Radiation refrigeration film

Abstract

The utility model relates to a radiation refrigeration film. The radiation refrigeration film comprises a base film layer, a functional layer, a reflecting layer, an adhesive layer and a magnetic adsorption layer which are sequentially stacked. According to the radiation refrigeration film adopting the technical scheme, the magnetic adsorption layer is attached to the surface of the metal base material, so that the attachment difficulty can be reduced, and the construction efficiency can be improved. In addition, metal substrates which are uneven in surface and cannot be bonded can be tightly combined through magnetic force. In addition, high heat conduction can be achieved through the magnetic adsorption layer, heat is rapidly guided into the radiation refrigeration film, and the heat dissipation capacity is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of radiation refrigeration, in particular to a radiation refrigeration film. BACKGROUND

[0002] As a new zero-energy consumption refrigeration product, the radiation refrigeration film uses the selective radiation characteristics to improve the reflection of sunlight and reduce the radiation heat on one hand, and radiate heat outward through infrared light on the other hand, so as to achieve the purpose of cooling and refrigeration. The characteristics of zero-energy consumption refrigeration endow the radiation refrigeration film with a wide range of application fields, and the application prospect is huge in the power grid control cabinet, the grain storage warehouse, the energy storage cabinet of photovoltaic, etc. However, the current membrane type radiation refrigeration products are all pasted on the surface of the base material by pressure-sensitive adhesive, although the bonding force is high, but the difficulty of pasting is increased in the initial construction, and it is difficult to peel off and the base material surface coating is easily damaged when replaced later. SUMMARY

[0003] Therefore, it is necessary to provide a radiation refrigeration film for reducing the adhesion difficulty.

[0004] A radiation refrigeration film, comprising a base film layer, a functional layer, a reflection layer, an adhesive layer and a magnetic adsorption layer which are sequentially stacked.

[0005] The radiation refrigeration film of the utility model technical scheme can reduce the adhesion difficulty and improve the construction efficiency by using the magnetic adsorption layer to adhere to the surface of the metal base material. In addition, the metal base material with uneven surface cannot be bonded, but can be tightly combined through magnetic force. In addition, the magnetic adsorption layer can also realize high thermal conductivity, quickly guide the heat into the radiation refrigeration film, and improve the heat dissipation capacity.

[0006] In a feasible implementation manner, the peeling force of the magnetic adsorption layer is 5N / cm-30N / cm.

[0007] The magnetic adsorption layer is a heat-conducting rubber magnetic adsorption layer.

[0008] The thickness of the magnetic adsorption layer is 20μm-50μm.

[0009] In a feasible implementation manner, the radiation refrigeration film further comprises a microstructure layer, and the microstructure layer is located on the side of the base film layer away from the functional layer.

[0010] The surface of the microstructure layer away from the base film layer is provided with micro-nano structures, and the micro-nano structures comprise spaced protruding portions and recessed portions.

[0011] In a feasible implementation manner, the microstructure layer and the base film layer are stacked, and the transmittance of 0.2μm-2.5μm wavelength sunlight is greater than 90%, and the haze is greater than 65%.

[0012] In a feasible implementation, the cross-sectional shape of the protruding part in the direction along the thickness of the radiation refrigeration film is at least one of arc, triangle, trapezoid, step, and irregular shape;

[0013] In the direction along the thickness of the radiation refrigeration film, the depth of the micro-nano structure is 2 μm-5 μm;

[0014] In the direction parallel to the surface of the radiation refrigeration film, the period of the micro-nano structure is 2 μm-10 μm.

[0015] In a feasible implementation, the base film layer is a PET base film layer, a PVC base film layer, a PC base film layer, a PP base film layer, a PE base film layer, a PMMA base film layer, or a TPU base film layer;

[0016] The thickness of the base film layer is 23 μm-100 μm;

[0017] The transmittance of the microstructure layer, the base film layer, and the functional layer stacked together to 0.2 μm-2.5 μm wavelength sunlight is greater than 85%, and the haze is greater than 65%.

[0018] In a feasible implementation, the functional layer includes a coating and fillers distributed in the coating, and the fillers are silica fillers, glass bead fillers, titanium dioxide fillers, calcium carbonate fillers, or barium sulfate fillers;

[0019] The thickness of the functional layer is 15 μm-50 μm.

[0020] In a feasible implementation, the reflective layer is a metal reflective layer or a dielectric layer;

[0021] The thickness of the reflective layer is 10 nm-200 nm.

