Perovskite battery packaging assembly

Abstract

The utility model provides a perovskite cell packaging assembly, which comprises a glass substrate, a perovskite cell sheet, a conductive adhesive tape, a bus bar, a packaging film and a glass cover plate from bottom to top in sequence, the glass substrate is divided into a central area and a peripheral packaging area, the perovskite cell sheet is located in the central area of the glass substrate, and the conductive adhesive tape is located in the peripheral packaging area of the glass substrate. The two conductive adhesive tapes are respectively arranged at two sides of the perovskite cell piece, the length of the conductive adhesive tapes is greater than that of the perovskite cell piece, the two bus bars are respectively overlapped and connected with the conductive adhesive tapes through welding, and the overlapping areas of the bus bars and the conductive adhesive tapes are located in the packaging area of the glass substrate. According to the perovskite cell packaging assembly, the original assembly structure is optimized, and the outdoor stability and the photoelectric conversion efficiency of the perovskite photovoltaic assembly are improved based on the welding superposition structure of the bus bar and the conductive adhesive tape.

Description

Technical Field

[0001] This utility model relates to the field of photovoltaic cells, and in particular to a perovskite cell encapsulation component. Background Technology

[0002] Perovskite solar cells are the third generation of photovoltaic cells, using organometal halide semiconductors as light-absorbing materials. As the efficiency of crystalline silicon solar cells gradually reaches its theoretical limit, perovskite solar cells, due to their significant advantages in efficiency and cost, are widely regarded by the industry, governments, and investors as the next-generation mainstream photovoltaic technology. Compared to crystalline silicon solar cells, perovskite solar cells have higher theoretical efficiency and can flexibly adjust their bandgap. Narrow-bandgap crystalline silicon cells can be stacked to achieve even higher efficiency, while avoiding degradation issues common in crystalline silicon cells such as PID, LIP, and LeTID. In the field of building-integrated photovoltaics (BIPV), the light transmittance and flexibility of perovskite solar cells make them an ideal choice.

[0003] Perovskite photovoltaic modules are the result of perovskite solar cells being converted into modules. Currently, the common way to extract current from cell-encapsulated modules is to use junction boxes, which are encapsulated inside the module. However, the junction boxes will block some of the perovskite cells, affecting light absorption and reducing photoelectric conversion efficiency.

[0004] Therefore, it is necessary to improve the structure of perovskite cell packaging components to enhance their performance. Utility Model Content

[0005] The purpose of this invention is to provide a perovskite solar cell encapsulation component that optimizes the original component structure. Based on the welded superposition structure of busbars and conductive tape, it improves the outdoor stability and photoelectric conversion efficiency of perovskite photovoltaic modules.

[0006] This utility model adopts the following technical solution: a perovskite solar cell encapsulation assembly, comprising, from bottom to top, a glass substrate, a perovskite solar cell, conductive adhesive strips, busbars, an encapsulation film, and a glass cover plate. The glass substrate is divided into a central area and a surrounding encapsulation area. The perovskite solar cell is located in the central area of ​​the glass substrate. There are two conductive adhesive strips, which are respectively disposed on both sides of the perovskite solar cell, and the length of the conductive adhesive strips is longer than the length of the perovskite solar cell. There are two busbars, which are respectively welded and overlapped with each of the conductive adhesive strips. The overlapping area of ​​the busbars and the conductive adhesive strips is located in the encapsulation area of ​​the glass substrate.

[0007] As a further improvement of this utility model, the end of the busbar that is not connected to the conductive adhesive strip extends out of the glass substrate and the glass cover plate, and the length of the busbar extending outside the glass substrate is greater than the length in the glass substrate.

[0008] As a further improvement of this utility model, the thickness of the welding layer between the busbar and the conductive adhesive strip is 0.2-0.5 mm.

[0009] As a further improvement of this utility model, butyl adhesive is applied around the glass substrate and the glass cover plate, and butyl adhesive is also applied around the busbar and in the gap between the conductive strip and the glass substrate.

