Laser device and laser processing equipment

Abstract

The utility model is applicable to the technical field of laser processing, and provides a laser device and laser processing equipment, the laser device comprises a first laser, a first collimation unit and a focusing unit; the first laser is used for emitting a first laser beam, and the first collimation unit and the focusing unit are arranged on a light path of the first laser beam; the first laser, the first collimation unit and the focusing unit are sequentially arranged along the light path of the first laser beam, and the distance between the first collimation unit and the first laser is adjustable. According to the embodiment of the invention, by adjusting the distance between the first collimation unit and the first laser, the focus position of the first laser beam emitted from the focusing unit can be adjusted, and the adjustment range of the focus position of the first laser beam can be increased, so that the laser device can process more types of workpieces, and the applicability of the laser device is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of laser processing, in particular to a laser device and a laser processing equipment. BACKGROUND

[0002] Laser processing technology is a non-contact processing technology, which has the characteristics of small heat-affected zone, high processing efficiency and high processing precision, and is widely used in cutting, marking, welding, drilling and other processes.

[0003] The laser device is used to emit a laser beam so as to perform laser processing on a workpiece by the laser beam. With the application of the laser device in heavy industry fields such as automobiles, ships and aerospace, the focal point position of the laser beam needs to be adjusted correspondingly when processing different workpieces, so as to improve the quality of laser processing.

[0004] However, the current laser device has a small adjustment range of the focal point position when adjusting the position of the focal point, which is difficult to be compatible with processing more different workpieces, resulting in poor applicability of the laser device. CONTENT OF THE INVENTION

[0005] The embodiments of the present application provide a laser device and a laser processing equipment, which can improve the applicability of the laser device.

[0006] In a first aspect, the embodiments of the present application provide a laser device, which comprises:

[0007] a first laser, configured to emit a first laser beam;

[0008] a first collimating unit, disposed on an optical path of the first laser beam;

[0009] a focusing unit, disposed on the optical path of the first laser beam, wherein the first laser, the first collimating unit and the focusing unit are sequentially disposed along the optical path of the first laser beam; and a distance between the first collimating unit and the first laser is adjustable.

[0010] In some possible implementation manners of the first aspect, the laser device further comprises:

[0011] a first mounting mirror seat, wherein the first laser, the first collimating unit and the focusing unit are disposed on the first mounting mirror seat;

[0012] a first driving unit, disposed on the first mounting mirror seat, wherein the first collimating unit is disposed on an output end of the first driving unit, and the first driving unit is configured to drive the first collimating unit to be close to or away from the first laser.

[0013] In some possible implementation manners of the first aspect, the laser device further includes:

[0014] a second laser for emitting a second laser beam;

[0015] a second collimating unit arranged on an optical path of the second laser beam;

[0016] a first reflecting mirror arranged on an optical path of the first laser beam, the first reflecting mirror being located between the first collimating unit and the focusing unit, and the first reflecting mirror being configured to transmit the first laser beam;

[0017] a second reflecting mirror arranged on an optical path of the second laser beam, the second laser, the second collimating unit and the second reflecting mirror being sequentially arranged along the optical path of the second laser beam, and the second reflecting mirror being configured to reflect the second laser beam to the first reflecting mirror, so that the first reflecting mirror reflects the second laser beam to the focusing unit.

[0018] In some possible implementation manners of the first aspect, a distance between the second collimating unit and the second laser is adjustable.

[0019] In some possible implementation manners of the first aspect, the laser device further includes:

[0020] a second mounting mirror seat, the second laser, the second collimating unit and the second reflecting mirror being arranged on the second mounting mirror seat;

[0021] a second driving unit arranged on the second mounting mirror seat, the second collimating unit being arranged on an output end of the second driving unit, and the second driving unit being configured to drive the second collimating unit to be close to or away from the second laser.

[0022] In some possible implementation manners of the first aspect, the first laser is a fiber laser, and the second laser is a semiconductor laser.

[0023] In some possible implementation manners of the first aspect, the first laser is configured to emit the first laser beam with a power of 0-30 KW, and the second laser is configured to emit the second laser beam with a power of 0-20 KW.

[0024] In some possible implementation manners of the first aspect, the laser device further includes:

[0025] a first protective mirror arranged on an optical path of the first laser beam, the first protective mirror being located on a side of the focusing unit away from the first collimating unit.

