Multi-layer PCB

Abstract

The utility model discloses a multilayer PCB, comprising a multilayer board structure, the lower side of the multilayer board structure is provided with two support boards, the bottom of each support board is fixedly provided with a shock insulation pad, and the support boards are provided with two shock absorption mechanisms connected with the multilayer board structure. The damping mechanism comprises a supporting frame, a guide rod, a bottom plate, a spring, a connecting table, a heightening frame, a micro damper and a conduction ball head, the supporting frame is fixed to the supporting plate, the guide rod is slidably installed on the supporting frame, the bottom plate is fixed to the bottom of the guide rod, the spring is fixedly installed on the bottom plate, the upper end of the spring is fixed to the supporting frame, and the connecting table is fixed to the top of the guide rod; the upper end of the connecting table is fixed to the multi-layer plate structure, the outer surface of the connecting table is in a circular truncated cone shape, the miniature damper is fixedly installed on the heightening frame, the movable end of the miniature damper is fixed to the conduction ball head, and the conduction ball head is in sliding contact with the connecting table. The multi-layer circuit board is good in damping performance, and the influence of vibration on the multi-layer circuit board is reduced.

Description

TECHNICAL FIELD

[0001] The utility model relates to circuit board technical field especially relates to a multilayer PCB. BACKGROUND

[0002] The name of circuit board has: ceramic circuit board, alumina ceramic circuit board, aluminum nitride ceramic circuit board, circuit board, PCB board, aluminum substrate, high frequency board, thick copper plate, impedance board, PCB, super thin circuit board, super thin circuit board, printing (copper etching technology) circuit board etc.

[0003] The multilayer circuit board is one kind of circuit board, and the height is integrated, and the performance is better. A large number of electronic components will be installed on the multilayer circuit board, but the shock absorption performance of the existing multilayer circuit board is poor, which leads to that the vibration is easy to cause great influence on the electronic components, therefore, in view of the above status, it is urgent to develop a multilayer PCB with good shock absorption performance and reducing the influence of vibration on the multilayer circuit board, so as to overcome the deficiency in the current actual application and meet the current demand. UTILITY MODEL CONTENT

[0004] The utility model discloses a multilayer PCB to solve the problem in the background art.

[0005] In order to achieve the above object, the utility model adopts the following technical scheme:

[0006] A multilayer PCB, including multilayer board structure, support plate, rubber support column and shock absorption mechanism, the downside of multilayer board structure is provided with two support plates, and the bottom of each support plate is fixed with an anti-seismic pad, a plurality of rubber support columns connected with multilayer board structure are fixed on the support plate, two shock absorption mechanisms connected with multilayer board structure are installed on the support plate, the shock absorption mechanism includes: support frame, guide rod, bottom plate, spring, connecting table, heightening stand, micro damper and conductive ball head, the support frame is fixed on the support plate, the guide rod is slidably installed on the support frame, the bottom of the guide rod is fixed with the bottom plate, the spring is fixedly installed on the bottom plate, the upper end of the spring is fixed with the support frame, the top of the guide rod is fixed with the connecting table, the upper end of the connecting table is fixed with the multilayer board structure, the outer surface of the connecting table is in the shape of a circular truncated cone, the diameter of the connecting table gradually decreases from top to bottom, the heightening stand is fixed on the support plate, the micro damper is fixedly installed on the heightening stand, the movable end of the micro damper is fixed with the conductive ball head, and the conductive ball head is in sliding contact with the connecting table.

[0007] Preferably, the left and right ends of the support plate are provided with an installation hole, and the installation hole is used for installing a bolt.

[0008] Preferably, the multilayer board structure comprises a top layer circuit board, a bottom layer circuit board, a middle layer circuit board, a first insulating partition plate and a second insulating partition plate, the first insulating partition plate is fixedly connected between the top layer circuit board and the middle layer circuit board, and the second insulating partition plate is fixedly connected between the bottom layer circuit board and the middle layer circuit board.

[0009] Preferably, the multilayer board structure is fixedly connected with a heat dissipation mechanism on the left side and the right side.

[0010] Preferably, the heat dissipation mechanism comprises a heat-conducting adhesive strip and heat dissipation adhesive sheets, the heat-conducting adhesive strip is fixedly installed on the side surface of the multilayer board structure, and a plurality of heat dissipation adhesive sheets are fixedly installed on the heat-conducting adhesive strip.

[0011] Preferably, the heat-conducting adhesive strip and the heat dissipation adhesive sheets are made of polyurethane heat-conducting adhesive.

