Circuit board heat dissipation structure and heat pump water heater

Abstract

The utility model discloses a circuit board heat dissipation structure and a heat pump water heater, and relates to the technical field of heat pump water heaters, the circuit board heat dissipation structure can comprise a circuit board assembly and a heat exchanger assembly, the heat exchanger assembly comprises a heat exchanger body and a pipeline structure communicating with the heat exchanger body, and the pipeline structure is used for communicating with cooling water; the circuit board assembly is connected with the pipeline structure of the heat exchanger assembly, so that the pipeline structure can be in heat conduction contact with the circuit board assembly, cooling water flowing in the pipeline structure can exchange heat with the circuit board assembly, heat of the circuit board assembly is taken away, the circuit board assembly is cooled, and the heat dissipation effect is good; due to the fact that the heat exchanger assembly is a heat exchange part of the heat pump water heater, and the temperature of the heat exchanger assembly is lower than that of the circuit board assembly, other parts such as a water pump do not need to be additionally arranged when the heat exchanger assembly is used for dissipating heat of the circuit board assembly, and the structure is simple.

Description

Technical Field

[0001] This application relates to the field of heat pump water heater technology, and in particular to a circuit board heat dissipation structure and a heat pump water heater. Background Technology

[0002] Currently, heat pump water heaters use a small amount of electricity as power and refrigerant as a carrier to continuously absorb low-temperature heat energy from environmental heat sources (such as water and air), convert it into higher-temperature heat energy, and then release the higher-temperature heat energy into the water that needs to be heated.

[0003] Heat pump water heaters typically include a circuit board assembly, which controls the start-up, shutdown, and heat exchange of the heat pump water heater. The circuit board assembly includes various heating components such as capacitors, inductors, and resistors. When the circuit board assembly is working, these heating components generate a lot of heat. If the heat is not dissipated in time, the heating components will become too hot and eventually be damaged.

[0004] In related technologies, there are two main heat dissipation methods: the first is to install heat sinks on the fan cavity side to dissipate heat from the circuit board components through air cooling; the second is to install a heat sink on the circuit board, which includes a heat sink base and heat sinks. The heat sink base is fixed to the circuit board and connected to the heat sinks, and heat is dissipated through the heat sinks. However, in harsh environments and at high ambient temperatures, the heat sinks have poor thermal conductivity, air cooling cannot conduct heat in a timely manner, and the heat sink structure is complex. Utility Model Content

[0005] This application provides a circuit board heat dissipation structure and a heat pump water heater, which can solve the technical problems of poor air cooling effect and complex water cooling structure of circuit board components.

[0006] In a first aspect, embodiments of this application provide a circuit board heat dissipation structure, which includes:

[0007] Circuit board assembly;

[0008] A heat exchanger assembly, comprising a heat exchanger body and a piping structure communicating with the heat exchanger body, the piping structure being used to communicate with cooling water, and the piping structure being connected to the circuit board assembly and forming a thermally conductive contact.

[0009] In some embodiments, the piping structure includes an inlet pipe and an outlet pipe, which are respectively connected to the heat exchanger body, and at least one of the inlet pipe and the outlet pipe is connected to the circuit board assembly and forms a thermally conductive contact.

[0010] In some embodiments, the outlet pipe includes:

[0011] The first pipe section is connected to the heat exchanger body;

[0012] The second pipe segment is connected to the first pipe segment, and the extension direction of the second pipe segment is set at an angle to the extension direction of the first pipe segment.

[0013] Both the first pipe segment and the second pipe segment are connected to the circuit board assembly and form a thermally conductive contact.

[0014] In some embodiments, the inlet pipe and the outlet pipe are located on the same side of the heat exchanger body, and both the inlet pipe and the outlet pipe are connected to the circuit board assembly and form a thermally conductive contact.

[0015] In some embodiments, at least a portion of the piping structure is a metal pipe, and the metal pipe is connected to the circuit board assembly to form a thermally conductive contact.

[0016] In some embodiments, the outer wall of the metal conduit has a mounting plane, to which the circuit board assembly is connected.

[0017] In some embodiments, the area where the piping structure connects to the circuit board assembly and forms a thermally conductive contact is provided with thermally conductive adhesive.

[0018] In some embodiments, the circuit board heat dissipation structure includes:

[0019] A thermally conductive component is disposed on the circuit board assembly and is connected to the pipeline structure to form a thermally conductive contact.

[0020] In some embodiments, the circuit board assembly includes a printed circuit board and a plurality of heat-generating components disposed on the printed circuit board, wherein the plurality of heat-generating components are distributed in the area where the printed circuit board is connected to the piping structure and forms a thermally conductive contact.

