Silicon wafer cleaning equipment
By combining brushes and spray pipes on the transmission platform, eliminating the need for flower baskets and water tanks, efficient cleaning of silicon wafers is achieved. This solves the problems of high liquid consumption, high energy consumption, and large footprint of traditional cleaning equipment, simplifies the equipment structure, and reduces operating costs.
Patent Information
- Application Number
- CN202520346650.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-28
- Publication Date
- 2026-02-10
- Estimated Expiration
- 2035-02-28
AI Technical Summary
Traditional silicon wafer cleaning equipment consumes a large amount of liquid, has high energy consumption, occupies a large area, and has a complex structure, resulting in high operating costs.
The design incorporates a transmission platform combined with brushes and spray pipes, eliminating the need for flower baskets and water tanks. Cleaning is performed via spraying, and the combination of brushes and chemicals removes particulate matter and chemical contaminants, simplifying the equipment structure.
It significantly reduces water consumption and energy consumption, lowers equipment manufacturing and maintenance costs, reduces floor space, and improves cleaning efficiency and cleanliness.
Smart Images
Figure CN223888664U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of photovoltaic manufacturing technology, and in particular relates to a silicon wafer cleaning device. Background Technology
[0002] In semiconductor manufacturing, solar cell manufacturing and other fields, silicon wafer cleaning is an important process step. Its purpose is to remove particles, chemical contaminants and other impurities from the surface of silicon wafers to ensure the cleanliness of silicon wafers, thereby improving product quality and performance.
[0003] Traditional silicon wafer cleaning equipment typically uses a basket and water tank for cleaning. Multiple water tanks are usually set up, each containing a different solution. The silicon wafer is placed in the basket, and a robotic arm moves the basket back and forth in the water tank to immerse it in the water, thus cleaning the silicon wafer.
[0004] Traditional water tank cleaning methods require large amounts of cleaning solution, with each tank filled with chemicals or pure water. This method not only consumes a lot of water but also requires frequent changes of the cleaning solution, increasing operating costs. High energy consumption: To maintain the temperature and cleanliness of the cleaning solution in the tanks, heating and circulating filtration systems are typically required, resulting in high energy consumption. Furthermore, the multiple tanks require a large footprint, hindering the compact layout of production lines. Utility Model Content
[0005] This invention provides a silicon wafer cleaning device, which aims to solve the problems of high liquid consumption, high energy consumption, and large footprint of existing cleaning equipment.
[0006] This utility model is implemented as follows: a silicon wafer cleaning device, comprising: a transmission platform, a first brush, a second brush, a first reagent spray pipe, and a first pure water spray pipe;
[0007] The transmission platform transmits along the first direction;
[0008] The first brush and the second brush are sequentially arranged above the transmission platform along a first direction. Both the first brush and the second brush include a rotating shaft and brush bristles arranged around the rotating shaft. The rotating shaft is arranged along a second direction, which is perpendicular to the first direction.
[0009] The first agent spray pipe is disposed between the first brush and the second brush, and the spray nozzle of the first agent spray pipe faces the transmission platform;
[0010] The first pure water spray pipe is disposed between the first medicine spray pipe and the second brush, and the spray nozzle of the first pure water spray pipe faces the transmission platform.
[0011] Optionally, it may also include: a first roller and a second roller;
[0012] The first roller and the second roller have their rotation axes arranged along a second direction. The first roller is disposed between the first medicine spray pipe and the first pure water spray pipe, and the second roller is disposed between the first roller and the first pure water spray pipe.
[0013] Optionally, it also includes: a second agent spray pipe and a second pure water spray pipe;
[0014] The second agent spray pipe is positioned above the first roller, with the spray nozzles of the second agent spray pipe facing the first roller;
[0015] The second pure water spray pipe is positioned above the second roller, with the spray nozzles of the second pure water spray pipe facing the second roller.
[0016] Optionally, the transmission platform includes two oppositely arranged pulleys and a belt tensioned between the two pulleys.
