Metal penetrating ultrasonic sensor additionally provided with sound matching layer

Abstract

The utility model relates to the field of ultrasonic sensors, and discloses a metal penetration ultrasonic sensor additionally provided with a sound matching layer, which comprises a shell, the sound matching layer and a coupling layer, and a chip, a sound absorption board and a circuit board are arranged in an inner cavity of the shell; the top of the sound matching layer is adhered to the bottom of the shell, and the sound matching layer is made of a soft material; and the top of the coupling layer is adhered to the bottom of the sound matching layer. The beneficial effects of the utility model are that the sound matching layer made of the soft material is arranged between the bottom surface of the ultrasonic sensor and the coupling layer, and the sound matching layer can effectively buffer the adverse effect of the coupling layer on the vibration of the sensor, so that the ultrasonic sensor vibrates in a relatively free state, and the normal vibration frequency and vibration amplitude of the ultrasonic sensor are maintained as far as possible; it is ensured that distance measurement of the ultrasonic sensor is sufficient in the actual distance measurement process so that application scenes related to vehicle door distance measurement can be met, and the distance measurement precision requirement and the distance measurement range requirement can be met.

Description

Technical Field

[0001] This utility model relates to the field of ultrasonic sensors, and specifically to a metal-penetrating ultrasonic sensor with an added acoustic matching layer. Background Technology

[0002] The ranging function of an ultrasonic sensor is based on the time difference between the transmission and reception of ultrasonic signals. The ultrasonic signal emitted by the ultrasonic sensor has a stable and sufficient frequency and amplitude. When the signal encounters a target object, it is reflected back. The sensor can accurately receive the reflected signal and, based on the time interval between transmission and reception, combined with the speed of ultrasonic waves in the air, accurately calculate the distance to the target object.

[0003] Currently, the working surface of the ultrasonic sensor used in car doors is bonded to one side of the coupling layer, while the other side of the coupling layer is directly assembled to the inner surface of the door. However, when the coupling layer is bonded to the ultrasonic working surface, it suppresses the vibration of the ultrasonic sensor to a certain extent, reducing the frequency and amplitude of the ultrasonic sensor. A lower frequency may lead to a decrease in signal resolution during propagation, making it difficult to accurately distinguish small targets at close range. A lower amplitude directly affects the signal propagation distance and intensity, making the reflected signal weak, or even unable to be effectively received by the ultrasonic sensor at long distances. Both of these situations result in insufficient ranging by the ultrasonic sensor in actual ranging operations, failing to meet the ranging accuracy and range requirements of car door-related applications (such as automatic door opening distance control and collision avoidance detection). Utility Model Content

[0004] The technical problem this invention aims to solve is that when measuring distances on car doors, the coupling layer is in direct and close contact with the working surface of the ultrasonic sensor, which suppresses the vibration of the ultrasonic sensor to a certain extent. This results in insufficient distance measurement during actual distance measurement, failing to meet the requirements of distance measurement applications related to car doors. The purpose is to provide a metal-penetrating ultrasonic sensor with an added acoustic matching layer. A soft acoustic matching layer is provided between the bottom surface of the ultrasonic sensor and the coupling layer to ensure that the ultrasonic sensor has a normal vibration frequency and amplitude, so that the ultrasonic sensor has sufficient distance measurement in actual distance measurement to meet the application scenarios of car door distance measurement.

[0005] This utility model is achieved through the following technical solution:

[0006] A metal-penetrating ultrasonic sensor with an added acoustic matching layer includes a housing, an acoustic matching layer, and a coupling layer. The inner cavity of the housing is equipped with a chip, a sound-absorbing plate, and a circuit board. The top of the acoustic matching layer is bonded to the bottom of the housing, and the acoustic matching layer is made of a soft material. The top of the coupling layer is bonded to the bottom of the acoustic matching layer.

[0007] The beneficial effects of this utility model are that by setting an acoustic matching layer and attaching the top of the acoustic matching layer to the bottom of the housing, and attaching the top of the coupling layer to the bottom of the acoustic matching layer, a soft acoustic matching layer is formed between the bottom surface (working surface) of the ultrasonic sensor and the coupling layer. The soft material properties of the acoustic matching layer give it good elasticity and compliance, which can effectively buffer the adverse effects of the coupling layer on the sensor vibration, allowing the ultrasonic sensor to vibrate in a relatively free state, maintaining its normal vibration frequency and amplitude as much as possible. This replaces the direct and tight contact (hard connection) between the coupling layer and the working surface of the ultrasonic sensor, ensuring that the ultrasonic sensor has sufficient distance measurement in the actual distance measurement process to meet the application scenarios related to vehicle door distance measurement (such as automatic sensing door opening distance control, collision avoidance detection, etc.), and to meet the distance measurement accuracy and range requirements.

