Infrared detector module and infrared imaging equipment

Abstract

The utility model relates to the field of infrared detection, and discloses an infrared detector module and infrared imaging equipment, the infrared detector module comprises a circuit board, a shell, an infrared detector and a light-transmitting piece, the shell is provided with a window and a ventilation hole; the shell is fixedly connected with the surface of the circuit board, the light-transmitting piece is located in the window, and the shell, the light-transmitting piece and the circuit board form a cavity; the light-transmitting part is located on an incident light path of the infrared detector; the infrared detector is positioned in the cavity and is electrically connected with the circuit board; the ventilation hole is communicated with the cavity and used for releasing heat in the cavity. The shell and the light-transmitting piece play a role in protecting the infrared detector, and the influence of particles on imaging of the infrared detector can be reduced. The heat in the cavity can be discharged to the outside of the cavity through the ventilation hole, so that the heat in the cavity is prevented from causing expansion of the shell and affecting the combination degree between the shell and the circuit board, meanwhile, the influence of the heat on imaging of the infrared detector can be avoided, and the yield of the infrared detector module is improved.

Description

Technical Field

[0001] This application relates to the field of infrared detection, and in particular to an infrared detector module and an infrared imaging device. Background Technology

[0002] Encapsulating infrared detector chips in a vacuum environment protects them from external environmental influences, improving performance and reliability. A light window for infrared light is installed at a certain distance above the infrared detector chip. Because the chip and window are very close, particles can easily fall onto the window surface during long-term use, affecting the infrared detector's imaging.

[0003] Therefore, how to solve the above-mentioned technical problems should be a key focus for those skilled in the art. Utility Model Content

[0004] The purpose of this application is to provide an infrared detector module and an infrared imaging device to reduce the impact of dust and other particles on infrared detector imaging, and to solve the impact of encapsulation heat on the bonding between the housing and the circuit board and the infrared detector imaging.

[0005] To address the aforementioned technical problems, this application provides an infrared detector module, comprising:

[0006] The circuit board, housing, infrared detector, and light-transmitting element, wherein the housing has a window and a ventilation hole;

[0007] The housing is fixedly connected to the surface of the circuit board, the light-transmitting element is located at the window, and the housing, the light-transmitting element, and the circuit board form a cavity; the light-transmitting element is located on the incident light path of the infrared detector;

[0008] The infrared detector is located in the cavity and is electrically connected to the circuit board;

[0009] The ventilation hole is connected to the cavity and is used to release heat from the cavity.

[0010] Optionally, the outer surface of the light-transmitting element is flush with the outer surface of the housing; or, the outer surface of the light-transmitting element is higher than the outer surface of the housing; or, the outer surface of the light-transmitting element is lower than the outer surface of the housing; the outer surface of the light-transmitting element and the outer surface of the housing are surfaces away from the infrared detector.

[0011] Optionally, it also includes:

[0012] Dust plug located in the ventilation hole; and / or,

[0013] An isolation shield located above the housing.

[0014] Optionally, the housing is connected to the circuit board by adhesive bonding.

[0015] Optionally, the surface of the housing opposite the circuit board is textured; or,

[0016] The surface of the housing opposite to the circuit board has a recess for filling with colloid.

[0017] Optionally, it also includes:

[0018] A positioning blind hole is provided on the housing.

[0019] Optionally, it also includes:

[0020] A groove surrounding the ventilation opening, the shape of which differs from that of the positioning blind hole.

[0021] Optionally, it also includes:

[0022] A reinforcing element located within the cavity.

[0023] Optionally, the reinforcing elements are dispersed on the inner surface of the housing; or,

[0024] The reinforcing element is partially embedded in the housing, while the remaining portion is located on the inner surface of the housing; the inner surface of the housing is the surface closest to the infrared detector.

[0025] Optionally, the infrared detector is electrically connected to the circuit board via a wire located on the side of the infrared detector; or,

[0026] The infrared detector is located on the upper surface of the circuit board, and a conductor is provided between the lower surface of the infrared detector and the upper surface of the circuit board.

