Semiconductor dehumidification module

Abstract

A semiconductor dehumidification module comprises a semiconductor refrigerator and a cold end heat exchanger, the cold end heat exchanger is arranged at the cold end of the semiconductor refrigerator, the semiconductor dehumidification module further comprises a temperature equalizing plate, the temperature equalizing plate is arranged on the cold end heat exchanger in a sleeving mode, and a plurality of heat exchange channels used for storing refrigerants are arranged in the temperature equalizing plate; the uniform temperature plate comprises a plurality of deformable heat exchange tubes which are arranged in the width direction of the uniform temperature plate, and the heat exchange channels are arranged in the heat exchange tubes. According to the semiconductor dehumidification module, the temperature equalizing plate is arranged, the temperature equalizing plate is arranged on the cold end heat exchanger in a sleeving mode, the multiple heat exchange channels used for storing refrigerants are arranged in the temperature equalizing plate, when airflow passes through the cold end heat exchanger, the refrigerants in the heat exchange channels are used for heat exchange, and the condensation effect of the cold end heat exchanger on water vapor in the airflow can be improved; and more water vapor in the airflow is cooled and condensed into liquid water, so that the dehumidification effect of the semiconductor dehumidification module is improved, and the user experience is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to dehumidifier technical field, especially a kind of semiconductor dehumidification module. BACKGROUND

[0002] Chinese patent document No.CN119164024A was published on December 20, 2024, which discloses a semiconductor dehumidification device, comprising a casing, a semiconductor refrigerator arranged in the casing, a cold-end heat exchanger and a hot-end heat exchanger. The cold-end heat exchanger and the hot-end heat exchanger are arranged at the cold end and the hot end of the semiconductor refrigerator respectively. The opposite sides of the casing are respectively provided with an air inlet and an air outlet. The cold-end heat exchanger has a cold-end flow channel arranged along a straight line. The cold-end flow channel and the upper side wall of the casing form a cold-end air duct. The hot-end heat exchanger has a hot-end flow channel arranged along a straight line. The hot-end flow channel and the lower side wall of the casing form a hot-end air duct. Air flows into the cold-end air duct and the hot-end air duct from the air inlet in a straight line direction. The air in the cold-end air duct and the hot-end air duct flows out of the air outlet in a straight line direction. When the air flows through the cold-end flow channel of the cold-end heat exchanger, the water vapor in the air is cooled and condensed into liquid water, achieving air dehumidification. However, this dehumidification method has general dehumidification effect, and there are still a lot of water vapor in the air that has not been condensed.

[0003] Therefore, it is necessary to make further improvements. UTILITY MODEL CONTENTS

[0004] The utility model aims to provide a semiconductor dehumidification module with simple structure, good condensation effect, good dehumidification effect, good user experience and strong practicality, to overcome the shortcomings of the prior art.

[0005] A semiconductor dehumidification module designed for this purpose comprises a semiconductor refrigerator and a cold-end heat exchanger. The cold-end heat exchanger is arranged at the cold end of the semiconductor refrigerator. The semiconductor dehumidification module further comprises a uniform temperature plate, which is sleeved on the cold-end heat exchanger. The uniform temperature plate is provided with a plurality of heat exchange channels for storing refrigerant.

[0006] The uniform temperature plate comprises a plurality of heat exchange pipes arranged along the width direction of the uniform temperature plate and deformable. The heat exchange channels are arranged in the heat exchange pipes.

[0007] A first side portion is arranged on the uniform temperature plate, which is located between the cold end of the semiconductor refrigerator and the cold-end heat exchanger.

[0008] A fracture is arranged on the uniform temperature plate, so that the heat exchange channels are arranged in a disconnected manner.

[0009] An installation opening is arranged on the uniform temperature plate. The uniform temperature plate is sleeved on the cold-end heat exchanger through the installation opening. The cold-end heat exchanger is arranged in the installation opening.

[0010] The uniform temperature plate is made of aluminum material and is bendable.

[0011] The heat end heat exchanger is arranged at the heat end of the semiconductor refrigerator, and one side of the heat end heat exchanger is provided with a heat dissipation fan.

[0012] The mounting bracket is further arranged, and the heat end heat exchanger is mounted on the inner cavity of the mounting bracket, and the cold end heat exchanger is located outside the mounting bracket.

[0013] The cold end heat exchanger comprises a fixing plate and cold end heat exchange fins distributed transversely on one side of the fixing plate, the fixing plate is fixed on the heat end heat exchanger, and adjacent two cold end heat exchange fins and the fixing plate form a cold end flow channel for airflow passing.

