Laser processing system of display panel

Abstract

The utility model provides a laser processing system of a display panel, which comprises a first laser device, a second laser device, a laser light source, a laser light source and a control system, the scanning head is mounted on the processing platform, is positioned at the irradiation end of the first laser and is used for receiving the ablation laser and ablating a display layer and optical cement in the display panel through the ablation laser; the display panel comprises a display layer, optical cement and a thin film layer, and the optical cement is located between the display layer and the thin film layer; the second laser device is installed on the processing platform and used for emitting ablation laser and conducting ablation treatment on the display layer so as to strip the display layer and the thin film layer, and the optical cement is located on the thin film layer; and the camera is positioned on one side of the second laser and is used for photographing the stripped thin film layer under the top light and / or backlight to obtain a photographed picture. According to the utility model, the transparency of the optical cement on the film layer can be obtained, so that the processing precision of laser cutting can be known.

Description

Technical Field

[0001] This utility model relates to the field of laser precision machining, and in particular to a laser machining system for display panels. Background Technology

[0002] The manufacturing process of Organic Light-Emitting Diode (OLED) display panels involves multiple steps, including substrate selection, transparent conductive layer deposition, organic light-emitting layer deposition, encapsulation, laser cutting / drilling, inspection / testing, and assembly / packaging. During the inspection / testing of the display panel, electrical performance tests can be performed to check the light emission of each pixel to ensure product quality. In existing technologies, after the laser cutting step, no cutting information corresponding to the transparent conductive layer and organic light-emitting layer is obtained at the physical level, making it impossible to understand the control precision related to laser cutting. Therefore, there is room for improvement. Utility Model Content

[0003] In view of the shortcomings of the prior art described above, the purpose of this utility model is to provide a laser processing system for display panels, which solves the problem that the control precision related to laser cutting cannot be known after the laser cutting step in the prior art.

[0004] To achieve the above and other related objectives, this utility model provides a laser processing system for display panels, comprising:

[0005] The first laser, mounted on the processing platform, is used to emit an ablation laser.

[0006] A scanning head, mounted on a processing platform and located at the irradiation end of the first laser, is used to receive the ablation laser and ablate the display layer and optical adhesive in the display panel using the ablation laser; wherein, the display panel includes a display layer, optical adhesive and a thin film layer, and the optical adhesive is located between the display layer and the thin film layer;

[0007] A second laser, mounted on a processing platform, is used to emit an ablation laser to ablate the display layer, thereby peeling the display layer from the thin film layer, with the optical adhesive located on the thin film layer.

[0008] A camera, located to one side of the second laser, is used to take pictures of the peeled thin film layer under top light and / or back light to obtain photographic images.

[0009] In one embodiment of this utility model, the laser processing system further includes:

[0010] A beam splitter is disposed at the emitting end of the first laser. The beam splitter is used to split the ablation laser into a first beam splitter and a second beam splitter according to a preset beam splitting ratio.

[0011] A laser monitoring module is installed on the side of the beam splitter from which the first laser beam is split, in order to monitor and analyze the first laser beam.

[0012] The scanning head is positioned on the side of the beam splitter from which the ablation laser is split.

[0013] In one embodiment of the present invention, the laser processing system further includes a beam expander disposed between the first laser and the beam splitter.

[0014] In one embodiment of the present invention, the laser processing system further includes an attenuator disposed between the first laser and the beam splitter.

[0015] In one embodiment of the present invention, the laser processing system further includes a reflector located on the side of the beam splitter away from the first laser, and the emitting end of the first laser, the beam splitter, and the reflector are arranged along a straight line;

[0016] The reflector receives the second laser beam split by the beam splitter and reflects it onto the scanning head.

[0017] In one embodiment of the present invention, the laser processing system further includes a reflector located on the side of the beam splitter away from the first laser, and the emitting end of the first laser, the beam splitter, and the reflector are arranged along a straight line;

[0018] The reflector receives the first laser beam split by the beam splitter and reflects it onto the laser monitoring module.

[0019] In one embodiment of this utility model, the laser monitoring module monitors and analyzes the first power corresponding to the first sub-laser, and the laser processing system further includes:

[0020] A power detection instrument is located on the emitting side of the scanning head to detect the second power corresponding to the second sub-laser emitted by the scanning head;

[0021] The processing module is electrically connected to the power detection instrument and the laser monitoring module to obtain the first power and the second power.

[0022] In one embodiment of this utility model, the processing module is electrically connected to the attenuator to adjust the beam intensity of the ablation laser output by the attenuator.

