Laser emitting device and laser radar

Abstract

The embodiment of the utility model relates to the technical field of laser, and discloses a laser emitting device and a laser radar, and the laser emitting device comprises a circuit board; the light source comprises a fixed surface and a light-emitting surface which are opposite, the fixed surface is fixed on the non-edge area of the first surface of the circuit board, and the light-emitting surface is used for outputting a laser beam perpendicular to the circuit board; the pressing strip assembly is arranged in the edge area of the first face, and the pressing strip assembly is attached to the circuit board in the direction of one edge of the first face; and the collimating lens group is arranged on an emergent light path of the light source and is used for collimating the laser beam and then emitting the laser beam. By means of the mode, the divergence angle of the collimated laser beam is basically kept consistent with the designed divergence angle, and the optical index requirement of the laser emitting device is met.

Description

TECHNICAL FIELD

[0001] Embodiments of the present application relate to the technical field of laser technology, and specifically relate to a laser emitting device and a laser radar. BACKGROUND

[0002] In recent years, intelligent auxiliary driving of automobiles has developed rapidly, and in particular, high-level intelligent auxiliary driving is listed as a key development direction by automobile manufacturers and component manufacturers. As a main sensing element of high-level intelligent auxiliary driving, a laser radar can provide very accurate distance, angle and speed information, and is crucial in this field.

[0003] In a transmitting module of an existing laser radar, a laser light source is usually placed at the edge of a PCB (Printed Circuit Board) to facilitate heat dissipation of the laser light source, and a collimating mirror is installed in the light output direction of the laser light source so that the collimating mirror can collimate the laser beam emitted by the laser light source to make the laser beam exit with a very small divergence angle. When the PCB deforms due to thermal expansion and contraction, the edge of the PCB is prone to be raised upward or bent downward, which causes a large change in the back focal length of the laser emitter (i.e., the distance between the light output position of the laser light source and the collimating mirror), resulting in a change in the divergence angle of the collimated laser beam relative to the designed divergence angle, thereby failing to meet the optical index requirements. CONTENT OF THE INVENTION

[0004] In view of the above problems, embodiments of the present application provide a laser emitting device and a laser radar, so that the divergence angle of the collimated laser beam remains substantially consistent with the designed divergence angle, meeting the optical index requirements of the laser emitting device.

[0005] According to an aspect of embodiments of the present application, a laser emitting device is provided, which includes: a circuit board; a light source including opposite fixed surfaces and a light output surface, the fixed surfaces being fixed to a non-edge region of a first surface of the circuit board, and the light output surface being used to output a laser beam perpendicular to the circuit board; a pressing strip assembly arranged at an edge region of the first surface, the pressing strip assembly being arranged in abutment with the circuit board along the direction of one edge of the first surface; and a collimating mirror group arranged on the light output path of the light source and used to collimate and exit the laser beam.

[0006] The laser emitting device provided by the embodiments of the present application has the following advantages. The fixing surface of the light source is fixed on the non-edge area of the circuit board, so that the light emitting surface opposite to the fixing surface of the light source can output laser beams perpendicular to the circuit board. The collimating lens group is arranged on the light emitting path of the light source, so that the collimating lens group can collimate the laser beams. When the circuit board is deformed due to thermal expansion and contraction, the displacement of the non-edge area of the circuit board is smaller than that of the edge position. Further, the pressure strip assembly is arranged on the first surface of the circuit board, so that the pressure strip assembly can support the circuit board when the circuit board is deformed upward or downward, thereby preventing the deformation of the circuit board and greatly reducing the degree of deformation of the circuit board. In this way, in a high-temperature or low-temperature environment, the distance variation between the light source and the collimating lens group can be greatly reduced, that is, the back focal length variation of the laser emitting device is reduced, so that the variation of the divergence angle of the laser beams collimated by the collimating lens group is within a preset range and is basically consistent with the designed divergence angle of the laser emitting device, thereby ensuring that the divergence angle of the laser emitting device meets the index requirements in a high-temperature or low-temperature environment.

[0007] In an optional manner, one side of the first surface is further provided with a power connector, one end of the power connector is electrically connected with the light source, and the other end of the power connector is used for being electrically connected with an external power supply. The pressure strip assembly includes a first pressure strip and a second pressure strip, and the first pressure strip and the second pressure strip are respectively arranged on the circuit board along the directions of the other two opposite sides of the first surface. The first pressure strip and the second pressure strip can support the circuit board when the circuit board is deformed upward or downward, thereby reducing the degree of deformation of the circuit board.