[0022] In a feasible implementation, the metal reflective layer is an aluminum reflective layer, a silver reflective layer, a titanium reflective layer, a chromium reflective layer, a copper reflective layer, or a nickel reflective layer;

[0023] The dielectric layer includes at least one first sub-dielectric layer and at least one second sub-dielectric layer, the first sub-dielectric layer and the second sub-dielectric layer are alternately stacked, and the refractive index of the first sub-dielectric layer is greater than that of the second sub-dielectric layer by 0.05-2;

[0024] The first sub-dielectric layer is a zinc sulfide dielectric layer or a titanium dioxide dielectric layer, and the second sub-dielectric layer is a magnesium fluoride dielectric layer or a PMMA dielectric layer.

[0025] In a feasible implementation, the thickness of the adhesive layer is 20 μm-50 μm;

[0026] The adhesive layer is a flame-retardant adhesive layer.

[0027] The flame-retardant adhesive layer is a self-adhesive. BRIEF DESCRIPTION OF DRAWINGS

[0028] Figure 1 A schematic diagram of a radiation refrigeration film according to an embodiment of the present application;

[0029] Figure 2 A schematic diagram of a radiation refrigeration film according to another embodiment of the present application;

[0030] Figure 3 A schematic diagram of a radiation refrigeration film and a metal substrate according to an embodiment of the present application;

[0031] Figure 4 A schematic diagram of a radiation refrigeration film and a metal substrate according to another embodiment of the present application. DETAILED DESCRIPTION

[0032] In order to make the above objectives, features and advantages of the present application more apparent, specific embodiments of the present application will be described in detail below with reference to the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. It will be apparent, however, to one skilled in the art that the present application can be practiced without some or all of these details. In other instances, well known process steps have not been described in detail in order to avoid unnecessarily obscuring the present application. Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which the present application belongs. The terminology used in the description of the present application herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the present application. As used in this description, the terms "therefore", "because", and the like are not to be interpreted as conveying a causal relationship, but rather, are simply provided as delineators of enumerated items.

[0033] It is to be understood that where the terms "fixed" or "connected" are used herein, they can be "directly fixed" or "directly connected" or "fixed" or "connected" via an intermediate member. As used herein, the terms "vertical", "horizontal", "left", "right", and the like are merely used for the purpose of explanation.

[0034] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which the present application belongs. The terminology used in the description of the present application herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the present application. As used in this description, the terms "therefore", "because", and the like are not to be interpreted as conveying a causal relationship, but rather, are simply provided as delineators of enumerated items.

[0035] The current membrane type radiation refrigeration product is pasted on the surface of the base material by pressure sensitive adhesive, although the bonding force is high, but the pasting difficulty is increased in the initial construction, and the peeling is difficult and the base material surface coating is easily damaged when replaced. At present, the application scene of the radiation refrigeration film is mostly metal base material, therefore, in order to solve these problems, the utility model provides a magnetic type radiation refrigeration film.

[0036] Please see Figure 1 The radiation refrigeration film 100 of the embodiment of the utility model comprises a base film layer 110, a functional layer 120, a reflection layer 130, a viscous adhesive layer 140 and a magnetic adsorption layer 150 which are sequentially stacked.

[0037] In the radiation refrigeration film 100 of the embodiment, the base film layer 110 provides support for other layers; the functional layer 120 is used for radiating heat to the atmospheric window; the reflection layer 130 is used for reflecting sunlight and reflecting heat through the atmospheric window to reduce the heat accumulation on the surface of the object; the functional layer 120 is used for radiating heat to the atmospheric window. When the sunlight irradiates on the radiation refrigeration film 100 of the embodiment, the radiation refrigeration film 100 can reflect part of the sunlight, and at the same time, transfer the heat to the outer space in the form of infrared radiation of the atmospheric window, so as to reduce the temperature of the metal base material.

[0038] In the radiation refrigeration film 100 of the embodiment, the viscous adhesive layer 140 is used for pasting the reflection layer 130 and the magnetic adsorption layer 150 together, and then attaching to the surface of the metal base material through the magnetic adsorption layer 150.

[0039] By using the magnetic adsorption layer 150 to attach to the surface of the metal base material, the radiation refrigeration film 100 of the embodiment can reduce the attachment difficulty and improve the construction efficiency. In addition, for the metal base material which cannot be bonded due to the uneven surface, the magnetic force can be used to realize the close combination. In addition, the magnetic adsorption layer 150 can also realize high heat conduction, quickly guide the heat into the inside of the radiation refrigeration film 100, and improve the heat dissipation capacity.

