Grinding wheel for grinding-down machine

Abstract

The utility model provides a grinding wheel for a grinding-down machine, and relates to the technical field of grinding-down machines. The grinding wheel for the grinding-down machine comprises a base body at least provided with a flange plate, and the flange plate is used for being connected with the grinding-down machine so as to drive the base body to rotate; the working layer is arranged in the circumferential direction of the base body and used for making contact with a to-be-machined workpiece to be ground. A plurality of chip grooves are formed in the face, back on to the base body, of the working layer. The chip grooves extend from the inner side face of the working layer to the outer side face of the working layer. The chip groove penetrates through the inner side face and the outer side face to form a first penetrating-out opening and a second penetrating-out opening correspondingly. The extending direction of the chip groove is inclined relative to the radial direction, passing through the first penetrating opening, of the rotating shaft of the base body. The second penetrating-out opening is close to the rotating front end of the base body relative to the first penetrating-out opening; the chip removal and chip containing volume of the grinding wheel can be optimized and enhanced, and the cooling effect of the grinding wheel can be improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of grinding and beveling machine, specifically to a grinding and beveling machine grinding wheel. BACKGROUND

[0002] Grinding and chamfering are indispensable steps in single crystal silicon rod processing, which not only improves the mechanical strength and surface quality of the silicon rod, but also provides convenience for subsequent processing and reduces material waste and processing cost. Grinding and chamfering process usually uses grinding and beveling machine, which uses high-speed rotating grinding wheel to remove excess amount and obtain single crystal silicon products with size and surface quality meeting customer standards.

[0003] In the prior art, since the vertical grinding and beveling machine grinding wheel has a downward inclination angle, the silicon powder generated during grinding cannot be completely discharged, and part of the residual silicon powder will adhere to the surface of the working layer of the grinding wheel. When the adhered silicon powder hinders the contact between the surface of the working layer and the surface of the single crystal silicon, the cutting ability of the grinding wheel will decrease, thereby forming a fish scale-like pattern (which is actually a point-shaped pit produced after the silicon material is forced to peel off) on the surface of the silicon rod. In the case of using the slicing end of the silicon wafer as an adhesive surface, the appearance of the stacked silicon wafers will show dense point-shaped silicon drops. Usually, when the finished product square rod has a fish scale pattern, the fine grinding wheel must be trimmed. If it is not found in time, it may even cause the tool to be soaked, resulting in edge collapse loss. INVENTION CONTENTS

[0004] The utility model discloses a grinding and beveling machine grinding wheel that can form a three-dimensional cooling of the grinding wheel from the working layer to the base body, realize the maximum discharge of silicon powder and sufficient cooling of the grinding wheel, to solve the problem that in the prior art, silicon powder is easily adhered to the surface of the working layer of the grinding wheel during grinding and beveling, causing the working layer of the grinding wheel to be blocked, the chip capacity and heat dissipation ability to be greatly reduced, and the cutting ability of the grinding wheel to be decreased.

[0005] The utility model discloses the technical scheme is:

[0006] A grinding and beveling machine grinding wheel comprises:

[0007] A base body having at least a flange plate for connecting the grinding and beveling machine to drive the base body to rotate; and

[0008] A working layer arranged along the circumference of the base body for contacting the workpiece to be processed for grinding; and a plurality of chip removal grooves arranged on the side of the working layer opposite to the base body.

[0009] The chip removal groove extends from the inner side of the working layer to the outer side of the working layer; the chip removal groove passes through the inner side and the outer side to form a first through hole and a second through hole respectively; and the extension direction of the chip removal groove is inclined relative to the radial direction of the rotation axis of the base body through the first through hole; and the second through hole is close to the rotation front end of the base body relative to the first through hole.

[0010] Further, it also comprises:

[0011] The transition layer is arranged between the base body and the working layer.

[0012] Further, the transition layer is a non-diamond layer; the transition layer comprises a bonding agent, metal powder and filler.