[0027] Optionally, the housing is a housing that can withstand a high temperature of at least 250°C.

[0028] Optionally, the housing comprises any of the following:

[0029] Plastic casing, metal casing, ceramic casing.

[0030] Optionally, the plastic housing comprises any of the following:

[0031] Thermotropic liquid crystal polymer housing, lyotropic liquid crystal polymer housing, polyimide housing.

[0032] Optionally, the light-transmitting element is fixed to the window by adhesive bonding; or,

[0033] The light-transmitting element is fixed to the window by a clip; or...

[0034] The light-transmitting element is fixed to the window by a clamping element. Optionally, the adhesive layer between the housing and the circuit board includes any one of epoxy adhesive, silicone adhesive, and polyurethane adhesive; and / or,

[0035] The adhesive layer between the light-transmitting element and the window includes any one of epoxy adhesive, silicone adhesive, and polyurethane adhesive.

[0036] Optionally, the ventilation hole is located on the upper surface of the housing, or the ventilation hole is located on the side wall of the housing.

[0037] Optionally, the field of view of the infrared detector is 30° to 120°, including the endpoint values.

[0038] Optionally, the infrared detector includes any of the following:

[0039] Metal-packaged infrared detectors, ceramic-packaged infrared detectors, wafer-level packaged infrared detectors, and pixel-level packaged infrared detectors.

[0040] Optionally, the infrared detector is located on the upper surface of the circuit board.

[0041] Optionally, the infrared detector module has a length ranging from 5mm to 18mm, a width ranging from 5mm to 18mm, and a height ranging from 3mm to 6mm, including all endpoint values; and / or,

[0042] The diameter of the ventilation hole ranges from 0.01 mm to 0.3 mm, including the endpoint values; and / or,

[0043] The ventilation port includes a first through hole and a second through hole that are connected. The first through hole is directly connected to the cavity, and the diameter of the first through hole is smaller than that of the second through hole.

[0044] This application also provides an infrared imaging device, including any of the infrared detector modules described above.

[0045] This application provides an infrared detector module comprising: a circuit board, a housing, an infrared detector, and a light-transmitting element. The housing has a window and a ventilation hole. The housing is fixedly connected to the surface of the circuit board. The light-transmitting element is located at the window. The housing, the light-transmitting element, and the circuit board form a cavity. The light-transmitting element is located in the incident light path of the infrared detector. The infrared detector is located in the cavity and electrically connected to the circuit board. The ventilation hole communicates with the cavity and is used to release heat from the cavity.

[0046] As can be seen, the infrared detector module in this application includes: a circuit board, a housing, an infrared detector, and a light-transmitting element. The light-transmitting element is disposed on a window in the housing. The light-transmitting element, the housing, and the circuit board form a cavity, and the infrared detector is disposed within the cavity. The housing and the light-transmitting element protect the infrared detector. When a particle falls onto the light-transmitting element of the detector module, the distance between the particle and the infrared detector is relatively large, which can reduce the impact on the infrared detector's imaging. Furthermore, the housing has a ventilation hole communicating with the cavity. Heat may be generated during the encapsulation of the housing and the circuit board or other processes. The heat inside the cavity can be discharged to the outside of the cavity through the ventilation hole, preventing the housing from expanding due to heat inside the cavity, which could affect the bonding between the housing and the circuit board and lead to the failure of the housing and circuit board encapsulation. At the same time, it can also prevent heat from affecting the infrared detector's imaging, improving the yield of the infrared detector module.

