Optical isolation chip and electronic device

Abstract

The utility model discloses an optical isolation chip and an electronic device. A substrate, a light source assembly, a light receiving assembly and an isolation lens are arranged in the chip. The substrate includes a mounting front surface on which a first wiring area and a second wiring area are disposed. The light source assembly is mounted in the first wiring area. The light receiving assembly is installed in the second wiring area. The isolation lens is installed on the installation front face, and two isolated cavities are formed between the isolation lens and the first wiring area and between the isolation lens and the second wiring area. The light source assembly and the light receiving assembly are contained in the corresponding cavities respectively, a light path between the light source assembly and the light receiving assembly passes through the isolation wall between the two cavities, and isolation between the light source assembly and the light receiving assembly is achieved; the optical isolation chip not only can be used as an optical path adjusting device between the light source assembly and the light receiving assembly, but also can play a good role in electrical isolation, and the isolation reliability of the optical isolation chip is improved.

Description

Technical Field

[0001] This utility model relates to the field of optical chip manufacturing, and in particular to an optical isolation chip and electronic device. Background Technology

[0002] Optical isolation chips can effectively solve the problem of electrical interference between devices and are widely used in communications, automotive and industrial production.

[0003] In existing optical isolation chips, the optical receiving component and the optical transmitting component are located in the same cavity. The light source emitted by the optical receiving component is controlled by the optical adjustment device and enters the optical receiving component to achieve signal transmission and isolation.

[0004] However, these optical isolation chips often have weak insulation withstand voltage and low reliability, and cannot meet the requirements of strong insulation isolation scenarios. Utility Model Content

[0005] This invention provides an optical isolation chip and electronic device to improve the isolation reliability of the optical isolation chip.

[0006] According to one aspect of the present invention, an optical isolation chip is provided, the optical isolation chip comprising:

[0007] The substrate includes a mounting front side, on which a first wiring area and a second wiring area are provided;

[0008] The light source assembly is installed in the first wiring area;

[0009] An optical receiving component is installed in the second wiring area;

[0010] An isolation lens is mounted on the mounting front, forming two mutually isolated cavities between the first wiring area and the second wiring area; the light source assembly and the light receiving assembly are respectively housed in their corresponding cavities, and the optical path between the light source assembly and the light receiving assembly passes through the isolation wall between the two cavities.

[0011] Optionally, the optical isolation chip further includes: a first auxiliary device corresponding to the light source component, and a second auxiliary device corresponding to the light receiving component;

[0012] The first auxiliary device is mounted on the outer periphery of the isolation lens, on the mounting front side near the light source assembly;

[0013] The second auxiliary device is mounted on the outer periphery of the isolation lens, on the mounting front side near the light receiving component.

[0014] Optionally, the first auxiliary device and the second auxiliary device are respectively arranged adjacent to two opposite sides on the mounting front.

[0015] Optionally, the substrate further includes a mounting back side;

[0016] The optical isolation chip further includes: a first connector corresponding to the light source component, and a second connector corresponding to the light receiving component;

[0017] The first connector and the second connector are respectively mounted on the back of the mounting.

[0018] Optionally, the first connector and the second connector are respectively disposed adjacent to two opposite sides on the mounting back.

[0019] Optionally, the substrate includes at least one heat transfer layer and at least one heat dissipation layer disposed in an overlapping manner;

[0020] On the heat transfer layer, heat transfer through-hole arrays are respectively provided at positions directly opposite to the first wiring area and the second wiring area;

[0021] The heat dissipation layer is disposed on the side of the heat transfer layer away from the isolation lens; on the heat dissipation layer, at the position directly opposite the first wiring area and the second wiring area, heat dissipation material is filled through both sides, wherein the thermal conductivity of the heat dissipation material is higher than that of air and the substrate.

[0022] Optionally, the total number of base layers of the substrate is n+1, wherein the number of heat transfer layers is n and the number of heat dissipation layers is 1, where n is an integer greater than 0.

[0023] Optionally, the light source assembly includes a transmission driver chip and multiple light transmitters; the light receiving assembly includes a signal processing chip and multiple light receivers.