[0013] Further, the working layer is a diamond layer; the working layer comprises abrasive, bonding agent and filler.

[0014] Further, the flange plate is provided with at least a plurality of mounting holes, the plurality of mounting holes are uniformly distributed along the circumference of the flange plate; and a first drainage hole is arranged between the circumference where the plurality of mounting holes are located and the central hole of the flange plate.

[0015] Further, a plurality of second drainage holes are arranged on the flange plate outside the circumference where the plurality of mounting holes are located, and the plurality of second drainage holes are uniformly distributed along the circumference of the flange plate.

[0016] Further, the first drainage hole is arranged in parallel to the axial direction of the rotation axis of the base body; the second drainage hole is arranged in an inclined manner relative to the axial direction of the rotation axis of the base body; a first face is arranged on the base body close to the working layer, and a first communication port is arranged at the intersection of the second drainage hole and the first face; a second face is arranged on the base body away from the working layer, and a second communication port is arranged at the intersection of the second drainage hole and the second face; and the distance between the second communication port and the rotation axis of the base body is greater than the distance between the first communication port and the rotation axis of the base body.

[0017] Further, the included angle between the extension direction of the second drainage hole and the axial direction of the rotation axis of the base body is 10°-80°.

[0018] Further, a plurality of weight-reducing holes are arranged on the flange plate, and the plurality of weight-reducing holes are uniformly distributed along the circumference of the flange plate.

[0019] Further, the included angle between the extension direction of the chip removal groove and the radial direction of the rotation axis of the base body through the first through hole is 10°-80°.

[0020] The beneficial effects of the utility model are:

[0021] 1.The utility model discloses a flange disc on the base body is provided to connect the grinding wheel and the grinding machine, the grinding wheel can rotate with the main shaft of the grinding machine, and the silicon powder adhered to the surface of the grinding wheel is discharged through the chip removal groove on the working layer during rotation, and the chip removal groove is radially inclined relative to the rotating shaft, so that the chip removal and chip capacity of the working layer surface of the grinding wheel are enhanced, thereby solving the problem that the silicon powder is easily adhered to the working layer surface of the grinding wheel during the cutting of the grinding wheel of the grinding machine in the prior art, the working layer of the grinding wheel is blocked, the chip removal and heat dissipation capacity are greatly reduced, and the cutting capacity of the grinding wheel is reduced. BRIEF DESCRIPTION OF DRAWINGS

[0022] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the drawings needed to be used in the embodiments or prior art description will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.

[0023] Figure 1 It is a three-dimensional schematic view of the grinding wheel of the embodiment of the utility model;

[0024] Figure 2 It is another angle three-dimensional schematic view of the grinding wheel of the embodiment of the utility model;

[0025] Figure 3 It is a front view of the grinding wheel of the embodiment of the utility model;

[0026] Figure 4 It is the A-A side sectional view of the utility model; Figure 3

[0027] Figure 5 It is the front view of the grinding wheel of the preferred mode of the embodiment of the utility model.

[0028] Signs: 100-base body, 101-first surface, 102-second surface, 110-flange disc, 111-mounting hole, 112-center hole, 113-first drain hole, 114-second drain hole, 115-first communication port, 116-second communication port, 117-weight reduction hole, 120-connection layer;

[0029] 200-working layer, 210-chip removal groove, 220-inside surface, 221-first through hole, 230-outside surface, 231-second through hole;

[0030] 300-transition layer. DETAILED DESCRIPTION

[0031] ​In the description of the utility model, it is understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate the orientation or positional relationship shown in the drawings, which is only for the convenience of describing the utility model and simplifying the description, and does not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the utility model.

[0032] The following disclosure provides many different embodiments or examples for implementing different structures of the utility model. In order to simplify the disclosure of the utility model, the components and settings of specific examples are described below. Of course, they are only examples, and the purpose is not to limit the utility model.

[0033] The embodiments of the utility model will be described in detail below with reference to the drawings.

