Display module and display device

Abstract

The utility model relates to a display module and a display device. The display module comprises an array substrate, a touch substrate and a conductive connecting piece. The array substrate comprises a display area and a binding area located on at least one side of the display area. The touch substrate comprises a first substrate and a touch layer formed on the first substrate, and the orthographic projection of the touch layer on the array substrate covers the display area and extends to the binding area; the conductive connecting piece is arranged between the array substrate and the touch layer, one end of the conductive connecting piece is electrically connected with the binding area of the array substrate, and the other opposite end of the conductive connecting piece is electrically connected with the touch layer; the touch layer is formed on the first substrate, so that the process is simplified, the thickness of the display module is reduced, the production yield of the display module is improved, meanwhile, the conductive connecting piece is arranged between the array substrate and the touch layer, and the touch function is achieved by directly and electrically connecting the conductive connecting piece with the array substrate and the touch layer; the increase of the frame width of the display module is reduced.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of display, in particular to a display module and a display device. BACKGROUND

[0002] Capacitive touch screen is a common touch input device, which works based on the principle of capacitive sensing. Its main structure includes a touch (senser) film, which is usually composed of transparent conductive materials such as indium tin oxide (ITO). When a finger or other conductive object contacts the screen surface, the capacitance value at the touch point will change, and the touch screen controller can detect these capacitance changes and accurately calculate the position of the touch point, thereby realizing human-computer interaction. Capacitive touch screen is widely used due to its fast response speed, high sensitivity, high reliability and high durability.

[0003] In related technologies, the touch film of the capacitive touch screen can be formed in a direct on-cell touch (DOT) manner, that is, the ITO is directly deposited on the surface of the encapsulation layer of the light emitting device layer; or the touch film is attached to the upper side of the light emitting device layer as an independent component. However, the first structure has high process requirement, high cost, and is prone to display defects (Mura), and once the DOT of the display screen is abnormal, the entire display screen will be scrapped; the second structure does not affect the display screen, but increases the thickness of the module stack, and the touch film needs to be additionally bound to the circuit board, which increases the frame width of the display module. CONTENT OF THE UTILITY MODEL

[0004] Therefore, the present application provides a display module and a display device, which can reduce the overall thickness of the display module, reduce the increase of the frame width of the display module, and improve the production yield of the display module while realizing capacitive touch.

[0005] The present application provides a display module, which comprises:

[0006] An array substrate comprising a display area and a binding area located on at least one side of the display area;

[0007] A touch substrate disposed above the array substrate, the touch substrate comprising a first substrate and a touch layer formed on the first substrate, the touch layer being located on the side of the first substrate close to the array substrate, and the orthographic projection of the touch layer on the array substrate covering the display area and extending to the binding area; and

[0008] A conductive connecting piece is arranged between the array substrate and the touch control layer, one end of the conductive connecting piece is electrically connected with the binding area of the array substrate, and the other end of the conductive connecting piece is electrically connected with the touch control layer, and the touch control layer and the array substrate are signal-connected through the conductive connecting piece.

[0009] In some embodiments, the display module further comprises a light emitting device layer, the light emitting device layer is arranged between the array substrate and the touch control substrate, and at least one side of the light emitting device layer is arranged inwardly relative to the edges of the array substrate and the touch control substrate.

[0010] The conductive connecting piece is located in the space formed inwardly relative to the array substrate and the touch control substrate.

[0011] In some embodiments, the display module further comprises a glue frame, the glue frame is located between the array substrate and the touch control substrate, and is arranged around the light emitting device layer.

[0012] The touch control layer extends out of the edge of the glue frame at one end close to the binding area, and the conductive connecting piece is located on the side of the glue frame away from the light emitting device layer and in contact with the part of the touch control layer extending out of the edge of the glue frame.

[0013] In some embodiments, the conductive connecting piece comprises a first pad, a conductive connecting part and a second pad.

[0014] The first pad is arranged on the touch control layer and between the touch control layer and the conductive connecting part, and the second pad is arranged on the array substrate and between the array substrate and the conductive connecting part.