[0024] Multiple optical transmitters are disposed between the transmission driver chip and the isolation wall, and are respectively connected to the transmission driver chip; multiple optical receivers are disposed between the signal processing chip and the isolation wall, and are arranged opposite to the optical transmitters on the other side of the isolation wall, and are also respectively connected to the signal processing chip.

[0025] Optionally, the optical isolation chip further includes: a first reflective component and a second reflective component;

[0026] The first reflective component is disposed in the cavity where the light source component is located. The first reflective component can change the propagation path of the light emitted by the light emitter, so that it passes through the isolation wall and enters another cavity.

[0027] The second reflective component is disposed within the cavity where the light receiving component is located. The second reflective component can reflect the light entering through the isolation wall, directing it toward the light receiver.

[0028] According to another aspect of the present invention, an electronic device is provided, the electronic device comprising the optical isolation chip described in the first aspect.

[0029] The optical isolation chip and electronic device provided by this utility model include a substrate, a light source assembly, a light receiving assembly, and an isolation lens. The substrate includes a mounting front side, on which a first wiring area and a second wiring area are formed. The light source assembly is mounted in the first wiring area. The light receiving assembly is mounted in the second wiring area. The isolation lens is mounted on the mounting front side, forming two mutually isolated cavities with the first and second wiring areas. The light source assembly and the light receiving assembly are respectively housed within their corresponding cavities. The optical path between the light source assembly and the light receiving assembly passes through the isolation wall between the two cavities, achieving isolation between them. The isolation lens serves both as an optical path adjustment device between the light source assembly and the light receiving assembly and provides excellent electrical isolation, improving the isolation reliability of the optical isolation chip.

[0030] It should be understood that the description in this section is not intended to identify key or essential features of the embodiments of this utility model, nor is it intended to limit the scope of this utility model. Other features of this utility model will become readily apparent from the following description. Attached Figure Description

[0031] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0032] Figure 1 A schematic diagram of the structure of an optical isolation chip from a top view, provided for this utility model embodiment;

[0033] Figure 2 A schematic diagram of the structure of an optical isolation chip provided in an embodiment of this utility model from a frontal viewing angle;

[0034] Figure 3 A schematic diagram of another optical isolation chip provided in this embodiment of the present invention from a top view angle;

[0035] Figure 4 A schematic diagram of another optical isolation chip provided in this embodiment of the present invention from the main viewing angle;

[0036] Figure 5 A schematic diagram of the film layer composition of a substrate in another optically isolated chip provided in this embodiment of the present invention;

[0037] Figure 6 A circuit diagram of another optical isolation chip provided in this embodiment of the present utility model;

[0038] Figure 7 A schematic diagram of the composition of another optical isolation chip provided in this embodiment of the present utility model from a top view angle;

[0039] Figure 8 A schematic diagram of the composition of another optical isolation chip provided in an embodiment of this utility model from the main viewing angle;

[0040] Figure 9 This is a schematic diagram of the composition of an electronic device provided in an embodiment of the present invention. Detailed Implementation

[0041] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the protection scope of the present invention.

[0042] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this utility model are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of the utility model described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0043] To address the problems mentioned in the background art, this utility model provides an optical isolation chip. Figure 1 This is a schematic diagram of the structure of an optical isolation chip from a top view, provided by a new embodiment of the present invention. Figure 2 This is a schematic diagram of the structure of an optical isolation chip from a frontal viewing angle, provided as an embodiment of the present invention. Figure 1and Figure 2 The optical isolation chip 100 includes a substrate 101, a light source assembly 102, a light receiver assembly 103, and an isolation lens 104. The substrate 101 includes a mounting front side, on which a first wiring region 105 and a second wiring region 106 are disposed. The light source assembly 102 is mounted in the first wiring region 105. The light receiver assembly 103 is mounted in the second wiring region 106. The isolation lens 104 is mounted on the mounting front side, forming two mutually isolated cavities 107 between the lens 104 and the first wiring region 105 and the second wiring region 106. The light source assembly 102 and the light receiver assembly 103 are respectively housed within their corresponding cavities 107, and the optical path between the light source assembly 102 and the light receiver assembly 103 passes through an isolation wall 108 between the two cavities 107.

