Laser processing platform and laser processing equipment

Abstract

The utility model provides a laser processing platform and laser processing equipment and belongs to the field of semiconductor processing and manufacturing, the laser processing platform comprises a supporting table, the supporting table is further used for containing a part to be cut and installing a laser cutting assembly, the supporting table comprises a supporting frame, a supporting piece and a supporting plate, the supporting frame is rectangular, and the supporting piece is arranged on the supporting plate. The number of the supporting pieces is multiple, each supporting piece has the freedom degree of moving in the first horizontal direction and the second horizontal direction, the first horizontal direction is perpendicular to the second horizontal direction, the supporting pieces are used for supporting the supporting plate, the supporting plate is used for supporting a part to be cut, and the supporting plate is provided with a hollowed-out part used for discharging waste. Compared with the prior art, the technical problem that a large amount of heat is easily accumulated on the back face of a workpiece in the existing laser machining process is solved.

Description

Technical Field

[0001] This utility model belongs to the field of semiconductor processing and manufacturing, and more specifically, it relates to a laser processing platform. This utility model also relates to a laser processing equipment. Background Technology

[0002] Laser processing, as one of the main methods of material processing, places a significant emphasis on the processing platform, which is a major factor affecting processing quality. With the rapid development of laser processing technology, its applications are expanding, and the structures of workpieces are becoming increasingly complex, leading to higher requirements for processing quality and performance. Currently, the most common laser processing platforms on the market are honeycomb panels, mostly made of metal or plastic. The platform design uses a 6mm diameter circular cross-arrangement. This type of screen is relatively simple to use, as it can be directly installed on equipment for punching, primarily serving a supporting and adsorption function. Simultaneously, with the continuous growth in market demand, higher requirements are being placed on the stability and efficiency of the processing. However, for processing more complex workpieces, such as green ceramic through-holes in the field of low-temperature co-fired ceramics / high-temperature co-fired ceramics (LTCC / HTCC), heat accumulation easily occurs at the contact surface between the laser beam on the ceramic sheet and the platform during laser processing, causing back-side ablation. Furthermore, the accumulation of heat can lead to softening and collapse of the processing platform, severely affecting the quality of laser processing. Utility Model Content

[0003] The purpose of this invention is to provide a laser processing platform to solve the technical problem that a large amount of heat can easily accumulate on the back of the workpiece during existing laser processing.

[0004] To achieve the above objectives, the technical solution adopted by this utility model is: to provide a laser processing platform, comprising:

[0005] A support platform is provided for accommodating parts to be cut and for mounting laser cutting components. The support platform includes a support frame, support members, and a support plate. The support frame is rectangular. There are multiple support members, each of which has a degree of freedom to move along a first horizontal direction and a second horizontal direction. The first horizontal direction is perpendicular to the second horizontal direction. The support members are used to support the support plate, which is used to support the parts to be cut. The support plate is provided with a cutout for discharging waste material.

[0006] In one possible implementation, the laser processing platform further includes a driving component, which includes a first lead screw guide mechanism and a second lead screw guide mechanism both disposed on the support frame. The second lead screw guide mechanism is disposed at the power output end of the first lead screw guide mechanism and is used to drive the second lead screw guide to move along the first horizontal direction. The laser cutting component is disposed at the power output end of the second lead screw guide mechanism.

[0007] In one possible implementation, the support platform further includes a first mounting rod and two first guide rods, both of which are disposed on the support frame. The two first guide rods extend along a first horizontal direction and are spaced apart along a second horizontal direction. The first mounting rod extends along the second horizontal direction. The two ends of the first mounting rod are respectively lockably connected to the two first guide rods, and the first mounting rod is movable along the first horizontal direction. The support member is lockably guided along the first horizontal direction and disposed on the first mounting rod.

[0008] In one possible implementation, the support platform further includes a second mounting rod and two second guide rods, both of which are disposed on the support frame. The second guide rods extend along a second horizontal direction and are spaced apart along a first horizontal direction. The second mounting rods extend along the first horizontal direction, and the two ends of the second mounting rods are respectively lockably connected to the two second guide rods. The second mounting rods are movable along the second horizontal direction, and the support member is lockably guided along the second horizontal direction by the second guide rods.