[0017] Optionally, it also includes a feeding mechanism, which is disposed in front of the transfer platform along the first direction.
[0018] Optionally, the feeding mechanism includes at least two sets of feeding conveyor belts arranged side by side along the second direction, wherein the width of the feeding conveyor belts is less than or equal to 1 / 4 of the width of the silicon wafer.
[0019] Optionally, it also includes a discharge mechanism, which is disposed after the transmission platform along the first direction.
[0020] Optionally, the discharge mechanism includes at least two sets of discharge conveyor belts arranged side by side along the second direction, wherein the width of the discharge conveyor belts is less than or equal to 1 / 4 of the width of the silicon wafer.
[0021] Optionally, it also includes a rotating drying rack, which is disposed after the discharge mechanism along the first direction.
[0022] Optionally, the rotating drying rack includes a rotating shaft arranged along the second direction, and at least three sets of clamping assemblies arranged radially along the rotating shaft;
[0023] Each clamping assembly includes at least two clamping arms, each clamping arm having a sliding groove arranged parallel to the second direction, the opening of the sliding groove facing the second direction, and the end of the clamping arm facing away from the rotating shaft being penetrated by the sliding groove.
[0024] Optionally, the groove is a through groove.
[0025] Optionally, a waste liquid collection device is connected to the transmission platform.
[0026] The beneficial effects achieved by this invention are as follows: by using a transmission platform to transport silicon wafers, and sequentially arranging a first brush, a first chemical spray pipe, a first pure water spray pipe, and a second brush above the transmission platform along a first direction, the basket and water tank are eliminated, simplifying the equipment structure, reducing manufacturing and maintenance costs, and minimizing the equipment's footprint. Using a spray method to clean the surface of the silicon wafers significantly reduces water consumption and energy consumption. The combined use of the brush and chemical agent effectively removes particles and chemical contaminants from the silicon wafer surface. Attached Figure Description
[0027] Figure 1 This is a three-dimensional structural schematic diagram of the silicon wafer cleaning device provided by this utility model;
[0028] Figure 2 This is an enlarged view of point A;
[0029] Figure 3 This is a cross-sectional schematic diagram of the silicon wafer cleaning device provided by this utility model.
[0030] Explanation of reference numerals in the attached figures:
[0031] 100. Silicon wafer cleaning equipment; 101. Conveyor platform; 102. First brush; 103. Second brush; 104. First chemical spray pipe; 105. First pure water spray pipe; 106. First roller; 107. Second roller; 108. Second chemical spray pipe; 109. Second pure water spray pipe; 110. Feeding mechanism; 111. Discharge mechanism; 112. Rotary drying rack; 1121. Clamping arm; 1122. Slide chute. Detailed Implementation
[0032] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model. Furthermore, it should be understood that the specific embodiments described herein are merely for explaining this utility model and are not intended to limit this utility model.
[0033] In the description of this utility model, it should be understood that the terms "length", "width", "upper", "lower", "left", "right", "horizontal", "top", "bottom", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.
[0034] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the stated features. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.
[0035] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection, an electrical connection, or a connection that allows for communication; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.
[0036] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.
[0037] The following disclosure provides numerous different embodiments or examples for implementing various structures of the present invention. To simplify the disclosure, specific examples of components and arrangements are described below. These are merely examples and are not intended to limit the scope of the invention. Furthermore, reference numerals and / or letters may be repeated in different examples; such repetition is for simplification and clarity and does not in itself indicate a relationship between the various embodiments and / or arrangements discussed. In addition, examples of various specific processes and materials are provided in this invention, but those skilled in the art will recognize the application of other processes and / or the use of other materials.
[0038] This invention utilizes a transport platform to move silicon wafers. Above the platform, along a first direction, a first brush, a first chemical spray pipe, a first pure water spray pipe, and a second brush are sequentially arranged, eliminating the need for baskets and water tanks, simplifying the equipment structure, reducing manufacturing and maintenance costs, and minimizing the equipment's footprint. The spray method for cleaning the silicon wafer surface significantly reduces water consumption and energy consumption. The combined use of brushes and chemicals effectively removes particles and chemical contaminants from the silicon wafer surface.
