Semiconductor device tape-out process experiment box
By designing a reasonably partitioned experimental box for semiconductor device fabrication processes, the problems of collision and displacement during device storage were solved, achieving effective protection and enhanced safety of the devices, and improving experimental efficiency.
Patent Information
- Application Number
- CN202520070872.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-13
- Publication Date
- 2026-02-24
- Estimated Expiration
- 2035-01-13
AI Technical Summary
Existing semiconductor device experimental boxes lack reasonable functional zoning management, which makes the devices prone to collision, displacement, damage or contamination during storage, affecting experimental efficiency and safety.
Design a semiconductor device tape-out process experimental box, comprising an upper box, a lower box, baffles and connectors. Through reasonable partitioning and interference fit structure, it realizes the classified storage and protection of devices, including multiple partitions and fixing components to prevent device damage and contamination.
This enables the rational classification and storage of devices, improves experimental efficiency and safety, prevents devices from being damaged or contaminated during storage, and enhances the overall safety and ease of operation of the fabrication process.
Smart Images
Figure CN223935217U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present disclosure relates to the technical field of semiconductor device processing, in particular, to a semiconductor device flow process experiment box. BACKGROUND
[0002] In the process of semiconductor devices, the flow process is one of the key steps. The flow process often involves wafer cutting, photolithography, use of chemical reagents, and device storage and handling. In the related art, an experiment box is often provided to store the devices. Although some experiment boxes have the function of storing devices, they do not have partition management for different process steps, and do not take into account the collision and displacement problems that may occur during device storage. In addition, most experiment boxes are simple in design and lack effective device protection measures, which may cause device damage or contamination during the experiment. Therefore, there is an urgent need for an experiment box that can meet the storage needs of different links in the semiconductor flow process, has reasonable functional partitioning, effective device protection design, and is easy to operate, improving the efficiency and safety of the experiment.
[0003] It should be noted that the information disclosed in the above background section is only used to strengthen the understanding of the background of the present disclosure, and therefore can include information that does not constitute prior art known to those of ordinary skill in the art. CONTENT OF THE INVENTION
[0004] The purpose of the present disclosure is to overcome the shortcomings of the prior art and provide a semiconductor device flow process experiment box. So that it can meet the storage needs of different links in the semiconductor flow process; at the same time, the experiment box has reasonable functional partitioning, effective protection of devices, and easy-to-operate functions.
[0005] According to one aspect of the present disclosure, a semiconductor device flow process experiment box is provided, the experiment box comprising an upper box body, a lower box body, a baffle and a connecting piece;
[0006] The upper box body and the lower box body are rotatably connected by the connecting piece, and the upper box body and the lower box body are detachably connected; wherein the upper box body has a first area; the lower box body has a second area;
[0007] The baffle is arranged between the upper box body and the lower box body, and the baffle can be fixed with the upper box body, so that when the upper box body and the lower box body are buckled, the material in the first area is blocked.
[0008] According to one embodiment of the present disclosure, the upper box body has a first mounting groove;
[0009] The baffle has a first protrusion capable of extending into the first mounting slot and being in interference fit with the sidewall of the first mounting slot.
[0010] According to an embodiment of the present disclosure, the experimental box has a fastened state;
[0011] The upper box body has a second protrusion;
[0012] The lower box body has a second mounting slot corresponding to the second protrusion;
[0013] In the fastened state of the experimental box, the second protrusion extends into the second mounting slot, and the second protrusion is in interference fit with the sidewall of the second mounting slot.
[0014] According to an embodiment of the present disclosure, the lower box body has a first partition plate;
[0015] The first partition plate divides the second area into a first material storage area and a chemical reagent storage area;
[0016] The first material storage area has a partition assembly, which divides the first material storage area into a plurality of variable-size sub-areas.