[0023] In one embodiment of this utility model, the beam splitter has a beam splitting ratio of 1:1.

[0024] In one embodiment of this utility model, the angle between the straight direction of the ablation laser emitted by the first laser and the plane direction of the beam splitter is 45°.

[0025] As described above, the laser processing system for a display panel of this utility model has the following beneficial effects: After the display panel is ablated and melted, the transparency of the optical adhesive on the thin film layer in the display panel can be obtained, thereby revealing the processing precision of the laser cutting. Attached Figure Description

[0026] Figure 1 This is a structural block diagram of a laser processing system for a display panel provided in an embodiment of the present invention.

[0027] Figure 2 For the present utility model in Figure 1 The structural block diagram of adding an attenuator in the laser processing system of the display panel.

[0028] Figure 3 This is a schematic diagram of a structure for ablation treatment of a display panel according to an embodiment of the present invention.

[0029] Figure 4 This is a schematic diagram of a structure for ablating a display panel according to an embodiment of the present invention.

[0030] Figure 5 This is a schematic diagram of the structure of a display panel after ablation treatment, according to an embodiment of the present invention.

[0031] Figure 6 A structural block diagram of a laser processing system for a display panel provided in another embodiment of the present invention.

[0032] Figure 7 In a display panel provided according to an embodiment of the present invention, the thin film layer is arranged on the front and the image is taken under top light.

[0033] Figure 8 For the present utility model in Figure 7 The provided display panel has the thin film layer facing forward, and the image is taken under backlight.

[0034] Figure 9 For the present utility model in Figure 7 The provided display panel has the thin film layer set on the reverse side, and the image is taken under top light.

[0035] Figure 10 For the present utility model in Figure 7The provided display panel has a thin film layer set on the reverse side, and the image is taken under backlight.

[0036] Figure 11 In another embodiment of the present invention, the thin film layer is arranged on the front of the display panel, and the image is taken under top light.

[0037] Figure 12 For the present utility model in Figure 11 The provided display panel has the thin film layer facing forward, and the image is taken under backlight.

[0038] Figure 13 For the present utility model in Figure 11 The provided display panel has the thin film layer set on the reverse side, and the image is taken under top light.

[0039] Figure 14 For the present utility model in Figure 11 The provided display panel has a thin film layer set on the reverse side, and the image is taken under backlight.

[0040] Figure Labels

[0041] 100. Display panel; 101. Display layer; 102. Thin film layer; 103. Glass substrate; 104. Indium tin oxide layer; 105. Electroluminescent film layer; 106. Silver layer;

[0042] 10. First laser; 20. Beam splitter; 30. Laser monitoring module; 40. Scanning head; 410. Power detection instrument; 50. Camera; 60. Processing module; 610. Host computer; 620. Sub-computer; 710. Beam expander; 720. Attenuator; 80. Reflector. Detailed Implementation

[0043] The following specific examples illustrate the implementation of this utility model. Those skilled in the art can easily understand other advantages and effects of this utility model from the content disclosed in this specification. This utility model can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of this utility model. It should be noted that, unless otherwise specified, the following embodiments and features described therein can be combined with each other.

[0044] It should be noted that the illustrations provided in the following embodiments are only schematic representations of the basic concept of the present invention. Therefore, the drawings only show the components related to the present invention and are not drawn according to the number, shape and size of the components in actual implementation. In actual implementation, the form, quantity and proportion of each component can be arbitrarily changed, and the layout of the components may also be more complex.

[0045] In the following description, numerous details are explored to provide a more thorough explanation of embodiments of the present invention. However, it will be apparent to those skilled in the art that embodiments of the present invention may be practiced without these specific details. In other embodiments, well-known structures and devices are shown in block diagram form rather than in detail to avoid obscuring embodiments of the present invention.

[0046] Please see Figures 1 to 14 This invention proposes a laser processing system and method for display panels, applicable to the field of laser precision processing, such as the processing of organic light-emitting diode (OLED) display panels. After ablation and melting of the display panel, this invention can obtain the transparency of the optical adhesive on the thin film layer of the display panel, thereby determining whether the laser processing meets the process requirements and facilitating the understanding of the processing precision of laser cutting. Detailed descriptions are provided below using specific embodiments.

[0047] Please see Figure 1 , Figure 2 In one embodiment of this utility model, a laser processing system for a display panel is proposed, which may include a first laser 10, a beam splitter 20, a laser monitoring module 30, a scanning head 40, a second laser, a camera 50, and a processing module 60. The first laser 10, beam splitter 20, laser monitoring module 30, scanning head 40, second laser, camera 50, and processing module 60 can be mounted on a processing platform.