[0021] In some embodiments, the heating element is in thermal contact with the piping structure.

[0022] Secondly, embodiments of this application provide a heat pump water heater, which includes:

[0023] Box;

[0024] A compressor assembly, wherein the compressor assembly is disposed within the housing;

[0025] A fan assembly, wherein the fan assembly is disposed within the housing;

[0026] In the circuit board heat dissipation structure described above, the heat exchanger assembly is disposed inside the housing and is connected to the compressor assembly. The circuit board assembly is connected to the heat exchanger assembly and forms a thermally conductive contact.

[0027] The circuit board heat dissipation structure and heat pump water heater based on the embodiments of this application have at least the following beneficial effects:

[0028] By connecting the circuit board assembly and the heat exchanger assembly through a piping structure, the piping structure can form a thermally conductive contact with the circuit board assembly. The piping structure can also be connected to cooling water, which can exchange heat with the circuit board assembly, carrying away the heat from the circuit board assembly and dissipating heat effectively. Since the heat exchanger assembly is a heat exchange component inherent in the heat pump water heater, and its temperature is lower than that of the circuit board assembly, using the heat exchanger assembly to dissipate heat from the circuit board assembly eliminates the need for additional components such as a water pump, resulting in a simple structure. Attached Figure Description

[0029] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0030] Figure 1 This is a three-dimensional structural diagram of a circuit board heat dissipation structure provided in an embodiment of this application;

[0031] Figure 2 This is a front view of a circuit board heat dissipation structure provided in an embodiment of this application;

[0032] Figure 3 This is a schematic diagram of the back structure of a circuit board heat dissipation structure provided in an embodiment of this application;

[0033] Figure 4 for Figure 2 A schematic diagram of the cross-sectional structure at point AA.

[0034] Explanation of reference numerals in the attached figures:

[0035] 100. Circuit board heat dissipation structure; 10. Circuit board assembly; 11. Printed circuit board; 12. Heating component; 20. Heat exchanger assembly; 21. Heat exchanger body; 22. Piping structure; 221. Inlet pipe; 222. Outlet pipe; 2221. First pipe section; 2222. Second pipe section; 223. Metal piping; 2231. Mounting plane; 30. Heat-conducting component. Detailed Implementation

[0036] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0037] On the one hand, please refer to Figure 1 This application provides a circuit board heat dissipation structure 100, which may include a circuit board assembly 10 and a heat exchanger assembly 20. The heat exchanger assembly 20 may include a heat exchanger body 21 and a pipe structure 22. The pipe structure 22 may be connected to the heat exchanger body 21 and is used to connect cooling water. The circuit board assembly 10 may be connected to the pipe structure 22, so that the circuit board assembly 10 and the pipe structure 22 can form a thermally conductive contact, that is, the pipe structure 22 can exchange heat with the circuit board assembly 10.

[0038] Optionally, the circuit board heat dissipation structure 100 can be applied to a heat pump water heater. The heat exchanger assembly 20 is a heat exchange component that the heat pump water heater itself has. The heat exchanger assembly 20 can be a titanium tube heat exchanger, and the temperature of the heat exchanger assembly 20 is lower than the temperature of the circuit board assembly 10. The cooling water flowing in the pipe structure 22 can exchange heat with the circuit board assembly 10, remove the heat from the circuit board assembly 10, and dissipate heat from the circuit board assembly 10. The heat dissipation effect is good. Furthermore, by using the heat exchanger assembly 20 to dissipate heat from the circuit board assembly 10, no additional components such as a water pump are required, and the structure is simple.

[0039] Optionally, the heat pump water heater is used to heat the pool water. The cooling water connected to the pipe structure 22 can be the pool water. That is, while the pool water dissipates heat to the circuit board assembly 10 through the pipe structure 22, the circuit board assembly 10 can also heat the pool water, which can improve the heating efficiency of the pool water.

[0040] It should be noted that in a device that has both a circuit board assembly 10 and a heat exchanger assembly 20, as long as the temperature of the heat exchanger assembly 20 is lower than the temperature of the circuit board assembly 10, the circuit board assembly 10 and the heat exchanger assembly 20 can be connected to form a thermally conductive contact, so that the circuit board assembly 10 and the heat exchanger assembly 20 can form a circuit board heat dissipation structure 100 for dissipating heat from the circuit board assembly 10. This structure has good heat dissipation effect and simple structure.