[0034] Embodiment 1

[0035] In the prior art, the vertical grinder is difficult to completely discharge the silicon powder generated during cutting because the fine grinding wheel inclination angle is downward, the silicon powder adheres to the surface of the working layer of the grinding wheel to participate in grinding, which causes the working layer of the grinding wheel to be blocked, the chip capacity and heat dissipation capacity are greatly reduced, and the cutting capacity of the grinding wheel is reduced, causing the formation of fish scale on the surface of the silicon rod, and even causing the knife to be stewed to cause edge collapse loss in severe cases.

[0036] In order to solve the above problems in the prior art, the embodiment provides a grinding wheel for a grinder, which is used for installing on a grinder to perform a fine grinding process of a single crystal silicon rod. The grinding wheel for the grinder can form a three-dimensional cooling of the grinding wheel from the working layer to the base body, realizing the maximum discharge of silicon powder and sufficient cooling of the grinding wheel. Please refer to Figures 1-4 The grinding wheel for the grinder mainly includes a base body 100, a transition layer 300 and a working layer 200.

[0037] The base body 100 is used to support the abrasive of the working layer 200, and is firmly fixed on the main shaft of the grinder during use, and plays a role of supporting the working layer 200 and clamping the grinding tool. As Figure 1 , Figure 2As shown in the drawings, the surface of the base 100 close to the working layer 200 is the first surface 101; the surface of the base 100 away from the working layer 200 is the second surface 102; the base 100 mainly comprises a flange plate 110 in the middle, the flange plate 110 is roughly in the shape of a ring, the flange plate 110 is provided with a central hole 112 in the middle; and the flange plate 110 is provided with six mounting holes 111 around the central hole 112, the mounting holes 111 are uniformly distributed along the circumference of the flange plate 110; and the inner diameter of one end of the mounting hole 111 is smaller, and the inner diameter of the other end is larger, which is used for setting bolts to fix the base 100 on the main shaft of the grinding machine. At the same time, the flange plate 110 is externally sleeved with a connecting layer 120, the connecting layer 120 is also roughly in the shape of a ring, and the connecting layer 120 is used for abutting the working layer 200. In addition, in the embodiment, the base 100 is made of aluminum alloy material, which can reduce the weight of the grinding wheel piece while ensuring the strength.

[0038] Moreover, a transition layer 300 is also arranged between the connecting layer 120 of the base 100 and the working layer 200, which is used to firmly adhere the working layer 200 to the base 100, and ensure the stability of the overall structure. The transition layer 300 is mainly arranged on the surface of the connecting layer 120 away from the flange plate 110.

[0039] The working layer 200 is the core part of the grinding wheel, which is responsible for contacting the single crystal silicon rod and performing the actual grinding work. In the embodiment, the working layer 200 is connected to the connecting layer 120 of the base 100 through the transition layer 300, and in one or more other embodiments, the working layer 200 can also be arranged on the base 100 through other connection structures. The working layer 200 is roughly in the shape of a ring and is arranged at the position close to the outer edge of the connecting layer 120 along the circumference of the base 100, and the working layer 200 has an inner side surface 220 and an outer side surface 230, wherein the outer side surface 230 directly contacts the single crystal silicon rod. At the same time, a plurality of chip removal grooves 210 are arranged on the surface of the working layer 200 away from the base 100. The chip removal groove 210 extends from the inner side surface 220 of the working layer 200 to the outer side surface 230 of the working layer 200 and is arranged through the inner side surface 220, and the junction of the chip removal groove 210 and the inner side surface 220 forms a first through hole 221; and the chip removal groove 210 is arranged through the outer side surface 230, and the junction of the chip removal groove 210 and the outer side surface 230 forms a second through hole 231; so that the chip removal groove 210 connects the inner side surface 220 and the outer side surface 230 of the working layer 200, so that the silicon powder attached to the outer side surface 230 can be discharged inward, avoiding the influence of the silicon powder attached to the outer side surface 230 directly contacting the single crystal silicon rod on the grinding performance of the grinding wheel. Moreover, the extension direction of the chip removal groove 210 is arranged obliquely relative to the radial direction of the rotation axis of the base 100; the second through hole 231 is closer to the front end of the rotation axis of the base 100 than the first through hole 221, as shown in the drawings. Figure 3As shown in the top view angle, when the grinding wheel rotates clockwise, the silicon powder can more easily enter and be removed due to the inclination of the chip removal groove 210, and the volume of the chip removal groove 210 is larger than that of the chip removal groove 210 arranged along the radial direction of the rotating shaft of the base body 100, thereby enhancing the chip removal and chip holding capacity of the working layer 200 of the grinding wheel, and reducing the probability of clogging of the chip removal groove 210.