[0008] In an optional manner, the second surface of the circuit board is provided with a pressure frame, the pressure frame is arranged on the four surrounding edges of the second surface, and the second surface is opposite to the first surface. The pressure frame can support the circuit board when the circuit board is deformed upward or downward, thereby reducing the degree of deformation of the circuit board.

[0009] In an optional manner, the four surrounding edges of the circuit board are provided with a plurality of first through holes, the first pressure strip and the second pressure strip are respectively provided with a plurality of second through holes at positions corresponding to the plurality of first through holes, and the pressure frame is respectively provided with a plurality of third through holes at positions corresponding to the plurality of first through holes. The device further includes fasteners, and the fasteners pass through the second through holes, the first through holes and the third through holes to fixedly connect the circuit board with the first pressure strip, the second pressure strip and the pressure frame. The fasteners can simultaneously fixedly connect the circuit board with the first pressure strip, the second pressure strip and the pressure frame, thereby quickly assembling the first pressure strip, the second pressure strip and the pressure frame.

[0010] In an optional mode, the thermal expansion coefficients of the first pressing strip, the second pressing strip and the pressing frame are equal, and the thermal expansion coefficient of the first pressing strip is smaller than the thermal expansion coefficient of the circuit board. In a high and low temperature environment, the deformation amount of the first pressing strip, the second pressing strip and the pressing frame is smaller than that of the circuit board, which can provide better support effect and further reduce the deformation of the circuit board.

[0011] In an optional mode, the device further comprises a lens barrel, one end of the lens barrel is fixedly connected with the first pressing strip and the second pressing strip respectively, and the center of the light source is aligned with the center of the lens barrel along the direction perpendicular to the circuit board; the collimating lens group is arranged in the lens barrel, the laser beam is incident into the collimating lens group from one end of the lens barrel, and is emitted from the other end of the lens barrel after collimation by the collimating lens group; the thermal expansion coefficient of the lens barrel is equal to the thermal expansion coefficient of the first pressing strip. In a high and low temperature environment, the deformation amount of the lens barrel is small, that is, the displacement of the lens barrel along the light path of the light source is small, so that the displacement of the collimating lens group in the lens barrel is also small, which makes the back focal length change of the laser emitting device small, and ensures that the change amount of the divergence angle of the laser beam is within a preset range.

[0012] In an optional mode, the lens barrel and the first pressing strip and the second pressing strip are fixed by an adhesive or by soldering. The operation of fixing by the adhesive is simple, which can improve the assembly speed; the fixing by soldering can make the fixing between the lens barrel and the first pressing strip and the second pressing strip more stable.

[0013] In an optional mode, the collimating lens group comprises a first collimating lens and a second collimating lens, the first collimating lens and the second collimating lens are arranged in sequence on the light path of the light source, the first collimating lens is used for collimating the laser beam for the first time, and the second collimating lens is used for collimating the laser beam for the second time after the first collimation and emitting. By collimating the laser beam emitted by the light source through the first collimating lens and the second collimating lens, the divergence angle of the laser beam can be reduced to within a preset range, which meets the optical index requirements of the laser emitting device.

[0014] In an optional mode, the light source is a vertical cavity surface emitting laser or an edge emitting laser.

[0015] According to another aspect of the embodiments of the present application, a laser radar is provided, comprising the laser emitting device provided by any of the above embodiments.

[0016] Compared with the edge position, the displacement of the non-edge area of the circuit board is smaller when the circuit board in the laser emitting device deforms due to thermal expansion and cold contraction under high and low temperature environments, and therefore the distance variation between the light source and the collimating mirror group is smaller. Further, the pressure strip assembly is arranged on the first surface of the circuit board, and the pressure strip assembly can support the circuit board when the circuit board deforms upward or downward, thereby preventing the deformation of the circuit board and greatly reducing the deformation degree of the circuit board. In the above manner, the back focal length variation of the laser emitting device can be greatly reduced, so that the laser beams emitted by the light source can be normally collimated by the collimating mirror group under high and low temperature environments, the variation of the divergence angle of the laser beams emitted by the laser emitting device is ensured to be within a preset range, the divergence angle of the laser beams of the laser radar meets the optical index, and the laser radar can normally work in high and low temperature environments.

