved, the vacuum degree of the evaporation-condensation loop is stabilized, and the service life of the multi-layer curved heat dissipation structure is ultimately prolonged.

[0063] It can be understood that, after the evaporation cavity milling pinning and assembly operation of the heat-conducting plate group, the evaporation cavity 101 is formed in the heat exchange base 100. Through the milling pinning and bending assembly operation of the heat-conducting pipe group, the components in the heat-conducting pipe group are adapted and connected to each other to form the phase-change return pipe group 200 with a serpentine bending. Then, through the assembly and brazing operation of the heat exchange base 100 and the phase-change return pipe group 200, the heat exchange base 100 and the phase-change return pipe group 200 are tightly connected, so that the evaporation cavity 101 is connected to the phase-change return pipe group 200 to form an evaporation-condensation loop. Finally, through the sealing operation of the evaporation-condensation loop after injecting refrigerant under vacuum, not only the vacuum degree of the evaporation-condensation loop can be kept stable, but also the boiling point of the refrigerant can be reduced, so as to improve the evaporation circulation heat exchange efficiency. In this way, the multi-layer bending heat dissipation structure unit made by the multi-layer bending heat dissipation structure manufacturing method has higher unit heat exchange efficiency, so as to reduce the heat accumulation of the electronic element 10.

[0064] Please refer to Figure 1 It can be understood that, by applying the multi-layer bending heat dissipation structure of the present disclosure to the heat sink, since the liquid refrigerant outlet end of the phase-change return pipe group 200 is connected to the evaporation cavity 101, the phase-change return pipe group 200 can guide the liquid refrigerant obtained by condensing the gaseous refrigerant into the evaporation cavity 101. The liquid refrigerant absorbs the heat of the electronic element 10 through the heat exchange base 100 to evaporate and form gaseous refrigerant. The gaseous refrigerant with small density moves to a higher position. Since the phase-change return pipe group 200 is arranged in multiple layers and bends outside the heat exchange base 100, the position of the gaseous refrigerant inlet end of the phase-change return pipe group 200 is higher than the position of the liquid refrigerant outlet end of the phase-change return pipe group 200. This allows the gaseous refrigerant to enter the phase-change return pipe group 200 and flow along the curved path under the action of gravity. The gaseous refrigerant flows more slowly in the process of curved flow, and can fill the entire phase-change return pipe group 200, so as to increase the contact area between the gaseous refrigerant and the phase-change return pipe group 200 and improve the unit heat exchange efficiency of the above multi-layer bending heat dissipation structure.

[0065] Compared with the prior art, the present disclosure has at least the following advantages:

[0066] The multi-layered curved heat dissipation structure described above, since the liquid refrigerant outlet end of the phase change return pipe group 200 is communicated with the evaporation cavity 101, the phase change return pipe group 200 can guide the liquid refrigerant obtained by condensing the gaseous refrigerant into the evaporation cavity 101, and the liquid refrigerant absorbs the heat of the electronic element 10 through the heat exchange base 100 to evaporate and form gaseous refrigerant, and the gaseous refrigerant with small density can move to a higher position. Again, since the phase change return pipe group 200 is arranged in multiple layers and curved outside the heat exchange base 100, the position of the gaseous refrigerant inlet end of the phase change return pipe group 200 is higher than the position of the liquid refrigerant outlet end of the phase change return pipe group 200, so that the gaseous refrigerant can enter the phase change return pipe group 200 and flow along the curved path under the action of gravity, and the gaseous refrigerant flows more slowly in the process of curved flow and can fill the entire phase change return pipe group 200, so as to increase the contact area between the gaseous refrigerant and the phase change return pipe group 200 and improve the unit heat exchange efficiency of the multi-layered curved heat dissipation structure.

[0067] The above-described embodiments only express several implementation manners of the present disclosure, and the description is relatively specific and detailed, but it cannot be understood as a limitation on the scope of the utility model patent. It should be noted that for ordinary skilled persons in the art, without departing from the concept of the present disclosure, several modifications and improvements can be made, which all belong to the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure patent should be subject to the appended claims.