[0044] Specifically, substrate 101 refers to the underlying support structure of the optical isolator chip 100, providing a surface for mounting and fixing the chip and its related devices. Through-holes and wiring on substrate 101 also enable connections between various devices on the board and between devices on the board and external circuits. For example, substrate 101 can be a multilayer copper-clad PCB substrate made of materials such as ceramic, organic, or silicon. The mounting front side refers to the surface of substrate 101 used for mounting the chip and its related devices; for example, the mounting front side can be a plane. The first wiring area 105 refers to the area on the mounting front side used for connecting the light source assembly 102. The first wiring area 105 is provided with connecting gold wires and connection contacts, enabling the mounting and signal transmission of the light source assembly 102. Similar to the first wiring area 105, the second wiring area 106 refers to the area on the mounting front side used for connecting the light receiving assembly 103, also provided with connecting gold wires and connection contacts, enabling the mounting and signal transmission of the light receiving assembly 103. For example, when the substrate 101 is a copper-clad PCB substrate, copper plating and surface traces can be applied only in the first wiring area 105 and the second wiring area 106 on the mounting front side. The surface copper plating in other areas can be removed by etching or other processes to increase the creepage distance.

[0045] The light source component 102 refers to a light signal emitting component that can generate a corresponding light signal according to an input control signal, wherein the control signal can be an electrical signal. Exemplarily, the light source component 102 may include a light emitter, a driver chip, and auxiliary devices. The light emitter may include at least one of a light-emitting diode, a laser diode, an organic light-emitting diode, and a quantum dot light-emitting diode. The auxiliary devices may include capacitors and / or resistors. The light source component 102 is disposed in the first wiring region 105. Through the connection points and gold wires on the first wiring region 105, connection to corresponding peripheral circuits and access to control signals can be achieved.

[0046] The optical receiving component 103 refers to an optical signal receiving and analysis processing component. It can convert the optical signal emitted by the light source component 102 into an electrical signal using the photoelectric effect, and then perform signal processing such as operational amplification on the electrical signal before outputting it to the subsequent circuit. Exemplarily, the optical receiving component 103 may include an optical receiver, a transimpedance amplifier chip, and auxiliary devices. The optical receiver may include at least one of a photodiode, a phototransistor, and a photoelectric field-effect transistor. The auxiliary devices may include capacitors and / or resistors. The optical receiving component 103 is disposed in the second wiring region 106, and through the connection points and gold wires on the second wiring region 106, it achieves connection with peripheral circuits and signal output to the subsequent circuits.

[0047] The isolating lens 104 has two grooves on its surface that contacts the mounting front, corresponding to the first wiring area 105 and the second wiring area 106, respectively. When the isolating lens 104 is mounted flush against the mounting front, the grooves are aligned with their corresponding wiring areas, forming a cavity 107 between them. The light source assembly 102 and the light receiving assembly 103 are respectively disposed in different cavities 107, and the optical path between the light source assembly 102 and the light receiving assembly 103 passes through the isolation wall 108 between the two cavities 107. The isolating lens 104 and the isolation wall 108 thereon serve both as a sealing and isolation component between the first wiring area 105 and the second wiring area 106, and as an optical path adjustment device between the light source assembly 102 and the light receiving assembly 103. Exemplarily, the material of the isolating lens 104 may include at least one of insulating and transparent materials such as silicone, polycarbonate (also known as PC), acrylic (also known as polypropylene), glass, and silicon. The inner wall of cavity 107 may be integrated with a reflective component, which can reflect the light emitted by light source component 102, so that it passes through the isolation wall 108 and is captured by light receiving component 103.

[0048] The optical isolation chip provided in this embodiment includes a substrate, a light source assembly, a light receiver assembly, and an isolation lens. The substrate includes a mounting front side, on which a first wiring area and a second wiring area are formed. The light source assembly is mounted in the first wiring area. The light receiver assembly is mounted in the second wiring area. The isolation lens is mounted on the mounting front side, forming two mutually isolated cavities with the first and second wiring areas. The light source assembly and the light receiver assembly are respectively housed within their corresponding cavities. The optical path between the light source assembly and the light receiver assembly passes through the isolation wall between the two cavities, achieving isolation between them. The isolation lens serves both as an optical path adjustment device between the light source assembly and the light receiver assembly and provides excellent electrical isolation, improving the isolation reliability of the optical isolation chip.