[0041] Please see Figures 1 to 3 In some embodiments, the piping structure 22 may include an inlet pipe 221 and an outlet pipe 222, which are respectively connected to the heat exchanger body 21. At least one of the inlet pipe 221 and the outlet pipe 222 is connected to the circuit board assembly 10 and forms a thermally conductive contact.

[0042] Optionally, the heat exchanger body 21 may have an inlet and an outlet, with an inlet pipe 221 connected to the inlet and an outlet pipe 222 connected to the outlet, so that cooling water flows into the heat exchanger body 21 from the inlet pipe 221. After heat exchange in the heat exchanger body 21, the cooling water flows out of the heat exchanger body 21 from the outlet pipe 222. The circuit board assembly 10 may be connected to the inlet pipe 221 and form a thermally conductive contact. The temperature of the inlet pipe 221 is lower than that of the outlet pipe 222. Connecting the circuit board assembly 10 to the inlet pipe 221 can improve the heat dissipation effect.

[0043] Optionally, the circuit board assembly 10 can be connected to the water inlet pipe 221 and the water outlet pipe 222, which can increase the thermally conductive contact area of ​​the circuit board assembly 10, improve the heat dissipation effect, and also facilitate the fixing of the circuit board assembly 10, making the circuit board assembly 10 more secure.

[0044] Optionally, the circuit board assembly 10 can be connected to the water outlet pipe 222 and form a thermally conductive contact. Since the temperature of the pool water generally needs to be heated to 26°C to 28°C, and the operating temperature range of the circuit board assembly 10 is generally 40°C to 70°C, the circuit board assembly 10 can work normally within this range without being affected by the temperature. Therefore, connecting the circuit board assembly 10 to the water outlet pipe 222 can also dissipate heat from the circuit board assembly 10.

[0045] Please see Figure 1 and Figure 2 In some embodiments, the outlet pipe 222 may include a first pipe section 2221 and a second pipe section 2222. The first pipe section 2221 may be connected to the heat exchanger body 21, and the second pipe section 2222 may be connected to the first pipe section 2221. The extension direction of the second pipe section 2222 may be set at an angle to the extension direction of the first pipe section 2221. Both the first pipe section 2221 and the second pipe section 2222 are connected to the circuit board assembly 10 and form a thermally conductive contact.

[0046] Optionally, the first pipe segment 2221 and the second pipe segment 2222 can be arranged to intersect, so that the first pipe segment 2221 and the second pipe segment 2222 can form an angle between them, or in other words, the first pipe segment 2221 and the second pipe segment 2222 can form a triangular structure. Thus, the first pipe segment 2221 and the second pipe segment 2222 can form a connecting bracket. The circuit board assembly 10 is connected to the first pipe segment 2221 and the second pipe segment 2222, which can be fixed more firmly. Furthermore, by arranging the first pipe segment 2221 and the second pipe segment 2222 at an angle, the contact area between the circuit board assembly 10 and the water outlet pipe 222 can be increased, that is, the heat exchange area between the circuit board assembly 10 and the water outlet pipe 222 can be increased, thereby increasing the heat dissipation effect.

[0047] Preferably, the centerline of the first pipe segment 2221 is perpendicular to the centerline of the second pipe segment 2222, and the centerlines of the first pipe segment 2221 and the second pipe segment 2222 are coplanar, so that the outer peripheral surfaces of the first pipe segment 2221 and the second pipe segment 2222 can be connected to the circuit board assembly 10.

[0048] Please see Figure 2 and Figure 3 In some embodiments, the inlet pipe 221 and the outlet pipe 222 are located on the same side of the heat exchanger body 21, and both the inlet pipe 221 and the outlet pipe 222 are connected to the circuit board assembly 10 and form a thermally conductive contact.

[0049] Optionally, the inlet and outlet of the heat exchanger body 21 are located on the same side, the inlet pipe 221 is connected to the inlet, and the outlet pipe 222 is connected to the outlet, so that the inlet pipe 221 and the outlet pipe 222 are located on the same side of the heat exchanger body 21, and the axis of the inlet pipe 221 and the axis of the outlet pipe 222 can be located on the same plane, so that the outer peripheral surfaces of the inlet pipe 221 and the outlet pipe 222 can be connected to the circuit board assembly 10, and the outer peripheral surfaces of the inlet pipe 221 and the outlet pipe 222 can form a thermally conductive contact with the circuit board assembly 10, so that the cooling water flowing through the inlet pipe 221 and the cooling water flowing through the outlet pipe 222 can dissipate heat from the circuit board assembly 10.