[0040] On the basis of the foregoing embodiment, the peeling force of the magnetic adsorption layer 150 is 5N / cm-30N / cm. Further, the peeling force of the magnetic adsorption layer 150 can be but is not limited to 5N / cm, 6N / cm, 7N / cm, 8N / cm, 9N / cm, 10N / cm, 11N / cm, 12N / cm, 13N / cm, 14N / cm, 15N / cm, 16N / cm, 17N / cm, 18N / cm, 19N / cm, 20N / cm, 21N / cm, 22N / cm, 23N / cm, 24N / cm, 25N / cm, 26N / cm, 27N / cm, 28N / cm, 29N / cm or 30N / cm. Still further, the peeling force of the magnetic adsorption layer 150 is preferably 10N / cm-15N / cm.

[0041] On the basis of the foregoing embodiment, the magnetic adsorption layer 150 is a heat-conducting rubber magnetic adsorption layer. The material of the heat-conducting rubber magnetic adsorption layer is heat-conducting rubber magnet, which is composed of silicone rubber, nitrile rubber, magnetic powder and processing agent. In a feasible implementation, the mass ratio of silicone rubber, nitrile rubber, magnetic powder and processing agent is (3-5):(3-5):(80-110):(10-15). Further, the mass ratio of silicone rubber, nitrile rubber, magnetic powder and processing agent is 5:5:100:12.

[0042] On the basis of the foregoing embodiment, the thickness of the magnetic adsorption layer 150 is 20-50 μm. Further, the thickness of the magnetic adsorption layer 150 can be but is not limited to 20 μm, 21 μm, 22 μm, 23 μm, 24 μm, 25 μm, 26 μm, 27 μm, 28 μm, 29 μm, 30 μm, 31 μm, 32 μm, 33 μm, 34 μm, 35 μm, 36 μm, 37 μm, 38 μm, 39 μm, 40 μm, 41 μm, 42 μm, 43 μm, 44 μm, 45 μm, 46 μm, 47 μm, 48 μm, 49 μm or 50 μm.

[0043] On the basis of the foregoing embodiment, the functional layer 120 includes paint and fillers distributed in the paint, and the fillers are silica fillers, glass bead fillers, titanium dioxide fillers, calcium carbonate fillers or barium sulfate fillers. The functional layer 120 is formed by coating the surface of the base film layer 110 after mixing the paint and the fillers, and further, the fillers are uniformly distributed in the interior of the paint. By coating the surface of the base film layer 110 with the paint containing the above-mentioned fillers, the radiant energy can be concentrated in the mid-infrared band, and infrared radiation can be achieved.

[0044] On the basis of the foregoing embodiment, the thickness of the functional layer 120 is 15-50 μm. Further, the thickness of the functional layer 120 can be but is not limited to 15 μm, 16 μm, 17 μm, 18 μm, 19 μm, 20 μm, 21 μm, 22 μm, 23 μm, 24 μm, 25 μm, 26 μm, 27 μm, 28 μm, 29 μm, 30 μm, 31 μm, 32 μm, 33 μm, 34 μm, 35 μm, 36 μm, 37 μm, 38 μm, 39 μm, 40 μm, 41 μm, 42 μm, 43 μm, 44 μm, 45 μm, 46 μm, 47 μm, 48 μm, 49 μm or 50 μm.

[0045] On the basis of the foregoing embodiment, the reflective layer 130 is a metal reflective layer or a dielectric layer. The principle of the metal reflective layer reflecting light is that, in the metal, there are free electrons in the metal, the free electrons are not bound by the atomic nucleus, when the light propagates to the surface of the metal, the free electrons will be forced to vibrate under the action of the electric field, and then produce vibrations of the same frequency as the incident light, and the vibrations emit light of the same frequency as the original light. When the thickness of the metal reflective layer is less than the average free path of the free electrons in the metal reflective layer, the average free path increases with the increase of the thickness of the metal reflective layer, at this time, the thicker the metal reflective layer, the higher the reflectivity. When the thickness of the metal reflective layer is greater than or equal to the average free path of the electrons in the bulk metal, the average free path of the electrons in the metal reflective layer is the same as that of the bulk material, at this time, the metal reflective layer is equivalent to the bulk material, and the reflectivity basically remains unchanged with the change of the film thickness.

