Camera module

Abstract

The utility model discloses a camera module. The camera module can comprise a power conversion module, an image sensor module, an image processing module, a memory module and a serializer module which are integrated on a first substrate, and an LED driving module and an LED which are integrated on a second substrate. The camera module further comprises a coaxial connector, a plug-in connector and a power supply connector. The power supply conversion module is connected with a first external power supply through a coaxial connector; the serializer module is connected with an external controller through a coaxial connector; the image sensor module is connected with the LED driving module through a plug-in connector; and the LED driving module is connected with a second external power supply through the power supply connector so as to receive power supply. The utility model provides a novel camera module.

Description

Technical Field

[0001] This application relates to the field of camera technology, and in particular to an in-vehicle camera module for in-vehicle image acquisition. Background Technology

[0002] Intelligent driving has become a crucial area of ​​innovation in the current automotive industry. Providing drivers with a safe and convenient driving experience remains a constant pursuit for researchers. Monitoring drivers through in-vehicle camera modules can enable various warnings and alerts, such as fatigue driving alerts, distracted driving alerts, and dangerous driving alerts. The applicant hopes to independently develop a new camera module tailored to their specific needs. Utility Model Content

[0003] To achieve the above objectives, this application discloses a camera module. The camera module has a novel structural design.

[0004] The first aspect of this application provides a camera module, the camera module comprising:

[0005] A power conversion module, an image sensor module, an image processing module, a storage module, and a serializer module are integrated on the first substrate.

[0006] And the LED driver module and LED integrated on the second substrate;

[0007] One end of the power conversion module is connected to a first external power source to receive a first supply voltage from the first external power source, and the other end is connected to an image sensor module, an image processing module, and a serializer module to convert the first supply voltage and output it to the image sensor module, the image processing module, and the serializer module.

[0008] One end of the image sensor module is connected to the image processing module, which is used to output the acquired raw video signal to the image processing module, and the other end is connected to the LED driver module, which is used to output the generated control signal to the LED driver module.

[0009] The image processing module is connected to the serializer module and is used to transmit the target video signal obtained after processing the original video signal to the serializer module.

[0010] The serializer module connects to an external controller and is used to transmit the target video signal to the external controller;

[0011] The storage module connects the image sensor module and the image processing module. It is used to store the configuration parameters of the image sensor module and the image processing module, and to configure the image sensor module and the image processing module according to the configuration parameters after power-on.

[0012] The LED driver module is connected to the image sensor module at one end and to the LED at the other end. It is used to receive control signals from the image sensor module to control the LED's light emission.

[0013] The LED driver module is also connected to a second external power supply to receive a second power supply voltage input.

[0014] Optionally, the camera module also includes: a coaxial connector, a mating connector, and a power connector;

[0015] The power conversion module is connected to a first external power source via a coaxial connector;

[0016] The serializer module connects to an external controller via a coaxial connector;

[0017] The image sensor module is connected to the LED driver module via a plug-in connector;

[0018] The LED driver module is connected to the second external power source in sequence via a plug-in connector and a power connector.

[0019] Optionally, the coaxial connector is connected to the power conversion module via inductors L7, L8, and R40, inductors L9 and R41, and capacitors C74, C78, ​​and C75, for outputting the first supply voltage received from the first external power source as the total input power of the first substrate. The coaxial connector is also connected to capacitor C77.

[0020] Optionally, the power conversion module includes power chip U1, power chip U4 and power chip U11;

[0021] Pin 1 of power chip U11 is connected to capacitors C236 and C235, and is connected to capacitor C234 and the total input power of the first substrate through resistor R300.

[0022] Pin 3 of power chip U11 outputs 3.8V power through inductor L113; pin 6 of power chip U11 outputs 1.1V power through inductor L114; pin 9 of power chip U11 outputs 1.8V power through inductor L115; pin 13 of power chip U11 is connected to capacitors C244 and C255 and outputs 3.3V power.

[0023] Pin 5 of power chip U11 is connected to inductor L114, capacitor C66, and a 1.1V power supply; pins 7, 8, and 15 of power chip U11 are connected to capacitors C238, C240, C239, and C241, and a 3.8V power supply; pin 10 of power chip U11 is connected to inductor L115, capacitor C245, and a 1.8V power supply; pin 11 of power chip U11 is connected to a 1.8V power supply via resistor R216.

[0024] Pin 1 of power chip U1 is connected to pin 2 of power chip U1, capacitor C246, and 3.8V power supply; pin 8 of power chip U1 is connected to resistor R219 and capacitor C254, and outputs 2.8V power supply.

[0025] Pin 8 of power chip U4 is connected to pin 5, pin 7 of power chip U4, capacitor C253, and 3.8V power supply; pin 2 of power chip U4 is connected to resistor R221, capacitor C252, and capacitor C250 through inductor L116, and outputs 1.2V power supply.

[0026] Optionally, the image sensor module includes an image sensor chip U2;

[0027] The 1.2V power supply is connected to pins J7, J5, J3, H8, H3, A6, A3, B2, D6, and E3 of the image sensor chip U2 via resistor R301; the 1.8V power supply is connected to pins H4, D1, and C6 of the image sensor chip U2 via resistor R8 and resistor R25; and the 2.8V power supply is connected to pins C3, E9, B8, and E7 of the image sensor chip U2 via resistor R1.

[0028] Optionally, the image processing module includes an image processing chip U17; a 1.1V power supply is connected to pins 63, 39, 33, and 10 of the image processing chip U17; a 3.3V power supply is connected to pins 5, 22, and 52 of the image processing chip U17; and a 1.8V power supply is connected to pins 68, 51, and 35 of the image processing chip U17.

[0029] Pin 48 of the image processing chip U17 is connected to pin 11 of the power supply chip U11 via resistor R214.