[0012] The multilayer PCB reduces vibration transmission to the multilayer board structure through the setting of the shock insulation pad, the rubber support column has a certain elastic deformation capacity and can buffer, when vibration causes the multilayer board structure to move downward, the multilayer board structure drives the connecting table, the guide rod and the bottom plate to move downward, the bottom plate drives the spring to deform and buffer, at the same time, the connecting table extrudes the conductive ball head when moving downward, the conductive ball head moves, the vibration force is transmitted to the miniature damper through the conductive ball head, the miniature damper absorbs and converts the vibration force, thereby reducing the influence of vibration on the multilayer circuit board. BRIEF DESCRIPTION OF DRAWINGS

[0013] Figure 1 It is a three-dimensional structure schematic view of the utility model.

[0014] Figure 2 It is a three-dimensional structure schematic view of the utility model Figure 1 It is a partial view of A in the middle.

[0015] Figure 3 It is a partial structure schematic view of the utility model.

[0016] LEGEND:

[0017] 1, multilayer board structure; 101, top layer circuit board; 102, bottom layer circuit board; 103, middle layer circuit board; 104, first insulating partition plate; 105, second insulating partition plate; 2, support plate; 201, shock insulation pad; 202, mounting hole; 3, rubber support column; 4, heat dissipation mechanism; 401, heat-conducting adhesive strip; 402, heat dissipation adhesive sheet; 5, damping mechanism; 501, support frame; 502, guide rod; 503, bottom plate; 504, spring; 505, connecting table; 506, heightening frame; 507, miniature damper; 508, conductive ball head. DETAILED DESCRIPTION

[0018] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of the present application.

[0019] Specific embodiments are given below.

[0020] Reference is made to Figures 1-3The utility model discloses an embodiment of a kind of multilayer PCB, including multilayer board structure 1, support plate 2, rubber support column 3 and damping mechanism 5, the downside of multilayer board structure 1 is provided with two support plate 2, the bottom of each support plate 2 is fixed with one shock insulation pad 201, reduce vibration transmission to multilayer board structure 1 by the setting of shock insulation pad 201, the left and right ends of support plate 2 are provided with one mounting hole 202, the mounting hole 202 is used to install bolt, bolt is fixed on external object by passing mounting hole 202, to fix support plate 2 and multilayer board structure 1, a plurality of rubber support column 3 connected with multilayer board structure 1 are fixed on support plate 2, rubber support column 3 has certain elastic deformation ability, can buffer, two damping mechanisms 5 connected with multilayer board structure 1 are installed on support plate 2, the damping mechanism 5 includes: support frame 501, guide rod 502, bottom plate 503, spring 504, connecting table 505, height increasing frame 506, micro damper 507 and transmission ball head 508, the support frame 501 is fixed on support plate 2, the guide rod 502 is slidably installed on the support frame 501, the bottom of guide rod 502 is fixed with bottom plate 503, spring 504 is fixedly installed on the bottom plate 503, the upper end of spring 504 is fixed with support frame 501, the top of guide rod 502 is fixed with connecting table 505, the upper end of connecting table 505 is fixed with multilayer board structure 1, the outer surface of connecting table 505 is circular truncated cone shape, the diameter of connecting table 505 gradually decreases from top to bottom, height increasing frame 506 is fixed on support plate 2, micro damper 507 is fixedly installed on height increasing frame 506, the movable end of micro damper 507 is fixed with transmission ball head 508, transmission ball head 508 is slidably contacted with connecting table 505, when vibration makes multilayer board structure 1 descend, connecting table 505, guide rod 502 and bottom plate 503 are driven to descend by multilayer board structure 1, bottom plate 503 drives spring 504 to generate deformation and buffer, simultaneously, transmission ball head 508 is extruded when connecting table 505 descends, so that transmission ball head 508 moves, vibration force is transmitted to micro damper 507 by transmission ball head 508, vibration force is absorbed and converted by micro damper 507, to reduce the influence of vibration on multilayer board structure 1.

[0021] The multilayer board structure 1 includes: a top layer circuit board 101, a bottom layer circuit board 102, a middle layer circuit board 103, a first insulating partition plate 104, and a second insulating partition plate 105.