[0017] According to an embodiment of the present disclosure, the partition assembly includes a plurality of horizontal plates and a plurality of vertical plates;
[0018] The plurality of horizontal plates are arranged in the first material storage area, and the length direction of the horizontal plates is the same as the length direction of the lower box body;
[0019] The vertical plate has a plurality of insertion slots arranged along the length direction of the vertical plate; when the horizontal plates are arranged in different insertion slots, the vertical plate and the horizontal plates form different-size sub-areas.
[0020] According to an embodiment of the present disclosure, the experimental box further includes a plurality of limiting blocks;
[0021] Part of the limiting blocks are arranged on the inner sidewall of the lower box body, and part of the limiting blocks are arranged on the first partition plate; adjacent limiting blocks form a clamping slot for the horizontal plates and the vertical plates.
[0022] According to an embodiment of the present disclosure, the experimental box further includes a second partition plate;
[0023] The second partition plate is arranged in the first area, and the second partition plate divides the first area into a tool storage area and a second material storage area.
[0024] According to an embodiment of the present disclosure, the experimental box further comprises a third partition plate;
[0025] The third partition plate is arranged in the second material storage area and is connected with the second partition plate. The third partition plate divides the second material storage area into an uncut wafer storage area and a cut wafer storage area.
[0026] According to an embodiment of the present disclosure, the experimental box further comprises a fourth partition plate;
[0027] The fourth partition plate is arranged in the tool storage area. The fourth partition plate divides the tool storage area into a first sub-storage area and a second sub-storage area.
[0028] According to an embodiment of the present disclosure, the experimental box further comprises a plurality of fixing members;
[0029] The fixing members are respectively arranged in the first material storage area, the cut wafer storage area and the first sub-storage area.
[0030] It should be understood that the foregoing general description and the following detailed description are only exemplary and explanatory, and are not intended to limit the present disclosure. BRIEF DESCRIPTION OF DRAWINGS
[0031] The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate embodiments consistent with the present disclosure and serve to explain the principles of the present disclosure. It is apparent that the accompanying drawings in the following description are only some embodiments of the present disclosure, and other drawings can be obtained by those skilled in the art without creative labor on the basis of these drawings.
[0032] Figure 1 For an embodiment of the present disclosure, a semiconductor device flow process experimental box is shown in the overall structure diagram.
[0033] Figure 2 For an embodiment of the present disclosure, an exploded view of a semiconductor device flow process experimental box is shown.
[0034] Figure 3 For an embodiment of the present disclosure, a structure diagram of the upper box body is shown.
[0035] Figure 4 For an embodiment of the present disclosure, a structure diagram of the lower box body rain pressure assembly is shown.
[0036] Figure 5 For Figure 4 An enlarged view of part A is shown.
[0037] Figure 6 For an embodiment of the present disclosure, a structure diagram of the partition assembly is shown.
[0038] BRIEF DESCRIPTION OF DRAWINGS
[0039] 1, upper box body; 11, first area; 111, tool storage area; 1111, first sub-storage area; 1112, second sub-storage area; 112, second material storage area; 1121, uncut wafer storage area; 1122, cut wafer storage area; 12, first mounting groove; 13, second protruding part; 14, second partition plate; 15, third partition plate; 16, fourth partition plate; 2, lower box body; 21, second area; 211, first material storage area; 2111, sub-area; 212, chemical reagent storage area; 22, second mounting groove; 23, first partition plate; 24, first side wall; 25, second side wall; 26, third side wall; 27, fourth side wall; 3, baffle; 31, first protruding part; 4, connecting piece; 5, partition assembly; 51, horizontal plate; 52, vertical plate; 521, plug-in groove; 6, limiting block; 61, clamping groove; 7, fixing piece. DETAILED DESCRIPTION
[0040] Example implementations will now be described more fully with reference to the accompanying drawings. Example implementations may, however, be implemented in many different forms and should not be construed as limited to the implementations set forth herein; rather, these implementations are provided so that this disclosure will be thorough and complete, and will fully convey the inventive concept of an example implementation to those skilled in the art. Like reference numerals refer to like elements throughout the figures, and thus a detailed description of them will not be repeated. In addition, the drawings are only schematic and are not necessarily to scale.