[0039] Example 1
[0040] This embodiment provides a silicon wafer cleaning device 100, including: a transmission platform 101, a first brush 102, a second brush 103, a first chemical spray pipe 104, and a first pure water spray pipe 105;
[0041] The transmission platform 101 transmits along the first direction;
[0042] The first brush 102 and the second brush 103 are sequentially arranged above the transmission platform 101 along a first direction. The first brush 102 and the second brush 103 both include a rotating shaft and brush bristles arranged around the rotating shaft. The rotating shaft is arranged along a second direction, which is perpendicular to the first direction.
[0043] The first agent spray pipe 104 is disposed between the first brush 102 and the second brush 103, and the spray hole of the first agent spray pipe 104 faces the transmission platform 101;
[0044] The first pure water spray pipe 105 is disposed between the first medicine spray pipe 104 and the second brush 103, and the spray hole of the first pure water spray pipe 105 faces the transmission platform 101.
[0045] The transfer platform 101 is typically horizontally positioned to transfer silicon wafers along a first direction, ensuring that the wafers move smoothly and continuously during the cleaning process. The first brush 102 and the second brush 103 are sequentially positioned above the transfer platform 101 in the first direction, meaning that the silicon wafers transferred by the transfer platform 101 first pass through the first brush 102 and then through the second brush 103.
[0046] Above the transmission platform 101, arranged sequentially along a first direction are a first brush 102, a first reagent spray pipe 104, a first pure water spray pipe 105, and a second brush 103. The first brush 102 includes a rotating shaft and bristles arranged around the shaft. The rotating shaft is parallel to the transmission platform 101 and is arranged along a second direction perpendicular to the first direction. The bristles on the rotating shaft rotate under its rotation. When the silicon wafer on the transmission platform 101 passes under the first brush 102, the first brush 102 contacts the silicon wafer, removing particles and contaminants from the surface of the silicon wafer.
[0047] The first chemical spray pipe 104 is positioned between the first brush 102 and the second brush 103, with its nozzles facing the transfer platform 101. The function of the chemical spray pipe is to spray chemical agents, such as acidic or alkaline cleaning solutions, to chemically remove contaminants from the silicon wafer surface. When the silicon wafer on the transfer platform 101 passes under the first chemical spray pipe 104, the agent sprayed by the first chemical spray pipe 104 adheres to the silicon wafer surface, chemically cleaning the wafer. Pre-removing particles and contaminants from the silicon wafer surface before chemical spray cleaning allows for better contact between the chemical agents and the silicon wafer surface, resulting in more effective chemical cleaning.
[0048] The first pure water spray pipe 105 is positioned between the first chemical spray pipe 104 and the second brush 103, with its nozzles facing the transfer platform 101. The function of the pure water spray pipe is to spray high-purity water to wash away residual chemicals and contaminants on the silicon wafer surface. When the silicon wafer on the transfer platform 101 passes under the first pure water spray pipe 105, the pure water sprayed by the first pure water spray pipe 105 washes away the chemicals adhering to the silicon wafer surface and residues produced by chemical reactions.
[0049] The second brush 103 also includes a rotating shaft and bristles arranged around the rotating shaft. The rotating shaft is parallel to the transmission platform 101 and is arranged along a second direction. The bristles on the rotating shaft rotate under the drive of the rotating shaft. When the silicon wafer on the transmission platform 101 passes under the second brush 103, the second brush 103 contacts the silicon wafer, removes residual moisture from the surface of the silicon wafer, and completes the silicon wafer cleaning.
[0050] It is understandable that the bristles of the first brush 102 and the second brush 103 need to be made of flexible material to avoid scratching the silicon wafer surface. The bristles of the first brush 102 and the second brush 103 can be made of the same flexible material or different flexible materials, which is not limited here.