[0026] In some possible implementation manners of the first aspect, the laser device further includes:

[0027] A second protection mirror is arranged on the light path of the first laser beam and the light path of the second laser beam, and is located between the first laser and the first collimation unit and between the second laser and the second collimation unit, respectively.

[0028] In a second aspect, an embodiment of the present application provides a laser processing device, which includes the laser device according to any one of the technical solutions above.

[0029] The laser device and the laser processing device provided by the embodiments of the present application have the following beneficial effects: the first laser is used to emit a first laser beam, the first laser, the first collimation unit and the focusing unit are sequentially arranged along the light path of the first laser beam, so that the first laser beam emitted by the first laser sequentially passes through the first collimation unit and the focusing unit, and after the first laser beam is emitted from the focusing unit, the workpiece can be processed by laser; since the spacing between the first collimation unit and the first laser is adjustable, the focal point position of the first laser beam after being emitted from the focusing unit can be adjusted by adjusting the spacing between the first collimation unit and the first laser, and the adjustment range of the focal point position of the first laser beam can be increased, so that the laser device can process more types of workpieces, thereby improving the applicability of the laser device. BRIEF DESCRIPTION OF DRAWINGS

[0030] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the drawings needed to be used in the embodiments or the prior art description will be briefly introduced as follows. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can also be obtained according to the structures shown in the drawings without creative labor.

[0031] Figure 1 FIG. 1 is a structural schematic diagram of an embodiment of the laser device of the present application.

[0032] DESCRIPTION OF DRAWINGS

[0033] 1, first laser; 2, first collimation unit; 3, focusing unit; 4, first mounting mirror seat; 5, first driving unit; 6, second laser; 7, second collimation unit; 8, first reflecting mirror; 9, second reflecting mirror; 10, second mounting mirror seat; 20, second driving unit; 30, first protection mirror; 40, second protection mirror; 50, first laser beam; 60, second laser beam.

[0034] The implementation, functional features and advantages of the present application will be further described with reference to the embodiments and the accompanying drawings. DETAILED DESCRIPTION

[0035] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by a person of ordinary skill in the art without creative effort fall within the scope of the present application.

[0036] It should be noted that when an element is referred to as being "fixed" or "disposed" on another element, it can be directly on the other element or indirectly on the other element with other elements in between. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or indirectly connected to the other element through other elements.

[0037] It should be understood that the terms "length", "width", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate the orientation or positional relationship shown in the drawings based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.

[0038] It should be understood that the term "and / or" used in the present application specification and the appended claims means any combination of one or more of the associated listed items and all possible combinations, and includes these combinations.

[0039] In addition, the terms "first", "second" are only for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined with "first", "second" can explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "plurality" is two or more, unless otherwise specifically limited.

[0040] Embodiments of the present application provide a laser device and a laser processing apparatus, which are used to solve the technical problem of poor applicability of the laser device.

[0041] In the embodiments of the present application, as shown in Figure 1 The laser device includes a first laser 1, a first collimating unit 2 and a focusing unit 3. The first laser 1 is used to emit a first laser beam 50, and the first collimating unit 2 and the focusing unit 3 are both disposed on the optical path of the first laser beam 50. The first laser 1, the first collimating unit 2 and the focusing unit 3 are sequentially disposed along the optical path of the first laser beam 50, and the spacing between the first collimating unit 2 and the first laser 1 is adjustable.

[0042] The first collimation unit 2 is configured to collimate the first laser beam 50 into parallel light, and the focusing unit 3 is configured to focus the first laser beam 50.

[0043] In the embodiment, the first collimation unit 2 comprises a collimation lens, and the focusing unit 3 comprises a focusing lens.

[0044] The first laser 1 is configured to emit the first laser beam 50. The first laser 1, the first collimation unit 2 and the focusing unit 3 are sequentially arranged along the optical path of the first laser beam 50, so that the first laser beam 50 emitted by the first laser 1 sequentially passes through the first collimation unit 2 and the focusing unit 3, and the workpiece can be processed by laser after the first laser beam 50 is emitted from the focusing unit 3. Since the distance between the first collimation unit 2 and the first laser 1 is adjustable, the position of the focal point of the first laser beam 50 after being emitted from the focusing unit 3 can be adjusted by adjusting the distance between the first collimation unit 2 and the first laser 1, and the adjustment range of the position of the focal point of the first laser beam 50 can be increased, so that the laser device can process more types of workpieces, thereby improving the applicability of the laser device.