Claims

1. A multi-layered curved heat dissipation structure, comprising: a heat exchange base, an inside of the heat exchange base forming an evaporation cavity for containing a refrigerant; an outside of the heat exchange base for mounting electronic components; the heat exchange base for conducting heat energy of the electronic components to the refrigerant to evaporate liquid refrigerant into gaseous refrigerant; characterized in that the multi-layered curved heat dissipation structure further comprises a phase change return pipe group; the phase change return pipe group being arranged in a multi-layered curved manner on the outside of the heat exchange base, the phase change return pipe group for condensing gaseous refrigerant into liquid refrigerant; a liquid refrigerant outlet end of the phase change return pipe group being communicated with the evaporation cavity to guide liquid refrigerant to flow towards the electronic components; a gaseous refrigerant inlet end of the phase change return pipe group being arranged at a position higher than that of the liquid refrigerant outlet end and being communicated with the evaporation cavity to guide gaseous refrigerant into the phase change return pipe group to condense.

2. The multilayered bend heat spreading structure of claim 1, wherein, the phase change return pipe group extending in a serpentine manner in a direction of gravity, and the gaseous refrigerant inlet end being arranged away from the electronic components.

3. The multilayered bend heat spreading structure of claim 1, wherein, the phase change return pipe group being arranged in a serpentine manner in a same vertical plane.

4. The multilayered bend heat spreading structure of claim 1, wherein, the phase change return pipe group comprising a refrigerant liquid outlet pipe, a serpentine condensing bent pipe and a refrigerant gaseous inlet pipe communicated in sequence; the refrigerant liquid outlet pipe and the refrigerant gaseous inlet pipe being both mounted on the outside of the heat exchange base, the refrigerant liquid outlet pipe being communicated with the evaporation cavity at a position close to the electronic components, and the refrigerant gaseous inlet pipe being communicated with the evaporation cavity at a position higher than the electronic components.

5. The multi-layered bending heat dissipation structure of claim 4, wherein, a first end of the serpentine condensing bent pipe being fixedly connected to the refrigerant liquid outlet pipe, and a second end of the serpentine condensing bent pipe being fixedly connected to the refrigerant gaseous inlet pipe; a ventilation gap being formed between the serpentine condensing bent pipe and the heat exchange base.

6. The multilayered bend heat spreading structure of claim 5, wherein, the multi-layered curved heat dissipation structure further comprising a fan unit, the fan unit being arranged on a side of the serpentine condensing bent pipe away from the heat exchange base; adjacent pipe walls in the serpentine condensing bent pipe forming heat dissipation air ducts, each of the heat dissipation air ducts being communicated with the ventilation gap; a blowing opening of the fan unit being arranged towards the heat dissipation air ducts.

7. The multilayered bend heat spreading structure of claim 6, wherein, the serpentine condensing bent pipe being a flat bent pipe, a width direction of the serpentine condensing bent pipe being consistent with an air outlet direction of the fan unit.

8. The multilayered bend heat spreading structure of claim 5, wherein, the phase change return pipe group further comprising a supporting bottom pipe, the supporting bottom pipe being fixedly arranged on the outside of the heat exchange base; the supporting bottom pipe being at a same horizontal level as the refrigerant liquid outlet pipe and being fixedly connected to the serpentine condensing bent pipe at a position away from the refrigerant liquid outlet pipe; the serpentine condensing bent pipe being communicated with the evaporation cavity through the supporting bottom pipe.

9. The multilayered bend heat spreading structure of claim 5, wherein, the phase change return pipe group further comprising a supporting top pipe, the supporting top pipe being fixedly arranged on the outside of the heat exchange base; the supporting top pipe being at a same horizontal level as the refrigerant gaseous inlet pipe and being fixedly connected to the serpentine condensing bent pipe at a position away from the refrigerant gaseous inlet pipe; the evaporation cavity being communicated with the serpentine condensing bent pipe through the supporting top pipe.

10. A heat spreader, comprising: a multi-layered curved heat dissipation structure according to any one of claims 1 to 9.

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