[0048] Specifically, the first laser 10 can be used to emit an ablation laser to ablate the display panel 100. Laser ablation is a process that uses a high-energy-density laser beam to emit onto the surface of a material, causing the material to be rapidly heated locally to its vaporization temperature or undergo a phase change and thus removed.

[0049] Specifically, the second laser (not shown in the figure) can be used to emit an ablation laser to ablate the display panel 100. Laser ablation is a key process in laser processing. It uses a high-energy-density laser beam to emit onto the surface of the material, causing the material to be rapidly heated, melted, vaporized, or decomposed locally, thereby removing the material.

[0050] like Figure 3 , Figure 4 ,and Figure 5As shown, the display panel 100 includes a display layer 101 and a thin film layer 102. The display layer 101 may include an electroluminescent (EL) film layer 105 and a silver layer 106, with the silver layer 106 disposed between the two EL film layers 105. The EL film layers 105 and the silver layer 106 have different absorption rates for different types of light; specifically, the EL film layers 105 and the silver layer 106 have the highest absorption rate under green light, therefore the ablation laser can be a green laser. The thin film layer 102 includes a glass substrate 103 and an indium tin oxide (ITO) layer 104. The ablation laser can be a red laser.

[0051] For example, an optical adhesive (not shown) is formed between the display layer 101 and the thin film layer 102, that is, an optical adhesive is formed between the indium tin oxide layer 104 and the electroluminescent film layer 105. The optical adhesive is not only used to bond different layers, but also has multiple functions to ensure the performance and reliability of the display.

[0052] Specifically, the beam splitter 20 is used to split the ablation laser emitted by the first laser 10 according to a splitting ratio. The beam splitter 20 is located at the emitting end of the first laser 10. In the field of lasers, the beam splitter 20 (also called a beam splitter or beam splitter) is an optical element that can divide an incident laser beam into two or more parts. The beam splitter 20 distributes the light intensity according to a certain ratio; part of the light is reflected, and the other part passes through the beam splitter 20. This ratio can be 50%:50, or it can be customized according to specific application requirements.

[0053] Specifically, the laser monitoring module 30 is used to monitor the first laser beam split by the beam splitter 20, and the processing module 60 analyzes the second laser beam based on the beam splitting ratio and the monitoring and analysis data of the first laser beam.

[0054] Specifically, the scanning head 40 is used to receive the second laser beam and to ablate the display layer 101 and optical adhesive in the display panel 100 using the second laser beam. After the second laser beam ablates the display layer 101 and optical adhesive, it will leave obvious grayish-brown marks and uniformly cover the light spot marks, such as... Figure 1 , Figure 6 , Figure 7 , Figure 8 and Figure 9 As shown, the second laser beam will leave a light spot mark on the optical adhesive.

[0055] After the second laser ablates the display layer 101 and the optical adhesive, the second laser emits an ablation laser to ablate the display layer 101, thereby separating the display layer 101 from the thin film layer 102, with the optical adhesive remaining on the thin film layer 102. For example, the second laser can be positioned to one side of the first laser 10. The second laser can emit light from a beam splitter 20, and under the action of the beam splitter 20, laser monitoring module 30, scanning head 40, camera 50, and processing module 60, the display layer 101 is ablated.

[0056] Specifically, camera 50 is used to take pictures of the peeled thin film layer 102 under top light and / or back light to acquire photographic images. Processing module 60 is used to obtain the transparency of the optical adhesive from the photographic images and generate laser processing information of display panel 100 based on the transparency of the optical adhesive.

[0057] Please see Figure 6 , Figure 7 , Figure 8 and Figure 9 In one embodiment of this invention, the optical adhesive has a light transmittance of less than 70%. After the second laser scan, the scanned area shows obvious grayish-brown marks that uniformly cover the light spot marks. The light spot marks within the scanned area are clear as... Figure 7 and Figure 8 When observed from the reverse side with a backlight, the light emission is not obvious. Figure 9 .

[0058] Please see Figure 6 , Figure 7 , Figure 8 and Figure 9 In one embodiment of this utility model, the transmittance of the optical adhesive is less than 70%, corresponding to an ablation laser frequency of 100kHz, a focal length of 255mm, a scanning speed of 2000mm / s, and a power of 8W. After the second laser scan, as... Figure 6 , Figure 9 The scanned area shows obvious grayish-brown marks that are evenly covered by light spots. The light spots within the scanned area are clear, as shown... Figure 7 and Figure 8 When observed from the reverse side with a backlight, the light emission is not obvious, such as... Figure 9 This does not meet the process requirements.

