Electroplating device with adjustable conveying tightness for copper wire silver plating

Abstract

The utility model is applicable to the technical field of copper wire electroplating, and provides an electroplating device with adjustable conveying tightness for copper wire silver plating, which comprises an electroplating main body, a pay-off assembly, a first cleaning assembly, a second cleaning assembly, a silver plating assembly and a tension assembly, the electroplating main body is provided with a first guide roller and a second guide roller which are used for guiding a copper wire, the first sweeping assembly comprises a pushing unit and a sweeping unit, the pushing unit comprises a pushing column and a pushing spring which are connected with the electroplating main body, and the surface of the copper wire before electroplating can be swept and dust and impurities can be swept through the arrangement of the first sweeping assembly; the influence on copper wire electroplating is avoided, the cleaning rollers can be prevented from being attached together through the repelling acting force of the multiple magnet blocks, and therefore the cleaning effect on the surface of the copper wire is good; through the arrangement of the silver plating assembly and the tension assembly, the tightness of the copper wire during silver plating is adjusted, so that the tension maintaining effect during copper wire electroplating is good, and the copper wire electroplating uniformity is maintained.

Description

TECHNICAL FIELD

[0001] The utility model belongs to copper wire electroplating technical field especially relates to a kind of electroplating device for copper wire silver plating with adjustable conveying tightness. BACKGROUND

[0002] Wire, electrical conductivity is very good, is used in manufacturing wire, cable, brush etc.;Good heat conductivity, often used to manufacture must prevent magnetic interference magnetism instrument, meter, such as compass, aviation instrument etc.;Plasticity is very good, easy to hot-press and cold-press force processing, can be made into pipe, bar, wire, strip, belt, plate, foil etc. Copper material, pure copper product has smelting product and processing product two, electroplating is the process that a certain metal surface is plated with a thin layer of other metal or alloy using electrolysis principle, is the process that the surface of metal or other material product is attached with a layer of metal film using electrolysis, to prevent metal oxidation (such as rust), improve wear resistance, electrical conductivity, reflectivity, corrosion resistance (copper sulfate etc.) and promote aesthetics, etc. Action, copper wire silver plating can prolong the life.

[0003] When copper wire is plated with silver, copper wire is affected by tightness in conveying process, so that copper wire is not uniformly electroplated, use of copper wire is affected, and dust and sundries on the surface of copper wire also interfere with electroplating. UTILITY MODEL CONTENT

[0004] The utility model aims at providing a kind of electroplating device for copper wire silver plating with adjustable conveying tightness, to solve the problem that when copper wire is plated with silver, copper wire is affected by tightness in conveying process, so that copper wire is not uniformly electroplated, use of copper wire is affected, and dust and sundries on the surface of copper wire also interfere with electroplating.

[0005] The utility model discloses a kind of copper wire silver-plated electroplating devices with adjustable conveying tightness, the device includes electroplating main body, pay-off assembly, first cleaning component, second cleaning component, silver-plated component and tension component;First guide roller and second guide roller for guiding copper wire are installed on the electroplating main body, the first cleaning component includes push unit and cleaning unit, the push unit includes with the fixed connection of electroplating main body push column and push spring, the end surface of the push spring is fixedly connected with push rod, the cleaning unit includes cleaning frame, the outer wall surface of the cleaning frame is rotatably connected with cleaning roller, the outer wall surface of the cleaning frame is also fixedly connected with cleaning block, the end surface of the cleaning block is fixedly connected with magnet block, the second cleaning component is installed on the inner wall surface of electroplating main body, the silver-plated component includes silver-plated box, first positioning roller and second positioning roller for positioning copper wire are installed on the silver-plated box, the tension component includes fixed frame, the end surface of the fixed frame is fixedly connected with tension plate, the outer wall surface of the tension plate is slidably connected with tension sliding block, the end surface of the tension sliding block is rotatably connected with rotating rod, the outer wall surface of the rotating rod is fixedly connected with fixed blade and tension roller.

[0006] As a further scheme of the utility model, the outer wall surface of the electroplating main body is provided with a first guide hole and a second guide hole, the first guide roller is rotatably connected with the electroplating main body through the first guide hole, and the second guide roller is rotatably connected with the electroplating main body through the second guide hole.

[0007] As a further scheme of the utility model, the pay-off assembly includes a pay-off frame fixedly connected with the electroplating main body, a pay-off rod is inserted into the outer wall surface of the pay-off frame, the end surface of the pay-off rod is fixedly connected with a fixed block, and the outer wall surface of the fixed block is inserted into the pay-off frame.

[0008] As a further scheme of the utility model, the outer wall surface of the push rod is slidably connected with the push column, the end surface of the cleaning frame is fixedly connected with the push rod, and the shape, size and structure of the second cleaning component are the same as those of the first cleaning component.