[0049] Optionally, Figure 3This is a schematic diagram of another optical isolation chip provided in an embodiment of the present invention, viewed from a top angle. Figure 4 This is a schematic diagram of another optical isolation chip provided by an embodiment of the present invention from the main viewing angle. Based on the foregoing embodiments, and combined with... Figure 3 and Figure 4 The optical isolation chip 100 also includes a first auxiliary device 301 corresponding to the light source assembly 102 and a second auxiliary device 302 corresponding to the light receiving assembly 103. The first auxiliary device 301 is mounted on the outer periphery of the isolation lens 104, on the mounting surface near the light source assembly 102. The second auxiliary device 302 is mounted on the outer periphery of the isolation lens 104, on the mounting surface near the light receiving assembly 103. The first auxiliary device 301 and the second auxiliary device 302 are respectively arranged adjacent to two opposite sides on the mounting surface.

[0050] The substrate 101 also includes a mounting back side. The optical isolation chip 100 also includes a first connector 401 corresponding to the light source assembly 102 and a second connector 402 corresponding to the light receiving assembly 103. The first connector 401 and the second connector 402 are respectively mounted on the mounting back side. The first connector 401 and the second connector 402 are respectively disposed adjacent to two opposite sides on the mounting back side.

[0051] Specifically, the first auxiliary device 301 refers to an electrical auxiliary device of the light source assembly 102 disposed outside the first wiring area 105. It can be connected to the chip input terminal and / or the corresponding electrical device on the first wiring area 105 through through-holes and conductive film layers in the substrate 101. For example, the first auxiliary device may include at least one of a capacitor, a resistor, and a transistor, wherein the capacitor is used for DC isolation, the resistor can realize voltage division and current limiting, and the transistor is used as a switch or signal driver. Similarly, the second auxiliary device 302 refers to an electrical auxiliary device of the light receiving assembly 103 disposed outside the second wiring area 106. It can be connected to the chip output terminal and / or the corresponding electrical device on the second wiring area 106 through through-holes and conductive film layers on the substrate 101. For example, the second auxiliary device may include at least one of a capacitor and a resistor, wherein the capacitor is used for DC isolation, the resistor can realize voltage division and current limiting, and the transistor is used as a switch or signal driver.

[0052] The first auxiliary device 301 and the second auxiliary device 302 are respectively installed on the periphery of the isolation lens 104. The first auxiliary device 301 can be installed on the mounting surface of the isolation lens 104 on the side close to the first wiring area 105, and the second auxiliary device 302 can be installed on the mounting surface of the isolation lens 104 on the side close to the second wiring area 106. For example, the first auxiliary device 301 and the second auxiliary device 302 are respectively arranged adjacent to two opposite sides on the mounting front. For example, when the mounting front is rectangular, the first auxiliary device 301 can be arranged adjacent to one edge of the first wiring area 105, and the second auxiliary device 302 can be arranged adjacent to the other edge of the second wiring area 106. These two rectangular sides are opposite sides of each other. Preferably, the first auxiliary device 301 and the second auxiliary device 302 can be arranged adjacent to two opposite corners of the rectangular mounting front. This arrangement of the two auxiliary devices can maximize the length of the creepage path on the upper surface of the optical isolation chip 100 under the premise of limited chip size. Combined with the thickness of the isolation lens 104, the creepage distance between the first auxiliary device 301 and the second auxiliary device 302 on the mounting front side can be greater than the safe creepage distance, thereby improving the withstand voltage level of the optical isolation chip 100. The safe creepage distance can be set according to the insulation isolation safety standard of the optical isolation chip 100. In addition, other auxiliary devices may also be provided in the first wiring area 105 and / or the second wiring area 106. The setting of other auxiliary devices can be determined according to the actual circuit design of the light source component and the light receiving component, which will not be elaborated here.