[0046] On the basis of the foregoing embodiment, the thickness of the reflective layer 130 is 10 nm to 200 nm. Further, the thickness of the reflective layer 130 can be, but is not limited to, 10 nm, 20 nm, 30 nm, 40 nm, 50 nm, 60 nm, 70 nm, 80 nm, 90 nm, 100 nm, 110 nm, 100 nm, 120 nm, 130 nm, 140 nm, 150 nm, 170 nm, 180 nm, 190 nm, or 200 nm. When the reflective layer 130 is a metal reflective layer, the greater the thickness of the reflective layer 130, the greater the reflectivity of the reflective layer 130, but the greater the thickness of the reflective layer 130, the heavier the weight of the radiative cooling film 100, so a suitable thickness can be selected according to the actual situation.

[0047] On the basis of the foregoing embodiment, the metal reflective layer is an aluminum reflective layer, a silver reflective layer, a titanium reflective layer, a chromium reflective layer, a copper reflective layer, or a nickel reflective layer. For example, the metal reflective layer is an aluminum reflective layer, aluminum is a good thermal insulation material, the thermal insulation property of aluminum is mainly reflected in the thermal radiation performance of aluminum, aluminum is a metal with strong sunlight reflection ability, when the thickness of the aluminum reflective layer is less than 35 nm, at this time, the transmittance of the aluminum reflective layer decreases with the increase of the thickness, and the reflectivity increases with the increase of the thickness, when the thickness of the aluminum reflective layer is greater than 35 nm, at this time, the transmittance of the aluminum reflective layer approaches zero, and the reflectivity increases sharply with the increase of the thickness, when the thickness is greater than the average free path of the electrons in the aluminum reflective layer, the reflectivity no longer increases with the increase of the thickness. Using aluminum as the material of the metal reflective layer can improve the cooling effect of the radiative cooling film 100.

[0048] On the basis of the foregoing embodiment, the dielectric layer includes at least one first sub-dielectric layer and at least one second sub-dielectric layer, the first sub-dielectric layer and the second sub-dielectric layer are alternately and superimposedly arranged, and the refractive index of the first sub-dielectric layer is greater than that of the second sub-dielectric layer by 0.05 to 2.

[0049] On the basis of the foregoing embodiment, the first sub-medium layer is a zinc sulfide medium layer or a titanium dioxide medium layer, and the second sub-medium layer is a magnesium fluoride medium layer or a PMMA medium layer.

[0050] On the basis of the foregoing embodiment, the thickness of the adhesive layer 140 is 20-50 mu m. Further, the thickness of the adhesive layer 140 can be, but is not limited to, 20 mu m, 25 mu m, 30 mu m, 35 mu m, 40 mu m, 45 mu m or 50 mu m. Further, the adhesive layer 140 is a pressure-sensitive adhesive. Further, the adhesive layer 140 is a flame-retardant adhesive layer. Further, the flame-retardant adhesive layer is a self-adhesive. The self-adhesive has certain strong adhesion and is not easy to fall off.

[0051] It should be noted that the structure of the radiation refrigeration film of the utility model is not limited to the foregoing embodiment, and can also include other layer structures.

[0052] Please refer to Figure 2 The radiation refrigeration film 200 of another embodiment of the utility model comprises a base film layer 210, a functional layer 220, a reflective layer 230, an adhesive layer 240 and a magnetic adsorption layer 250 which are sequentially stacked. In addition, the radiation refrigeration film 200 of the embodiment further comprises a microstructure layer 260, and the microstructure layer 260 is located on the side of the base film layer 210 away from the functional layer 220. The microstructure layer 260 is located on the side of the base film layer 210, can reduce the surface gloss of the base film layer 210, so as to reduce the light reflected by the reflective layer 230, thereby reducing light pollution. In addition, the microstructure layer 210 is arranged as a surface layer of the radiation refrigeration film 200, and the microstructure layer 260 can also play a role in protecting the base film layer 210, the functional layer 220 and the reflective layer 230, reducing the scratch of the radiation refrigeration film 200, so as to prolong the service life of the radiation refrigeration film 200.

[0053] Further, the microstructure layer 260 is provided with a micro-nano structure 261 on the surface away from the base film layer, and the micro-nano structure 261 comprises protruding portions 262 and recessed portions 263 which are spaced apart. The micro-nano structure 261 can be uniformly distributed or unevenly distributed. The microstructure layer 260 is formed by coating and pressing on the surface of the base film layer 210 to form the micro-nano structure 261. Further, the material of the micro-nano structure 261 is UV light curing paint or thermosetting paint, which can increase the flame-retardant capacity of the radiation refrigeration film 200.