[0017] The above description is only a summary of the technical solutions of the present application. In order to enable one skilled in the art to better understand the technical means of the present application, the content of the specification can be implemented, and in order to enable the above and other purposes, features and advantages of the present application to be more obvious and easy to understand, the following specific embodiments of the present application are described. BRIEF DESCRIPTION OF DRAWINGS

[0018] Various other advantages and benefits will become apparent to those of ordinary skill in the art upon reading the following detailed description of the preferred embodiments. The accompanying drawings are included to provide a description of the preferred embodiments and are not meant to limit the present application. Moreover, the same reference numerals in the attached drawings refer to the same or similar components. In the drawings:

[0019] Figure 1 A cross-sectional view of the laser emitting device provided by the embodiments of the present application is provided;

[0020] Figure 2 A partial structure exploded view of the laser emitting device provided by the embodiments of the present application is provided;

[0021] Figure 3 A structure schematic view of the circuit board provided by the embodiments of the present application is provided;

[0022] Figure 4 A perspective view of the laser emitting device provided by the embodiments of the present application is provided.

[0023] The reference numerals in the specific embodiments are as follows:

[0024] 10, laser emitting device;

[0025] 100, circuit board; 101, first through hole; 102, glue layer; 110, first surface; 111, short side; 112, long side; 120, power connector; 130, second surface; 140, pressing frame; 141, third through hole; 150, fastener; 200, light source; 210, light emitting surface; 300, pressing strip assembly; 310, first pressing strip; 311, second through hole; 320, second pressing strip; 400, collimator group; 410, first collimator; 420, second collimator; 500, lens barrel. DETAILED DESCRIPTION

[0026] The embodiments of the technical solutions of the present application will be described in detail below with reference to the drawings. The following embodiments are only used to more clearly illustrate the technical solutions of the present application, and therefore only serve as examples, and cannot limit the protection scope of the present application.

[0027] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs; the terms used herein are only for the purpose of describing specific embodiments and are not intended to limit the present application; the terms "include" and "have" and any variations thereof in the specification and claims of the present application and the above description of drawings are intended to cover non-exclusive inclusion.

[0028] In the description of the embodiments of the present application, the technical terms "first", "second", etc. are only used to distinguish different objects, and cannot be understood as indicating or implying relative importance or implicitly indicating the number, specific order or primary and secondary relationship of the indicated technical features. In the description of the embodiments of the present application, the meaning of "multiple" is more than two, unless otherwise explicitly and specifically limited.

[0029] In this paper, the reference to "embodiments" means that the specific features, structures or properties described in conjunction with the embodiments can be included in at least one embodiment of the present application. The appearance of this phrase in various places in the specification does not necessarily mean the same embodiment, nor is it an independent or alternative embodiment to other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0030] In the description of the embodiments of the present application, the term "and / or" is only a description of the association relationship between the associated objects, which means that there can be three relationships, for example, A and / or B, which can represent: A exists, A and B exist, and B exists. In addition, the character " / " in this paper generally represents a "or" relationship between the front and rear associated objects.

[0031] In the description of the embodiments of the present application, the term "a plurality of" refers to two or more (including two), and similarly, "a plurality of groups" refers to two or more groups (including two groups), and "a plurality of pieces" refers to two or more pieces (including two pieces).

[0032] In the description of the embodiments of the present application, the technical terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate the orientation or positional relationship shown in the drawings, which is only for the convenience of describing the embodiments of the present application and simplifying the description, and does not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the embodiments of the present application.

[0033] In the description of the embodiments of the present application, unless otherwise explicitly specified and limited, the technical terms "mounting", "connecting", "connecting", "fixing" and the like should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the internal communication of two elements or the interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in the embodiments of the present application can be understood according to the specific circumstances.

[0034] The light source of the laser radar can be various types of lasers, such as edge-emitting semiconductor lasers (Edge-Emitting Laser, EEL for short), vertical cavity surface emitting lasers (Vertical Cavity Surface Emitting Laser, VCSEL for short), fiber lasers, etc. The laser radar must pass various severe environmental tests before being installed on a vehicle, especially in high and low temperature tests, and the various optical indicators of the radar must be normal, such as the fast and slow axis divergence angles and the directivity of the beam, so that the laser radar can work normally when the vehicle is driving in different climate environments. In order to achieve this purpose, the laser radar is designed to have a complex optical and mechanical structure, and a complex material system is used to match and compensate for the large fluctuations in optical indicators caused by thermal expansion and contraction of the material. How to make the optical indicators of the laser radar emission module change little in high and low temperature environments is a technical problem that needs to be solved at present.