[0014] One side of the mounting bracket is provided with a water collecting groove, and the water collecting groove is located below the cold end heat exchanger.

[0015] The semiconductor dehumidification module of the utility model is provided with the uniform temperature plate, the uniform temperature plate is sleeved on the cold end heat exchanger, the uniform temperature plate is provided with a plurality of heat exchange channels for storing refrigerant, the refrigerant in the heat exchange channels is used for heat exchange when the airflow passes through the cold end heat exchanger, the condensation effect of the cold end heat exchanger on the water vapor in the airflow can be improved, more water vapor in the airflow is cooled and condensed into liquid water, and the dehumidification effect of the semiconductor dehumidification module is improved, and the experience of the user is improved. BRIEF DESCRIPTION OF DRAWINGS

[0016] Figure 1 It is the overall structure schematic view of the dehumidification module in an embodiment of the utility model.

[0017] Figure 2 It is the overall structure schematic view of the dehumidification module in an embodiment of the utility model.

[0018] Figure 3 It is the sectional view of the dehumidification module in an embodiment of the utility model.

[0019] Figure 4 It is the exploded structure schematic view of the dehumidification module in an embodiment of the utility model.

[0020] Figure 5 It is the sectional view of the uniform temperature plate in an embodiment of the utility model.

[0021] Figure 6 It is the overall structure schematic view of the uniform temperature plate in an embodiment of the utility model.

[0022] Figure 7 It is the overall structure schematic view of the cold end heat exchanger in an embodiment of the utility model. DETAILED DESCRIPTION

[0023] The utility model will be further described in combination with the drawings and embodiments.

[0024] Referring to Figures 1-7 The semiconductor dehumidification module comprises a semiconductor refrigerator 1 and a cold end heat exchanger 2 arranged at the cold end of the semiconductor refrigerator 1, the semiconductor refrigerator 1 is a semiconductor refrigerating sheet, and further comprises a uniform temperature plate 3 sleeved on the cold end heat exchanger 2, the uniform temperature plate 3 is provided with a plurality of heat exchange channels 4 for storing refrigerants, and the refrigerants in the heat exchange channels 4 are used for heat exchange with the cold end heat exchanger 2, so as to improve the condensation effect of the cold end heat exchanger 2 on water vapor in the airflow. In addition, the uniform temperature plate 3 can uniformly distribute heat, so that the water vapor in the airflow can be fully heat exchanged.

[0025] The uniform temperature plate 3 comprises a plurality of heat exchange pipes 5 arranged along the width direction of the uniform temperature plate 3 and deformable, and the heat exchange channels 4 are arranged in the heat exchange pipes 5; the heat exchange channels 4 are micro-channels, the heat exchange pipes 5 can be deformed and bent, and can be infinitely extended along the length direction, so that the heat exchange pipes 5 can form different lengths, so that the uniform temperature plate 3 can form different lengths, and the arrangement of the heat exchange pipes 5 along the width direction can also be infinitely extended, so that the uniform temperature plate 3 can form different widths, so that the uniform temperature plate 3 can be adapted to cold end heat exchangers 2 of different specifications; the heat exchange pipes 5 can be integrally welded.

[0026] The uniform temperature plate 3 is provided with a first side portion 6 between the cold end of the semiconductor refrigerator 1 and the cold end heat exchanger 2, the cold end of the semiconductor refrigerator 1 first exchanges heat with the refrigerant in the uniform temperature plate 3, and then the refrigerant in the uniform temperature plate 3 exchanges heat with the cold end heat exchanger 2.

[0027] The uniform temperature plate 3 is provided with a break 7 to disconnect the heat exchange channels 4.

[0028] The uniform temperature plate 3 is provided with a mounting opening 8, the uniform temperature plate 3 is sleeved on the cold end heat exchanger 2 through the mounting opening 8, and the cold end heat exchanger 2 is arranged on the mounting opening 8; the uniform temperature plate 3 is welded on the semiconductor refrigerator 1 or the cold end heat exchanger 2.

[0029] The uniform temperature plate 3 is made of aluminum material and can be bent, the uniform temperature plate 3 is arranged in a circle and is partially bent, so as to improve the heat exchange area of the uniform temperature plate 3, and further improve the condensation effect on water vapor in the airflow.

[0030] Further comprising a hot end heat exchanger 9 arranged at the hot end of the semiconductor refrigerator 1, one side of the hot end heat exchanger 9 is provided with a cooling fan 10, and the hot end heat exchanger 9 and the cooling fan 10 can discharge the heat at the hot end of the semiconductor refrigerator 1, thereby improving the refrigeration efficiency of the semiconductor refrigerator 1.