[0030] Pin A4 of image sensor chip U2 is connected to pin 66 of image processing chip U17 via resistor R201; pin B5 of image sensor chip U2 is connected to pin 64 of image processing chip U17 via resistor R19; pin B6 of image sensor chip U2 is connected to pin 65 of image processing chip U17 via resistor R21; pin D7 of image sensor chip U2 is connected to pin 2 of image processing chip U17 via resistor R208; pin H6 of image sensor chip U2 is connected to pin 58 of image processing chip U17; image sensor Pin J6 of chip U2 is connected to pin 57 of image processing chip U17; pin H5 of image sensor chip U2 is connected to pin 61 of image processing chip U17; pin H7 of image sensor chip U2 is connected to pin 60 of image processing chip U17; pin G7 of image sensor chip U2 is connected to pin 59 of image processing chip U17; pin B4 of image sensor chip U2 is connected to pin 34 of image processing chip U17; pin C2 of image sensor chip U2 is connected to pin 67 of image processing chip U17 through resistor R22.

[0031] Optionally, the memory module includes a memory chip U18; pin 1 of the memory chip U18 is connected to pin 44 of the image processing chip U17; pin 2 of the memory chip U18 is connected to pin 45 of the image processing chip U17; pin 6 of the memory chip U18 is connected to capacitor C222 and then to pin 47 of the image processing chip U17 via resistor R198; pin 5 of the memory chip U18 is connected to pin 46 of the image processing chip U17; and pin 8 of the memory chip U18 is connected to a 1.8V power supply.

[0032] Optionally, the serializer module includes a serial chip U5; pin 5 of the serial chip U5 is connected to pin 37 of the image processing chip U17; pin 6 of the serial chip U5 is connected to pin 36 of the image processing chip U17.

[0033] Pin 12 of the serial chip U5 is connected to the main input power supply of the first substrate through capacitor C77;

[0034] Pin 11 of the serial chip U5 is connected to a 1.8V power supply via resistor R39;

[0035] Pin 15 of serial chip U5 is connected to a 1.2V power supply via inductor L6; pin 16 of serial chip U5 is connected to a 1.8V power supply via resistor R57; pin 17 of serial chip U5 is connected to pin 48 of image processing chip U17 via resistor R296; pin 19 of serial chip U5 is connected to pin 27 of image processing chip U17; pin 20 of serial chip U5 is connected to pin 28 of image processing chip U17; pin 23 of serial chip U5 is connected to pin 25 of image processing chip U17; pin 24 of serial chip U5 is connected to pin 26 of image processing chip U17; pin 25 of serial chip U5 is connected to pin 48 of image processing chip U17. Pin 31 of U17 is connected; pin 26 of serial chip U5 is connected to pin 32 of image processing chip U17; pin 27 of serial chip U5 is connected to pin 23 of image processing chip U17; pin 28 of serial chip U5 is connected to pin 24 of image processing chip U17; pin 29 of serial chip U5 is connected to pin 29 of image processing chip U17; pin 30 of serial chip U5 is connected to pin 30 of image processing chip U17; pin 31 of serial chip U5 is connected to pin 38 of image processing chip U17 via resistor R60; pin 32 of serial chip U5 is connected to pin 43 of image processing chip U17 via resistor R98.

[0036] Optionally, the LED driver module includes an LED driver chip U19;

[0037] The mating connectors include connector COM2 and connector COM3;

[0038] The C5 pin of the image sensor chip U2 is connected to pin 4 of connector COM2 via resistor R295, and the 3rd pin of the LED driver chip U19 is connected to pin 4 of connector COM3.

[0039] Pin 6 of LED driver chip U19 is connected to the base (B) of oxide semiconductor field-effect transistor Q1; pin 7 of LED driver chip U19 is connected to the collector (C) of oxide semiconductor field-effect transistor Q1; the emitter (E) of oxide semiconductor field-effect transistor Q1 is connected to the LED through inductor L2.

[0040] Optionally, the power connector includes connector COM4, ​​pin 2 of connector COM4 is connected to the positive terminal of Schottky diode D3; pins 1 and 2 of connector COM2 are connected to resistor R289 and the negative terminal of Schottky diode D3.

[0041] A second aspect of this application provides a vehicle having a camera module as described above.

[0042] The camera module provided in this application features a new inter-module connection method and circuit design, realizing a new proprietary camera module design. Attached Figure Description

[0043] This application will be further described by way of exemplary embodiments, which will be described in detail with reference to the accompanying drawings. These embodiments are not limiting; in these embodiments, the same reference numerals denote the same structures, wherein:

[0044] Figure 1 This is an exemplary module composition diagram of a camera module shown according to some embodiments of this application;

[0045] Figure 2 This is an exemplary composition diagram of a power conversion module according to some embodiments of this application;

[0046] Figure 3 These are exemplary circuit schematics of a serializer module according to some embodiments of this application;

[0047] Figure 4 These are exemplary circuit schematics of a power conversion module according to some embodiments of this application;

[0048] Figure 5 These are exemplary circuit schematics of a memory module according to some embodiments of this application;

[0049] Figure 6 These are exemplary circuit schematics of an image sensor module according to some embodiments of this application;

[0050] Figure 7 This is an exemplary circuit schematic of an image processing module according to some embodiments of this application;

[0051] Figure 8 This is an exemplary circuit diagram of the connector between the first substrate and the second substrate and the power supply connector of the second substrate, according to some embodiments of this application.

[0052] Figure 9 This is an exemplary circuit schematic diagram of an LED module according to some embodiments of this application. Detailed Implementation

[0053] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0054] Unless otherwise defined, all technical and scientific terms used in this application have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains. The terminology used in this application and in its specification is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The terms "and / or" or "and / or" as used in this application include any and all combinations of one or more of the associated listed items. The term "vehicle" as used in this application can include, but is not limited to, moving machinery involved in the fields of land, water navigation, aviation, and aerospace, such as cars, passenger buses, large transport vehicles, trains, bullet trains, high-speed trains, subways, ships, airplanes, manned spacecraft, etc.