[0035] In the emission module of the existing laser radar, the laser light source is installed on the PCB, and the collimating mirror is installed in the light emitting direction of the laser light source. The laser beam emitted by the laser light source is collimated through the collimating mirror, so that the laser beam can be emitted with a very small divergence angle in a small range. In order to facilitate heat dissipation of the laser light source, the laser light source is usually placed at the edge of the PCB. When the PCB deforms due to thermal expansion and contraction, the edge of the PCB is prone to be upwardly warped or downwardly bent, which causes the position of the laser light source to deviate, the distance between the light emitting position of the laser light source and the collimating mirror, that is, the back focal length of the emission module, changes greatly, and the divergence angle of the laser beam collimated by the collimating mirror exceeds the preset range, which cannot meet the divergence angle index requirement of the emission module.

[0036] When the PCB deforms due to thermal expansion and contraction, the deviation of the non-edge area of the PCB is smaller than that of the edge of the PCB which is upwardly warped or downwardly bent. Therefore, in order to solve the above problem, the laser light source can be arranged in the non-edge area of the circuit board (PCB in the above), and the collimating mirror can be arranged in the light emitting path of the light source. In this way, when the circuit board deforms due to thermal expansion and contraction, the displacement of the non-edge area of the circuit board is smaller than that of the edge of the circuit board, and the distance between the laser light source and the collimating mirror changes less, so that the distance between the light emitting position of the laser light source and the collimating mirror, that is, the back focal length of the laser emission device, changes less.

[0037] However, under high and low temperature environments, the circuit board can deform seriously, which causes the non-edge area of the circuit board to still deviate greatly, and the distance between the laser light source on the non-edge area of the circuit board and the collimating mirror still changes greatly, that is, the back focal length of the laser emission device still changes greatly, which causes the divergence angle of the laser beam collimated by the collimating mirror to exceed the preset range, and cannot meet the divergence angle index requirement of the emission module.

[0038] To this end, the application provides a laser emission device. A pressure strip assembly is attached to the first surface of the circuit board where the light source is arranged. When the circuit board deforms upwardly or downwardly, the pressure strip assembly supports the circuit board to prevent the deformation of the circuit board. The degree of upward warping or downward bending of the circuit board can be greatly reduced, and thus the deformation of the circuit board is reduced, and the back focal length of the laser emission device is also reduced. The change of the divergence angle of the laser beam collimated by the collimating mirror is within the preset range, so that the divergence angle of the laser emission device can meet the index requirement under high and low temperature environments.

[0039] Please refer to Figure 1 and Figure 2 , Figure 1 shows a cross-sectional view of the laser emission device provided by the embodiment of the application, Figure 2An exploded view of a part of a laser emitting device is shown. The laser emitting device 10 includes a circuit board 100, a light source 200 and a collimating mirror group 400. The light source 200 includes opposite fixing faces (not shown in the figure) and an emitting face 210. The fixing faces are fixed to a non-edge region of a first face 110 of the circuit board 100, and the emitting face 210 is used to output a laser beam perpendicular to the circuit board 100. A pressing strip assembly 300 is arranged at an edge region of the first face 110, and the pressing strip assembly 300 is arranged along a direction of one edge of the first face 110 and is attached to the circuit board 100. The collimating mirror group 400 is arranged on an emitting light path of the light source 200 and is used to collimate and emit the laser beam. In the figure, Figure 1 the arrow indicates the emitting light path of the light source 200.

[0040] The circuit board 100 can be a cube or a cuboid. The main material of the circuit board 100 can be an epoxy glass fiber plate material. The circuit board 100 includes opposite first and second faces 110 and 130 (as shown in the figure), and the fixing faces are fixed to the first face 110. Preferably, the non-edge region of the circuit board 100 can be a central position of the circuit board 100, i.e., a position where diagonals of the first face 110 of the circuit board 100 intersect. The fixing faces of the light source 200 are fixed to the non-edge region of the circuit board 100, which means that the centers of the fixing faces are approximately aligned with the center of the circuit board 100, so that the center of the light source 200 is approximately aligned with the center of the circuit board 100. Of course, the non-edge region of the circuit board 100 can also refer to a partial region extending outward from the central position, so that the center of the fixing face of the light source 200 can be at any position on the partial region. Figure 4 In the case where the emitting face 210 of the light source 200 can output a laser beam perpendicular to the circuit board 100, the light source 200 can be a vertical cavity surface emitting laser or an edge emitting laser. The fixing faces can be fixedly arranged in attachment with the non-edge region of the circuit board 100, so that the entire light source 200 is fixedly arranged in the non-edge region of the circuit board 100. When the circuit board 100 is deformed, compared with the edge region of the circuit board 100, the displacement change of the non-edge region of the circuit board 100 is smaller, and the displacement change of the light source 200 on the non-edge region of the circuit board 100 is also smaller. Moreover, the fixing faces are fixedly connected with the circuit board 100, so that the light source 200 is electrically connected with the circuit board 100, and when the circuit board 100 is connected with a power supply, the emitting face 210 opposite to the fixing faces can output a laser beam perpendicular to the circuit board 100.