[0053] The mounting back side refers to the side of the substrate 101 opposite to the mounting front side, where no copper plating is provided, or the copper plating is removed by etching or other means. The first connector 401 is a connection component on the optical isolator chip 100 for connecting to an external pre-amplifier circuit, and can be used to receive control signals from the pre-amplifier circuit to the light source component 102. The first connector 401 can be electrically connected to devices and / or first auxiliary devices 301 on the first wiring area 105 of the mounting front side through a metal film layer within the substrate 101 and through-holes connecting the upper and lower film layers, enabling signal access to the light source component 102. For example, the first connector 401 may include multiple pins arranged in an array. The second connector 402 is a connection component on the optical isolator chip 100 for outputting signals to a subsequent circuit, and can output the corresponding electrical signal generated by the light receiver component 103 according to the light source to the subsequent circuit. The second connector 402 can be electrically connected to the device and / or the second auxiliary device 302 on the second wiring area 106 through the metal film layer in the substrate 101 and the through hole connecting the upper and lower film layers, so as to realize the signal output of the optical receiving component 103. For example, the second connector 402 may include multiple pins arranged in an array. The first connector 401 and the second connector 402 are respectively disposed at different positions on the mounting back. For example, the first connector 401 and the second connector 402 are respectively disposed adjacent to two opposite sides on the mounting back. For example, when the mounting back is rectangular, with the projection of the isolation wall 108 on the mounting back as the boundary, the first connector 401 can be disposed on the side closer to the first wiring area 105 and adjacent to the rectangular side of that side; the second connector 402 can be disposed on the side closer to the second wiring area 106 and adjacent to the rectangular side of that side, wherein the two rectangular sides are opposite sides. Preferably, the first connector 401 and the second connector 402 can be respectively disposed adjacent to two opposite corners of the rectangular mounting back. Such a connector arrangement method can maximize the distance between the two connectors based on the limited size of the optical isolation chip 100, thereby shortening the creepage distance length on the back of the chip and further improving the withstand voltage level of the optical isolation chip 100.

[0054] The optical isolating chip provided in this embodiment also includes a first auxiliary device corresponding to the light source component and a second auxiliary device corresponding to the light receiving component. The first auxiliary device is mounted on the outer periphery of the isolation lens, on the mounting front side near the light source component. The second auxiliary device is mounted on the outer periphery of the isolation lens, on the mounting front side near the light receiving component. The first and second auxiliary devices are respectively arranged adjacent to two opposite sides on the mounting front side. The substrate also includes a mounting back side, and the optical isolating chip also includes a first connector corresponding to the light source component and a second connector corresponding to the light receiving component. The first and second connectors are respectively mounted on the mounting back side, respectively arranged adjacent to two opposite sides on the mounting back side. Through the mounting position design of the auxiliary devices and connectors, the creepage distance length on both sides of the chip is shortened, and the withstand voltage level of the optical isolating chip is improved.

[0055] Optionally, Figure 5 This is a schematic diagram of the film layer composition of the substrate in another optically isolated chip provided by this utility model embodiment. Based on the foregoing embodiments, and combined with... Figure 4 and Figure 5 The substrate 101 includes at least one heat transfer layer 501 and at least one heat dissipation layer 502 disposed in an overlapping manner. Heat transfer layer 501 has arrays of heat transfer vias disposed at positions directly opposite to the first wiring region 105 and the second wiring region 106. The heat dissipation layer 502 is disposed on the side of the heat transfer layer 501 away from the isolation lens. The heat dissipation layer 502, at positions directly opposite to the first wiring region 105 and the second wiring region 106, is filled with a heat dissipation material penetrating both sides, wherein the thermal conductivity of the heat dissipation material is higher than that of air and the substrate 101.

[0056] Specifically, the heat transfer layer 501 is a film layer in the substrate 101 that uses heat transfer vias x to transfer heat from the first wiring region 105 to the mounting back side. A region on the heat transfer layer 501 directly opposite the first wiring region 105 is located on the heat dissipation path from the first wiring region 105 to the mounting back side, and this region is provided with an array of heat transfer vias. A region on the heat transfer layer 501 directly opposite the second wiring region 106 is located on the heat dissipation path from the second wiring region 106 to the mounting back side, and this region is also provided with an array of heat transfer vias. The heat transfer via array includes multiple arrayed heat transfer vias x, which penetrate both the front and back surfaces of the heat transfer layer 501. Since the thermal conductivity of air is higher than that of the substrate 101 material, the heat transfer via x structure on the heat transfer layer 501 can significantly improve the heat dissipation efficiency of the light source component 102 and the light receiving component 103 in the isolation lens 104 through the substrate 101, reduce the impact of heat generated by electrical components on chip performance, and improve the isolation reliability of the optical isolation chip 100.