[0055] The following describes some embodiments of this application. It should be noted that the following description is for illustrative purposes and is not intended to limit the scope of protection of this application.

[0056] This application discloses a camera module, such as Figure 1 As shown, the camera module 100 may include a first substrate 110 and a second substrate 120. The first substrate 110 integrates a power conversion module 111, an image sensor module 112, an image processing module 113, a serializer module 114, a storage module 115, and a coaxial connector 116. The second substrate 120 integrates an LED driver module 121 and an LED 122, specifically an infrared LED.

[0057] like Figure 1 As shown, one end of the power conversion module 111 is connected to a first external power source (not shown) to receive a first supply voltage from the first external power source. The other end is connected to the image sensor module 112, the image processing module 113, and the serializer module 114 to convert the first supply voltage and output it to the image sensor module 112, the image processing module 113, and the serializer module 114. Specifically, the power conversion module 111 can step down a 9-16V voltage to 2.8V, 1.8V, 1.2V, 1.1V, etc., and output them to the corresponding modules.

[0058] like Figure 1 As shown, one end of the image sensor module 112 is connected to the image processing module 113, which is used to output the acquired raw video signal to the image processing module 113, and the other end is connected to the LED driver module 121, which is used to output the generated control signal to the LED driver module 121.

[0059] The image processing module 113 is connected to the serializer module 114 and is used to transmit the target video signal obtained after processing the original video signal (e.g., filtering, noise reduction, enhancement, dynamic adjustment, etc.) to the serializer module 114.

[0060] The serializer module 114 is connected to an external controller (not shown) and is used to transmit the target video signal to the external controller (not shown).

[0061] The storage module 115 is connected to the image sensor module 112 and the image processing module 113. It is used to store the configuration parameters of the image sensor module 112 and the image processing module 113, and to configure the image sensor module 112 and the image processing module 113 according to the configuration parameters after power-on.

[0062] One end of the LED driver module 121 is connected to the image sensor module 112, and the other end is connected to the LED 122. It is used to receive control signals from the image sensor module 112 to control the light emission of the LED 122.

[0063] The LED driver module 121 is also connected to a second external power supply (not shown in the figure) for receiving a second power supply voltage input from the second external power supply.

[0064] To achieve the connection between the substrate and the module, such as Figure 1 As shown, the camera module also includes: a coaxial connector 116, a mating connector 118, and a power connector 117 for connecting the second substrate to the power supply.

[0065] The first substrate 110 can receive an external first power supply voltage (e.g., 9-16V) from a first external power source (not shown in the figure) via a coaxial connector 116. This external first power supply voltage is used as the total power input of the first substrate 110, providing input voltage for some or all modules on the first substrate 110. Simultaneously, the coaxial connector 116 is also used to realize signal transmission between the first substrate 110 and an external controller. Specifically, the coaxial connector 116 connects to external devices (including the first external power source, external controller, etc.) via a coaxial cable. The external devices provide voltage input to the camera module 100 through the coaxial cable and coaxial connector 116, and the camera module 100 outputs monitoring images through the coaxial cable and coaxial connector 116.

[0066] like Figure 1 As shown, in one embodiment, the power conversion module 111 can be connected to the coaxial connector 116 to receive the input of a first supply voltage, perform voltage conversion, and output the converted voltage to other modules on the first substrate 110, including the image sensor module 112, the image processing module 113, the serializer module 114, etc. The serializer module 114 can be connected to the coaxial connector 116 to transmit the received target video signal to an external controller via the coaxial connector 116. The external controller can be an on-board ECU.

[0067] The second substrate 120 can be connected to the first substrate 110 via a mating connector 118, and is connected to a second external power supply in sequence via the mating connector 118 and a power connector 117. The mating connector 118 specifically includes a connector 1181 connected to the image sensor module 112 and a connector 1182 connected to the LED driver module 121. Connector 1181 is disposed on the first substrate 110, and connector 1182 is disposed on the second substrate 120. Through these connectors, the modules on the second substrate 120 can receive a second power supply voltage and necessary control signals. For example, the LED driver module 121 on the second substrate 120 is connected to the image sensor module 112 via the mating connector 118 (in sequence via connectors 1182 and 1181) to receive a control signal from the image sensor module 112 for adjusting the exposure time. The LED driver module 121 controls the on-time of the LED 122 according to this control signal. For example, this control signal can be a strobe signal with a changing square wave waveform. The strobe light controls the illumination time of LED 122 during each frame image acquisition, thus avoiding constant illumination. This reduces the overall power consumption and heat generation of the entire camera module 100 while allowing it to quickly adapt to the surrounding lighting environment. LED 122 provides illumination based on the received control signal (i.e., the aforementioned strobe light), specifically using invisible light with a wavelength of 940nm to avoid interfering with occupants (including the driver and passengers) during operation, ensuring the safety of personnel and the vehicle. For example, LED driver module 121 can be connected to a second external power supply sequentially via connector 1182, connector 1181, and power connector 117 to receive a second supply voltage from the second external power supply and further provide this second supply voltage to LED 122.

[0068] This application provides a novel camera module with new connection and circuit designs for each module. Furthermore, this new camera module can reduce overall power consumption and heat generation during long-term operation without affecting image quality.

[0069] The circuit structure of each module described above is explained below. It should be noted that the following description is merely exemplary and is not intended to be limiting.