[0009] In one possible implementation, the support includes a foot, a first sliding sleeve, and a first locking bolt. There are multiple feet, each foot being evenly distributed on the top of the first sliding sleeve. The first sliding sleeve is slidably fitted onto the first mounting rod and the second mounting rod. The first locking bolt is adapted to the outer circumferential thread of the first sliding sleeve and can abut against the first mounting rod and the second mounting rod.

[0010] In one possible implementation, the support plate has a support area for supporting the part to be cut, the edge of the support area is located at the inner edge of the part to be cut and shaped, and the portion of the support plate outside the support area has a hollowed-out blanking hole.

[0011] Compared with existing technologies, the advantages of the laser processing platform provided by this utility model are as follows:

[0012] First, the various support components can be moved and combined to provide multiple support points at different positions according to the corresponding working conditions. This allows for the support of smaller or more perforated support plates, enabling the use of smaller support plates to support the workpiece to be cut. Furthermore, by using smaller support plates, this invention prevents the support plate from being cut simultaneously with the material, thus preventing the accumulation of excessive heat on the back of the workpiece. In addition, the perforations on the support plates facilitate the removal of waste generated during laser cutting. Second, when specific parts are not required to be processed, the support components can be moved to other positions to prevent them from obstructing the processing of other parts.

[0013] Furthermore, this invention can also drive the laser cutting component to move through the driving component, thereby improving the adaptability of this invention to various processing scenarios; the first guide rod and the first mounting rod in this invention can adjust the relative position of each support member in the support frame through their mutual matching, thereby adapting to support plates and parts to be cut of different sizes by adjusting the position of the support members.

[0014] In addition, this invention can also raise the height of the support plate by using support legs to prevent the laser from damaging the guide rod and mounting rod in this invention, so as to make the overall setting of the entire laser processing platform more reasonable.

[0015] In addition to the aforementioned beneficial effects, this utility model can also optimize the support area of ​​the support plate to allow waste generated during the part cutting process to fall more smoothly, and can prevent the support plate from being cut simultaneously during the laser cutting of the part. This helps to prevent the accumulation of a large amount of heat between the part to be cut and the platform, thereby preventing damage to the back surface and overall quality of the part.

[0016] Another objective of this invention is to provide a laser processing device, including the laser processing platform described above.

[0017] In one possible implementation, the laser processing equipment further includes a sealed box and a laser cutting assembly, wherein the support frame, the support member, the support plate, the part to be cut, and the laser cutting assembly are all disposed in the sealed box, which is filled with carbon dioxide.

[0018] Compared with the prior art, the present invention has all the advantages of the aforementioned laser processing platform. In addition, the present invention can prevent the laser cutting components from causing safety hazards to workers on site by setting a sealed box, and the carbon dioxide filling can prevent the parts to be cut from oxidizing, which is conducive to maintaining the quality of the finished parts. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. In the drawings:

[0020] Figure 1 A schematic diagram of the overall structure of the laser processing platform provided by this utility model;

[0021] Figure 2This is a schematic diagram showing the positional relationship between the support plate and the part to be cut in this utility model.

[0022] In the picture:

[0023] 1. Support platform; 11. Support frame; 12. Support component; 13. Support plate; 131. Material drop hole; 14. First guide rod; 15. First mounting rod; 16. Second guide rod; 17. Second mounting rod;

[0024] 2. Drive assembly; 21. First lead screw guide mechanism; 22. Second lead screw guide mechanism;

[0025] 3. Laser cutting components. Detailed Implementation

[0026] It should be noted that, unless otherwise specified, the embodiments and features described in these embodiments of the present invention can be combined with each other.

[0027] In the description of this utility model, it should be noted that if terms such as "upper", "lower", "inner", "back" or indicating orientation or positional relationship appear, they are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0028] Furthermore, in the description of this utility model, unless otherwise explicitly defined, the terms "installation," "connection," "joining," and "connector" should be interpreted broadly. For example, a connection can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, or it can be a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model in light of the specific circumstances.

[0029] To make the technical problems, technical solutions, and beneficial effects of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the present utility model.