[0051] In this embodiment, a transfer platform 101 is used to transport silicon wafers. Above the transfer platform 101, along a first direction, a first brush 102, a first chemical spray pipe 104, a first pure water spray pipe 105, and a second brush 103 are sequentially arranged. This eliminates the need for baskets and water tanks, simplifying the equipment structure, reducing manufacturing and maintenance costs, and minimizing the equipment's footprint. Using a spray method to clean the surface of the silicon wafers significantly reduces water consumption and energy consumption. The combined use of brushes and chemicals effectively removes particles and chemical contaminants from the silicon wafer surface.
[0052] In some embodiments, the first brush 102 and the second brush 103 are respectively connected to a motor and driven to rotate by the motor. The rotation direction of the first brush 102 and the second brush 103 is adapted to the transmission direction of the transmission platform 101, that is, the first brush 102 and the second brush 103 rotate towards the first direction.
[0053] Example 2
[0054] In some embodiments, the silicon wafer cleaning apparatus 100 further includes: a first roller 106 and a second roller 107;
[0055] The first roller 106 and the second roller 107 are arranged along the second direction. The first roller 106 is arranged between the first medicine spray pipe 104 and the first pure water spray pipe 105, and the second roller 107 is arranged between the first roller 106 and the first pure water spray pipe 105.
[0056] The first roller 106 is positioned between the first chemical spray pipe 104 and the first pure water spray pipe 105, with its rotation axis arranged along the second direction. Along the first direction, the first roller 106 is positioned behind the first chemical spray pipe 104. When the silicon wafer on the transfer platform 101 passes under the first roller 106, the first roller 106 contacts the silicon wafer, ensuring that the chemical agent covers the silicon wafer surface more evenly and avoiding cleaning dead zones.
[0057] The second roller 107 is positioned between the first roller 106 and the first pure water spray pipe 105, with its axis of rotation also arranged along the second direction. Along the first direction, the second roller 107 is positioned behind the first roller 106. When the silicon wafer on the transfer platform 101 passes under the second roller 107, the second roller 107 further removes residual particles and loose contaminants from the surface of the silicon wafer through physical contact, ensuring a cleaner silicon wafer surface.
[0058] It is understandable that the first roller 106 and the second roller 107 need to be made of elastic material to avoid the bristles scratching the silicon wafer surface. The bristles of the first roller 106 and the second roller 107 can be made of the same elastic material or different elastic materials, which is not limited here.
[0059] In this embodiment, the addition of the first roller 106 and the second roller 107 removes residual particles and loose contaminants from the surface of the silicon wafer through physical contact, reducing the amount of residual particles and loose contaminants. Subsequent rinsing through the first pure water spray pipe 105 makes it easier to thoroughly remove residues, thereby improving the cleaning quality.
[0060] In some embodiments, the first roller 106 and the second roller 107 are respectively connected to a motor and driven to rotate by the motor. The rotation direction of the first roller 106 and the second roller 107 is adapted to the transmission direction of the transmission platform 101, that is, the first roller 106 and the second roller 107 rotate in the first direction.
[0061] Example 3
[0062] In some embodiments, the silicon wafer cleaning equipment 100 further includes: a second reagent spray pipe 108 and a second pure water spray pipe 109;
[0063] The second agent spray pipe 108 is positioned above the first roller 106, and the spray nozzle of the second agent spray pipe 108 faces the first roller 106.
[0064] The second pure water spray pipe 109 is positioned above the second roller 107, with the spray nozzles of the second pure water spray pipe 109 facing the second roller 107.
[0065] The second chemical spray pipe 108 is positioned above the first roller 106, with its spray nozzles facing the first roller 106. As the silicon wafer passes the first roller 106, a chemical agent is sprayed again to further remove stubborn contaminants from the wafer surface. The chemical agent sprayed by the second chemical spray pipe 108 can be the same as that sprayed by the first chemical spray pipe 104 (e.g., both acidic or both alkaline), or it can be a different agent (e.g., one acidic and the other alkaline); this is not limited to these specific applications.