[0041] The circuit board 100 can be a cube or a cuboid. The main material of the circuit board 100 can be an epoxy glass fiber plate material. The circuit board 100 includes opposite first and second faces 110 and 130 (as shown in the figure), and the fixing faces are fixed to the first face 110. Preferably, the non-edge region of the circuit board 100 can be a central position of the circuit board 100, i.e., a position where diagonals of the first face 110 of the circuit board 100 intersect. The fixing faces of the light source 200 are fixed to the non-edge region of the circuit board 100, which means that the centers of the fixing faces are approximately aligned with the center of the circuit board 100, so that the center of the light source 200 is approximately aligned with the center of the circuit board 100. Of course, the non-edge region of the circuit board 100 can also refer to a partial region extending outward from the central position, so that the center of the fixing face of the light source 200 can be at any position on the partial region.

[0042] Figure 1 ​It is known that t is the thickness of the circuit board 100, and l is the length of the circuit board 100. It is assumed that the length of the laser emitting device 10, i.e. the length in the direction of the optical axis, is L. When the light source 200 is arranged at the edge of the circuit board 100, the direction of the optical axis is along the length direction of the circuit board 100, and thus the length L of the laser emitting device 10 includes the length l of the circuit board 100. In the laser emitting device 10 of the present application, the direction of the optical axis is along the thickness direction of the circuit board 100, and thus the length L of the laser emitting device 10 includes the thickness t of the circuit board 100. Since the thickness t of the circuit board 100 is much smaller than the length l of the circuit board 100, the light source 200 is arranged at the center position of the circuit board 100, and the collimating mirror group 400 is arranged on the light path of the light source 200, so that the length of the laser emitting device 10 can be reduced.

[0043] The pressing strip assembly 300 can include two pressing strips, for example, a first pressing strip 310 and a second pressing strip 320 as shown in Figure 2 The pressing strip assembly 300 can also include four pressing strips, which can be arranged at the four edges of the circuit board 100, or can be combined into a rectangular pressing frame first, and then the rectangular pressing frame is fixedly arranged at the four edges of the circuit board 100. The pressing strip assembly 300 can be made of metal material.

[0044] The collimating mirror group 400 collimates the laser beam output by the light source 200, so that the collimated laser beam can be emitted with a very small divergence angle. For example, after collimation by the collimating mirror group 400, the divergence angle of the emitted laser beam can be within the range of ±0.1°.

[0045] As shown in Figure 1 The back focal length of the laser emitter is L. When the circuit board 100 deforms due to thermal expansion and contraction, since the displacement of the center position of the circuit board 100 is small, the distance between the collimating mirror group 400 and the center position changes little, so that the back focal length of the laser emitting device 10 changes little. In this way, it can be ensured that the collimating mirror group 400 can collimate the laser beam output by the light source 200, so that the change in the divergence angle of the collimated laser beam is within a predetermined range, for example, the change in the divergence angle is within 0.05°.

[0046] Please continue to refer to Figure 1The collimating lens group 400 can include a first collimating lens 410 and a second collimating lens 420, which are arranged in sequence on the light exit path of the light source 200, the first collimating lens 410 is used for collimating the laser beam for the first time, and the second collimating lens 420 is used for collimating the laser beam for the second time and emitting. After two times of collimating the laser beam, the divergence angle of the laser beam can be reduced to a preset range.

[0047] In a high-temperature or low-temperature environment, any two ends of the circuit board 100, for example Figure 3 The center position of the circuit board 100 may be displaced along the light exit path of the light source 200, so that the light source 200 is displaced in the same direction, which reduces or increases the distance between the light exit surface 210 of the light source 200 and the collimating lens group 400, thereby reducing or increasing the divergence angle of the collimated laser beam.

[0048] By attaching the pressing strip assembly 300 along one edge of the first surface 110, the pressing strip assembly 300 can support the upward warping or downward bending of the A end and the B end of the circuit board 100, reduce the degree of upward warping or downward bending of the A end and the B end, and further reduce the deformation degree of the circuit board 100, so that the displacement of the light source 200 is greatly reduced, thereby the distance between the light exit surface 210 of the light source 200 and the collimating lens group 400 does not change or changes very little, and finally the change amount of the divergence angle of the laser beam is controlled within a preset range.