[0030] Please refer to the following: Figure 1 and Figure 2The laser processing platform provided by this utility model will now be described. The laser processing platform includes a support platform 1. More specifically, the support platform 1 is used to accommodate the parts to be cut and to install the laser cutting assembly 3. The support platform 1 includes a support frame 11, support members 12, and a support plate 13. The support frame 11 is rectangular, and there are multiple support members 12. Each support member 12 has a degree of freedom to move along a first horizontal direction and a second horizontal direction. The first horizontal direction is perpendicular to the second horizontal direction. The support members 12 are used to support the support plate 13, and the support plate 13 is used to support the parts to be cut. The support plate 13 is provided with a hollow for discharging waste material.

[0031] Compared with the prior art, firstly, the various support members 12 in this embodiment can be matched and combined by their own movement to provide multiple support points at different positions according to the corresponding working conditions, thereby supporting support plates 13 with smaller size or more hollows. Thus, the smaller support plate 13 can support the workpiece to be cut. When a smaller support plate 13 can be used, this invention can prevent the support plate 13 from being cut at the same time during the material cutting process, thereby preventing the technical problem of a large amount of heat accumulating on the back of the workpiece. In addition, the hollows set on the support plate 13 are conducive to the discharge of waste generated by laser cutting. Secondly, when it is not necessary to process specific parts, this invention can also move the support member 12 to other positions to prevent the support member 12 from hindering the processing of other parts.

[0032] Based on the above embodiments, in order to drive the laser cutting assembly 3 to move, a preferred embodiment is proposed. The laser processing platform further includes a driving assembly 2, which includes a first lead screw guide mechanism 21 and a second lead screw guide mechanism 22, both disposed on the support frame 11. The second lead screw guide mechanism 22 is located at the power output end of the first lead screw guide mechanism 21 and is used to drive the second lead screw guide to move along a first horizontal direction. The laser cutting assembly 3 is located at the power output end of the second lead screw guide mechanism 22. This allows the laser cutting assembly 3 to move via the driving assembly 2, thereby improving the adaptability of this invention to various processing scenarios.

[0033] Regarding the connection between the support member 12 and the support frame 11, the support platform 1 also includes a first mounting rod 15 and two first guide rods 14, both of which are provided on the support frame 11. The two first guide rods 14 extend along a first horizontal direction and are spaced apart along a second horizontal direction. The first mounting rod 15 extends along the second horizontal direction. The two ends of the first mounting rod 15 are respectively lockably connected to the two first guide rods 14, and the first mounting rod 15 can move along the first horizontal direction. The support member 12 is lockably guided along the first horizontal direction and is provided on the first mounting rod 15. Similarly, the support platform 1 also includes second mounting rods 17 and two second guide rods 16, both of which are disposed on the support frame 11. The second guide rods 16 extend along a second horizontal direction, and the two second guide rods 16 are spaced apart along a first horizontal direction. The second mounting rods 17 extend along a first horizontal direction, and both ends of the second mounting rods 17 are lockably connected to the two second guide rods 16. The second mounting rods 17 are movable along the second horizontal direction, and the support member 12 is lockably guided along the second horizontal direction on the second guide rods 16. In this way, the first guide rods 14 and the first mounting rods 15 can adjust the relative positions of the support members 12 in the support frame 11 by matching the two, thereby adapting to support plates 13 and parts to be cut of different sizes by adjusting the position of the support members 12.

[0034] Based on the above embodiments, to prevent laser cutting from damaging the guide rod and mounting rod, a preferred embodiment is proposed. The support member 12 includes support feet, a first sliding sleeve, and a first locking bolt. Multiple support feet are evenly distributed on the top of the first sliding sleeve. The first sliding sleeve is slidably fitted onto the first mounting rod 15 and the second mounting rod 17. The first locking bolt is threaded to the outer circumference of the first sliding sleeve and can abut against the first mounting rod 15 and the second mounting rod 17. In this way, this embodiment can raise the height of the support plate 13 using the support feet, preventing laser damage to the guide rod and mounting rod in this invention, thus making the overall setup of the laser processing platform more reasonable.

[0035] A preferred embodiment is proposed, wherein the support plate 13 is provided with a support area for supporting the part to be cut, the edge of the support area is located at the inner edge of the part to be cut and formed, and the part of the support plate 13 outside the support area is provided with a hollowed-out material drop hole 131. By optimizing the support area of ​​the support plate 13, the waste generated during the part cutting process can fall more smoothly, and the support plate 13 can be prevented from being cut at the same time during the laser cutting of the part. This helps to prevent the accumulation of a large amount of heat between the part to be cut and the platform, thereby preventing damage to the back surface and overall quality of the part.