[0015] In some embodiments, the thickness of the conductive connecting piece in a first direction ranges from 0.01 mm to 0.03 mm, and the width of the conductive connecting piece in a second direction ranges from 0.5 mm to 1.5 mm, wherein the first direction is the thickness direction of the array substrate, the second direction is the direction from the display area to the binding area, and the second direction is perpendicular to the first direction.

[0016] In some embodiments, the thickness of the touch control layer in the first direction ranges from 0.01 mm to 0.15 mm.

[0017] In some embodiments, the material of the conductive connecting part is conductive glue.

[0018] In some embodiments, the material of the touch control layer is metal oxide or metal.

[0019] In some embodiments, the display module further comprises:

[0020] an optical adhesive layer disposed between the touch control layer and the light emitting device layer; and

[0021] a heat dissipation layer disposed on a side of the array substrate away from the light emitting device layer.

[0022] The present application also provides a display device comprising the display module as described above.

[0023] The present application provides a display module and a display device. The present application forms a touch control substrate by depositing a touch control layer on a first substrate, and then assembles the touch control substrate and an array substrate in alignment. The touch control layer extends to a bonding area of the array substrate, one end of a conductive connecting member is electrically connected to the bonding area of the array substrate, and the opposite end of the conductive connecting member is electrically connected to the touch control layer, so that the signal between the touch control layer and the array substrate is conducted, and the touch control function is realized. The touch control layer is directly formed on the first substrate, which can reduce the thickness of the display module, and avoid affecting other display components of the display module, thereby improving the production yield of the display module. Meanwhile, the touch control layer extends to the bonding area of the array substrate, so that the conductive connecting member is arranged at the space between the bonding area of the array substrate and the extended part of the touch control layer, and the conductive connecting member is directly electrically connected to the array substrate and the touch control layer to realize the signal conduction between the array substrate and the touch control layer, thereby simplifying the process, avoiding the additional circuit board structure, and reducing the impact on the frame of the display module. BRIEF DESCRIPTION OF DRAWINGS

[0024] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the embodiment description. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can also be obtained by those skilled in the art without any creative effort on the basis of these drawings.

[0025] In order to more completely understand the present application and its beneficial effects, the following will be described in conjunction with the drawings, wherein the same reference numerals in the following description represent the same parts.

[0026] Figure 1 is a cross-sectional view of a display module provided by the prior art;

[0027] Figure 2 is a cross-sectional view of another display module provided by the prior art;

[0028] Figure 3 is a cross-sectional view of a display module provided by an embodiment of the present application;

[0029] Figure 4is a partial schematic view of a display module provided by an embodiment of the present application.

[0030] Label explanation:

[0031] 10, display module; 101, cover plate; 102, touch film; 110, array substrate; 120, touch substrate; 121, first substrate; 122, touch layer; 130, conductive connecting piece; 131, first pad; 132, conductive connecting part; 133, second pad; 140, light emitting device layer; 141, anode layer; 142, organic light emitting layer; 143, cathode layer; 144, thin film packaging layer; 150, glue frame; 160, optical glue layer; 170, heat dissipation layer; 180, polarizer; 210, first circuit board; 220, chip; 230, second circuit board. DETAILED DESCRIPTION

[0032] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by a person skilled in the art without creative labor are within the protection scope of the present application.

[0033] Please refer to Figure 1 , Figure 1 is a cross-sectional view of a display module in the prior art, which includes an array substrate 110, a light emitting device layer 140, a touch film 102, a polarizer 180 and a cover plate 101 which are sequentially stacked along a first direction Y. The array substrate 110 includes a binding area B, and the binding area B is bound with a first circuit board 210 and a chip 220. The light emitting device layer 140 includes an anode layer 141, an organic light emitting layer 142, a cathode layer 143 and a thin film packaging layer 144 (TFE) which are sequentially stacked along the first direction Y. The display module adopts a design of integrated packaging touch (DOT), that is, an ITO film is formed on the upper surface of the thin film packaging layer 144 as the touch film 102 by depositing ITO. However, the process of the display module has high requirements, high cost, is prone to display defects (Mura), and once DOT abnormalities occur, the entire display module will be scrapped, resulting in a low production yield of the display module.