[0041] The flow process is one of the key steps of semiconductor device processing. The flow process often involves wafer cutting, photolithography, use of chemical reagents, and device storage and handling, etc. In the related art, an experimental box is generally provided to assist device storage. Although some experimental boxes have the function of storing devices, they lack partition management for different process steps, which affects the experimental efficiency of different processes. At the same time, there may be problems of device collision and displacement in the experimental box during device storage, which may cause damage and pollution of the device, affect the safety of the experiment, and even increase the cost of the experiment.
[0042] Based on this, referring to Figure 1 , Figure 2 , Figure 3 , Figure 4This application discloses a semiconductor device tape-out process experimental box, which includes an upper box 1, a lower box 2, a baffle 3, and a connector 4; the upper box 1 and the lower box 2 are rotatably connected by the connector 4, and the upper box 1 and the lower box 2 are detachably connected; wherein, the upper box 1 has a first region 11; the lower box 2 has a second region 21; the baffle 3 is disposed between the upper box 1 and the lower box 2, and the baffle 3 can be fixed to the upper box 1 so that when the upper box 1 and the lower box 2 are fastened together, the material in the first region 11 is blocked.
[0043] In this embodiment, during the wafer fabrication process, some materials are placed in the first region 11 and some materials are placed in the second region 21. The materials involved in the wafer fabrication process are rationally partitioned through the first region 11 and the second region 21. This facilitates the classification, storage, protection, and operation of devices during the wafer fabrication process and meets the needs of various stages of the semiconductor wafer fabrication process. Furthermore, a baffle 3 is provided between the upper housing 1 and the lower housing 2. When devices need to be stored, the baffle 3 is fixed to the upper housing 1, effectively protecting the materials in the first region 11 and facilitating the locking between the upper housing 1 and the lower housing 2. This prevents materials in the first region 11 from falling out during device storage, thereby improving the safety of the wafer fabrication process.
[0044] In some embodiments of this disclosure, see Figure 2 The connecting part 4 can be a pin. The upper box 1, the baffle 3 and the lower box 2 are all rotatably connected by the pin. In this way, on the one hand, it is easy to realize the fastening between the upper box 1 and the lower box 2; on the other hand, the upper box 1, the baffle 3 and the lower box 2 can be separated by pulling out the pin, which is convenient for cleaning the upper box 1, the baffle 3 and the lower box 2.
[0045] As an example, the material of the connecting pin 4 can be metal.
[0046] In some embodiments of this disclosure, a reinforcing member (not specifically marked in the accompanying drawings) may be provided on the side of the baffle 3 near the lower box 2. The reinforcing member can improve the stability of the baffle, thereby better blocking the material in the first area 11.
[0047] As an example, the reinforcing members can be configured as horizontal keels and vertical keels; the horizontal keels are installed on the baffle 3, and the length direction of the horizontal keels is the same as the length direction of the baffle 3; the vertical keels are connected to the horizontal keels, and the length direction of the vertical keels is perpendicular to the length direction of the horizontal keels.
[0048] In some embodiments of this disclosure, see Figure 1 , Figure 2The upper box body 1 has a first mounting slot 12; the baffle 3 has a first protruding part 31, which can extend into the first mounting slot 12 and is in interference fit with the side wall of the first mounting slot 12.
[0049] It can be understood that when the experimental box is needed to store devices, the baffle 3 is close to the upper box body 1, the first protruding part 31 on the baffle 3 extends into the first mounting slot 12, and the first protruding part 31 is in interference fit with the side wall of the first mounting slot 12. In this way, the first baffle 3 blocks the first area 11, so that when the upper box body 1 is close to the lower box body 2, the materials in the first area 11 will not fall off, and the safety of storing devices is improved.