[0050] Optionally, the circuit board assembly 10 has multiple heating elements 12, and the heat output of the multiple heating elements 12 is not the same. The heating element 12 with higher heat output can form a thermally conductive contact with the water inlet pipe 221, and the heating element 12 with lower heat output can form a thermally conductive contact with the water outlet pipe 222. This can specifically dissipate heat from the multiple heating elements 12, making the temperature of the circuit board assembly 10 more uniform.

[0051] Please see Figure 4 In some embodiments, at least a portion of the conduit structure 22 is a metal conduit 223, and the metal conduit 223 is capable of being connected to the circuit board assembly 10 and forming a thermally conductive contact.

[0052] Optionally, the piping structure 22 may include a metal pipe 223, such as a copper pipe, aluminum pipe, etc. Due to its material properties, the metal pipe 223 has good thermal conductivity and high structural strength, making it easy to connect to the circuit board assembly 10. The connection methods between the metal pipe 223 and the circuit board assembly 10 include welding, threaded connection, etc. For example, by welding, the circuit board assembly 10 can be directly welded to the metal pipe 223, so that the circuit board assembly 10 can form a thermally conductive contact with the metal pipe 223. This method can provide a strong connection and good thermal conductivity. However, it should be noted that welding will generate welding impurities and a lot of heat, so other pipes cannot be connected to the two ends of the metal pipe 223 during welding.

[0053] Furthermore, the circuit board assembly 10 can be connected to the metal pipe 223 mechanically, such as by using screws, nuts and other fasteners to connect the circuit board assembly 10 to the metal pipe 223 and form a thermally conductive contact. The connection method is simple and does not generate impurities or a large amount of heat.

[0054] In some other embodiments, the piping structure 22 may include metal piping 223 and non-metal piping 223. The circuit board assembly 10 is connected to the metal piping 223, which can increase the heat dissipation effect, while the non-metal piping 223 can reduce production costs.

[0055] Please see Figure 4 In some embodiments, the outer wall of the metal conduit 223 may have a mounting plane 2231, to which the circuit board assembly 10 may be connected.

[0056] Optionally, the outer wall of the metal conduit 223 can be leveled so that the outer wall of the metal conduit 223 can form a mounting plane 2231. The mounting plane 2231 can provide a mounting platform so that the circuit board assembly 10 can be easily set on the mounting plane 2231. By forming the mounting plane 2231 on the outer wall of the metal conduit 223, the circuit board assembly 10 is installed more firmly, and the contact area between the circuit board assembly 10 and the metal conduit 223 is also larger, which can better dissipate heat from the circuit board assembly 10.

[0057] In some embodiments, the area where the conduit structure 22 is connected to the circuit board assembly 10 and forms a thermally conductive contact is provided with thermally conductive adhesive.

[0058] Optionally, thermally conductive adhesive is a special adhesive used to fill the gap between the conduit structure 22 and the circuit board assembly 10, so that the conduit structure 22 and the circuit board assembly 10 form a thermally conductive contact. Since the thermal conductivity of thermally conductive adhesive is usually much higher than that of air, thermally conductive adhesive can significantly improve the thermal conductivity of the thermally conductive contact area, which helps to quickly transfer the heat generated by the circuit board assembly 10 to the conduit structure 22, so that the heat on the circuit board assembly 10 can be quickly dissipated through the conduit structure 22.

[0059] In addition, the thermally conductive adhesive not only provides thermal conductivity, but also enhances the connection strength between the piping structure 22 and the circuit board assembly 10, which helps prevent the circuit board assembly 10 from loosening or being damaged under vibration or impact conditions. At the same time, it meets the requirements of fixing and thermally conducting the circuit board assembly 10. Compared with the traditional mechanical fixing method, connecting the circuit board assembly 10 and the piping structure 22 with thermally conductive adhesive can reduce the need for additional fasteners, thereby reducing manufacturing costs and complexity.

[0060] Please see Figure 1 In some other embodiments, the circuit board heat dissipation structure 100 may also include a heat-conducting element 30, which may be disposed on the circuit board assembly 10 and may be connected to the pipeline structure 22 to form a thermally conductive contact.