[0034] Please refer to Figure 2 , Figure 2As shown in FIG. 1, a cross-sectional view of another display module in the prior art includes an array substrate 110, a light-emitting device layer 140, a polarizer 180, a touch film 102, and a cover plate 101 which are sequentially stacked in a first direction Y. The array substrate 110 includes a binding area B which is bound with a first circuit board 210 and a chip 220. The display module uses the touch film 102 as an independent film layer which is attached to the polarizer 180 by lamination. This structure does not affect the light-emitting device layer 140, but the thickness of the touch film 102 is relatively large, which increases the overall thickness of the display module. In addition, the touch film 102 needs to be additionally provided with a second circuit board 230 to realize the touch function, so that the display module structure needs to be bound with two circuit boards at the same time, which affects the frame structure and width of the display module.

[0035] To solve the above problems, the present application provides a display module 10, please refer to Figure 3 The display module 10 includes an array substrate 110, a touch substrate 120, and a conductive connecting piece 130. The array substrate 110 includes a display area A and a binding area B located on at least one side of the display area A. The touch substrate 120 is arranged above the array substrate 110, and the touch substrate 120 includes a first substrate 121 and a touch layer 122 formed on the first substrate 121. The touch layer 122 is located on the side of the first substrate 121 close to the array substrate 110, and the orthographic projection of the touch layer 122 on the array substrate 110 covers the display area A and extends to the binding area B. The conductive connecting piece 130 is arranged between the array substrate 110 and the touch layer 122, one end of the conductive connecting piece 130 is electrically connected with the binding area B of the array substrate 110, and the opposite end of the conductive connecting piece 130 is electrically connected with the touch layer 122. The touch layer 122 and the array substrate 110 are signal-conducted through the conductive connecting piece 130.

[0036] The array substrate 110 includes a second substrate and thin film transistors and signal traces (not shown in the figure) disposed on the second substrate. The material of the second substrate can be rigid material such as glass or flexible material such as polyimide (PI). The specific structure of the thin film transistors and signal traces can refer to the prior art, which will not be described here. The array substrate 110 includes a binding area B, and the first circuit board 210, the chip 220 and other elements are also bound in the binding area B. The first circuit board 210 can be a flexible printed circuit board (FPC), and the chip 220 can be an integrated circuit (IC) chip 220, but is not limited thereto. The conductive connecting member 130 is disposed in the binding area B, so that the conductive connecting member 130 is close to the first circuit board 210 and the chip 220, shortens the signal transmission distance between the touch layer 122 and the first circuit board 210 and the chip 220, improves the efficiency of the touch function of the display module 10, and can avoid the influence of the conductive connecting member 130 on the non-binding side frame of the display module 10, which is beneficial to realize narrow frame design.

[0037] The touch substrate 120 includes the first substrate 121 and the touch layer 122. The first substrate 121 on the array substrate 110 covers the orthographic projection of the touch layer 122 on the array substrate 110, so as to protect the touch layer 122. The orthographic projection of the touch layer 122 on the array substrate 110 covers the display area A and extends to the binding area B, that is, the orthographic projection of the touch layer 122 on the array substrate 110 covers part of the binding area B, so as to facilitate the conductive connecting member 130 to be disposed in the space between the binding area B of the array substrate 110 and the extended part of the touch layer 122, so as to reduce the increase of the frame width.

[0038] The material of the first substrate 121 can be rigid material or flexible material, for example, the material of the first substrate 121 can be glass, and the glass is used as the first substrate 121 and can also be used as a cover plate to protect the display module 10. The material of the touch layer 122 is metal oxide or metal, for example, the material of the touch layer 122 can be indium tin oxide (ITO), but is not limited thereto. The touch layer 122 includes a touch electrode and a touch signal line, and the touch signal line is electrically connected with the touch electrode. In the present application, the ITO material is first deposited on the surface of the first substrate 121 by a deposition process and is patterned, and the touch electrode and the touch signal line are formed on the first substrate 121 at the same time by one patterning process, which simplifies the process and is beneficial to reducing the thickness of the touch layer 122, and the touch layer 122 is integrated with the first substrate 121, which can realize the touch function and protect the display module.