[0050] Further, referring to Figure 1 , Figure 2 , Figure 3 , Figure 4 In the embodiments of the present disclosure, the experimental box has a buckling state; the upper box body 1 has a second protruding part 13; the lower box body 2 has a second mounting slot 22 corresponding to the second protruding part 13; and when the experimental box is in the buckling state, the second protruding part 13 extends into the second mounting slot 22 and is in interference fit with the side wall of the second mounting slot 22. In this way, when the experimental box needs to be moved, the upper box body 1 is close to the lower box body 2, the movement of the upper box body 1 drives the movement of the second protruding part 13, the second protruding part 13 extends into the second mounting slot 22, and the second protruding part 13 is in interference fit with the side wall of the second mounting slot 22. In this way, the experimental box is closed, avoiding the phenomenon that the upper box body 1 and the lower box body 2 are loose when the experimental box is moved, resulting in the phenomenon that the devices in the experimental box fall out of the experimental box.
[0051] In some embodiments of the present disclosure, the number of second protruding parts 13 can be two, and the two second protruding parts 13 are arranged along the thickness direction of the upper box body 1. In this way, the sealing and fixing effect between the upper box body 1 and the lower box body 2 can be improved, and the phenomenon that the devices fall out of the experimental box can be further prevented.
[0052] It should be noted that the number of second protruding parts 13 is not specifically limited in the embodiments of the present disclosure, as long as the upper box body 1 and the lower box body 2 can be fixed.
[0053] In some embodiments of the present disclosure, referring to Figure 4The first partition plate 23 divides the second area 21 into a first material storage area 211 and a chemical reagent storage area 212. The first material storage area 211 is provided with a partition assembly 5, which divides the first material storage area 211 into a plurality of sub-areas 2111 with variable sizes. In this embodiment, the partition assembly can divide the first material storage area 211 into a plurality of sub-areas 2111 with variable sizes, so as to meet the storage of materials with different specifications.
[0054] As an example, the first material storage area 211 can store raw materials for processing devices, and of course, in other examples, the first material storage area 211 can also store devices. The chemical reagent storage area 212 can store photoresists and chemical reagents for processing devices.
[0055] It should be understood that the present embodiment only exemplifies the materials that can be stored in the area, but does not mean that only this material can be stored in the area.
[0056] In this embodiment, referring to Figure 4 , Figure 5 , Figure 6 The partition assembly 5 includes a plurality of horizontal plates 51 and a plurality of vertical plates 52. The plurality of horizontal plates 51 are arranged in the first material storage area 211, and the length direction of the horizontal plate 51 is the same as the length direction of the lower box body 2. The vertical plate 52 is provided with a plurality of plug-in slots 521 arranged along the length direction of the vertical plate 52. When the horizontal plate 51 is arranged in different plug-in slots 521, the vertical plate 52 and the horizontal plate 51 form sub-areas 2111 with different sizes.
[0057] In some embodiments, the partition assembly 5 can be assembled according to the experimental needs of the outside world. Specifically, the horizontal plate 51 is placed on the splicing platform to the required space, and then the vertical plate 52 is arranged close to the horizontal plate 51. The horizontal plate 51 is inserted into the plug-in slot 521 arranged on the vertical plate 52 to complete the assembly of the partition assembly 5. Then, the assembled partition assembly 5 is installed in the first material storage area 211 to realize the storage of materials with different specifications. In this way, the size of the sub-area 2111 can be flexibly adjusted according to materials with different specifications, and the application range of the experimental box is improved.
[0058] In some other embodiments, the partition assembly 5 can be assembled in the first material storage area 211. Specifically, the horizontal plate 51 is placed in the first material storage area 211 according to the experiment requirements, and then the vertical plate 52 is placed close to the horizontal plate 51. When the horizontal plate 51 is inserted into the insertion slot 521, the installation of the partition assembly 5 is completed, so as to realize the storage of different specifications of materials. In this way, the size of the sub-area 2111 can be flexibly adjusted according to different specifications of materials, and the application range of the experiment box is improved.