[0031] The hot end heat exchanger 9 is vertically distributed with a plurality of hot end heat exchange sheets 18.

[0032] It also includes a mounting bracket 11, with the hot-end heat exchanger 9 mounted on the inner cavity 12 of the mounting bracket 11, and the cold-end heat exchanger 2 and the cooling fan 10 located outside the mounting bracket 11; the hot-end heat exchanger 9, the cooling fan 10 and the semiconductor cooler 1 are fixed on the mounting bracket 11, and the mounting bracket 11 is fixed on the body of the dehumidifier.

[0033] The cold end heat exchanger 2 includes a fixed plate 13 and cold end heat exchange plates 14 laterally distributed on one side of the fixed plate 13. The cold end heat exchange plates 14 are integrally formed with the fixed plate 13. The fixed plate 13 is fixed to the hot end heat exchanger 9 by screws. A cold end flow channel 15 is formed between two adjacent cold end heat exchange plates 14 and the fixed plate 13 for airflow to pass through. When the airflow passes through the cold end flow channel 15, it exchanges heat with the cold end heat exchanger 2, thereby cooling and condensing the water vapor in the airflow into liquid water.

[0034] A water receiving tank 16 is provided on one side of the mounting bracket 11. The water receiving tank 16 is located below the cold end heat exchanger 2. The water receiving tank 16 is used to collect the liquid water formed by the cooling and condensation of water vapor in the airflow. A drain hole 17 is provided in the middle of the water receiving tank 16 for draining the liquid water.

[0035] The table below compares the dehumidification capacity of the dehumidification module in this embodiment with that of a traditional dehumidification module:

[0036]

[0037] As can be seen from the table above, with the same cooling chip power, the dehumidification capacity of the dehumidification module in this embodiment is greater than that of the traditional dehumidification module.

[0038] The above describes the preferred embodiments of this utility model, illustrating and describing its basic principles, main features, and advantages. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made without departing from the spirit and scope of this utility model, and all such changes and modifications fall within the scope of the claims. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. A semiconductor dehumidification module, comprising a semiconductor cooler (1) and a cold-end heat exchanger (2), wherein the cold-end heat exchanger (2) is disposed at the cold end of the semiconductor cooler (1), characterized in that: It also includes a heat exchange plate (3), which is fitted on the cold end heat exchanger (2). The heat exchange plate (3) has several heat exchange channels (4) for storing refrigerant.

2. The semiconductor dehumidification module according to claim 1, characterized in that: The heat exchange plate (3) includes several heat exchange tubes (5) arranged along the width direction of the heat exchange plate (3) and deformable, and the heat exchange channel (4) is set inside the heat exchange tubes (5).

3. The semiconductor dehumidification module according to claim 2, characterized in that: The temperature distribution plate (3) is provided with a first side (6), which is located between the cold end of the semiconductor cooler (1) and the cold end heat exchanger (2).

4. The semiconductor dehumidification module according to claim 3, characterized in that: The heat exchange plate (3) is provided with a break (7) so that the heat exchange channel (4) is disconnected.

5. The semiconductor dehumidification module according to claim 3, characterized in that: The temperature distribution plate (3) is provided with an installation port (8). The temperature distribution plate (3) is fitted onto the cold end heat exchanger (2) through the installation port (8). The cold end heat exchanger (2) is installed through the installation port (8).

6. The semiconductor dehumidification module according to claim 3, characterized in that: The heat spreader (3) is made of aluminum and can be bent.

7. The semiconductor dehumidification module according to claim 1, characterized in that: It also includes a hot-end heat exchanger (9), which is located at the hot end of the semiconductor cooler (1), and a cooling fan (10) is provided on one side of the hot-end heat exchanger (9).

8. The semiconductor dehumidification module according to claim 7, characterized in that: It also includes a mounting bracket (11), a hot-end heat exchanger (9) mounted on the inner cavity (12) of the mounting bracket (11), and a cold-end heat exchanger (2) located outside the mounting bracket (11).

9. The semiconductor dehumidification module according to claim 8, characterized in that: The cold end heat exchanger (2) includes a fixed plate (13) and cold end heat exchange plates (14) laterally distributed on one side of the fixed plate (13). The fixed plate (13) is fixed on the hot end heat exchanger (9). A cold end flow channel (15) for airflow is formed between two adjacent cold end heat exchange plates (14) and the fixed plate (13).

10. The semiconductor dehumidification module according to claim 9, characterized in that: A water receiving trough (16) is provided on one side of the mounting bracket (11), and the water receiving trough (16) is located below the cold end heat exchanger (2).

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