[0039] The conductive connecting piece 130 has opposite two ends in the first direction Y, one end of the conductive connecting piece 130 is in contact with the binding area B of the array substrate 110, specifically, the end of the conductive connecting piece 130 close to the array substrate 110 is electrically connected with the signal trace on the array substrate 110; the opposite end of the conductive connecting piece 130 is in contact with the touch layer 122, specifically, the end of the conductive connecting piece 130 close to the touch layer 122 is connected with the touch signal line on the touch layer 122. The conductive connecting piece 130 connects the touch signal line of the touch layer 122 with the signal trace on the array substrate 110 to realize the control of the first circuit board 210 and the chip 220 on the touch layer 122 and realize the touch function of the display module 10.

[0040] In the present application, the touch layer 122 is directly formed on the first substrate 121 by deposition in the structure of the display module 10 to form the touch substrate 120, which can reduce the thickness of the display module 10, avoid the influence on other display components of the display module 10, and improve the production yield of the display module 10; at the same time, the touch layer 122 is extended to the binding area B to facilitate the arrangement of the conductive connecting piece 130 between the array substrate 110 and the touch substrate 120, and the array substrate 110 and the touch layer 122 are directly electrically connected by the conductive connecting piece 130 to realize the touch function, which simplifies the process, avoids the additional increase of the circuit board and other structures, and reduces the influence on the frame of the display module 10.

[0041] In the present application, the display module 10 further comprises the light emitting device layer 140, which is arranged between the array substrate 110 and the touch substrate 120. The light emitting device layer 140 can be an organic light emitting diode (OLED), which comprises an anode layer 141, an organic light emitting layer 142, a cathode layer 143 and a thin film encapsulation layer 144 arranged in sequence along the first direction Y. The organic light emitting layer 142 can comprise at least one of a red light emitting unit, a green light emitting unit and a blue light emitting unit.

[0042] In some embodiments, referring to Figure 3 , at least one side of the light emitting device layer 140 is arranged inwardly relative to the edges of the array substrate 110 and the touch substrate 120, and the conductive connecting member 130 is located in the space formed inwardly relative to the array substrate 110 and the touch substrate 120 of the light emitting device layer 140. At least one side of the light emitting device layer 140 is arranged inwardly relative to the edges of the array substrate 110 and the touch substrate 120, and the conductive connecting member 130 is located in the space formed inwardly relative to the array substrate 110 and the touch substrate 120 of the light emitting device layer 140. By arranging the conductive connecting member 130 in the space formed inwardly relative to the array substrate 110 and the touch substrate 120 of the light emitting device layer 140, the influence of the conductive connecting member 130 on the frame of the display module 10 is reduced, the increase in the frame width is reduced, and the narrow frame design is facilitated.

[0043] In some embodiments, referring to Figure 3 , the display module 10 further comprises a glue frame 150, which is arranged between the array substrate 110 and the touch substrate 120, and surrounds the light emitting device layer 140 to improve the packaging performance and protect the light emitting device layer 140. The touch layer 122 extends out of the edge of the glue frame 150 at one end close to the binding area B, the conductive connecting member 130 is located on the side of the glue frame 150 away from the light emitting device layer 140, and the conductive connecting member 130 is in direct contact with the part of the touch layer 122 extending out of the edge of the glue frame 150 at one end close to the touch layer 122. The conductive connecting member 130 is arranged on the side of the glue frame 150 away from the light emitting device layer 140 and does not contact the glue frame 150, so as to avoid the influence of the conductive connecting member 130 on the light emitting device layer 140. At the same time, the touch layer 122 extends out of the edge of the glue frame 150 at one end close to the binding area B, so that the touch layer 122 is directly electrically connected with the conductive connecting member 130 without the need to arrange additional connecting wires, thereby simplifying the process.

