High-strength welding structure of flexible flat cable and thermal printing head

Abstract

The utility model discloses a high-strength welding structure of a flexible flat cable and a thermal printing head, and relates to the field of printer flat cable fixation, the high-strength welding structure comprises the thermal printing head and the flexible flat cable, the flexible flat cable is welded and fixed at the top end of the thermal printing head, the flexible flat cable is of a three-layer design, the middle layer of the flexible flat cable is exposed and welded with the thermal printing head, and the middle layer of the flexible flat cable is welded with the thermal printing head. The thermal printing head comprises a printing head body and a bonding pad, the bonding pad is fixed to the rear side of the top end of the printing head body, the flexible flat cable comprises a circuit board body, a first square PI film opening, a copper foil opening and a second square PI film opening, the first square PI film opening is formed in the top end of the circuit board body, and the second square PI film opening is formed in the bottom end of the circuit board body. According to the high-strength welding structure of the flexible flat cable and the thermal printing head provided by the utility model, the design that the two surfaces of the copper foil layer located at the middle layer are exposed can be adsorbed at the bonding pad of the thermal printing head through soldering tin, so that the overall anti-pulling strength and stability are greatly improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the field of printer wire fixing, and specifically relates to a high-strength welding structure of flexible wire and thermal print head. BACKGROUND

[0002] In a thermal printer, flexible wire plays a crucial role. It is not only a bridge connecting the thermal print head and the mainboard or other circuit components, but also the key to ensuring stable transmission of printing signals. With its soft, thin, and lightweight characteristics, flexible wire can adapt to the complex and compact structure layout inside the printer, effectively delivering the printing instructions received by the thermal print head to the mainboard or other related circuit components.

[0003] With the intense competition in the thermal printing market, the market demands higher quality for thermal printers, and the price of thermal printers is constantly being lowered, which puts higher and higher requirements on the production efficiency and stability of the core. As an important link in the production of thermal printers, the welding strength, efficiency, and yield of the thermal print head and flexible wire greatly affect the quality and manufacturing cost of the printer. Therefore, the welding efficiency and stability of the thermal print head have always been a major problem in the manufacturing process of thermal printers. SUMMARY

[0004] To achieve the above-mentioned purpose, the utility model provides the following technical scheme: a high-strength welding structure of flexible wire and thermal print head, comprising a thermal print head and a flexible wire, the flexible wire is welded and fixed at the top end of the thermal print head, the flexible wire is designed in three layers, and the middle layer of the flexible wire is exposed and welded with the thermal print head.

[0005] Preferably, the thermal print head comprises a print head body and a pad, and the pad is fixed at the top end of the back side of the print head body.

[0006] Preferably, the flexible wire comprises a circuit board body, a first square PI film opening, a copper foil opening, and a second square PI film opening, the first square PI film opening is opened at the top end of the circuit board body, the second square PI film opening is opened at the bottom end of the circuit board body, the copper foil opening is opened through the middle section of the circuit board body, and the first square PI film opening, the copper foil opening, and the second square PI film opening are provided with a plurality of groups and correspond one-to-one to the pads.

[0007] Preferably, the circuit board body comprises an upper PI film, a copper foil layer, and a lower PI film, the upper PI film is adhesively fixed at the top end of the copper foil layer, and the lower PI film is adhesively fixed at the bottom end of the copper foil layer.

[0008] Preferably, the first square PI film opening is formed through the upper PI film, the copper foil opening is formed through the copper foil layer, and the second square PI film opening is formed through the lower PI film.

[0009] Preferably, the second square PI film opening and the second square PI film opening are of the same size and are larger than the copper foil opening.