[0045] In an embodiment, as shown in Figure 1 The laser device further comprises a first mounting mirror seat 4 and a first driving unit 5. The first laser 1, the first collimation unit 2, the focusing unit 3 and the first driving unit 5 are all arranged on the first mounting mirror seat 4. The first collimation unit 2 is arranged on the output end of the first driving unit 5, and the first driving unit 5 is configured to drive the first collimation unit 2 to move close to or away from the first laser 1.

[0046] By driving the first collimation unit 2 to move close to or away from the first laser 1 through the first driving unit 5, the position of the focal point of the first laser beam 50 emitted from the focusing unit 3 can be adjusted, the adjustment mode is simplified, and the adjustment efficiency is improved.

[0047] In an embodiment, as shown in Figure 1 The laser device further comprises a second laser 6, a second collimation unit 7, a first reflecting mirror 8 and a second reflecting mirror 9. The second laser 6 is configured to emit a second laser beam 60. The second collimation unit 7 and the second reflecting mirror 9 are both arranged on the optical path of the second laser beam 60, and the first reflecting mirror 8 is arranged on the optical path of the first laser beam 50. The first reflecting mirror 8 is located between the first collimation unit 2 and the focusing unit 3, and is configured to transmit the first laser beam 50. The second laser 6, the second collimation unit 7 and the second reflecting mirror 9 are sequentially arranged along the optical path of the second laser beam 60. The second reflecting mirror 9 is configured to reflect the second laser beam 60 to the first reflecting mirror 8, so that the first reflecting mirror 8 reflects the second laser beam 60 to the focusing unit 3.

[0048] The first laser beam 50 can pass through the first collimating unit 2, the first mirror 8 and the focusing unit 3 in sequence to form a first laser path. The second laser beam 60 can pass through the second collimating unit 7, the second mirror 9, the first mirror 8 and the focusing unit 3 in sequence to form a second laser path.

[0049] In the embodiment, the first laser 1 can be selected to emit light only according to actual working conditions, so that the focusing unit 3 focuses the first laser beam 50 and then performs laser processing on the workpiece. The second laser 6 can also be selected to emit light only, so that the focusing unit 3 focuses the second laser beam 60 and then performs laser processing on the workpiece. The first laser 1 and the second laser 6 can also be selected to emit light at the same time, the first laser beam 50 and the second laser beam 60 are coupled at the first mirror 8, and then the focusing unit 3 focuses the coupled laser beam and then processes the workpiece. In this way, the laser device can adapt to more working conditions, thereby improving the applicability of the laser device.

[0050] In an embodiment, the distance between the second collimating unit 7 and the second laser 6 can be adjusted to adjust the focal point position of the second laser beam 60 emitted from the focusing unit 3, increase the adjustment range of the focal point position of the second laser beam 60, and improve the applicability of the laser device.

[0051] In an embodiment, as shown in Figure 1 The laser device further includes a second mounting mirror seat 10 and a second driving unit 20, the second laser 6, the second collimating unit 7, the second mirror 9 and the second driving unit 20 are arranged on the second mounting mirror seat 10. The second collimating unit 7 is arranged on the output end of the second driving unit 20, and the second driving unit 20 is used to drive the second collimating unit 7 to approach or move away from the second laser 6.

[0052] By driving the second collimating unit 7 to approach or move away from the second laser 6 through the second driving unit 20, the focal point position of the second laser beam 60 emitted from the focusing unit 3 can be adjusted, the adjustment method is simplified, and the adjustment efficiency is improved.

[0053] In an embodiment, the second mounting mirror seat 10 is arranged on the first mounting mirror seat 4.

[0054] In an embodiment, the first laser 1 is a fiber laser, and the second laser 6 is a semiconductor laser. The first laser 1 and / or the second laser 6 can be selected to be started to adapt to the needs of users for cutting efficiency and cutting quality.

[0055] In an embodiment, the wavelength of the first laser beam 50 emitted by the first laser 1 is 1030nm-1080nm, and the wavelength of the second laser beam 60 emitted by the second laser 6 is 420nm-470m or 940nm-980nm.

[0056] In an embodiment, the first laser 1 is configured to emit the first laser beam 50 with a power of 0-30KW, and the second laser 6 is configured to emit the second laser beam 60 with a power of 0-20KW. The first laser 1 and / or the second laser 6 can be selectively activated to adapt to more working conditions and improve the compatibility of the laser device.

