Dresser

Abstract

The utility model discloses a trimmer which comprises a swing arm connected with a driving device and a grinding head movably connected with the swing arm, one end of the swing arm is connected with the driving device, the other end of the swing arm is movably connected with the grinding head, and the diameter of the grinding head is larger than that of a wafer. When the diameter of the grinding head is larger than the diameter of the wafer, especially when the diameter of the grinding head reaches 1.2-1.3 times of the diameter of the wafer, even if the swing amplitude and the swing frequency of the grinding head are reduced, full coverage of the using area of the wafer can still be achieved, so that periodic non-finishing areas are avoided, and meanwhile due to the fact that full coverage of the using area is achieved, the service life of the wafer is prolonged. Residual pollutants can be effectively removed, and secondary damage to the wafer is avoided.

Description

Technical Field

[0001] This utility model relates to the field of trimmer technology, and more specifically, to a trimmer. Background Technology

[0002] In existing chemical mechanical polishing (CMP) processes, the dresser, as a key consumable, suffers from significant technical defects. Traditional dressers employ a single-function design, their core function limited to fixing the diamond grinding head, and their size is much smaller than the wafer diameter (typically 60%-80% of the wafer size). This size difference causes the grinding pad to form periodic un-dressed areas during the dresser's reciprocating oscillation. Statistical data shows that this design defect directly leads to a 2.3-4.7 times increase in the density of residual contaminants on the grinding pad surface, becoming a major cause of secondary damage such as scratches and dents on the wafer surface. Therefore, how to solve the problem of periodic un-dressed areas forming on the grinding pad and how to remove residual contaminants are the technical problems that this invention aims to address. Utility Model Content

[0003] The utility model description section introduces a series of simplified concepts, which will be further explained in detail in the detailed description section. This utility model description section is not intended to limit the key features and essential technical features of the claimed technical solution, nor is it intended to determine the scope of protection of the claimed technical solution.

[0004] To at least partially solve the above problems, this utility model provides a dresser, comprising: a swing arm connected to a drive device, and a grinding head movably connected to the swing arm, wherein one end of the swing arm is connected to the drive device and the other end is movably connected to the grinding head, and the diameter of the grinding head is larger than the diameter of the wafer.

[0005] Preferably, the connection between the swing arm and the drive device is located outside the CMP platform, and the swing arm reciprocates around the connection between the swing arm and the drive device as the center, driving the grinding head to reciprocate along an arc.

[0006] Preferably, the grinding head forms an annular dressing surface with an inner diameter of r and an outer diameter of R on the grinding pad of the CMP platform.

[0007] Preferably, the area of ​​use of the wafer on the polishing pad of the CMP platform is located within the annular trimming surface.

[0008] Preferably, it also includes a liquid supply source and an infusion device, wherein the infusion device is disposed on or inside the swing arm, one end of the infusion device is connected to the liquid supply source, and the other end is movably connected to the grinding head through a liquid outlet device.

[0009] Preferably, one end of the liquid dispensing device is connected to the infusion device, and the other end passes through the grinding head and extends to the bottom surface of the grinding head, wherein the grinding head is movably connected to the liquid dispensing device.

[0010] Preferably, the liquid dispensing device is tubular, with its top connected to the swing arm and communicating with the infusion device. The outer wall of the liquid dispensing device is connected to the grinding head via a first transmission device, and the bottom of the liquid dispensing device penetrates the grinding head and extends to the bottom surface of the grinding head.

[0011] Preferably, a gap is reserved between the bottom surface of the liquid dispensing device and the grinding pad of the CMP platform.

[0012] Preferably, the first transmission device is a bearing or a bushing.

[0013] Preferably, the first transmission device is disposed on the top of the grinding head and is movably connected to the liquid outlet device. A motor is disposed on the swing arm, the drive shaft of the motor extends in the direction of the grinding head, and a second transmission device is disposed on the drive shaft of the motor, the second transmission device being connected to the first transmission device.

[0014] Compared with the prior art, the present invention has at least the following beneficial effects:

[0015] When the diameter of the grinding head is larger than the diameter of the wafer, especially when the diameter of the grinding head reaches 1.2-1.3 times the diameter of the wafer, even if the swing amplitude and oscillation frequency of the grinding head are reduced, it is still possible to achieve full coverage of the wafer's working area, thereby avoiding the occurrence of periodically untrimmed areas. At the same time, because full coverage of the working area is achieved, residual contaminants can be effectively removed, avoiding secondary damage to the wafer.

[0016] The trimmer described in this utility model, other advantages, objectives and features of this utility model will be partly apparent from the following description, and partly understood by those skilled in the art through study and practice of this utility model. Attached Figure Description

[0017] The accompanying drawings are provided to further illustrate the present invention and form part of the specification. They are used together with the embodiments of the present invention to explain the present invention, but do not constitute a limitation thereof. In the drawings:

[0018] Figure 1 This is a schematic diagram of the dressing device described in this utility model operating on a CMP platform.

[0019] Figure 2 Top views of the infusion device mounted on the swing arm (shown in A) and mounted inside the swing arm (shown in B).

