Light source structure and backlight module

Abstract

The utility model discloses a light source structure and a backlight module, the light source structure comprises a substrate, a groove is formed in the substrate, and a circuit layer is arranged at the bottom of the groove; the light-emitting device is arranged at the bottom of the groove and electrically connected with the circuit layer, and the light-emitting device is located between the bottom of the groove and the notch of the groove. The problem that an existing light source structure is high in cost can be solved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of light source, in particular to a light source structure and a backlight module. BACKGROUND

[0002] With the development of LED backlight module towards light and thin direction, side-in LED backlight source is widely applied in display devices such as panel, display and notebook computer.

[0003] At present, the LED light bar in the structure of side-in backlight module includes PCB board, LED lamp bead and top block, the LED light bar is spaced apart from the LED lamp bead through the top block and the light guide plate, so as to prevent the light guide plate from wearing the LED lamp bead, and the cost of the LED light bar is increased.

[0004] Therefore, the current technology needs to be improved and improved. CONTENT OF THE INVENTION

[0005] The present application provides a light source structure and a backlight module, which can alleviate the problem of high cost in the current light source structure.

[0006] The present application provides a light source structure, which comprises:

[0007] A substrate, a groove is formed in the substrate, and a circuit layer is arranged at the bottom of the groove;

[0008] A light emitting device, the light emitting device is arranged at the bottom of the groove and electrically connected with the circuit layer, and the light emitting device is located between the bottom of the groove and the groove opening.

[0009] In some embodiments of the light source structure, the groove is filled with a fluorescent glue layer to cover the light emitting device.

[0010] In some embodiments of the light source structure, the light emitting device comprises a plurality of first LED chips and a plurality of second LED chips, and the first LED chips and the second LED chips are arranged alternately.

[0011] In some embodiments of the light source structure, the fluorescent glue layer is located between the bottom of the groove and the groove opening.

[0012] In some embodiments of the light source structure, the light emitting device comprises a plurality of light emitting groups arranged along a first direction, each light emitting group comprises a first LED chip, a second LED chip and a third LED chip arranged along a second direction, and the first direction and the second direction intersect.

[0013] In some embodiments of the light source structure, the light emitting device comprises a plurality of light emitting groups arranged along a first direction, each light emitting group comprises a first LED chip, a second LED chip and a third LED chip arranged along a first direction.

[0014] In some embodiments of the light source structure, the first LED chip is a blue LED chip and the second LED chip is a green LED chip.

[0015] In some embodiments of the light source structure, the first LED chip is a blue LED chip, the second LED chip is a green LED chip, and the third LED chip is a red LED chip.

[0016] In some embodiments of the light source structure, the light-emitting device includes a flip-chip LED.

[0017] This application also provides a backlight module, which includes the light source structure described above.

[0018] This application provides a light source structure including a substrate and a light-emitting device. A groove is formed in the substrate, and a circuit layer is disposed at the bottom of the groove. The light-emitting device is disposed at the bottom of the groove and electrically connected to the circuit layer, with the light-emitting device located between the bottom of the groove and the groove opening. In this embodiment, the light-emitting device is disposed within the groove by directly creating a groove in the substrate, with the light-emitting device located between the bottom of the groove and the groove opening, without exposing the groove opening. When a light guide plate is disposed on the substrate, the light guide plate can be supported by the groove wall, that is, by the substrate itself, preventing the light guide plate from contacting the light-emitting device and causing wear. This eliminates the need for an additional top block, reducing costs. Attached Figure Description

[0019] The technical solution and other beneficial effects of this application will become apparent from the following detailed description of specific embodiments in conjunction with the accompanying drawings.

[0020] Figure 1 This is a schematic diagram of the backlight module provided in an embodiment of this application.

[0021] Figure 2 Provided for the embodiments of this application Figure 1 A schematic diagram of the structure of the LED light strip.

[0022] Figure 3 Provided for the embodiments of this application Figure 1 A schematic diagram of the structure of the LED lamp beads.

[0023] Figure 4 This is a top view of the light source structure provided in an embodiment of this application.

[0024] Figure 5 Provided for the embodiments of this application Figure 4 A schematic diagram of the cross-section.