[0070] Figure 2 The circuit architecture associated with the power conversion module 111 in some embodiments of this application is shown, such as Figure 2As shown, in some embodiments, the power conversion module 111 may include three voltage conversion elements: a first conversion element 210, a second conversion element 220, and a third conversion element 230. The first conversion element 210 can be implemented by a power management chip (PMIC), which accepts an external voltage input (such as the previously mentioned 9-16V input voltage) and performs voltage conversion. One example is that the PMIC can be implemented by a 3-channel Buck circuit (denoted as Buck1, Buck2, and Buck3) and a 1-channel LDO circuit (denoted as LDO). The input 9-16V voltage is stepped down by Buck1 to output 3.8V. This 3.8V voltage can be used as the input voltage for Buck2, Buck3, and LDO, and will also be output to the second conversion element 220 and the third conversion element 230 as input voltages. Buck2 can be stepped down to output 1.1V, Buck3 can be stepped down to output 1.8V, and LDO can be converted to output 3.3V. These output voltages will be input to power subsequent modules, including image sensor module 112, image processing module 113, and serializer module 114. The second conversion element 220 may be a buck converter to convert the input 3.8V to 1.2V and output it to image sensor module 112 and serializer module 114. The third conversion element 230 may be a low-dropout regulator to convert the input 3.8V to 2.8V and output it to image sensor module 112.

[0071] Figure 3 The circuit architecture 300 associated with the serializer module in some embodiments of this application is shown, such as Figure 3As shown, the circuit architecture 300 may include a coaxial connector COM1 (i.e., the coaxial connector 116 mentioned above), a MAX96717F serial chip U5, a diode D2, a ferrite bead FB1, inductors L7, L8, and L9, a 25MHz passive crystal oscillator Y2, and capacitors C69, C70, C71, C72, C73, C74, C75, C76, C77, C78, ​​and C79. The following resistors are used: C80, C81, C82, C83, C84, C85, C86; R39, R40, R41, R46, R51, R57, R58, R59, R60, R63, R64, R65, R66, R67, R68, R69, R70, R71, and R98. Pins 2, 18, 21, and 22 of the serial chip U5 are left unconnected. Pin 1 is connected to one end of resistor R66 and one end of capacitor C85; pin 3 is connected to one end of resistor R68 and one end of resistor R70; pin 4 is connected to one end of resistor R69 and one end of resistor R71; pin 5 is connected to one end of resistor R59 and image processing chip U17 (this image processing chip U17 belongs to the image processing module, and can be referenced at the same time). Figure 7 Pin 37 of the relevant content is connected; pin 6 is connected to one end of resistor R58 and pin 36 of the image processing chip U17; pin 7 is connected to one end of resistor R67 and one end of capacitor C86; pin 8 is connected to one end of resistor R64, one end of resistor R65, and one end of capacitor C83 via resistor R63; the other end of resistor R65 is connected to pin 1 of the 25MHz passive crystal oscillator; pin 9 is connected to pin 3 of the 25MHz passive crystal oscillator, the other end of resistor R64, and one end of capacitor C84; pin 10 is grounded via resistor R46; pin 11 is connected to one end of capacitor C72 and one end of capacitor C73; and pin 11 is connected to a 1.8V power supply via resistor R39 (e.g., provided by a power conversion module, see also [reference]). Figure 4 (Related content), pin 12 is connected to one end of capacitor C77 and grounded through diode D2. Pin 13 is grounded first through capacitor C76 and then through resistor R51. Pin 14 is connected to one end of capacitor C79 and one end of capacitor C80. Pin 15 is connected to one end of capacitor C69, one end of capacitor C70, and one end of capacitor C71, and connected to a 1.2V power supply through inductor L6 (e.g., provided by a power conversion module; see also [reference]). Figure 4(Related content), pin 16 is connected to one end of capacitor C81, one end of capacitor C82, the other end of resistor R58, and the other end of resistor R59. It is then connected to a 1.8V power supply via resistor R57 (e.g., provided by a power conversion module; see also [link to relevant content]). Figure 4 (Related content), pin 17 is connected to pin 48 of image processing chip U17 via resistor R296; pin 19 is connected to pin 27 of image processing chip U17; pin 20 is connected to pin 28 of image processing chip U17; pin 23 is connected to pin 25 of image processing chip U17; pin 24 is connected to pin 26 of image processing chip U17; pin 25 is connected to pin 31 of image processing chip U17; pin 26 is connected to pin 32 of image processing chip U17; pin 27 is connected to pin 23 of image processing chip U17; pin 28 is connected to pin 24 of image processing chip U17; pin 29 is connected to pin 29 of image processing chip U17; pin 30 is connected to pin 30 of image processing chip U17; pin 31 is connected to pin 38 of image processing chip U17 via resistor R60; and pin 32 is connected to pin 43 of image processing chip U17 via resistor R98.

[0072] One end of coaxial connector COM1 is connected to the other end of capacitor C77. It is then connected via inductors L7 and L8 in parallel with resistors R40 and R41, and further connected to one end of capacitors C74, C78, ​​and C75, and subsequently to the power conversion module. This module outputs the first supply voltage received from the first external power source as the total power input to the first substrate. The other ends of resistors R66, R67, R68, and R69 are connected to a 1.8V voltage. Pin 33 of serial chip U5, pin 2 of 25M passive crystal oscillator Y2, pin 4 of 25M passive crystal oscillator Y2, the other end of COM1, the other end of capacitor C83, the other end of capacitor C84, the other end of capacitor C85, the other end of capacitor C86, the other end of resistor R70, the other end of resistor R71, the other end of capacitor C74, the other end of capacitor C78, ​​the other end of capacitor C75, the other end of capacitor C79, the other end of capacitor C80, the other end of capacitor C69, the other end of capacitor C70, the other end of capacitor C71, the other end of capacitor C72, and the other end of capacitor C73 are connected to ground.