[0009] As a further scheme of the utility model, the end surface of the silver-plated box is fixedly connected with the electroplating main body, the outer wall surface of the silver-plated box is provided with a first positioning hole and a second positioning hole, the first positioning roller is rotatably connected with the silver-plated box through the first positioning hole, and the second positioning roller is rotatably connected with the silver-plated box through the second positioning hole.

[0010] As a further scheme of the utility model, the outer wall surface of the fixed frame is fixedly connected with the electroplating main body, the outer wall surface of the tension plate is also provided with a tension sliding groove for the movement of the tension sliding block, and the fixed blade and the tension roller are rotatably connected with the tension sliding block through the rotating rod.

[0011] The utility model provides a kind of copper wire silver plating electroplating device of adjustable conveying tightness, by the setting of first cleaning component, to realize can the surface cleaning of copper wire before electroplating, to dust impurity cleaning, avoid the influence caused to copper wire electroplating, and the repulsive force of multiple magnet block, can avoid cleaning roller to be attached together, to the effect of copper wire surface cleaning is good;By the setting of silver plating component and tension component, to realize the tightness when copper wire silver plating is adjusted, so that the effect of tension keeping is good when copper wire electroplating, to keep the uniformity of copper wire electroplating. BRIEF DESCRIPTION OF DRAWINGS

[0012] Figure 1 A kind of copper wire silver plating electroplating device of adjustable conveying tightness provided for the utility model embodiment is shown in the figure;

[0013] Figure 2 A kind of copper wire silver plating electroplating device of adjustable conveying tightness provided for the utility model embodiment is partially front view sectional view;

[0014] Figure 3 A kind of copper wire silver plating electroplating device of adjustable conveying tightness provided for the utility model embodiment is partially side view sectional view.

[0015] Figure 4 A kind of copper wire silver plating electroplating device of adjustable conveying tightness provided for the utility model embodiment is Figure 3 Enlarged view of A in the figure.

[0016] In the drawing: 1, electroplating main body;11, first guide hole;12, second guide hole;13, first guide roller;14, second guide roller;2, pay-off assembly;21, pay-off rack;22, pay-off rod;23, fixed block;3, first cleaning component;31, push unit;311, push column;312, push spring;313, push rod;32, cleaning unit;321, cleaning rack;322, cleaning roller;323, cleaning block;324, magnet block;4, second cleaning component;5, silver plating component;51, silver plating box;52, first positioning hole;53, second positioning hole;54, first positioning roller;55, second positioning roller;6, tension component;61, fixed rack;62, tension plate;63, tension sliding block;64, rotating rod;65, fixed blade;66, tension roller;67, tension sliding slot. DETAILED DESCRIPTION

[0017] In order to make the purpose, technical scheme and advantages of the utility model more clear and obvious, the utility model is further described in detail below with the drawings and examples.It should be understood that the specific examples described here are only used to explain the utility model, and not to limit the utility model.

[0018] The specific implementation of the utility model is described in detail below in combination with specific embodiments.

[0019] As Figures 1 to 4 shown, the utility model provides a kind of copper wire silver plating with adjustable conveying tightness electroplating device for one embodiment of the utility model, device includes electroplating main body 1, pay-off assembly 2, first cleaning assembly 3, second cleaning assembly 4, silver plating assembly 5 and tension assembly 6;First guide roller 13 and second guide roller 14 for the copper wire orientation are installed on electroplating main body 1, first cleaning assembly 3 includes push unit 31 and cleaning unit 32, push unit 31 includes with electroplating main body 1 fixed connection push column 311 and push spring 312, the end surface of push spring 312 is fixedly connected with push rod 313, cleaning unit 32 includes cleaning frame 321, the outer wall surface of cleaning frame 321 is rotatably connected with cleaning roller 322, the outer wall surface of cleaning frame 321 is also fixedly connected with cleaning block 323, the end surface of cleaning block 323 is fixedly connected with magnet block 324, second cleaning assembly 4 is installed on the inner wall surface of electroplating main body 1, silver plating assembly 5 includes silver plating box 51, first positioning roller 54 and second positioning roller 55 for the positioning of copper wire are installed on silver plating box 51, tension assembly 6 includes fixed frame 61, the end surface of fixed frame 61 is fixedly connected with tension plate 62, the outer wall surface of tension plate 62 is slidably connected with tension slide block 63, the end surface of tension slide block 63 is rotatably connected with rotating rod 64, the outer wall surface of rotating rod 64 is fixedly connected with fixed blade 65 and tension roller 66.