[0047] In addition, this application also provides an infrared imaging device with the above-mentioned advantages. Attached Figure Description

[0048] To more clearly illustrate the technical solutions of the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0049] Figure 1 A cross-sectional schematic diagram of an infrared detector module provided in an embodiment of this application. Figure 1 ;

[0050] Figure 2 A cross-sectional schematic diagram of an infrared detector module provided in an embodiment of this application. Figure 2 ;

[0051] Figure 3 A cross-sectional schematic diagram of an infrared detector module provided in an embodiment of this application. Figure 3 ;

[0052] Figure 4 A cross-sectional schematic diagram of an infrared detector module provided in an embodiment of this application. Figure 4 ;

[0053] Figure 5 A bottom view of a housing provided in an embodiment of this application;

[0054] Figure 6 This is a top view of an infrared detector module provided in an embodiment of this application;

[0055] In the diagram, 1 is the circuit board, 2 is the housing, 3 is the infrared detector, 4 is the light-transmitting component, 5 is the cavity, 6 is the wire, 7 is the reinforcing body, 8 is the conductor, 21 is the ventilation hole, 22 is the positioning blind hole, 23 is the groove, 24 is the texture, 211 is the first through hole, 212 is the second through hole, 31 is the infrared detector chip, and 32 is the light window. Detailed Implementation

[0056] To enable those skilled in the art to better understand the present application, the present application will be further described in detail below with reference to the accompanying drawings and specific embodiments. Obviously, the described embodiments are merely some embodiments of the present application, and not all embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0057] Many specific details are set forth in the following description in order to provide a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Those skilled in the art can make similar extensions without departing from the spirit of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0058] As described in the background section, the infrared detector chip and the optical window are currently very close together. During long-term use, this can easily lead to problems such as particles falling onto the surface of the optical window, thus affecting the imaging of the infrared detector.

[0059] In view of this, this application provides an infrared detector module, please refer to... Figures 1 to 5 ,include:

[0060] The circuit board 1, housing 2, infrared detector 3 and light-transmitting element 4, wherein the housing 2 has a window and a ventilation hole 21;

[0061] The housing 2 is fixedly connected to the surface of the circuit board 1, the light-transmitting element 4 is located at the window, and the housing 2, the light-transmitting element 4 and the circuit board 1 form a cavity 5; the light-transmitting element 4 is located on the incident light path of the infrared detector 3;

[0062] The infrared detector 3 is located in the cavity 5 and is electrically connected to the circuit board 1;

[0063] The ventilation hole 21 is connected to the cavity 5 and is used to release the heat in the cavity 5.

[0064] The infrared detector 3 includes an infrared detector chip 31 and a light window 32.

[0065] This application does not limit the packaging type of the infrared detector 3; it depends on the circumstances. For example, the infrared detector 3 includes, but is not limited to, any of the following:

[0066] Metal-packaged infrared detectors, ceramic-packaged infrared detectors, wafer-level packaged infrared detectors, and pixel-level packaged infrared detectors.

[0067] The infrared detector 3 is preferably a wafer-level packaged infrared detector or a pixel-level packaged infrared detector, in order to further reduce the size of the infrared detector module.

[0068] Both the outer and inner surfaces of the light-transmitting element 4 are flat, with the inner surface being the side closest to the infrared detector 3. The light-transmitting element 4 transmits infrared light. The window of the housing 2 matches the light-transmitting element 4 to ensure a tight fit between the housing 2 and the light-transmitting element 4, forming a cavity 5. Since the light-transmitting element 4 is located in the incident light path of the infrared detector 3, infrared light can illuminate the infrared detector 3 after passing through the light-transmitting element 4.

[0069] To improve the transmittance of infrared light on the light-transmitting element 4, the light-transmitting element 4 can be a germanium (Ge) light-transmitting element, a silicon (Si) light-transmitting element, or a sulfur selenium glass light-transmitting element, etc.

[0070] It should be noted that this application does not limit the positional relationship between the outer surface of the light-transmitting element 4 and the outer surface of the housing 2.

[0071] As one possible implementation method, such as Figure 1 As shown, the outer surface of the light-transmitting element 4 is flush with the outer surface of the housing 2.

[0072] As another possible implementation method, such as Figure 2 As shown, the outer surface of the light-transmitting element 4 is higher than the outer surface of the housing 2.