[0054] On the basis of the foregoing embodiment, the microstructure layer 260 and the base film layer 210 are laminated, and the transmittance of 0.2-2.5 μm wavelength sunlight is greater than 90%, and the haze is greater than 65%. The transmittance is the light transmittance of the radiation cooling film 200, and the haze is the cloudy or turbid appearance of the inside or surface of the transparent or translucent radiation cooling film 200 due to diffuse reflection. By controlling the transmittance of the radiation cooling film 200, the reflective layer 230 can reflect more sunlight, thereby improving the cooling effect. By controlling the haze of the radiation cooling film 200, the light pollution caused by the reflective layer 230 reflecting sunlight can be reduced.

[0055] On the basis of the foregoing embodiment, the cross-sectional shape of the protruding portion 262 along the thickness direction of the radiation cooling film 200 is at least one of an arc shape, a triangular shape, a trapezoidal shape, a stepped shape, and an irregular shape. Changing the cross-sectional shape of the protruding portion 262 can control the transmittance and the haze of the radiation cooling film 200.

[0056] On the basis of the foregoing embodiment, the depth of the micro-nano structure 261 along the thickness direction of the radiation cooling film 200 is 2-5 μm. Further, the depth of the micro-nano structure 261 can be, but is not limited to, 2 μm, 3 μm, 4 μm, or 5 μm. Changing the depth of the micro-nano structure 261 can control the transmittance and the haze of the radiation cooling film 200.

[0057] On the basis of the foregoing embodiment, the period of the micro-nano structure 261 along the direction parallel to the surface of the radiation cooling film 200 is 2-10 μm. Further, the period of the micro-nano structure 261 can be, but is not limited to, 2 μm, 3 μm, 4 μm, 5 μm, 6 μm, 7 μm, 8 μm, 9 μm, or 10 μm. Changing the period of the micro-nano structure 261 can control the transmittance and the haze of the radiation cooling film 200.

[0058] On the basis of the foregoing embodiment, the base film layer 210 is a PET (polyethylene terephthalate) base film layer, a PVC (polyvinyl chloride) base film layer, a PC (polycarbonate) base film layer, a PP (polypropylene) base film layer, a PE (polyethylene) base film layer, a PMMA (polymethyl methacrylate) base film layer, or a TPU (thermoplastic polyurethane elastomer) base film layer. By using the above-mentioned material base film layer 210, the transmittance of 0.2-2.5 μm wavelength sunlight of the laminated microstructure layer 260, the base film layer 210, and the functional layer 220 is greater than 85%, and the haze is greater than 65%. The cooperation of the microstructure layer 260, the base film layer 210, the functional layer 220, and the reflective layer 230 radiates the light that has passed through the microstructure layer 260, the base film layer 210, and the functional layer 220, thereby achieving good cooling effect of the radiation cooling film 200, and reducing the light pollution caused by the radiation cooling film 200.

[0059] On the basis of the foregoing embodiments, the thickness of the base film layer 210 is 23 μm to 100 μm. Further, the thickness of the base film layer 210 can be, but is not limited to, 23 μm, 24 μm, 25 μm, 26 μm, 27 μm, 28 μm, 29 μm, 30 μm, 31 μm, 32 μm, 33 μm, 34 μm, 35 μm, 36 μm, 37 μm, 38 μm, 39 μm, 40 μm, 41 μm, 42 μm, 43 μm, 44 μm, 45 μm, 46 μm, 47 μm, 48 μm, 49 μm, 50 μm, 51 μm, 52 μm, 53 μm, 54 μm, 55 μm, 56 μm, 57 μm, 58 μm, 59 μm, 60 μm, 61 μm, 62 μm, 63 μm, 64 μm, 65 μm, 66 μm, 67 μm, 68 μm, 69 μm, 70 μm, 71 μm, 72 μm, 73 μm, 74 μm, 75 μm, 76 μm, 77 μm, 78 μm, 79 μm, 80 μm, 81 μm, 82 μm, 83 μm, 84 μm, 85 μm, 86 μm, 87 μm, 88 μm, 89 μm, 90 μm, 91 μm, 92 μm, 93 μm, 94 μm, 95 μm, 96 μm, 97 μm, 98 μm, 99 μm, or 100 μm.

[0060] Please refer to Figure 3 and Figure 4 , when the radiation refrigeration film 100 or the radiation refrigeration film 200 of the above two embodiments is applied, the radiation refrigeration film 100 or the radiation refrigeration film 200 is magnetically adsorbed on the metal base material 300, specifically, the magnetic adsorption layer 150 of the radiation refrigeration film 100 or the magnetic adsorption layer 250 of the radiation refrigeration film 200 is magnetically adsorbed on the metal base material 300. It can be seen that the surface of the metal base material 300 cannot be bonded due to unevenness, and can be tightly combined through magnetic force.