[0020] The utility model provides a kind of copper wire silver plating with adjustable conveying tightness electroplating device, by the setting of first cleaning assembly 3, to realize can the surface cleaning of copper wire before electroplating, to dust impurity cleaning, avoid the influence caused to copper wire electroplating, and the repulsive force of multiple magnet block 324, can avoid cleaning roller 322 to stick together, to the effect of good copper wire surface cleaning;By the setting of silver plating assembly 5 and tension assembly 6, to realize the tightness of copper wire silver plating time adjustment, so that the effect of good tension retention when copper wire electroplating, to keep the uniformity of copper wire electroplating.

[0021] In the embodiment of the utility model, in use, copper line roller is installed to pay off wire assembly 2, copper line is pulled out, through second guide roller 14 and second positioning roller 55 enter into silver plating box 51, because the force of urging spring 312, will make the cleaning frame 321 be urged, magnet block 324 gradually close when moving with the cleaning frame 321, repulsion will also gradually increase, avoid two groups of cleaning roller 322 completely adhere together, can when copper line moves, the dust and impurity of copper line outer wall surface is cleaned, and copper line will be affected by tension roller 66, and is adhered with tension roller 66, when copper line is loose, tension slide block 63 is affected by gravity, drives tension roller 66 to move, adheres with copper line again, make its silver plating uniform effect is good, after copper line passes through first positioning roller 54 and first guide roller 13 collection, simultaneously copper line is affected by second cleaning assembly 4, can wipe the residual electroplating solution of copper line outer wall surface, convenient to its drying treatment.

[0022] As Figure 1 The utility model discloses a silver plating device, including electroplating main part 1, the outer wall surface of electroplating main part 1 is provided with first positioning roller 54, first positioning roller 54 is provided with first guide roller 13, first guide roller 13 is provided with second positioning roller 55, second positioning roller 55 is provided with second guide roller 14, first positioning roller 54, first guide roller 13, second positioning roller 55 and second guide roller 14 are connected with the copper line of silver plating, and the outer wall surface of electroplating main part 1 is provided with first guide hole 11 and second guide hole 12, first guide roller 13 is rotatably connected with electroplating main part 1 through first guide hole 11, second guide roller 14 is rotatably connected with electroplating main part 1 through second guide hole 12,

[0023] Can assist positioning to silver plating copper line, make its moving effect good.

[0024] As Figure 2 The utility model discloses a silver plating device, including electroplating main part 1, the outer wall surface of electroplating main part 1 is provided with first positioning roller 54, first positioning roller 54 is provided with first guide roller 13, first guide roller 13 is provided with second positioning roller 55, second positioning roller 55 is provided with second guide roller 14, first positioning roller 54, first guide roller 13, second positioning roller 55 and second guide roller 14 are connected with the copper line of silver plating, and the outer wall surface of electroplating main part 1 is provided with first guide hole 11 and second guide hole 12, first guide roller 13 is rotatably connected with electroplating main part 1 through first guide hole 11, second guide roller 14 is rotatably connected with electroplating main part 1 through second guide hole 12,

[0025] Can install copper line roller on pay off wire assembly 2, convenient to pull copper line and electroplate it.

[0026] As Figure 2 The utility model discloses a silver plating device, including electroplating main part 1, the outer wall surface of electroplating main part 1 is provided with first positioning roller 54, first positioning roller 54 is provided with first guide roller 13, first guide roller 13 is provided with second positioning roller 55, second positioning roller 55 is provided with second guide roller 14, first positioning roller 54, first guide roller 13, second positioning roller 55 and second guide roller 14 are connected with the copper line of silver plating, and the outer wall surface of electroplating main part 1 is provided with first guide hole 11 and second guide hole 12, first guide roller 13 is rotatably connected with electroplating main part 1 through first guide hole 11, second guide roller 14 is rotatably connected with electroplating main part 1 through second guide hole 12,

[0027] Can sweep the impurity on the surface of copper line, and also can wipe the electroplating solution on the surface of silver plating copper line.

[0028] As Figure 3 The utility model discloses a silver plating device, including electroplating main part 1, the outer wall surface of electroplating main part 1 is provided with first positioning roller 54, first positioning roller 54 is provided with first guide roller 13, first guide roller 13 is provided with second positioning roller 55, second positioning roller 55 is provided with second guide roller 14, first positioning roller 54, first guide roller 13, second positioning roller 55 and second guide roller 14 are connected with the copper line of silver plating, and the outer wall surface of electroplating main part 1 is provided with first guide hole 11 and second guide hole 12, first guide roller 13 is rotatably connected with electroplating main part 1 through first guide hole 11, second guide roller 14 is rotatably connected with electroplating main part 1 through second guide hole 12, Figure 4As further scheme embodiment of the utility model is shown, the end surface of silver plating box 51 is fixedly connected with electroplating main body 1, the outer wall surface of silver plating box 51 is provided with first positioning hole 52 and second positioning hole 53, first positioning roller 54 is rotatably connected with silver plating box 51 through first positioning hole 52, and second positioning roller 55 is rotatably connected with silver plating box 51 through second positioning hole 53.