[0061] Optionally, the heat-conducting component 30 is a component specifically designed for heat transfer. The heat-conducting component 30 typically has a high thermal conductivity and can be configured in various shapes and sizes to adapt to different circuit board assemblies 10 and heat dissipation requirements. The heat-conducting component 30 can be installed on the circuit board assembly 10 through various connection methods, such as adhesive bonding or bolt connection, so that the heat-conducting component 30 can be connected to the circuit board assembly 10 and form a good thermal contact to effectively transfer heat. The heat-conducting component 30 can also be connected to the pipe structure 22 and form a thermal contact. The connection method between the heat-conducting component 30 and the pipe structure 22 may include welding, threaded connection, or other reliable connection methods. When the cooling water flows in the pipe structure 22, it can carry away the heat conducted by the heat-conducting component 30, thereby achieving a heat dissipation effect. Through the synergistic effect of the heat-conducting component 30 and the pipe structure 22, the heat generated on the circuit board assembly 10 can be quickly conducted and carried away.

[0062] Please see Figure 1 and Figure 4 In some embodiments, the circuit board assembly 10 may include a printed circuit board 11 and a plurality of heating elements 12 disposed on the printed circuit board 11, wherein the plurality of heating elements 12 may be distributed in the area where the printed circuit board 11 is connected to the pipeline structure 22 and forms a thermally conductive contact.

[0063] Optionally, the heat-generating component 12 refers to electronic components that generate heat when operating in electronic devices, such as integrated circuits, resistors, and capacitors. Distributing multiple heat-generating components 12 can avoid heat concentration and reduce thermal stress on the printed circuit board 11. Furthermore, distributing multiple heat-generating components 12 in the area where the printed circuit board 11 connects to the conduit structure 22 and forms a thermally conductive contact allows the heat-generating components 12 to be placed close to the conduit structure 22 so that the heat generated by the heat-generating components 12 can be more effectively absorbed and carried away by the conduit structure 22.

[0064] Please see Figure 1 and Figure 4 In some embodiments, the heating element 12 can also make thermal contact with the piping structure 22.

[0065] Optionally, the heating element 12 can directly contact the piping structure 22 in a thermally conductive manner, transferring heat to the piping structure 22 through thermal conduction. This reduces the heat transfer path and thus increases the heat dissipation effect. Alternatively, thermally conductive adhesive can be filled between the heating element 12 and the piping structure 22 to ensure a good thermal contact surface, thereby enhancing the thermal conductivity.

[0066] On the other hand, this application embodiment also provides a heat pump water heater, which includes a housing, a compressor assembly, a fan assembly, and a circuit board heat dissipation structure 100. The housing serves as an external protective component of the heat pump water heater and can form an installation cavity. The compressor assembly, fan assembly, and circuit board heat dissipation structure 100 can all be disposed inside the housing. The compressor assembly can communicate with the heat exchanger assembly 20, so that the compressor assembly can compress the refrigerant into the heat exchanger assembly 20. The circuit board assembly 10 can be connected to the heat exchanger assembly 20 and form a thermally conductive contact. The fan assembly can drive the airflow inside the housing to increase the heat dissipation effect.

[0067] The beneficial effects of the heat pump water heater in this application are the same as those of the circuit board heat dissipation structure 100 in this application, and will not be described again here.

[0068] In the accompanying drawings of this embodiment, the same or similar reference numerals correspond to the same or similar components. In the description of this application, it should be understood that if terms such as "upper," "lower," "left," and "right" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, they are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, the terms used to describe positional relationships in the accompanying drawings are only for illustrative purposes and should not be construed as limiting this patent. For those skilled in the art, the specific meaning of the above terms can be understood according to the specific circumstances.

[0069] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A circuit board heat dissipation structure, characterized by comprising: The application relates to a circuit board heat dissipation structure. The application relates to a circuit board heat dissipation structure. The application relates to a circuit board heat dissipation structure. The application relates to a circuit board heat dissipation structure.

2. The circuit board heat dissipating structure according to claim 1, wherein The application relates to a circuit board heat dissipation structure.

3. The circuit board heat dissipating structure according to claim 2, wherein The application relates to a circuit board heat dissipation structure. The application relates to a circuit board heat dissipation structure. The application relates to a circuit board heat dissipation structure. The application relates to a circuit board heat dissipation structure.

4. The circuit board heat dissipating structure according to claim 2, wherein The application relates to a circuit board heat dissipation structure.

5. The circuit board heat dissipating structure according to claim 1, wherein The application relates to a circuit board heat dissipation structure.

6. The circuit board heat dissipating structure according to claim 5, wherein The application relates to a circuit board heat dissipation structure.

7. The circuit board heat dissipating structure according to claim 1, wherein The application relates to a circuit board heat dissipation structure.

8. The circuit board heat dissipating structure according to claim 1, wherein The application relates to a circuit board heat dissipation structure. The application relates to a circuit board heat dissipation structure.

9. The circuit board heat dissipating structure according to claim 1, wherein The application relates to a circuit board heat dissipation structure.

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