[0010] Compared with the prior art, the present application has the following beneficial effects:

[0011] The double-face exposed design of the copper foil layer in the middle layer can be adsorbed on the solder pad of the thermal printing head through soldering, thereby greatly improving the overall tensile strength and stability. BRIEF DESCRIPTION OF DRAWINGS

[0012] The present application will be further described below in conjunction with the drawings:

[0013] Figure 1 The present application is a high-strength welding structure of a flexible flat cable and a thermal printing head Figure One ;

[0014] Figure 2 The present application is a high-strength welding structure of a flexible flat cable and a thermal printing head Figure Two ;

[0015] Figure 3 The present application is a high-strength welding structure of a flexible flat cable and a thermal printing head

[0016] Figure 4 The present application is a high-strength welding structure of a flexible flat cable and a thermal printing head

[0017] As shown in the drawings: 1, thermal printing head; 11, printing head body; 12, solder pad; 2, flexible flat cable; 21, circuit board body; 211, upper PI film; 212, copper foil layer; 213, lower PI film; 22, first square PI film opening; 23, copper foil opening; 24, second square PI film opening. DETAILED DESCRIPTION

[0018] In order to more clearly illustrate the overall concept of the present application, the following will be described in conjunction with the drawings in an exemplary manner.

[0019] It should be noted that in the following description, many specific details are set forth in order to provide a thorough understanding of the present application, however, the present application can also be implemented in other ways different from those described herein, therefore, the scope of protection of the present application is not limited by the specific embodiments disclosed below.

[0020] In addition, in the description of the utility model, it needs to be understood that the orientation or position relationship indicated by the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "axial", "radial", "circumferential" and the like is based on the orientation or position relationship shown in the drawings, and is only for the convenience of describing the utility model and simplifying the description, and therefore cannot be understood as a limitation on the utility model.

[0021] In the utility model, unless otherwise explicitly specified and limited, the terms "mounting", "connection", "connecting", "fixing" and the like should be understood in a broad sense, for example, can be fixed connection, or can be detachable connection, or can be integrated; can be directly connected, or can be indirectly connected through an intermediate medium, or can be the communication or interaction relationship between two elements. However, it is noted that direct connection means that the connection between the two main bodies does not form a connection relationship through an excessive structure, but is connected to form a whole only through a transmission structure. For ordinary skilled persons in the art, the specific meaning of the above terms in the utility model can be understood according to the specific circumstances.

[0022] In the utility model, unless otherwise explicitly specified and limited, the first feature "on" or "under" the second feature can be direct contact between the first and second features, or indirect contact between the first and second features through an intermediate medium. In the description of the specification, the description of the reference terms "one embodiment", "some embodiments", "example", "specific example" or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In the specification, the illustrative description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0023] Please refer to Figures 1 to 4 The utility model provides a kind of technical scheme: a high-strength welding structure of flexible flat cable and thermal printing head, including thermal printing head 1 and flexible flat cable 2, flexible flat cable 2 is welded and fixed at the top end of thermal printing head 1, flexible flat cable 2 is three-layer design, and the middle layer of flexible flat cable 2 is exposed and welded with thermal printing head 1;

[0024] The design that copper foil layer 212 double-face exposed located in middle layer can be simultaneously absorbed at the soldering pad 12 of thermal printing head 1 by soldering, greatly improve the overall tensile strength and stability;

[0025] The thermal sensitive print head 1 comprises a print head body 11 and a solder pad 12 fixed at the rear side of the top end of the print head body 11.

[0026] The flexible flat cable 2 comprises a circuit board body 21, a first square PI film opening 22, a copper foil opening 23 and a second square PI film opening 24, the first square PI film opening 22 is arranged at the top end of the circuit board body 21, the second square PI film opening 24 is arranged at the bottom end of the circuit board body 21, the copper foil opening 23 is arranged through the middle section of the circuit board body 21, the first square PI film opening 22, the copper foil opening 23 and the second square PI film opening 24 are arranged in multiple groups and correspond to the solder pad 12 one by one.

[0027] The circuit board body 21 comprises an upper PI film 211, a copper foil layer 212 and a lower PI film 213, the upper PI film 211 is fixedly bonded at the top end of the copper foil layer 212, and the lower PI film 213 is fixedly bonded at the bottom end of the copper foil layer 212.