[0008] In some embodiments, the outer casing is generally cylindrical, and the inner cavity of the outer casing is provided with an elliptical cylindrical mounting groove for mounting the chip, sound-absorbing panel, and circuit board. The mounting groove facilitates the positioning of the chip, sound-absorbing panel, and circuit board.

[0009] In some embodiments, the chip, sound-absorbing plate, and circuit board are sequentially mounted in a mounting slot from bottom to top, and the chip and the circuit board are connected by leads. By providing leads to electrically connect the chip and the circuit board, signal transmission and acquisition are achieved.

[0010] In some embodiments, a first recessed platform is provided on the top of the side wall of the mounting groove, and two first recessed platforms are respectively located on both sides of the mounting groove, with the bottom of the first recessed platform being higher than the top of the circuit board. By providing first recessed platforms on both side walls of the mounting groove, it is convenient for operators to smoothly install the chip, sound-absorbing plate, and circuit board into the mounting groove, and the bottom of the first recessed platform being higher than the top of the circuit board facilitates the protection of the circuit board placed in the mounting groove.

[0011] In some embodiments, a second recess is provided on the front side of the chip, and the negative electrode of the chip is located within the second recess. By providing a second recess on the front side of the chip and placing the negative electrode within the second recess, it is easier for operators to identify the negative electrode soldering position through the second recess during soldering, thus preventing incorrect installation of the positive and negative electrodes.

[0012] In some embodiments, the device further includes a double-stranded cable and a plug, with the two ends of the double-stranded cable connected to a circuit board and the plug, respectively.

[0013] In some embodiments, a third recessed platform is provided on the outer side of the housing, and two third recessed platforms are symmetrically arranged along the axis of the housing. By providing symmetrical third recessed platforms on the outer side of the housing, it is convenient for the clamp to clamp against the side wall of the third recessed platform during installation, increasing the contact area at the clamping point and preventing the housing from rotating, thus ensuring the stability of the housing positioning.

[0014] In some embodiments, a sound-absorbing panel is further included. The sound-absorbing panel is generally elliptical in shape and is made of foam or fiberglass. By providing a sound-absorbing layer, the noise and interference generated by the ultrasonic sensor during operation are absorbed, thereby reducing the impact of this noise on the sensor's detection accuracy.

[0015] In some embodiments, the bottom surface of the housing is knurled, or the surface roughness Ra of the bottom surface is 6.3. By providing knurling on the bottom surface of the housing, or by having the surface roughness Ra of the bottom surface be 6.3, it is easier to improve the adhesion strength with the sound matching layer.

[0016] In some embodiments, the acoustic matching layer is made of silicone rubber. By utilizing the adhesive and highly elastic properties of silicone rubber, an acoustic matching layer of a certain thickness is formed by bonding the coupling layer to the bottom of the housing. This prevents the coupling layer from suppressing the vibration of the ultrasonic sensor and ensures that the ultrasonic sensor has normal vibration frequency and amplitude.

[0017] Compared with the prior art, this utility model has the following advantages and beneficial effects:

[0018] 1. A soft acoustic matching layer is provided between the bottom surface (working surface) of the ultrasonic sensor and the coupling layer. The soft material properties of the acoustic matching layer give it good elasticity and compliance, which can effectively buffer the adverse effects of the coupling layer on the sensor vibration. It allows the sensor to vibrate in a relatively free state, maintaining its normal vibration frequency and amplitude as much as possible. Instead of the coupling layer directly and closely contacting the working surface of the ultrasonic sensor, it ensures that the ultrasonic sensor has sufficient ranging capability in actual ranging processes to meet the application scenarios related to vehicle door ranging (such as automatic sensing door opening distance control, collision avoidance detection, etc.) and achieve the required ranging accuracy and range.

[0019] 2. By providing knurling on the bottom surface of the outer shell, or by having a surface roughness Ra of 6.3 on the bottom surface, the bonding strength with the sound matching layer can be improved.

[0020] 3. Utilizing the high viscosity and elasticity of silicone rubber, an acoustic matching layer of a set thickness is formed by bonding the coupling layer to the bottom of the outer shell. This prevents the coupling layer from suppressing the vibration of the ultrasonic sensor and ensures that the ultrasonic sensor has normal vibration frequency and amplitude.

[0021] 4. By setting a second recess on the front of the chip and placing the negative electrode of the chip inside the second recess, it is easier for operators to identify the negative electrode welding position through the second recess during soldering, thus preventing incorrect installation of the positive and negative electrodes. Attached Figure Description

[0022] The accompanying drawings, which are included to provide a further understanding of the embodiments of the present invention and form part of this application, do not constitute a limitation thereof. In the drawings:

[0023] Figure 1 This is an exploded view of the present invention;

[0024] Figure 2 This is a structural diagram of the outer shell in this utility model;

[0025] Figure 3 This is another structural view of the outer shell in this utility model;

[0026] Figure 4 This is a structural diagram of the chip in this utility model.