[0049] In some embodiments, the pressing strip assembly 300 can be made of a metal material with a low thermal expansion coefficient, and the main material of the circuit board 100 is an epoxy glass fiber plate material, so that the thermal expansion coefficient of the pressing strip assembly 300 is less than the thermal expansion coefficient of the circuit board 100. In a high-temperature or low-temperature environment, the deformation amount of the pressing strip assembly 300 is smaller than that of the circuit board 100, which can provide better support effect and further reduce the deformation of the circuit board 100.

[0050] In the laser emitting device 10 provided in this application embodiment, by fixing the fixed surface of the light source 200 to the non-edge area of ​​the circuit board 100, the light-emitting surface 210 of the light source 200 opposite to the fixed surface can output a laser beam perpendicular to the circuit board 100. Furthermore, by placing the collimating lens group 400 in the output light path of the light source 200, the collimating lens group 400 can collimate the laser beam. When the circuit board 100 deforms due to thermal expansion and contraction, the displacement of the non-edge area of ​​the circuit board 100 is smaller compared to the edge position. Further, by attaching a pressure strip assembly 300 to the first surface 110 of the circuit board 100, the pressure strip assembly 300 can support the circuit board 100 when it deforms upwards or downwards, preventing deformation and greatly reducing the degree of deformation. By means of the above method, the change in distance between the light source 200 and the collimating lens group 400 can be greatly reduced in high temperature or low temperature environments, that is, the change in back focus of the laser emitting device 10 can be reduced, so that the change in the divergence angle of the laser beam collimated by the collimating lens group 400 is within the preset range and basically consistent with the divergence angle designed for the laser emitting device 10, thereby ensuring that the divergence angle of the laser emitting device 10 meets the requirements in both high and low temperature environments.

[0051] To reduce the degree of deformation of the circuit board 100, this application further proposes an implementation method, please refer to [further details]. Figure 2 and combined Figure 3 , Figure 3 A schematic diagram of the circuit board structure provided in an embodiment of this application is shown. As shown in the figure, a power connector 120 is also provided on one side of the first surface 110. One end of the power connector 120 is electrically connected to the light source 200, and the other end of the power connector 120 is used to electrically connect to an external power source. The first pressure strip 310 and the second pressure strip 320 are respectively attached to the circuit board 100 along the other two opposite sides of the first surface 110.

[0052] Power connector 120 can be as follows Figure 2 The light source 200 is positioned at the short side 111 of the first surface 110 to facilitate wiring of the power connector 120 to an external power source. When the external power source supplies power to the circuit board 100, the light source 200 can output a laser beam.

[0053] The first pressure strip 310 and the second pressure strip 320 can be extended along the long side 112 of the first surface 110, so that the first pressure strip 310 and the second pressure strip 320 can support the A end and B end of the circuit board 100 when they are tilted upward or bent downward, thereby reducing the degree of tilting or bending of the A end and B end, and thus reducing the degree of deformation of the circuit board 100.

[0054] The first pressing strip 310 and the second pressing strip 320 can be made of a metal material with a low coefficient of thermal expansion, so that the coefficients of thermal expansion of the first pressing strip 310 and the second pressing strip 320 are less than the coefficient of thermal expansion of the circuit board 100. In a high-low temperature environment, the deformation of the first pressing strip 310 and the second pressing strip 320 is less than that of the circuit board 100, and a better supporting effect can be provided, thereby further reducing the deformation of the circuit board 100.

[0055] To further reduce the deformation of the circuit board 100, the application further provides an embodiment, please continue to refer to 2 and Figure 3 , and combine Figure 4 , Figure 4 A perspective view of a laser emitting device provided by an embodiment of the application is shown in the figure. The second surface 130 of the circuit board 100 is provided with a pressing frame 140, which is arranged in close contact with the four peripheral edges of the second surface 130.

[0056] The pressing frame 140 can support the A end and the B end of the circuit board 100 when they are curved upward or downward, reduce the degree of curvature of the A end and the B end, and thereby reduce the deformation of the circuit board 100.

[0057] The pressing frame 140 can be made of the same metal material as the first pressing strip 310, so that the coefficient of thermal expansion of the pressing frame 140 is equal to that of the first pressing strip 310, and the coefficient of thermal expansion of the pressing frame 140 is less than that of the circuit board 100. Thus, the deformation of the pressing frame 140 in a high-low temperature environment is less than that of the circuit board 100, and a better supporting effect can be provided, thereby further reducing the deformation of the circuit board 100.