[0073] Figure 4 The circuit architecture 400 associated with the power conversion module in some embodiments of this application is shown. For example... Figure 4As shown, the circuit architecture 400 may include LN20042 / 1Q1 power chip U1, SA23002 power chip U4, SA47302 power chip U11, capacitors C66, C234, C235, C236, C237, C238, C239, C240, C241, C242, C243, C245, C246, C250, C251, C252, C253, C254, C255, inductors L113, L114, L115, L116, resistors R216, R219, R220, R221, R222, R294, and R300. Pin 1 of the aforementioned power chip U11 is connected to one end of capacitor C236 and one end of capacitor C235, and is connected to capacitor C234 and the main input power supply of the first substrate through resistor R300; pin 2 of power chip U11 is connected to ground through resistor R294; pin 3 of power chip U11 outputs 3.8V power through inductor L113. Pin 4 of power chip U11 is connected to the other end of capacitor C237; pin 5 is connected to one end of inductor L114, one end of capacitor C66, and a 1.1V power supply; pin 6 outputs 1.1V power through inductor L114. Pins 7, 8, and 15 of power chip U11 are connected to one end of capacitor C238, one end of capacitor C240, one end of capacitor C239, one end of capacitor C241, and a 3.8V power supply. Pin 9 of power chip U11 is connected to one end of inductor L115, outputting 1.8V power. Pin 10 of power chip U11 is connected to the other end of inductor L115, one end of capacitor C245, and the 1.8V power supply. Pin 11 of power chip U11 is connected to pin 48 of image processing chip U17 via resistor R214, and also to the 1.8V power supply via resistor R216. Pin 12 of power chip U11 is connected to ground via capacitor C242, pin 16 is connected to ground via capacitor C243, and pin 13 is connected to one end of capacitor C244 and one end of capacitor C255, outputting 3.3V power. Pin 6 of power chip U1 is left floating, and pin 1 is connected to pin 2 of power chip U1, one end of capacitor C246, and the 3.8V power supply. Pin 5 of power chip U1 is connected to ground via capacitor C251. Pin 7 is connected to one end of resistor R219 and one end of resistor R220. Pin 8 is connected to the other end of resistor R219 and one end of capacitor C254, and outputs a 2.8V power supply. Pin 8 of power chip U4 is connected to pin 5, pin 7, one end of capacitor C253, and a 3.8V power supply.Pin 2 of power chip U4 is connected to one end of resistor R221, one end of capacitor C252, and one end of capacitor C250 via inductor L116, and outputs a 1.2V power supply. Pin 4 of power chip U4 is connected to the other end of resistor R221, one end of resistor R222, and the other end of capacitor C252. Pins 14 and 17 of power chip U11, pins 3, 4, and 9 of power chip U1, pins 1, 3, 6, and 9 of power chip U4, the other end of capacitor C234, C235, C236, C239, C240, C241, C66, C244, C245, C255, C246, R220, C254, C253, C250, and R222 are all connected to ground.

[0074] Figure 5 A circuit architecture 500 related to a memory module according to some embodiments of this application is shown. For example... Figure 5 As shown, the circuit architecture 500 may include a memory chip U18 (specifically, an 8M memory chip), capacitors C23 and C93, resistors R6, R7, and R211. Pin 1 of the memory chip U18 is connected to one end of resistor R7 and pin 44 of the image processing chip U17; pin 2 is connected to pin 45 of the image processing chip U17; pin 3 is connected to one end of resistor R6 and one end of capacitor C93; pin 7 is connected to one end of resistor R211; pin 6 is connected to one end of capacitor C222; and pin 6 is connected to pin 47 of the image processing chip U17 via resistor R198. Pin 5 of the memory chip U18 is connected to pin 46 of the image processing chip U17; pin 8, the other end of resistor R6, the other end of resistor R7, the other end of resistor R211, and the first segment of capacitor C23 are connected to a 1.8V power supply. Pin 4 of memory chip U18, pin 9 of memory chip U18, the other end of capacitor C93, and the other end of capacitor C23 are connected to ground.

[0075] Figure 6 A circuit architecture 600 related to an image sensor module is shown in some embodiments of this application. For example... Figure 6As shown, the circuit architecture 600 may include an OV2311 image sensor chip U2, capacitors C1, C2, C3, C4, C5, C6, C7, C8, C9, C10, C11, C12, C13, C14, C15, C16, C27, C28, C29, C39, C40, C42, and C46, ​​and resistors R1, R8, R13, R14, R19, R21, R22, R25, R26, R34, R36, R37, R38, and R301. Pins A1, A2, A8, A9, B1, B9, H1, H9, J1, J2, J8, J9, G3, G2, G1, F1, F2, E1, E2, D2, C1, D3, F3, and H2 of the aforementioned image sensor chip U2 are all left floating. Pin A4 of the image sensor chip U2 is connected to capacitor C161 and is also connected to pin 66 of the image processing chip U17 through resistor R201. Pin C5 of image sensor chip U2 is connected to pin 4 of 5-pin connector COM2 via resistor R295. Pin B5 is connected to pin 64 of image processing chip U17 and one end of resistor R13 via resistor R19. Pin B6 is connected to pin 65 of image processing chip U17 and one end of resistor R14 via resistor R21. Pin D7 is connected to pin 2 of image processing chip U17 via resistor R208. Pin H6 is connected to pin 58 of image processing chip U17. Connect pin J6 to pin 57 of image processing chip U17, pin H5 to pin 61 of image processing chip U17, pin H7 to pin 60 of image processing chip U17, pin G7 to pin 59 of image processing chip U17, pin B4 to pin 34 of image processing chip U17, pin C2 to pin 67 of image processing chip U17 through resistor R22, and pin A5 to one end of resistor R25 and one end of resistor R26. The 1.2V power supply is connected through resistor R301 to pins J7, J5, J3, H8, H3, A6, A3, B2, D6, and E3 of the image sensor chip U2, as well as one end of capacitors C1, C2, C3, C4, C5, C6, C7, C8, C9, C10, and C11. The 1.8V power supply is connected to the other ends of resistors R13 and R14.The 1.8V power supply is connected through resistors R8 and R25, to pins H4, D1, and C6 of image sensor chip U2, and to one end of capacitors C27, C28, and C29. The 2.8V power supply is connected through resistor R1 to pins C3, E9, B8, and E7 of image sensor chip U2, and to one end of capacitors C12, C13, C14, C15, and C16. Pin C9 of image sensor chip U2 is connected to one end of resistor R34; pin C7 is connected to one end of resistor R36; pin C4 is connected to one end of resistor R37; pin A7 is connected to one end of resistor R38; pin D8 is connected to one end of capacitor C46; pin G9 is connected to one end of capacitor C42; pin F9 is connected to one end of capacitor C40; and pin E8 is connected to one end of capacitor C39. The J4, D4, D5, C8, F7, F8, G4, G6, G8, B3, D9 pins of the image sensor chip U2, the other end of capacitor C1, the other end of capacitor C2, the other end of capacitor C3, the other end of capacitor C4, the other end of capacitor C5, the other end of capacitor C6, the other end of capacitor C7, the other end of capacitor C8, the other end of capacitor C9, the other end of capacitor C10, the other end of capacitor C11, the other end of capacitor C12, the other end of capacitor C13, the other end of capacitor C14, the other end of capacitor C15, the other end of capacitor C16, the other end of capacitor C27, the other end of capacitor C28, the other end of capacitor C29, the other end of capacitor C39, the other end of capacitor C40, the other end of capacitor C42, the other end of capacitor C46, ​​the other end of resistor R34, the other end of resistor R36, the other end of resistor R37, the other end of resistor R38, and the other end of resistor R26 are all connected to ground.