[0057] In an embodiment, as shown in FIG. 1, the laser device further comprises a first protective mirror 30, which is arranged on the light path of the first laser beam 50 and located on the side of the focusing unit 3 away from the first collimating unit 2. The first protective mirror 30 is configured to block dust to avoid the dust from entering and contaminating the focusing unit 3, the first mirror 8 and the first collimating unit 2. The first protective mirror 30 can transmit the laser beam emitted from the focusing unit 3. Figure 1

[0058] In an embodiment, as shown in FIG. 1, the laser device further comprises a second protective mirror 40, which is arranged on the light path of the first laser beam 50 and on the light path of the second laser beam 60, and is respectively located between the first laser 1 and the first collimating unit 2, and between the second laser 6 and the second collimating unit 7. The second protective mirror 40 is configured to block dust to avoid the dust from entering and contaminating the focusing unit 3, the first mirror 8, the first collimating unit 2, the second collimating unit 7 and the second mirror 9. The second protective mirror 40 can transmit the first laser beam 50 or the second laser beam 60. Figure 1

[0059] In addition, the embodiments of the present application also provide a laser processing equipment, which comprises the laser device, and the specific structure of the laser device is referred to the above-mentioned embodiments. Since the laser processing equipment adopts all the technical solutions of the above-mentioned embodiments, it at least has all the beneficial effects brought by the technical solutions of the above-mentioned embodiments.

[0060] The above-mentioned is only the preferred embodiments of the present application, and does not limit the patent scope of the present application. Any equivalent structural transformation made according to the content of the present application specification and drawings, or direct / indirect application in other related technical fields within the inventive concept of the present application is included in the patent protection scope of the present application.​​

Claims

1. A laser device, characterized by comprising: The laser device comprises: a first laser for emitting a first laser beam; a first collimating unit arranged on an optical path of the first laser beam; a focusing unit arranged on the optical path of the first laser beam, the first laser, the first collimating unit and the focusing unit being arranged in sequence along the optical path of the first laser beam; and 2. The laser device of claim 1, wherein a distance between the first collimating unit and the first laser is adjustable. The laser device further comprises: a first mounting mirror seat, the first laser, the first collimating unit and the focusing unit being arranged on the first mounting mirror seat; 3. The laser device of claim 1, wherein a first driving unit arranged on the first mounting mirror seat, the first collimating unit being arranged on an output end of the first driving unit, the first driving unit being used to drive the first collimating unit to move close to or away from the first laser. The laser device further comprises: a second laser for emitting a second laser beam; a second collimating unit arranged on an optical path of the second laser beam; a first reflecting mirror arranged on the optical path of the first laser beam, the first reflecting mirror being located between the first collimating unit and the focusing unit, and being used to transmit the first laser beam; 4. The laser device of claim 3, wherein a second reflecting mirror arranged on the optical path of the second laser beam, the second laser, the second collimating unit and the second reflecting mirror being arranged in sequence along the optical path of the second laser beam; and 5. The laser device of claim 4, wherein the second reflecting mirror being used to reflect the second laser beam to the first reflecting mirror, so that the first reflecting mirror reflects the second laser beam to the focusing unit. A distance between the second collimating unit and the second laser is adjustable. The laser device further comprises:

6. The laser device of claim 5, wherein, a second mounting mirror seat, the second laser, the second collimating unit and the second reflecting mirror being arranged on the second mounting mirror seat; 7. The laser device of claim 6, wherein the laser device is configured to operate in a continuous wave mode. a second driving unit arranged on the second mounting mirror seat, the second collimating unit being arranged on an output end of the second driving unit, the second driving unit being used to drive the second collimating unit to move close to or away from the second laser.

8. The laser device of claim 3, wherein, The first laser is a fiber laser, and the second laser is a semiconductor laser. The first laser is used to emit the first laser beam with a power of 0-30KW, and the second laser is used to emit the second laser beam with a power of 0-20KW.

9. The laser device of claim 3, wherein, The laser device further comprises: a first protective mirror arranged on the optical path of the first laser beam, the first protective mirror being located on a side of the focusing unit away from the first collimating unit.

10. A laser processing apparatus characterized by comprising: The laser device further comprises: a second protective mirror arranged on the optical path of the first laser beam and the optical path of the second laser beam, the second protective mirror being respectively located between the first laser and the first collimating unit, and between the second laser and the second collimating unit. The laser processing equipment comprises the laser device according to any one of claims 1 to 9.

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