[0058] As Figure 2 shown, to connect and fix the first pressing strip 310, the second pressing strip 320 and the pressing frame 140 to the circuit board 100 respectively, a plurality of first through holes 101 can be formed in the four peripheral edges of the circuit board 100, a plurality of second through holes 311 can be formed in the first pressing strip 310 and the second pressing strip 320 at positions corresponding to the plurality of first through holes 101, and a plurality of third through holes 141 can be formed in the pressing frame 140 at positions corresponding to the plurality of first through holes 101. The laser emitting device 10 further comprises a fastener 150. The fastener 150 is used to sequentially pass through the second through hole 311, the first through hole 101 and the third through hole 141, so as to fix and connect the circuit board 100 to the first pressing strip 310, the second pressing strip 320 and the pressing frame 140 respectively. The third through hole 141 can be a threaded hole, and the fastener 150 can be a screw. Of course, the first pressing strip 310 and the second pressing strip 320 can be fixed and pasted to the first surface 110 of the circuit board by using glue, and the pressing frame 140 can be fixed and pasted to the second surface 130 of the circuit board 100 by using glue, which can also achieve the fixed connection of the first pressing strip 310, the second pressing strip 320 and the pressing frame 140 to the circuit board 100 respectively.

[0059] By clamping the circuit board 100 in the middle through the first pressing strip 310 and the second pressing strip 320 and the pressing frame 140, the circuit board 100 can be supported together when the circuit board 100 deforms, greatly reducing the deformation of the circuit board 100, thereby reducing the back focal length change amount of the laser emitting device 10, reducing the divergence angle change of the collimated laser beam, and meeting the optical index requirements of the laser emitting device 10.

[0060] In order to fix the collimating lens group 400 on the exit light path of the light source 200, the present application further proposes an embodiment, please continue to refer to Figure 1 and Figure 4 The laser emitting device 10 further comprises a lens barrel 500, one end of the lens barrel 500 is fixedly connected with the first pressing strip 310 and the second pressing strip 320, and the center of the light source 200 is aligned with the center of the lens barrel 500 along the direction perpendicular to the circuit board 100. The collimating lens group 400 is arranged in the lens barrel 500, and the laser beam is incident into the collimating lens group 400 from one end of the lens barrel 500 and is emitted from the other end of the lens barrel 500 after collimation by the collimating lens group 400.

[0061] The lens barrel 500 and the first pressing strip 310 and the second pressing strip 320 can be fixed by adhesive or by solder, for example, the first pressing strip 310 and the second pressing strip 320 can be fixedly connected with one end of the lens barrel 500 through the glue layer 102 in the figure.

[0062] Under high and low temperature environment, the lens barrel 500 may be deformed due to thermal expansion and contraction, causing the collimating lens group 400 in the lens barrel 500 to displace along the exit light path of the light source 200, and further causing the distance between the collimating lens group 400 and the light exit surface of the light source 200 to change, so that the divergence angle of the laser beam changes greatly. Therefore, the lens barrel 500 can be made of the same metal material as the first pressing strip 310 and the second pressing strip 320, for example, a low CTE metal material, so that the thermal expansion coefficient of the lens barrel 500 is equal to the thermal expansion coefficient of the first pressing strip 310 and the second pressing strip 320, that is, the thermal expansion coefficient of the lens barrel 500 is smaller than the thermal expansion coefficient of the circuit board 100. Under high and low temperature environment, the deformation amount of the lens barrel 500 is small, that is, the displacement of the lens barrel 500 along the exit light path of the light source 200 is small, so that the displacement of the collimating lens group 400 in the lens barrel 500 is also small, so that the back focal length change of the laser emitting device 10 is small, and the change amount of the divergence angle of the laser beam is ensured to be within the preset range.

[0063] As Figure 1As shown, when the collimating lens group 400 includes the first collimating lens 410 and the second collimating lens 420, the back focal length X of the laser emitting device 10 is X = L1 + L2 + L3, where L1 represents the thickness of the first pressure strip 310 or the second pressure strip 320, L2 represents the thickness of the glue or solder, and L3 represents the distance between the end surface of the lens barrel 500 and the mounting surface of the second collimating lens 420. When the first pressure strip 310 and the second pressure strip 320 and the lens barrel 500 are made of a low-CTE metal material, and the thickness of the glue layer 102 is very small, the total change amount of X is small under high and low temperature environments, which means that the change amount of the divergence angle of the laser emitting device 10 is also small, thereby ensuring that the divergence angle of the laser emitting device 10 meets the optical index requirements.