[0076] Figure 7 The circuit architecture 700 associated with the image processing module in some embodiments of this application is shown. For example... Figure 7As shown, the circuit architecture 700 may include an FH8332 image processing chip U17, a 27MHz passive crystal oscillator Y1, and capacitors C87, C88, C159, C161, C213, C214, C215, C216, C217, C218, C219, C220, C222, C223, C224, and C225. 5. Capacitors C226, C227, C228, C229, and C230; Resistors R198, R199, R201, R203, R204, R205, R206, R208, R209, R210, R212, R213, R214, R215, and R296. Pins 2, 3, 4, 9, 67, 53, 54, 55, 56, 11, 12, 13, 14, 15, 16, 17, 19, and 20 of the aforementioned image processing chip U17 are all left floating. A 1.1V power supply is connected to pins 63, 39, 33, and 10 of the image processing chip U17, one end of capacitor C216, one end of capacitor C215, one end of capacitor C214, and one end of capacitor C213. Pin 8 of the image processing chip U17 is connected to ground via capacitor C217. Pin 6 is connected to pin 1 of the 27MHz passive crystal oscillator via resistor R212, one end of resistor R213, and one end of capacitor C87. Pin 7 of the image processing chip U17 is connected to pin 3 of the 27MHz passive crystal oscillator, the other end of resistor R213, and one end of capacitor C88. A 3.3V power supply is connected to pins 5, 22, and 52 of the image processing chip U17, one end of capacitor C218, one end of capacitor C219, one end of capacitor C225, one end of capacitor C226, one end of capacitor C228, and one end of capacitor C229. Pin 1 of the image processing chip U17 is connected to ground via capacitor C220. The 1.8V power supply is connected to pins 68, 51, and 35 of the image processing chip U17, one end of capacitors C230, C223, and C224, one end of resistors R205, R206, R210, R203, R204, and R215. Pin 51 of the image processing chip U17 is connected to the other end of resistor R215 and one end of capacitor C159; pin 40 is connected to the other end of resistor R205; pin 41 is connected to the other end of resistor R206; and pin 42 is connected to the other end of resistor R210 and resistor R209 via resistor R199.Pin 49 of the image processing chip U17 is connected to the other end of resistor R203, pin 50 is connected to the other end of resistor R204, and pin 21 is connected to ground through capacitor C227. Pins 69 and 18 of the image processing chip U17, pin 2 and pin 4 of the 27MHz passive crystal oscillator, the other end of capacitors C87, C88, C216, C213, C214, C215, C218, C219, C230, C2161, C228, C229, C159, C223, C222, C224, C225, C226, and the other end of resistor R209 are all grounded.

[0077] Figure 8 The circuit architecture 800 associated with the mating connector between the first substrate and the second substrate, and the power connector of the second substrate, is shown in some embodiments of this application. Figure 8As shown, the circuit architecture 800 may include a 2-pin connector COM4 (i.e., the power connector 117 mentioned above), a 5-pin first substrate connector COM2 (or 5-pin connector COM2, i.e., connector 1181 mentioned above), a Schottky diode D3, a transient voltage suppressor diode D5, capacitors C162, C163, C257, and C258, an inductor L28, an inductor L117, a resistor R289, and a resistor R295. Pin 2 of the 2-pin connector COM4 is connected to one end of inductor L117, one end of capacitor C258, and the transient voltage suppressor diode D5. The other end of inductor L117 is connected to one end of inductor L28, one end of capacitor C163, and one end of capacitor C257. The other end of inductor L28 is connected to the anode of Schottky diode D3 and one end of capacitor C162. Pins 1 and 2 of the 5-pin connector COM2 are connected to one end of resistor R289 and the negative terminal of Schottky diode D3. Pins 1, 3, and 4 of the 2-pin connector COM4, ​​pins 3 and 5 of the 5-pin connector COM2, the other ends of capacitors C162, C163, C257, and C258 are all connected to ground. With this circuit configuration, the 2-pin connector COM4 can transmit the second power supply voltage received from the outside through its own pin 2 to pins 1 and 2 of the 5-pin connector COM2, and further transmit it to the LED driver module of the second substrate through the 5-pin connector COM3 (i.e., connector 1182 mentioned above). Additionally, in this application, the first substrate's total input power supply is connected to resistor R289 to connect the first substrate's total input power supply and COM4, ​​so that when the second external power supply cannot power the second substrate through COM4, ​​COM2, and COM3, the first substrate's total input power supply can serve as an alternative input power supply for the second substrate.