[0028] The first square PI film opening 22 is arranged through the upper PI film 211, the copper foil opening 23 is arranged through the copper foil layer 212, and the second square PI film opening 24 is arranged through the lower PI film 213.

[0029] The second square PI film opening 24 and the second square PI film opening 24 are of the same size and are larger than the copper foil opening 23.

[0030] The copper foil opening 23 can be circular or other shapes, tin can be added from the outside and infiltrate into the solder pad 12 of the soldered thermal sensitive print head 1 through the copper foil opening 23, realizing soldering at the same time, the copper foil layer 212 leaked from the first square PI film opening 22 and the second square PI film opening 24 of the flexible flat cable 2 is adsorbed by the tin, and the soldering strength is higher than that of the traditional single-sided copper foil soldering.

[0031] At the same time, when the upper PI film 211 and the lower PI film 213 are both windowed, whether the tin is added from the outside or the tin bead brought by the solder pad 12 of the thermal sensitive print head 1, the flexible flat cable 2 is directly pressed in, and the soldering and heat conduction can be easily realized, thereby improving the soldering efficiency and stability.

[0032] It should be understood by those of ordinary skill in the art that the above discussion of any embodiment is only exemplary and is not intended to imply that the scope of the present application includes the claims limited to these examples; under the idea of the present application, the above embodiments or technical features in different embodiments can also be combined, the steps can be implemented in any order, and there are many other changes of different aspects of the present application as described above, which are not provided in detail for the sake of brevity.

[0033] The present application is intended to cover all such alternatives, modifications, and variations that fall within the broad scope of the appended claims. Accordingly, any and all such alternations, modifications, equivalents, improvements and the like are intended to be encompassed by the present application.

Claims

1. A high strength solder structure of a flexible flat cable and a thermal printhead, characterized by: The application relates to a thermal printing head (1) and a flexible flat cable (2) welded to the top end of the thermal printing head (1), wherein the flexible flat cable (2) is designed in three layers, and the middle layer of the flexible flat cable (2) is exposed and welded to the thermal printing head (1).

2. The high-strength solder structure of a flexible flat cable and a thermal printhead according to claim 1, characterized in that: The thermal printing head (1) comprises a printing head body (11) and a solder pad (12) fixed to the top end of the rear side of the printing head body (11).

3. The high-strength solder structure of a flexible flat cable and a thermal printhead according to claim 2, wherein: The flexible flat cable (2) comprises a circuit board body (21), a first square PI film opening (22), a copper foil opening (23) and a second square PI film opening (24), wherein the first square PI film opening (22) is arranged at the top end of the circuit board body (21), the second square PI film opening (24) is arranged at the bottom end of the circuit board body (21), the copper foil opening (23) is arranged through the middle section of the circuit board body (21), and the first square PI film opening (22), the copper foil opening (23) and the second square PI film opening (24) are arranged in multiple groups and correspond to the solder pad (12) one by one.

4. The high-strength solder structure of a flexible flat cable and a thermal printhead according to claim 3, wherein: The circuit board body (21) comprises an upper PI film (211), a copper foil layer (212) and a lower PI film (213), wherein the upper PI film (211) is adhesively fixed to the top end of the copper foil layer (212), and the lower PI film (213) is adhesively fixed to the bottom end of the copper foil layer (212).

5. The high-strength soldered structure of a flexible flat cable and a thermal printhead according to claim 4, wherein: The first square PI film opening (22) is arranged through the upper PI film (211), the copper foil opening (23) is arranged through the copper foil layer (212), and the second square PI film opening (24) is arranged through the lower PI film (213).

6. The high-strength solder structure of a flexible flat cable and a thermal printhead according to claim 5, wherein: The second square PI film opening (24) and the second square PI film opening (24) have the same size and are larger than the copper foil opening (23).

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