[0061] The radiation refrigeration film using the technical scheme of the present application can reduce the difficulty of adhesion and improve the construction efficiency by using the magnetic adsorption layer to adhere to the surface of the metal base material. In addition, for the metal base material which cannot be bonded due to unevenness, tight combination can be achieved through magnetic force. In addition, the magnetic adsorption layer can also achieve high thermal conductivity, quickly guide heat into the inside of the radiation refrigeration film, and improve the heat dissipation capacity.

[0062] The technical features of the above-described embodiments can be combined in any manner. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described, but as long as the combinations of the technical features do not exist, they should be considered as the scope of the present application.

[0063] The above-described embodiments only express several implementation manners of the utility model, the description is more specific and detailed, but can not therefore be understood as the limitation of the utility model patent range. It should be pointed out that for ordinary skilled person in the art, without departing from the utility model concept, several modifications and improvements can be made, which belong to the protection range of the utility model. Therefore, the protection range of the utility model patent should be subject to the appended claims.

Claims

1. A radiative cooling film, characterized in that, The radiation cooling film comprises a base film layer, a functional layer, a reflection layer, an adhesive layer and a magnetic adsorption layer which are sequentially stacked; The magnetic adsorption layer is a heat-conducting rubber magnetic adsorption layer; The peeling force of the magnetic adsorption layer is 5 N / cm-30 N / cm; The thickness of the magnetic adsorption layer is 20 μm-50 μm.

2. The radiative cooling film of claim 1, wherein, The radiation cooling film further comprises a microstructure layer which is located on the side of the base film layer away from the functional layer; The surface of the microstructure layer away from the base film layer is provided with a micro-nano structure, and the micro-nano structure comprises spaced protrusions and recesses.

3. The radiative cooling film of claim 2, wherein, The transmittance of the microstructure layer and the base film layer to 0.2 μm-2.5 μm wavelength sunlight is greater than 90%, and the haze is greater than 65%.

4. The radiative cooling film of claim 2, wherein, In the direction of the thickness of the radiation cooling film, the cross-sectional shape of the protrusions is at least one of arc, triangle, trapezoid, step and irregular shape; In the direction of the thickness of the radiation cooling film, the depth of the micro-nano structure is 2 μm-5 μm; In the direction parallel to the surface of the radiation cooling film, the period of the micro-nano structure is 2 μm-10 μm.

5. The radiative cooling film of claim 2, wherein, The base film layer is a PET base film layer, a PVC base film layer, a PC base film layer, a PP base film layer, a PE base film layer, a PMMA base film layer or a TPU base film layer; The thickness of the base film layer is 23 μm-100 μm; The transmittance of the microstructure layer, the base film layer and the functional layer to 0.2 μm-2.5 μm wavelength sunlight is greater than 85%, and the haze is greater than 65%.

6. The radiative cooling film of claim 1, wherein, The functional layer comprises a coating and a filler distributed in the coating, and the filler is a silica filler, a glass bead filler, a titanium dioxide filler, a calcium carbonate filler or a barium sulfate filler; The thickness of the functional layer is 15 μm-50 μm.

7. The radiative cooling film of claim 1, wherein, The reflection layer is a metal reflection layer or a dielectric layer; The thickness of the reflection layer is 10 nm-200 nm.

8. The radiative cooling film of claim 7, wherein, The metal reflection layer is an aluminum reflection layer, a silver reflection layer, a titanium reflection layer, a chromium reflection layer, a copper reflection layer or a nickel reflection layer; The dielectric layer comprises at least one first sub-dielectric layer and at least one second sub-dielectric layer, the first sub-dielectric layer and the second sub-dielectric layer are alternately stacked, and the refractive index of the first sub-dielectric layer is greater than that of the second sub-dielectric layer by 0.05-2; The first sub-dielectric layer is a zinc sulfide dielectric layer or a titanium dioxide dielectric layer, and the second sub-dielectric layer is a magnesium fluoride dielectric layer or a PMMA dielectric layer.

9. The radiative cooling film of claim 1, wherein, The thickness of the adhesive layer is 20 μm-50 μm; The adhesive layer is a flame-retardant adhesive layer; The flame-retardant adhesive layer is a non-dry adhesive.

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