[0073] As another possible implementation method, such as Figure 3 As shown, the outer surface of the light-transmitting element 4 is lower than the outer surface of the housing 2.

[0074] The outer surface of the light-transmitting element 4 and the outer surface of the housing 2 are the surfaces away from the infrared detector 3.

[0075] When the outer surface of the light-transmitting element 4 is lower than the outer surface of the housing 2, the housing 2 protruding from the light-transmitting element 4 can protect the light-transmitting element 4, prevent the light-transmitting element 4 from being damaged, and extend the service life of the light-transmitting element 4.

[0076] The number of ventilation holes 21 can be one or at least two, depending on the actual situation. This application does not impose any specific restrictions.

[0077] The shape of the ventilation hole 21 includes, but is not limited to, any one or any combination of circles, rectangles, squares, ellipses, pentagons, and hexagons.

[0078] It should be noted that the location of the ventilation hole 21 on the housing 2 is not limited in this application and can be set by the user.

[0079] In one possible implementation, the ventilation hole 21 is located on the upper surface of the housing 2, and the upper surface of the housing 2 is the surface away from the infrared detector 3, in order to reduce the manufacturing difficulty of the ventilation hole 21 on the housing 2. The upper surface of the housing 2 is the surface of the housing 2 opposite to the circuit board 1 and away from the circuit board.

[0080] As an alternative implementation, the ventilation hole 21 is located on the side wall of the housing 2, which is the side surface directly connected to the circuit board 1, in order to reduce the manufacturing difficulty of the ventilation hole 21 on the housing 2.

[0081] As an alternative implementation, the ventilation hole 21 is located at the connection between the upper surface of the housing 2 and the side wall.

[0082] The size of the ventilation hole 21 is not limited in this application and can be set by the user. As one possible implementation, the diameter of the ventilation hole 21 can be in the range of 0.01mm to 0.3mm, including the endpoint value, to avoid the ventilation hole 21 being too small, resulting in poor ventilation effect, and at the same time to avoid the ventilation hole 21 being too large, making it easy for dust to enter through the ventilation hole 21.

[0083] The preferred diameter range for the ventilation hole 21 is 0.05mm to 0.15mm, which simplifies the manufacturing process of the ventilation hole 21, increases ventilation efficiency, and reduces dust entering the cavity 5.

[0084] As one possible implementation, the ventilation hole 21 can be a pore of uniform size, but this application does not specifically limit it. In other embodiments of this application, such as... Figure 3 As shown, the ventilation hole 21 includes a first through hole 211 and a second through hole 212 that are connected. The first through hole 211 is directly connected to the cavity 5. The diameter of the first through hole 211 is smaller than that of the second through hole 212, which can reduce the manufacturing difficulty of the ventilation hole 21. In addition, when the ventilation hole 21 is provided with a colloid fixing part, it is convenient for the backfilled colloid to solidify and form. The first through hole 211 can be a tapered hole.

[0085] It should be noted that this application does not limit the connection method between the infrared detector 3 and the circuit board 1.

[0086] In one possible implementation, the infrared detector 3 is electrically connected to the circuit board 1 via a wire 6 located on the side of the infrared detector 3. The wire 6 can be gold wire. In this embodiment, the housing 2 also serves to protect the wire 6. This embodiment provides a simple electrical connection between the infrared detector 3 and the circuit board 1.

[0087] As an alternative implementation method, such as Figure 4 As shown, the infrared detector 3 is located on the upper surface of the circuit board 1, and a conductor 8 is provided between the lower surface of the infrared detector 3 and the upper surface of the circuit board 1. The conductor 8 can be a solder ball, and the infrared detector 3 is electrically connected to the circuit board 1 via through-silicon vias (TSVs) using solder balls. In this embodiment, the presence of wires 6 on the side of the infrared detector 3 is avoided, reducing the distance between the side of the infrared detector 3 and the side wall of the housing 2, thus reducing the size of the infrared detector module.