[0044] In some embodiments, referring to Figure 3 , the conductive connecting piece 130 comprises a first pad 131, a conductive connecting part 132 and a second pad 132; the first pad 131 is arranged on the touch layer 122 and located between the touch layer 122 and the conductive connecting part 132, and the second pad 132 is arranged on the array substrate 110 and located between the array substrate 110 and the conductive connecting part 132. By connecting the conductive connecting part 132 with the array substrate 110 and the touch layer 122 through the first pad 131 and the second pad 132, a specific and easily connected position can be provided for the conductive connecting part 132, the accuracy and stability of the connecting position of the conductive connecting part 132 can be improved, and meanwhile the first pad 131 and the second pad 132 can serve as current transmission channels, which is conducive to current flow and improves the conductive efficiency between the array substrate 110 and the touch layer 122.

[0045] The material of the conductive connecting part 132 can be conductive glue, such as anisotropic conductive glue (ACF), but is not limited thereto. The use of conductive glue as the conductive connecting part 132 has the advantages of simple process and low cost.

[0046] In some embodiments, referring to Figures 3-4 , the thickness d1 of the conductive connecting piece 130 in the first direction Y ranges from 0.01 mm to 0.03 mm, for example, d1 can be equal to 0.01 mm, 0.02 mm, 0.03 mm, etc. When the thickness d1 of the conductive connecting piece 130 is within the above range, the conductive function and efficiency of the conductive connecting piece 130 can be ensured, and meanwhile the thickness of the display module 10 will not increase too much, so as to reduce the impact on the thickness of the display module 10.

[0047] In some embodiments, referring to Figures 3-4 , the width W1 of the conductive connecting piece 130 in the second direction X ranges from 0.5 mm to 1.5 mm, for example, W1 can be equal to 0.5 mm, 0.7 mm, 0.9 mm, 1.1 mm, 1.3 mm, 1.5 mm, etc. As shown in Figure 3 , the second direction X is the direction from the display area A to the binding area B, and the second direction X is perpendicular to the first direction Y. When the width W1 of the conductive connecting piece 130 is within the above range, the conductive function and efficiency of the conductive connecting piece 130 can be ensured, and meanwhile the frame width of the display module 10 will not increase too much, so as to reduce the impact on the frame of the display module 10.

[0048] In some embodiments, referring to Figures 3-4 The thickness d2 of the touch layer 122 in the first direction Y is in the range of 0.01mm to 0.15mm, for example, d2 can be equal to 0.01mm, 0.03mm, 0.05mm, 0.07mm, 0.09mm, 0.11mm, 0.13mm, 0.15mm, etc. The touch layer 122 can be formed on the surface of the first substrate 121 by depositing ITO. The film layer of the touch layer 122 formed by the deposition process is thinner than the film layer of the attached independent touch film 102. When the thickness d2 of the touch layer 122 is in the above range, the touch function of the touch layer 122 can be guaranteed, and at the same time, due to the thin thickness of the touch layer 122, the overall thickness of the display module 10 can be reduced.

[0049] In some embodiments, referring to Figure 3 The display module 10 further comprises an optically clear adhesive (OCA) layer 160 arranged between the touch layer 122 and the light emitting device layer 140 to bond the touch substrate 120 and the light emitting device layer 140, thereby increasing the connection stability of the display module 10.

[0050] In some embodiments, referring to Figure 3 The display module 10 further comprises a heat dissipation layer 170 arranged on the side of the array substrate 110 away from the light emitting device layer 140. Since the light emitting device layer 140 generates heat during continuous light emission, the heat dissipation layer 170 arranged on the back of the array substrate 110 can dissipate heat from the light emitting device layer 140, thereby ensuring the performance and service life of the light emitting device layer 140. The material of the heat dissipation layer 170 can be a metal with good heat dissipation effect, such as aluminum (Al), but is not limited thereto.

[0051] The present application also provides a display device comprising the display module as described above. The display device can be a mobile phone, a tablet, a computer, a television, etc., but is not limited thereto.