[0010] As a further improvement of this utility model, one end of the conductive adhesive strip is flush with the edge of the perovskite solar cell, and the other end extends out of the perovskite solar cell and connects to the busbar.

[0011] As a further improvement of this utility model, the busbar is arranged along the direction of the conductive adhesive strip.

[0012] As a further improvement of this utility model, the busbar is perpendicular to the direction of the conductive adhesive strip.

[0013] As a further improvement of this utility model, the area of ​​the encapsulation film is not less than the area of ​​the perovskite solar cell and not greater than the area of ​​the glass cover.

[0014] As a further improvement of this utility model, the area of ​​the glass cover plate is equal to that of the glass substrate.

[0015] This invention relates to a perovskite solar cell encapsulation assembly that eliminates the junction box and uses a busbar to directly conduct current. Considering that the busbar cannot stably connect to the positive and negative terminals of the perovskite solar cell, conductive adhesive is used to connect the terminals. The conductive adhesive and the busbar are superimposed and fixed by welding at the connection point. This improves the connection stability between the busbar and the conductive adhesive tape, while also further reducing the contact resistance between them, resulting in better performance. The improvements to the perovskite solar cell encapsulation assembly of this application result in a simpler, more stable structure, lower cost, higher photoelectric conversion efficiency, better sealing, and greater suitability for harsh outdoor environments. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the perovskite battery encapsulation component of this utility model.

[0017] Figure 2 This is a schematic diagram of the glass substrate of this utility model.

[0018] Figure 3a This is a schematic diagram showing the busbar positioned along the direction of the conductive adhesive strip. Figure 3b A schematic diagram showing the busbar and conductive adhesive strip positioned perpendicularly. Detailed Implementation

[0019] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be described in detail below with reference to the accompanying drawings and specific embodiments.

[0020] Reference Figures 1-2 This embodiment of a perovskite solar cell encapsulation assembly includes, from bottom to top, a glass substrate 1, a perovskite solar cell 2, conductive adhesive strips 3, busbars 4, an encapsulation film 5, and a glass cover plate 6. The glass substrate 1 is divided into a central area 11 and surrounding encapsulation areas 12. The perovskite solar cell 2 is located in the central area 11 of the glass substrate. There are two conductive adhesive strips 3, which are respectively disposed on both sides of the perovskite solar cell 2, connecting the positive and negative terminals of the cell. The length of the conductive adhesive strips 3 is longer than the length of the perovskite solar cell 2. One end of the conductive adhesive strip 3 is flush with the edge of the perovskite solar cell 2, and the other end extends out of the perovskite solar cell 2 and connects to the busbar 4.

[0021] Two busbars 4 are used, each overlapping and connected to a conductive adhesive strip 3. Solder is applied to the conductive adhesive strip 3 using a soldering gun, and then the busbars 4 and conductive adhesive strips 3 are fixed together by soldering. The thickness of the solder layer 34 between the busbars 4 and conductive adhesive strips 3 is 0.2-0.5 mm. Too thick a layer will affect subsequent lamination and may cause the cover glass and substrate glass to crack during lamination; too thin a layer will result in a weak connection. A thickness of 0.3 mm is preferred to ensure better contact between the conductive adhesive strips 3 and busbars 4, reducing contact resistance and power generation loss. The series resistance between the busbars 4 and conductive adhesive strips 3 is <0.2Ω. The overlapping area of ​​the busbars 4 and conductive adhesive strips 3 is located in the encapsulation area 12 of the glass substrate, without obstructing the battery's light absorption. The end of the busbar 4 not connected to the conductive adhesive strip 3 extends beyond the glass substrate 1 and the glass cover 6. The length of the busbar 4 extending outside the glass substrate 1 is greater than its length within the glass substrate 1. In addition, the busbar 4 is arranged along the direction of the conductive adhesive strip 3, such as Figure 3a Or, the direction of busbar 4 is perpendicular to that of conductive strip 3, such as... Figure 3b This design allows for adaptability to various application scenarios. In this embodiment, the perovskite battery encapsulation assembly directly draws current using the busbar 4 and conductive adhesive strip 3, eliminating the need for a junction box, reducing the risk of damage, lowering costs, improving sealing, and making it more suitable for harsh outdoor environments.