[0025] Figure 6 Provided for the embodiments of this application Figure 4A schematic diagram of the longitudinal section.

[0026] Figure 7 This is a schematic diagram of the fluorescent adhesive layer in the light source structure provided in the embodiments of this application.

[0027] Figure 8 This is a schematic diagram of the first arrangement of light-emitting devices in the light source structure provided in the embodiments of this application.

[0028] Figure 9 This is a schematic diagram of a second arrangement of light-emitting devices in the light source structure provided in the embodiments of this application.

[0029] Figure 10 This is a schematic diagram of a third arrangement of light-emitting devices in the light source structure provided in the embodiments of this application.

[0030] Figure label:

[0031] 10. LED strip; 11. PCB board; 12. LED beads; 13. Top block; 20. Light guide plate; 30. Reflector; 40. Optical film; 121. Bracket; 122. LED chip;

[0032] 100, Substrate; 200, Light-emitting device; 300, Connector; 110, Groove; 120, Circuit layer; 130, Phosphor layer; 210, Blue LED chip; 210, Green LED chip; 230, Red LED chip. Detailed Implementation

[0033] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0034] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Features thus defined as "first" or "second" may explicitly or implicitly include one or more features. In the description of this utility model, "multiple" means two or more, unless otherwise explicitly specified.

[0035] Please see Figure 1 , Figure 2 and Figure 3This application provides a backlight module, which includes a light strip 10, a light guide plate 20, a reflector 30, and an optical film 40. The light strip 10 includes a PCB board 11, multiple LED beads 12, and multiple top blocks 13, all of which are disposed on the PCB board 11. The height of the top blocks 13 is greater than the thickness of the LED beads 12. In this case, the top blocks 13 can support the light guide plate 20 to space it from the LED beads 12, thus preventing the light guide plate 20 from wearing down the LED beads 12.

[0036] In this embodiment, the LED bead 12 includes a bracket 121 and an LED chip 122 encapsulated in the bracket 121. The LED bead 12 is then mounted on the PCB board 11 to form a light source.

[0037] Please refer to the following: Figure 4 , Figure 5 and Figure 6 In another embodiment of this application, a light source structure is provided, which includes a substrate 100 and a light-emitting device 200. A groove 110 is provided in the substrate 100, and a circuit layer 120 is provided at the bottom of the groove 110. The light-emitting device 200 is disposed at the bottom of the groove 110 and electrically connected to the circuit layer 120, and the light-emitting device 200 is located between the bottom of the groove 110 and the opening of the groove 110. In this embodiment, the light-emitting device 200 is disposed within the groove 110 by directly creating the groove 110 in the substrate 100, and the light-emitting device 200 is located between the bottom of the groove 110 and the opening of the groove 110, without exposing the opening of the groove 110. When a light guide plate is provided on the substrate 100, the light guide plate can be supported by the groove wall of the groove 110, that is, the light guide plate is supported by the substrate 100 itself, avoiding contact between the light guide plate and the light-emitting device 200 and thus preventing wear on the light-emitting device 200. This eliminates the need for an additional top block 13, reducing costs. Meanwhile, a groove 110 is formed on the substrate 100 to accommodate the light-emitting device 200, which reduces the overall thickness of the light source structure compared to setting a top block 13 on the surface of the substrate 100.

[0038] Please refer to the following: Figure 4 and Figure 7In one embodiment, the light-emitting device 200 includes multiple blue LED chips 210. The groove 110 on the substrate 100 can be a through-slot, and the multiple blue LED chips 210 are evenly spaced within the groove 110. The groove 110 can be filled with a phosphor layer 130 to cover the light-emitting device 200, corresponding to YAG or KSF phosphor mixed in the phosphor layer 130, so that the light source structure emits white light. In this embodiment, the LED chips are directly mounted in the through-slot of the substrate 100. Compared to setting LED beads 12, this eliminates the need for the LED bead bracket 121 structure and the LED chip packaging process, thereby further saving the cost of the light source structure.

[0039] Meanwhile, compared to the LED beads 12, there is no bracket 121 to block the LED chips in this embodiment, which can avoid visual defects caused by the cross light between the LED chips.