[0059] Please see Figure 10 , Figure 11 , Figure 12 and Figure 13 In one embodiment of this invention, the optical adhesive has a light transmittance of less than 70%, corresponding to an ablation laser frequency of 100 kHz, a focal length of 255 mm, a scanning speed of 2000 mm / s, and a power of 9 W. After the second laser scan, as... Figure 10 , Figure 13 The scanned area shows obvious grayish-brown marks that are evenly covered by light spots. The light spots within the scanned area are clear, as shown... Figure 11 and Figure 12 When viewed from the reverse side with a backlight, the light emission is more pronounced, such as... Figure 9 It meets the process requirements.

[0060] Therefore, it can be seen that, Figure 1 As shown, the ablation laser, at an appropriate power, ablates the display layer 101 and the optical adhesive to a greater depth and with a better ablation effect. This results in higher transparency of the optical adhesive on the thin film layer 102 after the ablation laser ablates the display layer 101, meeting the process requirements.

[0061] Please see Figure 1 , Figure 2 In one embodiment of the present invention, the laser processing system further includes a beam expander 710 or an attenuator 720, which is disposed between the first laser 10 and the beam splitter 20.

[0062] Specifically, such as Figure 1 As shown, a beam expander 710 is disposed between the first laser 10 and the beam splitter 20. The beam expander 710 can be used to expand the diameter of the laser beam while reducing its divergence angle.

[0063] Specifically, such as Figure 2 As shown, an attenuator 720 is provided between the first laser 10 and the beam splitter 20. The attenuator 720 is used to control the light intensity, such as a device to reduce the intensity of the beam, and the attenuator 720 does not significantly change other characteristics of the beam, such as wavelength, polarization state or propagation direction.

[0064] Please see Figure 1 , Figure 2 and Figure 14 In one embodiment of the present invention, the laser processing system further includes a reflector 80, which is located on the side of the beam splitter 20 away from the first laser 10. The emitting end of the first laser 10, the beam splitter 20 and the reflector 80 are arranged in a straight line.

[0065] Specifically, such as Figure 1 and Figure 2 As shown, the reflector 80 receives the second laser beam split from the beam splitter 20 and reflects it onto the scanning head 40. The first laser beam split from the beam splitter 20 is directly emitted to the laser monitoring module 30, which is used to detect the power of the first laser beam.

[0066] Furthermore, due to the beam splitting effect of the beam splitter 20, the ratio of the energy of the first split laser to the energy of the second split laser is known. Therefore, even if the laser monitoring module 30 only detects the power of the first split laser, it can still determine the power of the second split laser. For example, the processing module 60 analyzes the second split laser based on the beam splitting ratio and the monitoring and analysis data of the first split laser.

[0067] Specifically, such as Figure 14 As shown, the reflector 80 receives the first laser beam split by the beam splitter 20 and reflects it onto the laser monitoring module 30. The second laser beam split by the beam splitter 20 is directly emitted onto the scanning head 40.

[0068] Please see Figure 1 , Figure 2 In one embodiment of the present invention, the laser monitoring module 30 acquires the first power corresponding to the first sub-laser, and the laser processing system further includes a power detection instrument 410, which is located on the emitting side of the scanning head 40 and is used to detect the second power corresponding to the second sub-laser emitted by the scanning head 40.

[0069] Specifically, the processing module 60 is electrically connected to the power detection instrument 410 and the laser monitoring module 30 to acquire a first power and a second power, which are used to determine whether the ratio of the first power to the second power is the same as the beam splitter ratio of the beam splitter 20. When the ratio of the first power to the second power is the same as the beam splitter ratio, the power detection instrument and the laser monitoring module are functioning normally. When the ratio of the first power to the second power is different from the beam splitter ratio, the power detection instrument and / or the laser monitoring module are malfunctioning.

[0070] Please see Figure 1 , Figure 2 In one embodiment of this utility model, the processing module 60 is electrically connected to the attenuator 720, and the processing module 60 adjusts the beam intensity of the ablation laser output by the attenuator 720 based on the magnitude of the first power and the second power.

[0071] Please see Figure 1 , Figure 2 and Figure 14 In one embodiment of this utility model, the camera 50 takes pictures according to the following steps: When the peeled-off film layer 102 is placed face up, a picture is taken under top light and / or backlight to obtain the top-lit image and / or backlight image corresponding to the face up of the film layer 102. When the peeled-off film layer 102 is placed face down, a picture is taken under top light and / or backlight to obtain the top-lit image and / or backlight image corresponding to the face down of the film layer 102.