[0020] Figure 3This is a bottom view of the trimmer described in this utility model.

[0021] Figure 4 This is a top view of the connection between the grinding head and the liquid outlet device.

[0022] Figure 5 A cross-sectional view of the infusion device mounted on the swing arm.

[0023] Figure 6 A cross-sectional view of the infusion device installed inside the swing arm.

[0024] In the diagram: 1 swing arm, 2 grinding head, 3 wafer, 4 operating area, 5 infusion device, 51 external infusion device, 52 infusion channel, 6 dispensing device, 7 first transmission device, 8 motor, 9 second transmission device. Detailed Implementation

[0025] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments, so that those skilled in the art can implement it based on the description.

[0026] It should be understood that terms such as “having,” “comprising,” and “including” as used herein do not exclude the presence or addition of one or more other elements or combinations thereof.

[0027] like Figures 1-6 As shown, this utility model provides a dressing device, including: a swing arm 1 connected to a drive device, and a grinding head 2 movably connected to the swing arm 1. One end of the swing arm 1 is connected to the drive device, which is a commercially available product or existing technology capable of driving the swing arm 1 to swing; the other end is movably connected to the grinding head 2. Typically, the grinding head 2 and the swing arm 1 are rotatably connected, allowing the grinding head 2 to uniformly dress the polishing pad. The diameter of the grinding head 2 is larger than the diameter of the wafer 3. Figure 1 As shown, by increasing the diameter of the grinding head 2, it is possible to achieve 100% coverage of the usable area 4 of the wafer 3 when dressing the polishing pad. Typically, the connection between the swing arm 1 and the drive device is located outside the CMP platform. The swing arm 1 reciprocates around the connection point with the drive device, driving the grinding head 2 to reciprocate along an arc, thereby dressing the polishing pad. Figure 1 As shown. The grinding head 2 forms an annular dressing surface with an inner diameter of r and an outer diameter of R on the polishing pad of the CMP platform. The usable area 4 of the wafer 3 on the polishing pad is located within the annular dressing surface. The usable area 4 of the wafer 3 is typically as shown. Figure 1As shown in the diagram, when the diameter of the grinding head 2 is larger than the diameter of the wafer 3, especially when the diameter of the grinding head 2 reaches 1.2-1.3 times the diameter of the wafer 3, even if the swing amplitude and oscillation frequency of the grinding head 2 are reduced, it is still possible to achieve full coverage of the usage area 4 of the wafer 3, thereby avoiding the occurrence of periodic untrimmed areas. At the same time, because full coverage of the usage area 4 is achieved, residual contaminants can be effectively removed, avoiding secondary damage to the wafer 3.

[0028] The contaminants that typically remain on abrasive pads are:

[0029] 1. Diamond abrasive particles larger than 5 micrometers in diameter. These residues can cause micrometer-level scratches on the wafer during subsequent polishing.

[0030] 2. The irregular shape of polyurethane debris that falls off the surface of the polishing pad can easily cause abnormal local pressure, resulting in excessive polishing pressure and indentation.

[0031] 3. Metal ion contaminants mainly originate from the mechanical stripping of wafer surface materials.

[0032] These contaminants cannot be completely removed by traditional dressing tools; experimental verification shows a residual rate as high as 37%-42%, severely impacting the yield of processes below 28 nanometers. After addressing the issue of periodically undressed areas by adjusting the diameter of the grinding head 2, this invention also provides a further method for removing residual contaminants.

[0033] Furthermore, it also includes a liquid supply source and an infusion device 5. The liquid supply source can supply polishing fluid and other liquids to the grinding head 2 through the infusion device 5. The liquid supply source is a commercially available product or existing technology. The infusion device 5 is disposed on or inside the swing arm 1. Depending on its position on the swing arm 1, the infusion device 5 can be divided into an external infusion device 51 (disposed on the swing arm 1, such as...). Figure 2 As shown in A, and as Figure 5 (as shown) and infusion channel 52 (located inside the swing arm 1, such as...) Figure 2 As shown in B, and as Figure 6 (As shown). Whether an external infusion device 51 or an infusion channel 52 is selected, its function is to deliver liquid from the liquid supply source to the grinding head 2. The liquid diffuses from the center of the grinding head 2 towards the grinding head 2, and the flowing liquid removes surface residues of the grinding pad, reducing the residual rate of contaminants.

[0034] One end of the infusion device 5 is connected to a liquid supply source, and the other end is movably connected to the grinding head 2 via a liquid outlet device 6. One end of the liquid outlet device 6 is connected to the infusion device 5, and the other end passes through the grinding head 2 and extends to the bottom surface of the grinding head 2. The grinding head 2 is movably connected to the liquid outlet device 6.