[0040] As one embodiment, the fluorescent adhesive layer 130 is located between the bottom of the groove 110 and the opening of the groove 110, that is, the fluorescent adhesive layer 130 is exposed at the opening of the groove 110. When installing the light guide plate, the wear between the light guide plate and the fluorescent adhesive layer 130 can be avoided to prevent the LED chip from being squeezed, thereby improving the reliability of the light source structure.

[0041] Please see Figure 8 In one embodiment, the light-emitting device 200 includes a plurality of first LED chips and a plurality of second LED chips, which are arranged alternately. The first LED chips are blue LED chips 210, and the second LED chips are green LED chips 220, which are arranged alternately in a groove 110. A phosphor layer 130 can be filled into the groove 110, and the phosphor in the phosphor layer 130 can be KSF phosphor.

[0042] Please see Figure 9 In one embodiment, the light-emitting device 200 includes a plurality of light-emitting groups spaced apart along a first direction, each light-emitting group including a first LED chip, a second LED chip, and a third LED chip spaced apart along a second direction; the first direction and the second direction intersect. The first LED chip is a blue LED chip 210, the second LED chip is a green LED chip 220, and the third LED chip is a red LED chip 230.

[0043] In this embodiment, multiple light-emitting groups are spaced apart in the groove 110, and each light-emitting group is provided with light-emitting chips of three colors: red, green and blue, so that the light source structure can emit white light. Compared with only setting blue LED chip 210 or blue LED chip 210 and green LED chip 220, the setting of phosphor adhesive layer 130 can be omitted, thereby simplifying the manufacturing process.

[0044] Please see Figure 10 In one embodiment, the light-emitting device 200 includes a plurality of light-emitting groups spaced apart along a first direction. Each light-emitting group includes a first LED chip, a second LED chip, and a third LED chip spaced apart along the first direction. The first LED chip is a blue LED chip 210, the second LED chip is a green LED chip 220, and the third LED chip is a red LED chip 230. In this embodiment, the arrangement direction of the red, green, and blue LED chips can be the same as the arrangement direction of the light-emitting groups, and all can be spaced apart along the extension direction of the groove 110.

[0045] As one embodiment, the light-emitting device 200 includes a flip-chip LED. Correspondingly, the blue LED chip 210, green LED chip 220, and red LED chip 230 in this embodiment are all flip-chips; in this embodiment, the flip-chip LED is directly bonded to the substrate 100, which is beneficial to improving the heat dissipation of the light source structure.

[0046] As one embodiment, the light source structure in this embodiment is a light strip structure, which can be applied to side-lit backlight molding. The groove 110 is located in the middle of the substrate 100. One end of the light strip structure is provided with a connector 300 so as to form an electrical connection with other light strip structures during subsequent assembly.

[0047] This application embodiment also provides a backlight module, which includes the above-described light source structure. Since the light source structure has been described in detail above, it will not be repeated here.

[0048] The light source structure provided in the embodiments of this application has been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this application. The description of the above embodiments is only for the purpose of helping to understand the technical solutions and core ideas of this application. Those skilled in the art should understand that they can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. These modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A light source structure, characterized in that, The light source structure is a light strip structure, which is used in a side-lit backlight module. One end of the light strip structure is provided with a connector. The light source structure includes: A substrate having a groove in it, and a circuit layer being disposed at the bottom of the groove; A light-emitting device is disposed at the bottom of the groove and electrically connected to the circuit layer, and the light-emitting device is located between the bottom of the groove and the opening of the groove; The light-emitting device includes a plurality of light-emitting groups spaced apart along a first direction, each light-emitting group including a first LED chip, a second LED chip, and a third LED chip spaced apart along a second direction; the first direction and the second direction intersect; the first LED chip is a blue LED chip, the second LED chip is a green LED chip, and the LED chip is a red LED chip; Alternatively, the light-emitting device may include a plurality of light-emitting groups spaced apart along a first direction, each light-emitting group including a first LED chip, a second LED chip, and a third LED chip spaced apart along the first direction; the first LED chip is a blue LED chip, the second LED chip is a green LED chip, and the LED chip is a red LED chip.

2. The light source structure according to claim 1, characterized in that, The light-emitting device includes a flip-chip LED.

3. A backlight module, characterized in that, The backlight module includes the light source structure as described in claim 1 or 2.

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