[0022] Furthermore, the area of ​​the encapsulation film 5 is not less than the area of ​​the perovskite solar cell 2 and not greater than the area of ​​the glass cover plate 6. The area of ​​the glass cover plate 6 is equal to that of the glass substrate 1. The encapsulation film 5 can completely cover the perovskite solar cell 2, the conductive adhesive strip 3, and the busbar 4. The encapsulation film is a POE, EVA, or other adhesive film. Butyl adhesive 7 is applied around the glass substrate 1 and the glass cover plate 6, and butyl adhesive 7 is also applied around the busbar 4 and in the gaps between the conductive adhesive strip 3 and the glass substrate 1, ensuring a complete seal inside the encapsulated component.

[0023] The encapsulation component of this application is manufactured by hot lamination using a laminator. The hot pressing temperature is 120-150°C, the hot pressing pressure is 1-5 MPa, and the hot pressing time is 0.1-1 h.

[0024] Furthermore, the above embodiments are only used to illustrate the present utility model and are not intended to limit the technical solutions described in the present utility model. The understanding of this specification should be based on those skilled in the art. Although the present utility model has been described in detail with reference to the above embodiments, those skilled in the art should understand that they can still make modifications or equivalent substitutions to the present utility model. All technical solutions and improvements that do not depart from the spirit and scope of the present utility model should be covered within the scope of the claims of the present utility model.

Claims

1. A perovskite cell encapsulation assembly, characterized by: From bottom to top, it includes glass substrate, perovskite battery piece, conductive adhesive strip, bus bar, encapsulation film and glass cover plate, the glass substrate is divided into center area and surrounding encapsulation area, the perovskite battery piece is located in the center area of the glass substrate, the conductive adhesive strip is two, which are respectively arranged on both sides of the perovskite battery piece, and the length of the conductive adhesive strip is longer than the length of the perovskite battery piece, the bus bar is two, which are respectively connected with each conductive adhesive strip through welding overlap, and the overlap area of the bus bar and the conductive adhesive strip is located in the encapsulation area of the glass substrate.

2. The perovskite cell encapsulation assembly of claim 1, wherein: The end of the bus bar not connected with the conductive adhesive strip extends out of the glass substrate and the glass cover plate, and the length of the bus bar extending to the outside of the glass substrate is greater than that in the glass substrate.

3. The perovskite cell encapsulation assembly of claim 1, wherein: The welding layer between the bus bar and the conductive adhesive strip has a thickness of 0.2-0.5mm.

4. The perovskite cell encapsulation assembly of claim 1, wherein: Butyl rubber is attached around the glass substrate and the glass cover plate, and the gap between the bus bar and the conductive adhesive strip is also attached with butyl rubber.

5. The perovskite cell encapsulation assembly of claim 1, wherein: One end of the conductive adhesive strip is flush with the edge of the perovskite battery piece, and the other end extends out of the perovskite battery piece and is connected with the bus bar.

6. The perovskite cell encapsulation assembly of claim 1, wherein: The bus bar is arranged along the direction of the conductive adhesive strip.

7. The perovskite cell encapsulation assembly of claim 1, wherein: The bus bar is perpendicular to the direction of the conductive adhesive strip.

8. The perovskite cell encapsulation assembly of claim 1, wherein: The area of the encapsulation film is not less than the area of the perovskite battery piece, and not greater than the area of the glass cover plate.

9. The perovskite cell encapsulation assembly of claim 1, wherein: The area of the glass cover plate is equal to that of the glass substrate.

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