[0059] In some embodiments of the present disclosure, referring to Figure 4 , Figure 5 The experiment box further comprises a plurality of limiting blocks 6. Some of the limiting blocks 6 are arranged on the inner side wall of the lower box body 2, and some of the limiting blocks 6 are arranged on the first partition plate 23. Adjacent limiting blocks 6 form a clamping groove 61 for the horizontal plate 51 and the vertical plate 52.
[0060] Specifically, referring to Figure 4 , Figure 5 The inner side wall of the lower box body 2 comprises a first side wall 24, a second side wall 25, a third side wall 26 and a fourth side wall 27. The first side wall 24 and the third side wall 26 are symmetrically arranged about the width direction of the lower box body 2, the second side wall 25 and the fourth side wall 27 are symmetrically arranged about the length direction of the lower box body 2, and some of the limiting blocks 6 are arranged on the second side wall 25 (the part of the second side wall 25 corresponding to the first material storage area 211), the third side wall 26 and the fourth side wall 27 (the part of the fourth side wall 27 corresponding to the first material storage area 211). Some of the limiting blocks 6 are arranged on the first partition plate 23. In this way, the limiting blocks 6 arranged on the first partition plate 23 and the limiting blocks 6 arranged on the third side wall 26 can limit and fix the two ends of the horizontal plate 51, and the limiting blocks 6 arranged on the second side wall 25 and the fourth side wall 27 can limit and fix the two ends of the vertical plate 52. In this way, the partition assembly 5 can be better fixed in the first material storage area 211, and the material in the first material storage area 211 can be better limited and fixed.
[0061] In some embodiments of the present disclosure, referring to Figure 1 , Figure 2 , Figure 3 The experiment box further comprises a second partition plate 14. The second partition plate 14 is installed in the first area 11, and the second partition plate 14 divides the first area 11 into a tool storage area 111 and a second material storage area 112. In this way, the first area 11 is divided into the tool storage area 111 and the second material storage area 112 by the second partition plate 14. The tool storage area 111 is used for storing tools for device experiments, and the second material storage area 112 is used for storing experimental devices. In this way, reasonable partitioning is achieved, the efficiency of device experiments is improved, and errors in device experiments are reduced.
[0062] In some embodiments of this disclosure, see Figure 1 , Figure 2 , Figure 3 The experimental kit also includes a third partition 15; the third partition 15 is located in the second material storage area 112 and connected to the second partition 14, dividing the second material storage area 112 into an uncut wafer storage area 1121 and a diced wafer storage area 1122. Thus, the second partition 14 can partition the uncut wafers and diced wafers, facilitating experimental operations.
[0063] In some embodiments of this disclosure, see Figure 1 , Figure 2 , Figure 3 The experimental kit also includes a fourth partition 16; the fourth partition 16 is located in the tool storage area 111, and the fourth partition 16 divides the tool storage area 111 into a first sub-storage area 1111 and a second sub-storage area 1112.
[0064] As an example, tweezers can be stored in the first sub-storage area 1111, and tools such as droppers can be stored in the second sub-storage area 1112.
[0065] As another example, a dropper tool can be stored in the first sub-storage area 1111, and tools such as tweezers can be stored in the second sub-storage area 1112.
[0066] It should be noted that, in this embodiment of the disclosure, the tools stored in the first sub-storage area 1111 and the tools stored in the second sub-storage area 1112 are not limited.
[0067] In some embodiments of this disclosure, the experimental box further includes a plurality of fixing members 7; the fixing members 7 are respectively disposed in the first material storage area 211, the diced wafer storage area 1122 and the first sub-storage area 1111.