[0029] The copper wire can be immersed in silver plating box 51, and the supporting and fixing effect is good.

[0030] As shown in Figure 3 and Figure 4 As further scheme embodiment of the utility model is shown, the outer wall surface of fixed frame 61 is fixedly connected with electroplating main body 1, the outer wall surface of tension plate 62 is further provided with tension sliding groove 67 for the movement of tension sliding block 63, and fixed blade 65 and tension roller 66 are rotatably connected with tension sliding block 63 through rotating rod 64.

[0031] The tension roller 66 can be combined with the copper wire through the action of gravity, so that the tightness of the copper wire is adjusted, and the tension effect during electroplating is good.

[0032] The above is only the preferred embodiment of the utility model, and does not limit the utility model, and any modification, equivalent replacement and improvement within the spirit and principle of the utility model should be included in the protection scope of the utility model.

Claims

1. A plating device for plating silver on copper wire with adjustable tightness of delivery, characterized by, The device includes electroplating body (1), pay-off assembly (2), first cleaning assembly (3), second cleaning assembly (4), silver plating assembly (5) and tension assembly (6), the first guide roller (13) and the second guide roller (14) are installed on the electroplating body (1) for guiding copper wire, the first cleaning assembly (3) includes push unit (31) and cleaning unit (32), the push unit (31) includes push column (311) and push spring (312) fixedly connected with the electroplating body (1), the end surface of the push spring (312) is fixedly connected with the push rod (313), the cleaning unit (32) includes cleaning frame (321), the outer wall surface of the cleaning frame (321) is rotatably connected with the cleaning roller (322), the outer wall surface of the cleaning frame (321) is also fixedly connected with the cleaning block (323), the end surface of the cleaning block (323) is fixedly connected with the magnet block (324), the second cleaning assembly (4) is installed on the inner wall surface of the electroplating body (1), the silver plating assembly (5) includes silver plating box (51), the first positioning roller (54) and the second positioning roller (55) are installed on the silver plating box (51) for positioning copper wire, the tension assembly (6) includes fixed frame (61), the end surface of the fixed frame (61) is fixedly connected with the tension plate (62), the outer wall surface of the tension plate (62) is slidably connected with the tension sliding block (63), the end surface of the tension sliding block (63) is rotatably connected with the rotating rod (64), the outer wall surface of the rotating rod (64) is fixedly connected with the fixed blade (65) and the tension roller (66).

2. The electroplating apparatus for plating silver on copper wire with adjustable tightness of delivery according to claim 1, characterized in that, The outer wall surface of the electroplating body (1) is provided with a first guide hole (11) and a second guide hole (12), the first guide roller (13) is rotatably connected with the electroplating body (1) through the first guide hole (11), and the second guide roller (14) is rotatably connected with the electroplating body (1) through the second guide hole (12).

3. The electroplating apparatus for plating silver on copper wire with adjustable tightness of delivery according to claim 1, characterized in that, The pay-off assembly (2) includes a pay-off frame (21) fixedly connected with the electroplating body (1), the outer wall surface of the pay-off frame (21) is inserted with a pay-off rod (22), the end surface of the pay-off rod (22) is fixedly connected with a fixed block (23), and the outer wall surface of the fixed block (23) is inserted with the pay-off frame (21).

4. The electroplating apparatus for plating silver on copper wire with adjustable tightness of delivery according to claim 1, characterized in that, The outer wall surface of the push rod (313) is slidably connected with the push column (311), the end surface of the cleaning frame (321) is fixedly connected with the push rod (313), and the shape, size and structure of the second cleaning assembly (4) are the same as those of the first cleaning assembly (3).

5. The electroplating apparatus for plating silver on copper wire with adjustable tightness of delivery according to claim 1, wherein The end surface of the silver plating box (51) is fixedly connected with the electroplating body (1), the outer wall surface of the silver plating box (51) is provided with a first positioning hole (52) and a second positioning hole (53), the first positioning roller (54) is rotatably connected with the silver plating box (51) through the first positioning hole (52), and the second positioning roller (55) is rotatably connected with the silver plating box (51) through the second positioning hole (53).

6. The electroplating apparatus for plating silver on copper wire with adjustable tightness of delivery according to claim 1, wherein The outer wall surface of the fixing frame (61) is fixedly connected with the electroplating main body (1), the outer wall surface of the tension plate (62) is also provided with a tension sliding groove (67) for moving the tension sliding block (63), and the fixed blade (65) and the tension roller (66) are rotationally connected with the tension sliding block (63) through the rotating rod (64).

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