[0057] The heat dissipation layer 502 is a film layer on the substrate 101 that is further away from the mounting front side than the heat transfer layer 501. When there is only one heat dissipation layer 502, it can be set as the bottom layer of the substrate 101. The heat dissipation layer 502 can diffuse the heat conducted by the heat transfer layer 501 into the air around the mounting back side. Two heat dissipation areas y can be provided on the heat dissipation layer 502, respectively, opposite to the two wiring areas. The heat dissipation areas y penetrate both sides of the heat dissipation layer. For example, the size of the heat dissipation area y can be the same as or larger than the size of the corresponding wiring area, so that the projection of the heat transfer via x in the heat transfer layer 501 onto the heat dissipation layer 502 falls within the heat dissipation area y. The heat dissipation area y penetrates both sides of the heat dissipation layer and is filled with heat dissipation material. The thermal conductivity of the heat dissipation material is higher than that of air and substrate 101. For example, the heat dissipation material can be a ceramic material, carbon-based material, or metal oxide material, which has extremely high thermal conductivity and low electrical conductivity. This can increase the heat conduction efficiency of the material on the corresponding heat dissipation path of the wiring area and ensure that there is a sufficiently long creepage distance on the mounting back side. While ensuring the electrical isolation performance of the optical isolation chip 100, the heat dissipation performance of the optical isolation chip 100 is improved. For example, the heat dissipation material can be ceramic or epoxy resin.

[0058] For example, the total number of base layers of the substrate 101 is n+1, where the number of heat transfer layers 501 is n and the number of heat dissipation layers 502 is 1, and n is an integer greater than 0. To increase the creepage distance on the mounting back side, the outer copper layer of the heat transfer layer 501 is removed, which may affect the heat dissipation effect of the substrate. A heat dissipation material that penetrates and fills both sides is provided on the heat dissipation layer 502 at positions corresponding to the first wiring region 105 and the second wiring region 106, enabling the heat dissipation material of the heat dissipation layer 502 to directly contact the surface copper of the previous heat transfer layer, thus improving thermal conductivity. During the operation of the optical isolation chip 100, the heat generated by the related chips in the light source component 102 and the light receiving component 103 is mainly dissipated outward through the chip substrate via the substrate 101. The array of heat transfer vias and the heat dissipation material in the heat dissipation region y provided on the heat dissipation path of the chip can reduce the thermal resistance of the substrate 101. Combined with a low thermal resistance heat dissipation material, efficient heat conduction can be achieved, greatly improving the heat dissipation performance of the optical isolation chip 100.

[0059] Figure 6 This is a circuit diagram of another optical isolation chip provided in an embodiment of the present invention. Figure 7 This is a top-view schematic diagram of another optical isolation chip provided in an embodiment of the present invention, combined with... Figure 6 and Figure 7The light source assembly 102 includes a transmitting driver chip 601 and multiple light transmitters D1; ​​the light receiving assembly 103 includes a signal processing chip 602 and multiple light receivers D2. The multiple light transmitters D1 are disposed between the transmitting driver chip 601 and the isolation wall 108, and are each connected to the transmitting driver chip 601. The multiple light receivers D2 are disposed between the signal processing chip 602 and the isolation wall 108, and are arranged opposite to the light transmitters D1 on the other side of the isolation wall 108, and are also each connected to the signal processing chip 602.

[0060] Specifically, the optical transmitter D1 is an optical signal transmitting device in the electro-optic signal conversion process. It can emit corresponding optical signals under the drive of the transmitting driver chip 601. For example, the optical transmitter D1 can be a laser diode. The transmitting driver chip 601 is a chip that can provide corresponding driving signals to the optical transmitter D1 according to the control signal. The transmitting driver chip 601 can be provided with multiple sets of input pins i- and i+, which are respectively connected to the first connector on the back of the mounting plate, enabling access to control electrical signals and / or communication signals from the front-end circuit. The transmitting driver chip 601 can also be provided with multiple sets of driving signal output pins, which are respectively connected to each optical transmitter D1 to drive each optical transmitter D1 to emit light.