[0078] Figure 9 A circuit architecture 900 related to an LED module is shown in some embodiments of this application. For example... Figure 9As shown, the circuit architecture 900 may include an LM3409 LED driver chip U19, a 5-pin second substrate connector COM3 (or 5-pin connector COM3, i.e., connector 1182 mentioned above), a Schottky diode D1, an oxide semiconductor field-effect transistor Q1, infrared lamps LED1 and LED2, inductors L1 and L2, capacitors C259, C260, C261, C262, and C264, and resistors R2, R3, R4, R302, and R303. Pins 1 and 2 of the 5-pin connector COM3 are connected to one end of inductor L1 and one end of capacitor C259. Pin 4 of the 5-pin connector COM3 is connected to pin 3 of the LED driver chip U19 and one end of resistor R4. Pins 8 and 10 of LED driver chip U19 are connected to one end of capacitor C260, one end of capacitor C262, the other end of inductor L1, one end of resistor R5, and one end of resistor R302. Pin 1 of LED driver chip U19 is connected to one end of resistor R2 and the other end of resistor R302; pin 2 is connected to one end of resistor R3 and one end of capacitor C261; pin 4 is connected to one end of resistor R303 and one end of capacitor C263; pin 6 is connected to the base (B) of oxide semiconductor field-effect transistor Q1; pin 7 is connected to the collector (C) of oxide semiconductor field-effect transistor Q1 and the other end of resistor R5; pin 9 is connected to the other end of capacitor C260. The emitter (E) of oxide semiconductor field-effect transistor Q1 is connected to the negative terminal of Schottky diode D1 and one end of inductor L2. Inductor L2 is connected to the other end of R303, one end of capacitor C264, and the positive terminal of infrared lamp LED1. The negative terminal of infrared lamp LED1 is connected to the positive terminal of infrared lamp LED2. Pins 5 and 9 of the LED driver chip U19, pins 3 and 5 of the 5-pin connector COM3, the negative terminal of the infrared lamp LED2, the positive terminal of the Schottky diode D1, the other end of resistor R2, the other end of resistor R3, the other end of resistor R4, the other end of capacitor C261, the other end of capacitor C263, the other end of capacitor C262, the other end of capacitor C259, and the other end of capacitor C264 are all connected to ground.

[0079] This application also discloses a vehicle that may include the camera module described above.

[0080] This application has described the basic concepts. Obviously, for those skilled in the art, the above detailed disclosure is merely illustrative and does not constitute a limitation of this specification. Although not explicitly stated herein, those skilled in the art may make various modifications, improvements, and corrections to this specification. Such modifications, improvements, and corrections are suggested in this specification, and therefore, such modifications, improvements, and corrections still fall within the spirit and scope of the exemplary embodiments of this specification.

[0081] It should be understood that the embodiments described in this specification are merely illustrative of the principles of the embodiments described herein. Other variations may also fall within the scope of this specification. Therefore, alternative configurations of the embodiments described herein are intended to be consistent with the teachings of this specification, rather than as examples or limitations. Accordingly, the embodiments described herein are not limited to those explicitly introduced and described herein.

[0082] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0083] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A camera module, characterized in that, The camera module includes: A power conversion module, an image sensor module, an image processing module, a storage module, and a serializer module are integrated on the first substrate. And the LED driver module and LED integrated on the second substrate; One end of the power conversion module is connected to a first external power source to receive a first supply voltage from the first external power source, and the other end is connected to the image sensor module, the image processing module, and the serializer module to convert the first supply voltage and output it to the image sensor module, the image processing module, and the serializer module. One end of the image sensor module is connected to the image processing module, which is used to output the acquired raw video signal to the image processing module, and the other end is connected to the LED driver module, which is used to output the generated control signal to the LED driver module; The image processing module is connected to the serializer module and is used to transmit the target video signal obtained after processing the original video signal to the serializer module. The serializer module is connected to an external controller and is used to transmit the target video signal to the external controller; The storage module is connected to the image sensor module and the image processing module, and is used to store configuration parameters for configuring the image sensor module and the image processing module, and to configure the image sensor module and the image processing module according to the configuration parameters after power-on; The LED driver module is connected to the image sensor module at one end and to the LED at the other end, and is used to receive the control signal from the image sensor module to control the light emission of the LED; The LED driver module is also connected to a second external power source for receiving a second power supply voltage input from the second external power source.

2. The camera module according to claim 1, characterized in that, The camera module also includes: a coaxial connector, a mating connector, and a power connector; The power conversion module is connected to the first external power source via the coaxial connector; The serializer module is connected to the external controller via the coaxial connector; The image sensor module is connected to the LED driver module via the plug-in connector; The LED driver module is connected to the second external power source in sequence through the plug-in connector and the power connector.

3. The camera module according to claim 2, characterized in that, The coaxial connector is connected to the power conversion module via inductors L7, L8, and R40, inductors L9 and R41, and capacitors C74, C78, ​​and C75, for outputting the first power supply voltage received from the first external power source as the total input power of the first substrate; the coaxial connector is also connected to capacitor C77.

4. The camera module according to claim 3, characterized in that, The power conversion module includes power chip U1, power chip U4 and power chip U11. Pin 1 of the power chip U11 is connected to capacitors C236 and C235, and is connected to capacitor C234 and the total input power of the first substrate through resistor R300. The power chip U11 outputs 3.8V power through inductor L113; the power chip U11 outputs 1.1V power through inductor L114; the power chip U11 outputs 1.8V power through inductor L115; the power chip U11 outputs 3.3V power through pin 3 of the power chip U11 connected to capacitors C244 and C255. Pin 5 of the power chip U11 is connected to inductor L114, capacitor C66, and the 1.1V power supply; pins 7, 8, and 15 of the power chip U11 are connected to capacitors C238, C240, C239, and C241, and the 3.8V power supply; pin 10 of the power chip U11 is connected to inductor L115, capacitor C245, and the 1.8V power supply; pin 11 of the power chip U11 is connected to the 1.8V power supply via resistor R216. Pin 1 of the power chip U1 is connected to pin 2 of the power chip U1, capacitor C246, and the 3.8V power supply; pin 8 of the power chip U1 is connected to resistor R219 and capacitor C254, and outputs 2.8V power. Pin 8 of the power chip U4 is connected to pin 5 of the power chip U4, pin 7 of the power chip U4, capacitor C253, and the 3.8V power supply; pin 2 of the power chip U4 is connected to resistor R221, capacitor C252, and capacitor C250 through inductor L116, and outputs a 1.2V power supply.