[0088] In one embodiment of this application, the field of view of the infrared detector 3 is 30° to 120°, including the endpoint value.

[0089] The inner surface of the housing 2, together with the window and the photosensitive area of ​​the infrared detector chip, constitute the field of view of the infrared detector 3.

[0090] If the field of view is less than 30°, it is too small, which limits the application of the infrared detector module and also affects the lens used to match the infrared detector module; if the field of view is greater than 120°, the size of the window and the infrared detector module need to be increased, which will increase the cost of the infrared detector module.

[0091] It should be noted that this application does not limit the connection method between the housing 2 and the circuit board 1, as long as a fixed connection can be achieved.

[0092] In one possible implementation, the housing 2 is connected to the circuit board 1 by adhesive bonding. The housing 2 and the circuit board 1 are bonded together using an adhesive, which simplifies the connection process between them and improves manufacturing efficiency.

[0093] In this embodiment, the adhesive layer between the housing 2 and the circuit board 1 is not limited and can be selected at will.

[0094] As one possible implementation, the adhesive layer between the housing 2 and the circuit board 1 includes, but is not limited to, any one of epoxy resin, silicone, and polyurethane adhesive. Epoxy resin, silicone, and polyurethane adhesive have high-temperature resistance properties, which enables the infrared detector module to have high-temperature resistance.

[0095] To further enhance the robustness of the connection between the housing 2 and the circuit board 1, the surfaces of the housing 2 and the circuit board 1 opposite to each other are provided with textures 24, such as... Figure 5 As shown; or, the surface of the housing 2 opposite to the circuit board 1 is provided with a recess, which is used to fill the colloid.

[0096] By setting the texture 24, the surfaces of the housing 2 and the circuit board 1 are uneven, which increases the roughness of the surfaces of the housing 2 and the circuit board 1, thereby improving the connection and positioning blind hole 22 between the housing 2 and the circuit board 1.

[0097] The surface of the housing 2 opposite to the circuit board 1 is provided with a recess, and the colloid can be filled in the recess, so that the adhesion between the housing 2 and the circuit board 1 is stronger, and the connection reliability between the housing 2 and the circuit board 1 is enhanced.

[0098] High temperatures may occur during the manufacturing process. To avoid problems such as deformation of the shell 2 under high temperatures, the shell 2 is a shell 2 that can withstand a high temperature of at least 250°C.

[0099] It should be noted that the material of the housing 2 is not limited in this embodiment. For example, the housing 2 includes, but is not limited to, any of the following:

[0100] Plastic casing, metal casing, ceramic casing.

[0101] The plastic housing includes, but is not limited to, any of the following:

[0102] Thermotropic liquid crystal polymer housing, lyotropic liquid crystal polymer housing, polyimide housing.

[0103] Thermotropic liquid crystal polymer housing, lyotropic liquid crystal polymer housing, and polyimide housing have good mechanical strength and high temperature resistance, which can make housing 2 have high temperature resistance, thereby improving the infrared detector module's performance in high temperatures above 250 degrees Celsius.

[0104] In this embodiment, the method of fixing the light-transmitting element 4 to the window of the housing 2 is not limited and can be determined according to the situation. For example, the light-transmitting element 4 is fixed to the window by adhesive; or, the light-transmitting element 4 is fixed to the window by clips; or, the light-transmitting element 4 is fixed to the window by pressure.

[0105] When the light-transmitting component 4 is fixed to the window by adhesive bonding, the adhesive layer between the light-transmitting component 4 and the window is not limited in this embodiment and can be selected by the user.

[0106] As one possible implementation, the adhesive layer between the light-transmitting element 4 and the window includes, but is not limited to, any one of epoxy resin, silicone, and polyurethane adhesive. Epoxy resin, silicone, and polyurethane adhesive have high-temperature resistance properties, which enables the infrared detector module to have high-temperature resistance.