[0061] Optical receiver D2 corresponds one-to-one with optical transmitter D1. For example, the number of optical transmitters D1 and optical receivers D2 can both be four. Optical receiver D2 refers to the optical signal receiving device in the photoelectric conversion process, which can receive the optical signal emitted by optical transmitter D1 and convert it into an electrical signal. For example, optical receiver D2 can be a photodiode. Signal processing chip 602 refers to a data processing chip capable of converting and processing the electrical signal output by optical receiver D2. Signal processing chip 602 can have multiple sets of input pins, each connected to a different optical receiver D2, to receive the current signal generated by the photoelectric conversion of optical receiver D2. Signal processing chip 602 can also have multiple sets of output pins o+ and o-, each connected to a second connector on the back of the mounting plate, capable of outputting the processed electrical signal to subsequent circuits. For example, signal processing chip 602 can be a transimpedance amplifier chip.

[0062] The optical isolation chip provided in this embodiment includes a light source component comprising a transmitting driver chip and multiple optical transmitters; and an optical receiving component comprising a signal processing chip and multiple optical receivers. Multiple optical transmitters are disposed between the transmitting driver chip and the isolation wall, and are each connected to the transmitting driver chip. Multiple optical receivers are disposed between the signal processing chip and the isolation wall, one-to-one with the optical transmitters on the other side of the isolation wall, and are also each connected to the signal processing chip. This realizes multiple optically isolated signal transmission paths. The multi-path parallel implementation can increase data throughput and greatly improve the data transmission rate of the optical isolation chip.

[0063] Optionally, Figure 8 This is a schematic diagram of another optical isolation chip provided by this utility model from a main viewing angle. The optical path is exemplarily shown by yellow arrows in the figure. Based on the foregoing embodiments, refer to... Figure 8 The optical isolation chip 100 also includes a first reflective component 801 and a second reflective component 802. The first reflective component 801 is disposed within the cavity 107 where the light source component 102 is located. The first reflective component 801 can change the propagation path of the light emitted by the light emitter, causing it to pass through the isolation wall 108 and enter another cavity 107. The second reflective component 802 is disposed within the cavity 107 where the light receiving component 103 is located. The second reflective component 802 can reflect the light entering through the isolation wall 108, causing it to be directed towards the light receiver D2.

[0064] Specifically, the first reflective component 801 refers to a combination of light-reflecting devices disposed in the cavity 107 where the light source component 102 is located. It can reflect the light emitted by the light emitter to adjust the light path, so that the light passes through the isolation wall 108 and enters the cavity 107 where the light receiving component 103 is located. For example, the first reflective component 801 may include at least one reflective device, which may be disposed on the inner wall of the corresponding cavity 107 and may be integrally formed with the isolation lens 104. Conversely, the second reflective component 802 refers to a combination of light-reflecting devices disposed in the cavity 107 where the light receiving component 103 is located. It can reflect the light emitted by the light emitter to further adjust the light path, so that the light entering the cavity 107 where the light receiving component 103 is located enters the corresponding light receiver D2. For example, the second reflective component 802 may include at least one reflective device, which may be disposed on the inner wall of the corresponding cavity 107 and may be integrally formed with the isolation lens 104. It should be noted that the first reflective component 801 can correspond one-to-one with a light emitter, or one first reflective component 801 can correspond to multiple light emitters to achieve adjustment of multiple parallel light rays; the second reflective component 802 can correspond one-to-one with a light receiver D2, or one second reflective component 802 can correspond to multiple light receivers D2 to achieve adjustment of multiple parallel light rays, and no restrictions are made here.

[0065] The optical isolation chip provided in this embodiment also includes a first reflective component and a second reflective component. The first reflective component is disposed within the cavity where the light source component is located. The first reflective component can change the propagation path of the light emitted by the light emitter, causing it to pass through the isolation wall and enter another cavity. The second reflective component is disposed within the cavity where the light receiving component is located. The second reflective component can reflect the light entering through the isolation wall, causing it to be directed towards the light receiver. This achieves the adjustment of the optical path, ensuring that the light emitted by the light emitter enters the corresponding light receiver along a preset path, reducing light loss and improving the accuracy of data transmission by the chip.

[0066] This utility model also provides an electronic device. Figure 9 This is a schematic diagram of the composition of an electronic device provided in an embodiment of the present utility model, with reference to... Figure 9 Electronic device 900 includes optical isolation chip 100.