[0022] Both left and right sides of the multilayer board structure 1 are fixedly connected with a heat dissipation mechanism 4, the heat dissipation mechanism 4 comprises: heat-conducting adhesive strips 401 and heat dissipation adhesive sheets 402, the heat-conducting adhesive strips 401 are fixedly installed on the side of the multilayer board structure 1, a plurality of heat dissipation adhesive sheets 402 are fixedly installed on the heat-conducting adhesive strips 401, the heat-conducting adhesive strips 401 and the heat dissipation adhesive sheets 402 are both made of polyurethane heat-conducting adhesive, the contact area of the multilayer board structure 1 and air is increased through the heat-conducting adhesive strips 401 and the heat dissipation adhesive sheets 402, and the heat dissipation performance of the multilayer board structure 1 is improved.

[0023] Working principle: when the multilayer PCB board is subjected to vibration, the vibration transmission to the multilayer board structure 1 is reduced through the setting of the shock isolation pad 201; the rubber support column 3 has a certain elastic deformation capacity and can buffer; when the multilayer board structure 1 is lowered due to vibration, the connecting table 505, the guide rod 502 and the bottom plate 503 are lowered through the multilayer board structure 1, the bottom plate 503 drives the spring 504 to deform and buffer, at the same time, the connecting table 505 is lowered to extrude the conductive ball head 508, so that the conductive ball head 508 moves, the vibration force is transmitted to the micro damper 507 through the conductive ball head 508, the vibration force is absorbed and converted through the micro damper 507, so that the influence of vibration on the multilayer board structure 1 is reduced.

[0024] The above is only the preferred specific embodiment of the present application, but the protection scope of the present application is not limited to this, any skilled person in the art can make equivalent replacement or change according to the technical scheme and the inventive concept of the present application within the technical range disclosed by the present application, which should be covered in the protection scope of the present application.

Claims

1. A multilayer PCB board, characterized in that, The system includes a multi-layer board structure (1), a support plate (2), rubber support columns (3), and a shock-absorbing mechanism (5). Two support plates (2) are provided on the lower side of the multi-layer board structure (1). A vibration isolation pad (201) is fixed to the bottom of each support plate (2). Multiple rubber support columns (3) connected to the multi-layer board structure (1) are fixed on the support plates (2). Two shock-absorbing mechanisms (5) connected to the multi-layer board structure (1) are installed on the support plates (2). Each shock-absorbing mechanism (5) includes: a support frame (501), a guide rod (502), a base plate (503), a spring (504), a connecting platform (505), a heightening frame (506), a miniature damper (507), and a conductive ball head (508). The support frame (501) is fixed to the support plate (2), and the support frame (501) slides... A guide rod (502) is installed, and a base plate (503) is fixed to the bottom of the guide rod (502). A spring (504) is fixedly installed on the base plate (503). The upper end of the spring (504) is fixed to the support frame (501). A connecting platform (505) is fixed to the top of the guide rod (502). The upper end of the connecting platform (505) is fixed to the multilayer board structure (1). The outer surface of the connecting platform (505) is shaped like a frustum. The diameter of the connecting platform (505) gradually decreases from top to bottom. The height-increasing frame (506) is fixed to the support plate (2). A miniature damper (507) is fixedly installed on the height-increasing frame (506). The movable end of the miniature damper (507) is fixed to the conductive ball head (508). The conductive ball head (508) slides in contact with the connecting platform (505).

2. The multilayer PCB board according to claim 1, characterized in that, The support plate (2) has a mounting hole (202) at both its left and right ends, and the mounting hole (202) is used to install bolts.

3. The multilayer PCB board according to claim 1, characterized in that, The multilayer board structure (1) includes: a top circuit board (101), a bottom circuit board (102), a middle circuit board (103), a first insulating partition (104), and a second insulating partition (105). The first insulating partition (104) is fixedly connected between the top circuit board (101) and the middle circuit board (103), and the second insulating partition (105) is fixedly connected between the bottom circuit board (102) and the middle circuit board (103).

4. The multilayer PCB board according to claim 1, characterized in that, A heat dissipation mechanism (4) is fixedly connected to both the left and right sides of the multi-layer board structure (1).

5. The multilayer PCB board according to claim 4, characterized in that, The heat dissipation mechanism (4) includes: a thermally conductive adhesive strip (401) and a heat dissipation sheet (402). The thermally conductive adhesive strip (401) is fixedly installed on the side of the multilayer board structure (1), and multiple heat dissipation sheets (402) are fixedly installed on the thermally conductive adhesive strip (401).

6. The multilayer PCB board according to claim 5, characterized in that, Both the thermally conductive strip (401) and the heat dissipation sheet (402) are made of polyurethane thermally conductive adhesive.

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