[0066] The second pure water spray pipe 109 is positioned above the second roller 107, with its nozzles facing the second roller 107. It sprays pure water onto the silicon wafer after it passes through the second roller 107. As the silicon wafer passes through the second roller 107, it comes into contact with the roller, and simultaneously, pure water rinses it, initially removing any residual chemicals from the wafer's surface. The silicon wafer undergoes a second rinse when it passes through the first pure water spray pipe 105. These two rinses ensure the cleanliness of the silicon wafer.
[0067] In this embodiment, the addition of the second chemical spray pipe 108 allows for a secondary chemical treatment of the silicon wafer surface, effectively removing difficult-to-clean contaminants and improving the cleaning effect. The addition of the second pure water spray pipe 109 ensures that residual chemicals on the silicon wafer surface are thoroughly rinsed off, preventing the chemicals from affecting subsequent processes. Through two spray treatments of chemicals and pure water, the cycle time for a single cleaning can be significantly shortened, improving production efficiency.
[0068] Example 4
[0069] In some embodiments, the transmission platform 101 includes two oppositely arranged pulleys and a belt tensioned between the two pulleys.
[0070] Two pulleys are positioned opposite each other to drive the movement of the belt, ensuring the smooth movement of the silicon wafers on the transfer platform 101. The belt is tensioned between the two pulleys to support and transfer the silicon wafers, ensuring their stability and safety during the cleaning process.
[0071] Understandably, the drive wheel is connected to the motor, and its rotation drives the pulley and other driven wheels to rotate. Specifically, the drive wheel can be one of two pulleys; alternatively, it can be a separate drive wheel, in which the belt is tensioned between the drive wheel and the two pulleys. One or more tensioning pulleys can also be provided to help tension the belt, ensuring the stability of the transmission platform 101.
[0072] Specifically, the material of the tire can be an elastic material with good support to avoid scratching the silicon wafer surface during transmission, such as rubber or silicone.
[0073] In this embodiment, the pulley and tire are used in combination, resulting in a simple structure that is easy to maintain and replace, thus reducing equipment maintenance costs. Furthermore, the tire can be adjusted according to the size and shape of the silicon wafer, improving the adaptability and flexibility of the equipment.
[0074] Example 5
[0075] In some embodiments, the silicon wafer cleaning equipment 100 further includes a feeding mechanism 110, which is disposed in front of the transfer platform 101 along a first direction.
[0076] The feeding mechanism 110 is positioned before the transfer platform 101 to feed the silicon wafers to be cleaned into the transfer platform 101, ensuring orderly feeding of the silicon wafers, avoiding possible pauses and chaos during the feeding process, and improving cleaning efficiency. The addition of the feeding mechanism 110 enables automated feeding of silicon wafers, improves the automation level of the entire cleaning process, and reduces the need for manual operation.
[0077] In some embodiments, the feeding mechanism 110 includes at least two sets of feeding conveyor belts arranged side by side along a second direction, the width of which is less than or equal to 1 / 4 of the width of the silicon wafer.
[0078] The conveyor belt travels in the same direction as the transmission platform 101, along the first direction. Two sets of conveyor belts are arranged parallel to each other along the second direction, and the width of each set of conveyor belts is less than or equal to 1 / 4 of the width of the silicon wafer, reducing the contact area between the silicon wafer and the conveyor belt and lowering the risk of scratches. In this embodiment, "width" refers to the dimension along the second direction.
[0079] Specifically, two sets of conveyor belts are set up, and the distance between the outermost edges of the two sets of conveyor belts is adapted to the width of the silicon wafer, which reduces the contact area while ensuring the stability of feeding.
[0080] Example 6
[0081] In some embodiments, the silicon wafer cleaning equipment 100 further includes a discharge mechanism 111, which is disposed after the transfer platform 101 along a first direction.
[0082] The unloading mechanism 111 is located after the conveyor platform 101 and is used to smoothly deliver the cleaned silicon wafers out of the cleaning equipment, ensuring orderly unloading of the silicon wafers and avoiding possible damage during the unloading process. The addition of the unloading mechanism 111 realizes automated unloading of silicon wafers, improves the automation level of the entire cleaning process, and reduces the need for manual operation.