[0064] According to another aspect of the embodiments of the present application, a laser radar is also provided, which includes the laser emitting device 10 provided by any of the above embodiments.

[0065] Under high and low temperature environments, when the circuit board 100 in the laser emitting device 10 deforms due to thermal expansion and contraction, the displacement of the non-edge region of the circuit board 100 is smaller than that of the edge position, and therefore, the change amount of the distance between the light source 200 and the collimating lens group 400 is small. Further, the pressure strip assembly 300 is attached to the first surface 110 of the circuit board 100, and the pressure strip assembly 300 can support the circuit board 100 when it deforms upward or downward, thereby preventing the deformation of the circuit board 100 and greatly reducing the deformation degree of the circuit board 100. In the above manner, the change amount of the back focal length of the laser emitting device 10 can be greatly reduced, so that the laser beams emitted by the light source 200 can be normally collimated by the collimating lens group 400 under high and low temperature environments, and the change amount of the divergence angle of the laser beams emitted by the laser emitting device 10 is ensured to be within a preset range, thereby ensuring that the divergence angle of the laser beams of the laser radar meets the optical index, and enabling the laser radar to normally work under high and low temperature environments.

[0066] Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, but not to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that: they can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacement for part or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application, and they should be covered in the scope of the claims and the description of the present application. Especially, as long as there is no structural conflict, each technical feature mentioned in each embodiment can be combined in any way. The present application is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A laser emitting device, characterized by, The device comprises: a circuit board; a light source comprising opposite fixed surfaces and a light output surface, the fixed surfaces being fixed to a non-edge region of a first surface of the circuit board, the light output surface being used to output a laser beam perpendicular to the circuit board; a pressing strip assembly arranged at an edge region of the first surface, the pressing strip assembly being arranged in abutment with the circuit board along the direction of one edge of the first surface; a collimating mirror group arranged on the light output path of the light source and used to collimate and output the laser beam.

2. The apparatus of claim 1, wherein, One end of a power connector arranged at one edge of the first surface is electrically connected to the light source, and the other end of the power connector is used to be electrically connected to an external power source. The pressing strip assembly comprises a first pressing strip and a second pressing strip, and the first pressing strip and the second pressing strip are arranged in abutment with the circuit board along the direction of the other two opposite edges of the first surface, respectively.

3. The apparatus of claim 2, wherein, A pressing frame is arranged on a second surface of the circuit board, the pressing frame being arranged in abutment with the four peripheral edges of the second surface, and the second surface is opposite to the first surface.

4. The apparatus of claim 3, wherein, A plurality of first through holes are arranged on the four peripheral edges of the circuit board, a plurality of second through holes are arranged on the first pressing strip and the second pressing strip at positions corresponding to the plurality of first through holes, respectively, and a plurality of third through holes are arranged on the pressing frame at positions corresponding to the plurality of first through holes, respectively. The device further comprises fasteners, and the fasteners pass through the second through holes, the first through holes, and the third through holes to fixedly connect the circuit board with the first pressing strip, the second pressing strip, and the pressing frame, respectively.

5. The apparatus of claim 3, wherein, The first pressing strip, the second pressing strip, and the pressing frame have equal coefficients of thermal expansion, and the coefficient of thermal expansion of the first pressing strip is smaller than the coefficient of thermal expansion of the circuit board.

6. The apparatus of claim 5, wherein, The device further comprises a lens barrel, one end of the lens barrel is fixedly connected with the first pressing strip and the second pressing strip, respectively, and the center of the light source is aligned with the center of the lens barrel along a direction perpendicular to the circuit board. The collimating mirror group is arranged in the lens barrel, the laser beam enters the collimating mirror group from one end of the lens barrel, is collimated by the collimating mirror group, and then exits from the other end of the lens barrel. The lens barrel has a coefficient of thermal expansion equal to that of the first pressing strip.

7. The apparatus of claim 6, wherein, The lens barrel and the first pressing strip and the second pressing strip are fixed by an adhesive or by soldering.

8. The apparatus of claim 1, wherein, The collimating mirror group comprises a first collimating mirror and a second collimating mirror, the first collimating mirror and the second collimating mirror are arranged in sequence on the light output path of the light source, the first collimating mirror is used to collimate the laser beam for the first time, and the second collimating mirror is used to collimate the laser beam for the second time after the first collimation and then output the laser beam.

9. The apparatus of claim 1, wherein, The light source is a vertical cavity surface emitting laser or an edge emitting laser.

10. A lidar, comprising: The laser radar comprises the laser emitting device according to any one of claims 1-9.

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