[0107] The infrared detector 3 is located on the upper surface of the circuit board 1, such as Figures 1 to 5 As shown, the infrared detector 3 is stacked on the surface of the circuit board 1. However, this application does not specifically limit this arrangement, and the infrared detector 3 can also be configured in other ways.

[0108] The infrared detector module described in this application can have a length range of 5mm to 18mm, a width range of 5mm to 18mm, and a height range of 3mm to 6mm, including all endpoint values. The width and length may be equal or unequal.

[0109] The infrared detector module in this application can be very small in size, realizing the miniaturization of the infrared detector module, which makes the infrared detector module more suitable for various portable devices and miniaturized systems, thus broadening the application range.

[0110] For example, the length of the infrared detector module can be 5mm, 8mm, 10mm, 12mm, 14mm, 15mm, 18mm, etc., the width can be 5mm, 8mm, 10mm, 12mm, 14mm, 15mm, 18mm, etc., and the height can be 3mm, 4mm, 5mm, 6mm, etc.

[0111] In this embodiment, the infrared detector module includes: a circuit board 1, a housing 2, an infrared detector 3, and a light-transmitting element 4. The light-transmitting element 4 is disposed on a window of the housing 2. The light-transmitting element 4, the housing 2, and the circuit board 1 form a cavity 5. The infrared detector 3 is disposed in the cavity 5. The housing 2 and the light-transmitting element 4 protect the infrared detector 3. When a particle falls onto the light-transmitting element 4 of the detector module, the distance between the particle and the infrared detector 3 is relatively large, which can reduce the impact on the imaging of the infrared detector 3. Furthermore, the housing 2 has a ventilation hole 21 that communicates with the cavity 5. Heat may be generated when the housing 2 and the circuit board 1 are packaged or other processes are performed. The heat inside the cavity 5 can be discharged to the outside of the cavity 5 through the ventilation hole 21, preventing the housing 2 from expanding due to the heat inside the cavity 5, which would affect the bonding between the housing 2 and the circuit board 1 and thus cause the packaging failure of the housing 2 and the circuit board 1. At the same time, it can also prevent the heat from affecting the imaging of the infrared detector 3 and improve the yield of the infrared detector module.

[0112] Based on the above embodiments, in one embodiment of this application, the infrared detector module further includes:

[0113] Dust plug located in the ventilation hole 21; and / or,

[0114] An isolation shield located above the housing 2.

[0115] An infrared detector module may be equipped with only a dust plug, or only an isolation cover, or both a dust plug and an isolation cover.

[0116] By using a dust plug, dust can be prevented from entering the infrared detector module through the ventilation hole 21. The dust plug can be a removable silicone plug or a glue-fixing part, which is formed by dripping glue into the ventilation hole 21 and allowing it to cure.

[0117] The isolation cover matches the dimensions of the upper surface of the housing 2, allowing it to cover the upper surface of the housing 2. This serves two purposes: preventing dust from entering the infrared detector module through the ventilation hole 21, and protecting the light-transmitting element 4. When the infrared detector module needs to be used, or when it needs to be assembled with other equipment, the isolation cover can be removed. Furthermore, an infrared-transmitting element can be installed on the side of the isolation cover away from the light-transmitting element 4. When the isolation cover is removed, the infrared light passes through this element and enters the light-transmitting element 4, providing secondary protection. Alternatively, a window can be opened on the isolation cover opposite the light-transmitting element, with an infrared-transmitting element installed at the window. The infrared light passes through this element and enters the light-transmitting element 4, providing secondary protection.

[0118] Please refer to Figure 6 Based on any of the above embodiments, in one embodiment of this application, the infrared detector module may further include:

[0119] A positioning blind hole 22 is provided on the housing 2.

[0120] The positioning blind hole 22 does not penetrate the housing 2. The positioning blind hole 22 is used for alignment when the infrared detector module is integrated with other components after leaving the factory.

[0121] The shape of the positioning blind hole 22 includes, but is not limited to, any one of the following: circle, rectangle, square, ellipse, pentagon, and hexagon. A circle is preferred to simplify the manufacturing process of the positioning blind hole 22.