[0083] In some embodiments, the discharge mechanism 111 includes at least two sets of discharge conveyor belts arranged side by side along a second direction, the width of which is less than or equal to 1 / 4 the width of the silicon wafer.
[0084] The conveyor belt travels in the same direction as the transmission platform 101, along the first direction. Two sets of conveyor belts are arranged parallel to each other along the second direction, and the width of each set of conveyor belts is less than or equal to 1 / 4 of the width of the silicon wafer, reducing the contact area between the silicon wafer and the conveyor belt and lowering the risk of scratches. In this embodiment, "width" refers to the dimension along the second direction.
[0085] Example 7
[0086] In some embodiments, a rotating drying rack 112 is also included, which is disposed after the discharge mechanism 111 along a first direction.
[0087] The rotating drying rack 112 is located after the discharge mechanism 111. It is used to receive the cleaned silicon wafers sent out by the discharge mechanism 111 and to dry the moisture on the surface of the silicon wafers by rotating them, so as to ensure that the silicon wafers can be evenly dispersed during the drying process and reduce moisture residue.
[0088] In some embodiments, the rotating drying rack 112 includes a rotation axis disposed along a second direction, and at least three sets of clamping assemblies disposed circumferentially along the rotation axis;
[0089] Each clamping assembly includes at least two clamping arms 1121 arranged parallel to each other along the second direction. One end of each clamping arm 1121 is provided with a sliding groove 1122 that passes through both sides of the clamping arm 1121. The other end of the clamping arm 1121 is connected to a rotating shaft. The sliding groove 1122 extends along the second direction.
[0090] The clamping arm 1121 is elongated, with a groove 1122 extending through both sides of one end. This groove 1122 prevents obstruction of the silicon wafer's sides and accommodates wafers of varying widths. The groove 1122 extends along a second direction, with its depth along the length of the clamping arm 1121, facilitating wafer clamping. The other end of the clamping arm 1121 is connected to a rotating shaft, which drives its rotation. The clamping assembly includes at least two clamping arms 1121, arranged axially along the rotating shaft. At least three sets of clamping assemblies are evenly distributed along the rotating shaft.
[0091] The rotating shaft drives the clamping assembly to rotate. The rotating shaft rotates by a preset angle, at which point a set of clamping assemblies is directly facing the discharge mechanism 111. One end of the groove 1122 on the clamping arm 1121 of this clamping assembly corresponds to the silicon wafer on the transfer platform 101. The silicon wafer is driven by the transfer platform 101 to continue moving in the first direction. At this time, the silicon wafer slides into the groove 1122 from the second end under the push of the transfer platform 101. After the rotating shaft stops for a preset time, most of the silicon wafer has slid into the groove 1122. The rotating shaft rotates, driving the clamping assembly to rotate upward. As the clamping assembly rotates, the silicon wafer leaves the discharge mechanism 111. Because the clamping assembly drives the silicon wafer upward, the corresponding groove 1122 opens upward, preventing the silicon wafer from sliding out of the groove 1122. At the same time, under the action of gravity, the silicon wafer can slide deeper into the groove 1122, ensuring the stability of the silicon wafer discharge.
[0092] Specifically, a set of clamping components may include two clamping arms 1121, the distance between the two clamping arms 1121 being adapted to the silicon wafer to be clamped, so that the two clamping arms 1121 clamp the opposite sides of the silicon wafer.
[0093] In this embodiment, the rotating drying rack 112 can dry silicon wafers. The rotating drying rack 112 has a compact structure and can hold more silicon wafers in a limited space, which facilitates extending the drying time of the silicon wafers and helps to fully dry them.
[0094] Example 8
[0095] In some embodiments, a waste liquid collection device is connected to the transmission platform 101.
[0096] The waste liquid device is used to collect sprayed chemical agents and wastewater for recycling and treatment, thus avoiding pollution.