[0072] Please see Figure 1 , Figure 2 and Figure 14 In one embodiment of this utility model, the processing module 60 is used to obtain the transparency of the optical adhesive according to the following steps: The processing module 60 compares the transparency of the optical adhesive with a preset transparency threshold. When the transparency of the optical adhesive is greater than or equal to the preset transparency threshold, laser processing information that meets the process requirements is generated. When the transparency of the optical adhesive is less than the preset transparency threshold, laser processing information that does not meet the process requirements is generated.

[0073] Please see Figure 1 , Figure 2 and Figure 14 In one embodiment of this invention, after generating laser processing information that does not meet the process requirements, the processing module 60 further performs processing according to the following steps: The power of the ablation laser is increased while maintaining other processing parameters of the ablation laser, and the display layer 101 in another display panel 100 is ablated using a second laser beam split from the ablation laser. After the second laser beam ablates the display layer 101, the display layer 101 is ablated using an ablation laser to peel off the display layer 101 and the thin film layer 102 in the other display panel 100, with the optical adhesive located on the thin film layer 102. The processing module 60 obtains the transparency of the optical adhesive and generates laser processing information for the other display panel 100 based on the transparency of the optical adhesive.

[0074] In summary, the laser processing system for display panels disclosed in this utility model, after ablation and melting of the display panel, can obtain the transparency of the optical adhesive on the thin film layer of the display panel, thereby revealing the processing precision of the laser cutting. Therefore, this utility model effectively overcomes the various shortcomings of the prior art and has high industrial application value.

[0075] The above embodiments are merely illustrative of the principles and effects of this utility model and are not intended to limit the scope of this utility model. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of this utility model. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in this utility model should still be covered by the claims of this utility model.

Claims

1. A laser processing system of a display panel, characterized by, The laser processing system comprises: a first laser installed on a processing platform to emit ablation laser; a scanning head installed on the processing platform and located at the irradiation end of the first laser to receive the ablation laser and ablate the display layer and optical glue in the display panel by the ablation laser; wherein the display panel comprises a display layer, optical glue and a film layer, and the optical glue is located between the display layer and the film layer; a second laser installed on the processing platform to emit ablation laser and ablate the display layer to separate the display layer and the film layer, and the optical glue is located on the film layer; a camera located on one side of the second laser to take a photo of the separated film layer under top light and / or backlight to obtain a photo.

2. The laser processing system of the display panel according to claim 1, wherein, The laser processing system further comprises: a beam splitter provided at the emission end of the first laser, the beam splitter being used to split the ablation laser into first and second sub-lasers according to a preset splitting ratio; a laser monitoring module provided at the side of the beam splitter from which the first sub-laser is split out to monitor and analyze the first sub-laser; wherein the scanning head is provided at the side of the beam splitter from which the ablation laser is split out.

3. The laser processing system of the display panel according to claim 2, wherein, The laser processing system further comprises an expander provided between the first laser and the beam splitter.

4. The laser processing system of the display panel according to claim 2, wherein, The laser processing system further comprises an attenuator provided between the first laser and the beam splitter.

5. The laser processing system of the display panel according to claim 2, wherein The laser processing system further comprises a reflector located on the side of the beam splitter away from the first laser, and the emission end of the first laser, the beam splitter and the reflector are arranged in a straight line. The reflector receives the second sub-laser split out by the beam splitter and reflects the second sub-laser to the scanning head.

6. The laser processing system of the display panel according to claim 2, wherein The laser processing system further comprises a reflector located on the side of the beam splitter away from the first laser, and the emission end of the first laser, the beam splitter and the reflector are arranged in a straight line. The reflector receives the first sub-laser split out by the beam splitter and reflects the first sub-laser to the laser monitoring module.

7. The laser processing system of the display panel according to claim 4, wherein The laser monitoring module monitors and analyzes the first power corresponding to the first sub-laser, and the laser processing system further comprises: a power detection instrument located at the emission side of the scanning head to detect the second power corresponding to the second sub-laser emitted by the scanning head; a processing module electrically connected with the power detection instrument and the laser monitoring module to obtain the first power and the second power.

8. The laser processing system of the display panel according to claim 7, wherein, The processing module is electrically connected with the attenuator to adjust the beam intensity of the ablation laser output by the attenuator.

9. The laser processing system of the display panel according to claim 2, wherein, The splitting ratio of the beam splitter is 1:

1.

10. The laser processing system of the display panel according to claim 2, wherein, The included angle between the straight line direction of the ablation laser emitted by the first laser and the plane direction of the beam splitter is 45°.

Images