[0122] When the ventilation hole 21 and the positioning blind hole 22 have the same shape, in one embodiment of this application, the infrared detector module may further include a groove 23 surrounding the ventilation hole 21, the shape of which is different from that of the positioning blind hole 22.

[0123] The purpose of setting the irregular groove 23 is to distinguish it from the positioning blind hole 22 and to avoid mistaking the ventilation hole 21 for the positioning blind hole 22.

[0124] The diameter of the positioning blind hole 22 can be in the range of 0.1mm to 1mm, preferably in the range of 0.2mm to 0.6mm, so that it can be recognized by other components when the infrared detector module is integrated with other components after leaving the factory.

[0125] Please refer to Figures 1 to 5 Based on any of the above embodiments, in one embodiment of this application, the infrared detector module may further include:

[0126] The reinforcing element 7 is located inside the cavity 5 to prevent the housing 2 from being too weak and damaging the infrared detector 3.

[0127] In one possible implementation, the reinforcing elements 7 are distributed dispersedly on the inner surface of the housing 2. However, the arrangement of the reinforcing elements 7 in this application is not limited to this. In other embodiments of this application, the reinforcing elements 7 are partially embedded in the housing 2, and the remaining portion is located on the inner surface of the housing 2; the inner surface of the housing 2 is the surface closer to the infrared detector 3.

[0128] The reinforcing body 7 can be divided into multiple blocks, which are distributed on the inner surface of the housing 2 to provide a certain support for the housing 2. This allows the housing 2 to withstand the high temperature of the SMT (Surface Mount Technology) process and avoid problems such as deformation.

[0129] When the material of the shell 2 is a polymer, it may soften or deform under high temperatures. By embedding part of the reinforcing body 7 inside the shell 2, the shell 2 can be supported, allowing it to withstand the high temperatures of the SMT process and preventing deformation. The method for embedding part of the reinforcing body 7 inside the shell 2 is as follows: during the manufacturing process of the shell 2, a portion of the shell 2 is first manufactured, and then the reinforcing body 7 is fabricated on that portion. After the reinforcing body 7 is completed, the remaining portion of the shell 2 is then manufactured, thus embedding part of the reinforcing body 7 within the shell 2.

[0130] This application also provides an infrared imaging device, including the infrared detector module described in any of the above embodiments.

[0131] The various embodiments in this specification are described in a progressive manner. Each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.

[0132] The infrared detector module and infrared imaging device provided in this application have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this application. The descriptions of the embodiments above are only for the purpose of helping to understand the solution and core ideas of this application. It should be noted that those skilled in the art can make several improvements and modifications to this application without departing from the principles of this application, and these improvements and modifications also fall within the protection scope of this application.

Claims

1. An infrared detector module, characterized in that, include: The circuit board (1), housing (2), infrared detector (3) and light-transmitting element (4), wherein the housing (2) has a window and a ventilation hole (21); The housing (2) is fixedly connected to the surface of the circuit board (1), the light-transmitting element (4) is located in the window, and the housing (2), the light-transmitting element (4) and the circuit board (1) form a cavity (5); the light-transmitting element (4) is located in the incident light path of the infrared detector (3); The infrared detector (3) is located in the cavity (5) and is electrically connected to the circuit board (1); The ventilation hole (21) is connected to the cavity (5) and is used to release the heat in the cavity (5).

2. The infrared detector module as described in claim 1, characterized in that, The outer surface of the light-transmitting element (4) is flush with the outer surface of the housing (2); or the outer surface of the light-transmitting element (4) is higher than the outer surface of the housing (2); or the outer surface of the light-transmitting element (4) is lower than the outer surface of the housing (2); the outer surface of the light-transmitting element (4) and the outer surface of the housing (2) are surfaces away from the infrared detector (3).

3. The infrared detector module as described in claim 1, characterized in that, Also includes: The dust plug is located in the ventilation hole (21); and / or, An isolation shield located above the housing (2).