5. The camera module according to claim 4, characterized in that, The image sensor module includes an image sensor chip U2; The 1.2V power supply is connected to pins J7, J5, J3, H8, H3, A6, A3, B2, D6, and E3 of the image sensor chip U2 via resistor R301; the 1.8V power supply is connected to pins H4, D1, and C6 of the image sensor chip U2 via resistors R8 and R25; and the 2.8V power supply is connected to pins C3, E9, B8, and E7 of the image sensor chip U2 via resistor R1.

6. The camera module according to claim 5, characterized in that, The image processing module includes an image processing chip U17; The 1.1V power supply is connected to pins 63, 39, 33, and 10 of the image processing chip U17; the 3.3V power supply is connected to pins 5, 22, and 52 of the image processing chip U17; and the 1.8V power supply is connected to pins 68, 51, and 35 of the image processing chip U17. Pin 48 of the image processing chip U17 is connected to pin 11 of the power supply chip U11 via resistor R214. The image sensor chip U2's A4 pin is connected to the image processing chip U17's pin 66 via resistor R201; the image sensor chip U2's B5 pin is connected to the image processing chip U17's pin 64 via resistor R19; the image sensor chip U2's B6 pin is connected to the image processing chip U17's pin 65 via resistor R21; the image sensor chip U2's D7 pin is connected to the image processing chip U17's pin 2 via resistor R208; the image sensor chip U2's H6 pin is connected to the image processing chip U17's pin 58; the image sensor... Pin J6 of chip U2 is connected to pin 57 of image processing chip U17; pin H5 of image sensor chip U2 is connected to pin 61 of image processing chip U17; pin H7 of image sensor chip U2 is connected to pin 60 of image processing chip U17; pin G7 of image sensor chip U2 is connected to pin 59 of image processing chip U17; pin B4 of image sensor chip U2 is connected to pin 34 of image processing chip U17; pin C2 of image sensor chip U2 is connected to pin 67 of image processing chip U17 through resistor R22.

7. The camera module according to claim 6, characterized in that, The storage module includes a storage chip U18; Pin 1 of the memory chip U18 is connected to pin 44 of the image processing chip U17; pin 2 of the memory chip U18 is connected to pin 45 of the image processing chip U17; pin 6 of the memory chip U18 is connected to capacitor C222 and connected to pin 47 of the image processing chip U17 through resistor R198; pin 5 of the memory chip U18 is connected to pin 46 of the image processing chip U17; and pin 8 of the memory chip U18 is connected to the 1.8V power supply.

8. The camera module according to claim 7, characterized in that, The serializer module includes a serial chip U5; Pin 5 of the serial chip U5 is connected to pin 37 of the image processing chip U17; pin 6 of the serial chip U5 is connected to pin 36 of the image processing chip U17. Pin 12 of the serial chip U5 is connected to the main input power supply of the first substrate through capacitor C77. Pin 11 of the serial chip U5 is connected to the 1.8V power supply via resistor R39; Pin 15 of the serial chip U5 is connected to the 1.2V power supply via inductor L6; pin 16 of the serial chip U5 is connected to the 1.8V power supply via resistor R57; pin 17 of the serial chip U5 is connected to pin 48 of the image processing chip U17 via resistor R296; pin 19 of the serial chip U5 is connected to pin 27 of the image processing chip U17; pin 20 of the serial chip U5 is connected to pin 28 of the image processing chip U17; pin 23 of the serial chip U5 is connected to pin 25 of the image processing chip U17; pin 24 of the serial chip U5 is connected to pin 26 of the image processing chip U17; pin 25 of the serial chip U5 is connected to the image processing chip U17... Pin 31 of U17 is connected; pin 26 of the serial chip U5 is connected to pin 32 of the image processing chip U17; pin 27 of the serial chip U5 is connected to pin 23 of the image processing chip U17; pin 28 of the serial chip U5 is connected to pin 24 of the image processing chip U17; pin 29 of the serial chip U5 is connected to pin 29 of the image processing chip U17; pin 30 of the serial chip U5 is connected to pin 30 of the image processing chip U17; pin 31 of the serial chip U5 is connected to pin 38 of the image processing chip U17 via resistor R60; pin 32 of the serial chip U5 is connected to pin 43 of the image processing chip U17 via resistor R98.

9. The camera module according to claim 5, characterized in that, The LED driver module includes an LED driver chip U19; The mating connector includes connector COM2 and connector COM3; The C5 pin of the image sensor chip U2 is connected to the 4th pin of the connector COM2 via resistor R295, and the 3rd pin of the LED driver chip U19 is connected to the 4th pin of the connector COM3. Pin 6 of the LED driver chip U19 is connected to the base (B) of the oxide semiconductor field-effect transistor Q1; pin 7 of the LED driver chip U19 is connected to the collector (C) of the oxide semiconductor field-effect transistor Q1; and the emitter (E) of the oxide semiconductor field-effect transistor Q1 is connected to the LED through inductor L2.

10. The camera module according to claim 9, characterized in that, The power connector includes connector COM4, ​​pin 2 of which is connected to the positive terminal of Schottky diode D3; and pins 1 and 2 of connector COM2 are connected to resistor R289 and the negative terminal of Schottky diode D3.

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