[0027] The attached diagram shows the markings and corresponding component names:

[0028] Coupling layer 10, sound matching layer 20, housing 30, first recessed platform 301, third recessed platform 302, mounting groove 303, knurling 304, chip 31, second recessed platform 311, lead wire 32, circuit board 33, double flexible wire 34, plug 35, sound-absorbing plate 36. Detailed Implementation

[0029] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the embodiments and accompanying drawings. The illustrative embodiments and descriptions of this utility model are only used to explain this utility model and are not intended to limit this utility model.

[0030] Throughout this specification, references to "an embodiment," "an example," or "an example" mean that a particular feature, structure, or characteristic described in connection with that embodiment or example is included in at least one embodiment of the present invention. Therefore, the phrases "an embodiment," "an example," "an example," or "an example" appearing in various places throughout the specification do not necessarily refer to the same embodiment or example. Furthermore, specific features, structures, or characteristics can be combined in one or more embodiments or examples in any suitable combination and / or sub-combination. Moreover, those skilled in the art will understand that the illustrations provided herein are for illustrative purposes and are not necessarily drawn to scale. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0031] In the description of this utility model, the terms "front", "rear", "left", "right", "up", "down", "vertical", "horizontal", "high", "low", "inner", and "outer" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting the scope of protection of this utility model.

[0032] The terms "first," "second," etc., used in this utility model are merely for clarity of description and are not intended to limit any order or emphasize importance. Furthermore, the term "connection" as used herein, unless otherwise specified, can refer to a direct connection or an indirect connection via other components.

[0033] Example

[0034] See Figures 1-4 This embodiment provides a metal-penetrating ultrasonic sensor with an added acoustic matching layer 20, including a housing 30, an acoustic matching layer 20, and a coupling layer 10. A chip 31, a sound-absorbing plate 36, and a circuit board 33 are installed inside the housing 30. The top of the acoustic matching layer 20 is bonded to the bottom of the housing 30, and the acoustic matching layer 20 is made of a soft material. The top of the coupling layer 10 is bonded to the bottom of the acoustic matching layer 20. The soft acoustic matching layer 20, located between the bottom surface of the ultrasonic sensor and the coupling layer 10, ensures that the ultrasonic sensor has a normal vibration frequency and amplitude, making the distance measurement sufficient for actual distance measurement applications, thus meeting the requirements of vehicle door distance measurement.

[0035] See Figures 1-3The outer shell 30 is generally cylindrical, and its inner cavity is provided with an elliptical cylindrical mounting groove 303 for mounting the chip 31, the sound-absorbing plate 36, and the circuit board 33. The mounting groove 303 facilitates the positioning of the chip 31, the sound-absorbing plate 36, and the circuit board 33.

[0036] See Figures 1-3 The chip 31, sound-absorbing plate 36, and circuit board 33 are installed sequentially from bottom to top in the mounting slot 303, and the chip 31 and the circuit board 33 are connected by a lead wire 32. By setting the lead wire 32 to electrically connect the chip 31 and the circuit board 33, signal transmission and acquisition are realized.

[0037] See Figures 1-3 The mounting groove 303 has a first recessed platform 301 on the top of its side wall. Two first recessed platforms 301 are located on either side of the mounting groove 303, with the bottom of the first recessed platform 301 higher than the top of the circuit board 33. By providing first recessed platforms 301 on the side walls of the mounting groove 303, operators can easily install the chip 31, sound-absorbing plate 36, and circuit board 33 into the mounting groove 303. Furthermore, the bottom of the first recessed platform 301 being higher than the top of the circuit board 33 provides protection for the circuit board 33 placed within the mounting groove 303.

[0038] See Figures 1-3 The chip 31 has a second recess 311 on its front side, and the negative electrode of the chip 31 is located within the second recess 311. By setting the second recess 311 on the front side of the chip 31 and placing the negative electrode of the chip 31 within the second recess 311, it is convenient for operators to identify the negative electrode soldering position through the second recess 311 during soldering, thus preventing incorrect installation of the positive and negative electrodes.

[0039] See Figures 1-3 It also includes a double flexible cable 34 and a plug 35, with the two ends of the double flexible cable 34 connected to the circuit board 33 and the plug 35 respectively.