[0035] The liquid outlet device 6 serves as a connector between the grinding head 2 and the swing arm 1, and also needs to transfer the liquid delivered by the liquid delivery device 5 to the grinding head 2. Therefore, the liquid outlet device 6 is usually tubular, such as... Figure 5 and Figure 6 As shown, the side wall (when the infusion device 5 is an external infusion device 51) or top (when the infusion device 5 is an infusion channel 52) of the liquid outlet device 6 is connected to the swing arm 1 and communicates with the infusion device 5. The outer wall of the liquid outlet device 6 is connected to the grinding head 2 through the first transmission device 7. The bottom of the liquid outlet device 6 penetrates the grinding head 2 and extends to the bottom surface of the grinding head 2, so that the liquid can be directly delivered to the contact position between the grinding head 2 and the grinding pad and diffuse outward from the grinding head 2. Usually, the liquid outlet device 6 is located on the rotation axis of the grinding head 2, so that the delivered liquid can diffuse outward from the center of the grinding head 2 (bottom), thereby allowing the liquid to fully cover the contact position between the grinding head 2 and the grinding pad, removing residual contaminants and avoiding dry grinding. A gap is reserved between the bottom surface of the liquid outlet device 6 and the grinding pad of the CMP platform to avoid contact between the bottom of the liquid outlet device 6 and the grinding pad.

[0036] Based on the design requirements of the dresser, the grinding head 2 can be divided into two types: passive rotation and active rotation.

[0037] When the grinding head 2 is passively rotated, the first transmission device 7 is a bearing or bushing, which is fitted onto the liquid outlet device 6. Thus, under the multiple effects of the grinding pad rotation, the grinding head 2 reciprocating oscillation, and the liquid flushing, the grinding head 2 can be passively rotated.

[0038] When the grinding head 2 is actively rotating, the first transmission device 7 is located on the top of the grinding head 2 and is movably connected to the liquid outlet device 6. The swing arm 1 is equipped with a motor 8, the drive shaft of the motor 8 extends in the direction of the grinding head 2, and the drive shaft of the motor 8 is equipped with a second transmission device 9, which is connected to the first transmission device 7.

[0039] As one of many implementation methods, the first transmission device 7 and the second transmission device 9 can be meshing gears. The first transmission device 7 is fixed to the top of the grinding head 2, and a bearing or bushing is fitted onto the outer wall of the liquid outlet device 6 and connected to the first transmission device 7. Figure 4 As shown. Thus, the motor 8 drives the second transmission device 9 to rotate, which in turn drives the first transmission device 7 to rotate, thereby enabling the grinding head 2 to rotate with the liquid outlet device 6 as the rotation axis.

[0040] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0041] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a connection that allows communication between them; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0042] Although the embodiments of this utility model have been disclosed above, they are not limited to the applications listed in the specification and embodiments. They can be applied to various fields suitable for this utility model. For those skilled in the art, other modifications can be easily made. Therefore, without departing from the general concept defined by the claims and their equivalents, this utility model is not limited to the specific details and the illustrations shown and described herein.

Claims

1. A trimmer, comprising: A swing arm (1) connected to a drive device and a grinding head (2) movably connected to the swing arm (1) are characterized in that one end of the swing arm (1) is connected to the drive device and the other end is movably connected to the grinding head (2), wherein the diameter of the grinding head (2) is larger than the diameter of the wafer (3).

2. The trimmer according to claim 1, characterized in that, The connection between the swing arm (1) and the drive device is located outside the CMP platform. The swing arm (1) swings back and forth around the connection between the swing arm (1) and the drive device, and drives the grinding head (2) to reciprocate along the arc.

3. The trimmer according to claim 1, characterized in that, The grinding head (2) forms an annular dressing surface with an inner diameter of r and an outer diameter of R on the grinding pad of the CMP platform.

4. The trimmer according to claim 3, characterized in that, The area (4) of the wafer (3) on the polishing pad of the CMP platform is located within the annular trimming surface.

5. The trimmer according to claim 1, characterized in that, It also includes a liquid supply source and an infusion device (5), the infusion device (5) is set on the swing arm (1) or inside the swing arm (1), one end of the infusion device (5) is connected to the liquid supply source, and the other end is movably connected to the grinding head (2) through the liquid outlet device (6).

6. The trimmer according to claim 5, characterized in that, One end of the liquid dispensing device (6) is connected to the infusion device (5), and the other end passes through the grinding head (2) and extends to the bottom surface of the grinding head (2). The grinding head (2) is movably connected to the liquid dispensing device (6).

7. The trimmer according to claim 6, characterized in that, The liquid outlet device (6) is tubular. The top of the liquid outlet device (6) is connected to the swing arm (1) and communicates with the infusion device (5). The outer wall of the liquid outlet device (6) is connected to the grinding head (2) through the first transmission device (7). The bottom of the liquid outlet device (6) penetrates the grinding head (2) and extends to the bottom surface of the grinding head (2).

8. The trimmer according to claim 7, characterized in that, A gap is reserved between the bottom surface of the liquid outlet device (6) and the grinding pad of the CMP platform.

9. The trimmer according to claim 7, characterized in that, The first transmission device (7) is a bearing or a bushing.

10. The trimmer according to claim 8, characterized in that, The first transmission device (7) is located on the top of the grinding head (2) and is movably connected to the liquid outlet device (6). A motor (8) is provided on the swing arm (1). The drive shaft of the motor (8) extends in the direction of the grinding head (2). A second transmission device (9) is provided on the drive shaft of the motor (8). The second transmission device (9) is connected to the first transmission device (7).

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