4. The infrared detector module as described in claim 1, characterized in that, The housing (2) is connected to the circuit board (1) by adhesive bonding.

5. The infrared detector module as described in claim 4, characterized in that, The surface of the housing (2) opposite to the circuit board (1) is textured (24); or, The surface of the housing (2) opposite to the circuit board (1) is provided with a recess, which is used to fill the colloid.

6. The infrared detector module as described in claim 1, characterized in that, Also includes: A positioning blind hole (22) is provided on the housing (2).

7. The infrared detector module as described in claim 6, characterized in that, Also includes: A groove (23) surrounds the ventilation hole (21), the shape of which is different from that of the positioning blind hole (22).

8. The infrared detector module as described in claim 1, characterized in that, Also includes: The reinforcing element (7) is located within the cavity (5).

9. The infrared detector module as described in claim 8, characterized in that, The reinforcing elements (7) are dispersed on the inner surface of the shell (2); or, The reinforcing body (7) is partially embedded in the housing (2), and the remaining part is located on the inner surface of the housing (2); the inner surface of the housing (2) is the surface close to the infrared detector (3).

10. The infrared detector module as described in claim 1, characterized in that, The infrared detector (3) is electrically connected to the circuit board (1) via a wire (6) located on the side of the infrared detector (3); or, The infrared detector (3) is located on the upper surface of the circuit board (1), and a conductor (8) is provided between the lower surface of the infrared detector (3) and the upper surface of the circuit board (1).

11. The infrared detector module as described in claim 1, characterized in that, The housing (2) is a housing (2) that can withstand a high temperature of at least 250°C.

12. The infrared detector module as described in claim 11, characterized in that, The housing (2) includes any of the following: Plastic casing, metal casing, ceramic casing.

13. The infrared detector module as described in claim 12, characterized in that, The plastic housing includes any of the following: Thermotropic liquid crystal polymer housing, lyotropic liquid crystal polymer housing, polyimide housing.

14. The infrared detector module as described in claim 4, characterized in that, The light-transmitting element (4) is fixed to the window by adhesive bonding; or, The light-transmitting element (4) is fixed to the window by a clip; or, The light-transmitting element (4) is fixed to the window by a pressure member.

15. The infrared detector module as described in claim 14, characterized in that, The adhesive layer between the housing (2) and the circuit board (1) includes any one of epoxy adhesive, silicone adhesive, and polyurethane adhesive; and / or, The adhesive layer between the light-transmitting element (4) and the window includes any one of epoxy adhesive, silicone adhesive, and polyurethane adhesive.

16. The infrared detector module as described in claim 1, characterized in that, The ventilation hole (21) is located on the upper surface of the housing (2), or the ventilation hole (21) is located on the side wall of the housing (2).

17. The infrared detector module as described in claim 1, characterized in that, The field of view of the infrared detector (3) is 30°~120°, including the endpoint value.

18. The infrared detector module as described in claim 1, characterized in that, The infrared detector (3) includes any of the following: Metal-packaged infrared detectors, ceramic-packaged infrared detectors, wafer-level packaged infrared detectors, and pixel-level packaged infrared detectors.

19. The infrared detector module as described in claim 1, characterized in that, The infrared detector (3) is located on the upper surface of the circuit board (1).

20. The infrared detector module as described in claim 1, characterized in that, The infrared detector module has a length range of 5mm to 18mm, a width range of 5mm to 18mm, and a height range of 3mm to 6mm, including all endpoint values; and / or, The diameter of the ventilation hole (21) ranges from 0.01 mm to 0.3 mm, including the endpoint values; and / or, The ventilation hole (21) includes a first through hole (211) and a second through hole (212) that are connected. The first through hole (211) is directly connected to the cavity (5), and the diameter of the first through hole (211) is smaller than that of the second through hole (212).

21. An infrared imaging device, characterized in that, Including the infrared detector module as described in any one of claims 1 to 20.

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