[0097] The waste liquid device can be a waste liquid tank installed below the transmission platform 101, with the length and width of the waste liquid tank matching the transmission platform 101 and the depth sufficient to accommodate the generated waste liquid. A drain outlet is provided at the bottom of the waste liquid tank, which is connected to a waste liquid treatment system or a collection tank.
[0098] Alternatively, the waste liquid device may consist of a suction pipe installed below the transmission platform 101, arranged along the length of the transmission platform 101. The suction pipe has multiple suction ports, the positions of which correspond to the spray nozzles of the spray pipe, ensuring that the waste liquid can be absorbed in a timely manner. The suction pipe is connected to a waste liquid treatment system or a collection tank.
[0099] The waste liquid device can also take other forms of structure, which are not limited here.
[0100] The above are merely preferred embodiments of the present utility model and are not intended to limit the present utility model. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.
Claims
1. A silicon wafer cleaning device, characterized in that, include: The transmission platform, the first brush, the second brush, the first agent spray pipe, and the first pure water spray pipe; The transmission platform transmits along the first direction; The first brush and the second brush are sequentially arranged above the transmission platform along a first direction. Both the first brush and the second brush include a rotating shaft and brush bristles arranged around the rotating shaft. The rotating shaft is arranged along a second direction, which is perpendicular to the first direction. The first agent spray pipe is disposed between the first brush and the second brush, and the spray nozzle of the first agent spray pipe faces the transmission platform; The first pure water spray pipe is disposed between the first medicine spray pipe and the second brush, and the spray nozzle of the first pure water spray pipe faces the transmission platform.
2. The silicon wafer cleaning equipment as described in claim 1, characterized in that, Also includes: First roller, second roller; The first roller and the second roller have their rotation axes arranged along a second direction. The first roller is disposed between the first medicine spray pipe and the first pure water spray pipe, and the second roller is disposed between the first roller and the first pure water spray pipe.
3. The silicon wafer cleaning equipment as described in claim 2, characterized in that, Also includes: Second agent spray pipe and second pure water spray pipe; The second agent spray pipe is positioned above the first roller, with the spray nozzles of the second agent spray pipe facing the first roller; The second pure water spray pipe is positioned above the second roller, with the spray nozzles of the second pure water spray pipe facing the second roller.
4. The silicon wafer cleaning equipment as described in claim 1, characterized in that, The transmission platform includes two oppositely arranged pulleys and a belt tensioned between the two pulleys.
5. The silicon wafer cleaning equipment as described in claim 1, characterized in that, It also includes a feeding mechanism, which is disposed in front of the transmission platform along the first direction.
6. The silicon wafer cleaning equipment as described in claim 5, characterized in that, The feeding mechanism includes at least two sets of feeding conveyor belts arranged side by side along the second direction, the width of which is less than or equal to 1 / 4 of the width of the silicon wafer.
7. The silicon wafer cleaning equipment as described in claim 1, characterized in that, It also includes a discharge mechanism, which is located after the transmission platform along the first direction.
8. The silicon wafer cleaning equipment as described in claim 7, characterized in that, The discharge mechanism includes at least two sets of discharge conveyor belts arranged side by side along the second direction, wherein the width of the discharge conveyor belts is less than or equal to 1 / 4 of the width of the silicon wafer.
9. The silicon wafer cleaning equipment as described in claim 7, characterized in that, It also includes a rotating drying rack, which is arranged after the discharge mechanism along the first direction.
10. The silicon wafer cleaning equipment as described in claim 9, characterized in that, The rotating drying rack includes a rotating shaft arranged along the second direction, and at least three sets of clamping assemblies arranged radially along the rotating shaft; Each clamping assembly includes at least two clamping arms arranged parallel to each other along the second direction. One end of each clamping arm is provided with a sliding groove that passes through both sides of the clamping arm, and the other end of the clamping arm is connected to the rotating shaft. The sliding groove extends along the second direction.
11. The silicon wafer cleaning equipment as described in claim 1, characterized in that, The waste liquid collection device is connected to the transmission platform.