[0067] The optical isolation chip and electronic device provided by this utility model include a substrate, a light source assembly, a light receiving assembly, and an isolation lens. The substrate includes a mounting front side, on which a first wiring area and a second wiring area are formed. The light source assembly is mounted in the first wiring area. The light receiving assembly is mounted in the second wiring area. The isolation lens is mounted on the mounting front side, forming two mutually isolated cavities with the first and second wiring areas. The light source assembly and the light receiving assembly are respectively housed within their corresponding cavities. The optical path between the light source assembly and the light receiving assembly passes through the isolation wall between the two cavities, achieving isolation between them. The isolation lens serves both as an optical path adjustment device between the light source assembly and the light receiving assembly and provides excellent electrical isolation, improving the isolation reliability of the optical isolation chip.

[0068] The specific embodiments described above do not constitute a limitation on the scope of protection of this utility model. Those skilled in the art should understand that various modifications, combinations, sub-combinations, and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this utility model should be included within the scope of protection of this utility model.

Claims

1. An optically isolated chip, characterized in that, include: The substrate includes a mounting front side, on which a first wiring area and a second wiring area are provided; The light source assembly is installed in the first wiring area; An optical receiving component is installed in the second wiring area; An isolation lens is mounted on the mounting front, forming two mutually isolated cavities between the first wiring area and the second wiring area; the light source assembly and the light receiving assembly are respectively housed in their corresponding cavities, and the optical path between the light source assembly and the light receiving assembly passes through the isolation wall between the two cavities.

2. The optically isolated chip according to claim 1, characterized in that, Also includes: A first auxiliary device corresponding to the light source component, and a second auxiliary device corresponding to the light receiving component; The first auxiliary device is mounted on the outer periphery of the isolation lens, on the mounting front side near the light source assembly; The second auxiliary device is mounted on the outer periphery of the isolation lens, on the mounting front side near the light receiving component.

3. The optically isolated chip according to claim 2, characterized in that, The first auxiliary device and the second auxiliary device are respectively arranged adjacent to two opposite sides on the mounting front.

4. The optically isolated chip according to claim 1, characterized in that, The substrate also includes a mounting back side; The optical isolation chip further includes: a first connector corresponding to the light source component, and a second connector corresponding to the light receiving component; The first connector and the second connector are respectively mounted on the back of the mounting.

5. The optically isolated chip according to claim 4, characterized in that, The first connector and the second connector are respectively positioned adjacent to two opposite sides on the mounting back.

6. The optically isolated chip according to claim 1, characterized in that, The substrate includes at least one heat transfer layer and at least one heat dissipation layer that are overlapped; On the heat transfer layer, heat transfer through-hole arrays are respectively provided at positions directly opposite to the first wiring area and the second wiring area; The heat dissipation layer is disposed on the side of the heat transfer layer away from the isolation lens; on the heat dissipation layer, at the position directly opposite the first wiring area and the second wiring area, heat dissipation material is filled through both sides, wherein the thermal conductivity of the heat dissipation material is higher than that of air and the substrate.

7. The optically isolated chip according to claim 6, characterized in that, The total number of base layers of the substrate is n+1, wherein the number of heat transfer layers is n and the number of heat dissipation layers is 1, where n is an integer greater than 0.

8. The optical isolation chip according to any one of claims 1-7, characterized in that, The light source assembly includes a transmission driver chip and multiple light transmitters; the light receiving assembly includes a signal processing chip and multiple light receivers. Multiple optical transmitters are disposed between the transmission driver chip and the isolation wall, and are respectively connected to the transmission driver chip; Multiple optical receivers are disposed between the signal processing chip and the isolation wall, and are arranged opposite to the optical transmitters on the other side of the isolation wall, and are also connected to the signal processing chip.

9. The optically isolated chip according to claim 8, characterized in that, It also includes a first reflective component and a second reflective component; The first reflective component is disposed in the cavity where the light source component is located. The first reflective component can change the propagation path of the light emitted by the light transmitter, so that it passes through the isolation wall and enters another cavity. The second reflective component is disposed within the cavity where the light receiving component is located. The second reflective component can reflect the light entering through the isolation wall, directing it toward the light receiver.

10. An electronic device, characterized in that, Includes the optical isolation chip as described in any one of claims 1-9.

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