[0068] As an example, the fastener 7 can be self-adhesive silicone. The self-adhesive silicone is applied to the first material storage area 211, thus securing the components in the first material storage area 211 and preventing damage caused by material movement during experimental box movement. The self-adhesive silicone is also applied to the diced wafer storage area 1122, securing the diced wafer and preventing damage caused by material movement during experimental box movement. Finally, the self-adhesive silicone is applied to the first sub-storage area 1111, securing the material within the first sub-storage area 1111 and preventing damage caused by material movement during experimental box movement.
[0069] It should be noted that in other embodiments, the fixing member 7 is not limited to self-adhesive silicone, and the fixing member 7 is not only disposed in the first material storage area 211, the diced wafer storage area 1122 and the first sub-storage area 1111. This application will not elaborate further on these points.
[0070] Other embodiments of this disclosure will readily occur to those skilled in the art upon consideration of the specification and practice of the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of this disclosure that follow the general principles of this disclosure and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of this disclosure are indicated by the appended claims.
Claims
1. A semiconductor device fabrication process experimental kit, characterized in that, The experimental box includes an upper box body, a lower box body, a baffle, and connecting parts; The upper box and the lower box are rotatably connected by the connector, and the upper box and the lower box are detachably connected; wherein, the upper box has a first region; and the lower box has a second region; The baffle is disposed between the upper box and the lower box, and the baffle can be fixed to the upper box so that when the upper box and the lower box are fastened together, the material in the first area is blocked.
2. The semiconductor device tape-out process experimental kit according to claim 1, characterized in that, The upper housing has a first mounting groove; The baffle has a first protrusion that can extend into the first mounting groove and is interference-fitted with the side wall of the first mounting groove.
3. The semiconductor device tape-out process experimental kit according to claim 1, characterized in that, The experimental box is in a locked state; The upper box body has a second protrusion; The lower housing has a second mounting groove corresponding to the second protrusion; When the experimental box is in the locked state, the second protrusion extends into the second mounting groove, and the second protrusion is in interference fit with the side wall of the second mounting groove.
4. The semiconductor device fabrication process experimental kit according to claim 1, characterized in that, The lower box body has a first partition plate; The first partition divides the second area into a first material storage area and a chemical reagent storage area; The first material storage area has a partitioning component that divides the first material storage area into multiple sub-areas of variable size.
5. The semiconductor device tape-out process experimental kit according to claim 4, characterized in that, The partitioning component includes multiple horizontal panels and multiple vertical panels; Multiple horizontal plates are disposed in the first material storage area, and the length direction of the horizontal plates is the same as the length direction of the lower box body; The vertical plate has multiple insertion slots, which are arranged along the length of the vertical plate; wherein, when the horizontal plate is placed in different insertion slots, the vertical plate and the horizontal plate form sub-regions of different sizes.
6. The semiconductor device tape-out process experimental kit according to claim 5, characterized in that, The experimental box also includes multiple limiting blocks; Some of the limiting blocks are located on the inner side wall of the lower box body, and some of the limiting blocks are located on the first partition plate. Adjacent limiting blocks form a locking groove for the horizontal plate and the vertical plate.
7. The semiconductor device tape-out process experimental kit according to claim 5, characterized in that, The experimental kit also includes a second partition; The second partition is disposed in the first area, and the second partition divides the first area into a tool storage area and a second material storage area.
8. The semiconductor device tape-out process experimental kit according to claim 7, characterized in that, The experimental kit also includes a third partition; The third partition plate is disposed in the second material storage area and connected to the second partition plate. The third partition plate divides the second material storage area into an uncut wafer storage area and a diced wafer storage area.
9. The semiconductor device tape-out process experimental kit according to claim 8, characterized in that, The experimental kit also includes a fourth partition; The fourth partition is located within the tool storage area, and the fourth partition divides the tool storage area into a first sub-storage area and a second sub-storage area.
10. The semiconductor device tape-out process experimental kit according to claim 9, characterized in that, The experimental box also includes multiple fasteners; The fixing components are respectively located in the first material storage area, the diced wafer storage area, and the first sub-storage area.