[0052] The application provides a display module and a display device, and the application forms a touch substrate by depositing a touch layer on a first substrate, and then assembles the touch substrate and an array substrate in alignment, wherein the touch layer extends to a binding area of the array substrate, one end of a conductive connecting piece is electrically connected with the binding area of the array substrate, and the other end of the conductive connecting piece is electrically connected with the touch layer, so that the signal conduction between the touch layer and the array substrate is realized, and the touch function is realized. The touch layer is directly formed on the first substrate, which can reduce the thickness of the display module, avoid the influence on other display components of the display module, and improve the production yield of the display module. Meanwhile, the touch layer extends to the binding area of the array substrate, so that the conductive connecting piece is arranged at the space between the binding area of the array substrate and the extended part of the touch layer, the conductive connecting piece is directly electrically connected with the array substrate and the touch layer to realize the signal conduction between the array substrate and the touch layer, the process is simplified, the circuit board and other structures are not additionally increased, and the influence on the frame of the display module is reduced.

[0053] In the description of the present application, the terms "first", "second" are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Therefore, the features defined with "first", "second" can explicitly or implicitly include one or more features. In the description of the present application, the meaning of "multiple" is two or more, unless otherwise specifically limited.

[0054] In the above embodiments, the description of each embodiment has its own emphasis, and the parts not described in detail in a certain embodiment can be referred to the related description of other embodiments.

[0055] The embodiments, implementation manners and related technical features of the present application can be combined or replaced with each other without conflict.

[0056] The above is only the preferred embodiment of the present application, and does not limit the present application in any form, but any simple modification, equivalent change and modification made according to the technical essence of the present application to the above embodiment, without departing from the technical solution content of the present application, still belongs to the scope of the technical solution of the present application.

Claims

1. A display module, characterized by The display module comprises: an array substrate comprising a display area and a binding area located at least one side of the display area; a touch substrate disposed above the array substrate, the touch substrate comprising a first substrate and a touch layer formed on the first substrate, the touch layer being located at a side of the first substrate close to the array substrate, a normal projection of the touch layer on the array substrate covering the display area and extending to the binding area; and a conductive connecting member disposed between the array substrate and the touch layer, one end of the conductive connecting member being electrically connected with the binding area of the array substrate, and the other end of the conductive connecting member being electrically connected with the touch layer, the touch layer and the array substrate being signal-connected through the conductive connecting member. The display module further comprises a light emitting device layer disposed between the array substrate and the touch substrate, at least one side of the light emitting device layer being inwardly recessed relative to edges of the array substrate and the touch substrate.

2. The display module of claim 1, wherein, The conductive connecting member is located in a space inwardly recessed relative to the array substrate and the touch substrate. The display module further comprises a glue frame located between the array substrate and the touch substrate and surrounding the light emitting device layer.

3. The display module of claim 2, wherein, An end of the touch layer close to the binding area extends out of an edge of the glue frame, and the conductive connecting member is located at a side of the glue frame away from the light emitting device layer and in contact with a part of the touch layer extending out of the edge of the glue frame. The conductive connecting member comprises a first pad, a conductive connecting portion and a second pad.

4. The display module of claim 1, wherein, The first pad is disposed on the touch layer and located between the touch layer and the conductive connecting portion, and the second pad is disposed on the array substrate and between the array substrate and the conductive connecting portion. A thickness of the conductive connecting member in a first direction ranges from 0.01 mm to 0.03 mm, and a width of the conductive connecting member in a second direction ranges from 0.5 mm to 1.5 mm, wherein the first direction is a thickness direction of the array substrate, the second direction is a direction from the display area to the binding area, and the second direction is perpendicular to the first direction.

5. The display module of claim 1, wherein, A thickness of the touch layer in the first direction ranges from 0.01 mm to 0.15 mm.

6. The display module of claim 5, wherein, The material of the conductive connecting portion is conductive glue.

7. The display module of claim 4, wherein, The material of the touch layer is metal oxide or metal.

8. The display module of claim 1, wherein, The display module further comprises:

9. The display module of claim 2, wherein, an optical glue layer disposed between the touch layer and the light emitting device layer; and a heat dissipation layer disposed at a side of the array substrate away from the light emitting device layer. The display module comprises any one of the display modules according to claims 1 to 9.

10. A display device, characterized by comprising: ​

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