[0036] Based on the same inventive purpose, another objective of this utility model is to provide a laser processing device, including the laser processing platform mentioned above. Furthermore, a preferred embodiment is proposed, in which the laser processing device further includes a sealed box and a laser cutting assembly 3. The support frame 11, support member 12, support plate 13, part to be cut, and laser cutting assembly 3 are all housed within the sealed box, which is filled with carbon dioxide.

[0037] Compared with the prior art, the present invention has all the advantages of the laser processing platform mentioned above. In addition, the present invention can prevent the laser cutting component 3 from causing safety hazards to the workers on site by setting a sealed box, and the carbon dioxide filling can prevent the parts to be cut from oxidizing, which is conducive to maintaining the quality of the finished parts.

[0038] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A laser processing platform, characterized in that, include: A support platform (1) is used to accommodate the parts to be cut and to install the laser cutting assembly (3). The support platform (1) includes a support frame (11), support members (12) and a support plate (13). The support frame (11) is rectangular. There are multiple support members (12). Each support member (12) has a degree of freedom to move along a first horizontal direction and a second horizontal direction. The first horizontal direction is perpendicular to the second horizontal direction. The support member (12) is used to support the support plate (13). The support plate (13) is used to support the parts to be cut, and the support plate (13) is provided with a cutout for discharging waste.

2. The laser processing platform as described in claim 1, characterized in that, The laser processing platform further includes a drive assembly (2), which includes a first lead screw guide mechanism (21) and a second lead screw guide mechanism (22) both disposed on the support frame (11). The second lead screw guide mechanism (22) is disposed at the power output end of the first lead screw guide mechanism (21) and is used to drive the second lead screw guide to move along the first horizontal direction. The laser cutting assembly (3) is disposed at the power output end of the second lead screw guide mechanism (22).

3. The laser processing platform as described in claim 1, characterized in that, The support platform (1) further includes a first mounting rod (15) and two first guide rods (14) both disposed on the support frame (11). The two first guide rods (14) extend along a first horizontal direction and are spaced apart along a second horizontal direction. The first mounting rod (15) extends along the second horizontal direction. The two ends of the first mounting rod (15) are respectively lockably connected to the two first guide rods (14), and the first mounting rod (15) can move along the first horizontal direction. The support member (12) is lockably guided along the first horizontal direction and is provided on the first mounting rod (15).

4. The laser processing platform as described in claim 3, characterized in that, The support platform (1) further includes a second mounting rod (17) and two second guide rods (16) both disposed on the support frame (11). The second guide rods (16) extend along a second horizontal direction, and the two second guide rods (16) are arranged at intervals along a first horizontal direction. The second mounting rods (17) extend along a first horizontal direction. The two ends of the second mounting rods (17) are respectively lockably connected to the two second guide rods (16), and the second mounting rods (17) can move along the second horizontal direction. The support member (12) is lockably guided along the second horizontal direction and is provided on the second guide rods (16).

5. The laser processing platform as described in claim 4, characterized in that, The support member (12) includes a support foot, a first sliding sleeve and a first locking bolt. There are multiple support feet, and each support foot is evenly arranged on the top of the first sliding sleeve. The first sliding sleeve is slidably sleeved on the first mounting rod (15) and the second mounting rod (17). The first locking bolt is adapted to the outer circumferential thread of the first sliding sleeve, and the first locking bolt can abut against the first mounting rod (15) and the second mounting rod (17).

6. The laser processing platform as described in claim 1, characterized in that, The support plate (13) is provided with a support area for supporting the part to be cut. The edge of the support area is located on the inner edge of the part to be cut and formed. The part of the support plate (13) outside the support area is provided with a hollowed-out blanking hole (131).

7. A laser processing device, characterized in that, Includes the laser processing platform as described in any one of claims 1 to 6.

8. The laser processing equipment as described in claim 7, characterized in that, The laser processing equipment also includes a sealed box and a laser cutting assembly (3). The support frame (11), the support member (12), the support plate (13), the part to be cut, and the laser cutting assembly (3) are all located in the sealed box, which is filled with carbon dioxide.

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