[0040] See Figures 1-3 The outer side of the outer casing 30 is provided with a third recessed platform 302, and the two third recessed platforms 302 are symmetrically arranged along the axis of the outer casing 30. By providing symmetrical third recessed platforms 302 on the outer side of the outer casing 30, it is convenient for the clamp to clamp with the side wall of the third recessed platform 302 during installation, increasing the contact area at the clamping point and preventing the outer casing 30 from rotating, thus ensuring the stability of the positioning of the outer casing 30.

[0041] See Figures 1-3It also includes a sound-absorbing panel 36, which is generally elliptical in shape and made of foam or fiberglass. By setting the sound-absorbing layer, the noise and interference generated by the ultrasonic sensor during operation are absorbed, thereby reducing the impact of this noise on the sensor's detection accuracy.

[0042] See Figure 1 and Figure 4 The bottom surface of the outer casing 30 is provided with knurling 304, or the surface roughness Ra of the bottom surface is 6.3. By providing knurling 304 on the bottom surface of the outer casing 30, or by providing a surface roughness Ra of 6.3 on the bottom surface, the bonding strength with the sound matching layer 20 is improved. The depth of knurling 304 is in the range of 3.2 micrometers to 6.3 micrometers.

[0043] See Figures 1-3 The acoustic matching layer 20 is made of silicone rubber. By utilizing the high viscosity and elasticity of silicone rubber, an acoustic matching layer of a certain thickness (0.008mm-0.03mm) is formed on the basis of bonding the coupling layer 10 to the bottom of the outer shell 30. This thickness prevents the coupling layer 10 from suppressing the vibration of the ultrasonic sensor and ensures that the ultrasonic sensor has normal vibration frequency and amplitude.

[0044] During operation, a soft acoustic matching layer 20 is located between the bottom surface of the ultrasonic sensor and the coupling layer 10. Protected by the acoustic matching layer 20, the vibrating element of the ultrasonic sensor vibrates at a normal frequency and amplitude. Through interaction with the air, the mechanical vibration is converted into alternating compression and sparse ultrasonic signals, which are then emitted into the surrounding space. These ultrasonic signals propagate at specific frequencies and intensities towards potential target objects around the vehicle door.

[0045] The specific embodiments described above further illustrate the purpose, technical solution, and beneficial effects of this utility model. It should be understood that the above description is only a specific embodiment of this utility model and is not intended to limit the scope of protection of this utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the scope of protection of this utility model.

Claims

1. A metal-penetrating ultrasonic sensor with an added acoustic matching layer, characterized in that, include: The outer casing has a chip, a sound-absorbing panel, and a circuit board installed in its inner cavity; An acoustic matching layer, the top of which is bonded to the bottom of the outer shell, is made of a soft material; A coupling layer, the top of which is bonded to the bottom of the acoustic matching layer.

2. The metal-penetrating ultrasonic sensor with an added acoustic matching layer according to claim 1, characterized in that, The outer shell is cylindrical in shape, and the inner cavity of the outer shell is provided with an elliptical cylindrical mounting groove for mounting chips, sound-absorbing panels and circuit boards.

3. The metal-penetrating ultrasonic sensor with an added acoustic matching layer according to claim 2, characterized in that, The chip, sound-absorbing plate, and circuit board are installed sequentially from bottom to top in the mounting slot, and the chip and the circuit board are connected by leads.

4. The metal-penetrating ultrasonic sensor with an added acoustic matching layer according to claim 2, characterized in that, The top of the side wall of the mounting groove is provided with a first recessed platform, and the two first recessed platforms are respectively located on both sides of the mounting groove. The bottom of the first recessed platform is higher than the top of the circuit board.

5. The metal-penetrating ultrasonic sensor with an added acoustic matching layer according to claim 2, characterized in that, The chip has a second recessed platform on its front side, and the negative electrode of the chip is located inside the second recessed platform.

6. The metal-penetrating ultrasonic sensor with an added acoustic matching layer according to claim 2, characterized in that, It also includes a double-stranded cable and a plug, with the two ends of the double-stranded cable connected to the circuit board and the plug, respectively.

7. The metal-penetrating ultrasonic sensor with an added acoustic matching layer according to any one of claims 1-6, characterized in that, A third recessed platform is provided on the outer side of the outer shell, and the two third recessed platforms are symmetrically arranged along the axis of the outer shell.

8. The metal-penetrating ultrasonic sensor with an added acoustic matching layer according to any one of claims 1-6, characterized in that, It also includes a sound-absorbing panel, which is generally oval-shaped and made of foam or fiberglass.

9. The metal-penetrating ultrasonic sensor with an added acoustic matching layer according to any one of claims 1-6, characterized in that, The bottom surface of the outer casing is knurled, or the surface roughness Ra of the bottom surface is 6.

3.

10. The metal-penetrating ultrasonic sensor with an added acoustic matching layer according to claim 9, characterized in that, The acoustic matching layer is made of silicone rubber.

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