[0040] A specific working mode of the embodiment is as follows:

[0041] Before use, the grinding wheel is fixed on the spindle of the grinding machine through the flange 110; then the grinding machine is started, and the single crystal silicon rod is finely ground through the working layer 200 on the grinding wheel; during the fine grinding process, the silicon powder on the surface of the grinding wheel is removed through the chip removal groove 210 on the working layer 200 and the continuous cooling liquid flushing, which reduces the temperature of the grinding wheel and removes the silicon powder on the surface of the grinding wheel.

[0042] In the embodiment, the grinding wheel of the grinding machine is connected to the grinding machine through the flange 110 on the base body 100, so that the grinding wheel can rotate with the spindle of the grinding machine. During rotation, the silicon powder adhered to the surface of the grinding wheel is removed through the chip removal groove 210 on the working layer 200, and the chip removal and chip holding capacity of the surface of the working layer 200 of the grinding wheel is enhanced through the design of the radially inclined chip removal groove 210 relative to the rotating shaft, thereby solving the problem that the silicon powder is easily adhered to the surface of the working layer 200 of the grinding wheel during cutting of the grinding wheel of the grinding machine in the prior art, which causes the working layer 200 of the grinding wheel to be clogged, the chip removal and heat dissipation capacity is greatly reduced, and the cutting capacity of the grinding wheel is reduced.

[0043] Specifically, in the embodiment, the transition layer 300 is a non-diamond layer mainly composed of a binder, metal powder and filler; and the working layer 200 is a diamond layer mainly composed of abrasive, binder and filler, so as to keep the structure of the transition layer 300 and the working layer 200 firm and stable.

[0044] Specifically, in this embodiment, the flange 110 is further provided with a plurality of first drain holes 113. The first drain holes 113 are located between the circumferential area of ​​the six mounting holes 111 and the central hole 112. The first drain holes 113 of the flange 110 are used to drain coolant, allowing the coolant to carry away silicon powder and preventing silicon powder from clogging the surface of the grinding wheel. The first drain holes 113 are arranged parallel to the axial direction of the rotation axis of the base 100. At the same time, a plurality of second drain holes 114 are provided on the flange 110 outside the circumferential area of ​​the six mounting holes 111. The second drain holes 114 are closer to the working layer 200 than the first drain holes 113. When the grinding wheel is working, the second drain holes 114 can drain coolant more quickly and carry away silicon powder. Furthermore, the second drain holes 114 are inclined relative to the axial direction of the rotation axis of the base 100. In this embodiment, the intersection of the second drainage hole 114 and the first surface 101 of the substrate 100 forms the first connecting port 115; the intersection of the second drainage hole 114 and the second surface 102 of the substrate 100 forms the second connecting port 116. The distance between the second connecting port 116 and the rotation axis of the substrate 100 is greater than the distance between the first connecting port 115 and the rotation axis of the substrate 100. Therefore, during the rotation of the grinding wheel, the coolant near the edge of the substrate 100 has a tangential velocity, allowing it to be discharged more quickly and efficiently through the inclined second drainage hole 114, carrying away silicon powder. Simultaneously, the accelerated circulation of the coolant enhances the cooling effect on the grinding wheel. In this embodiment, the inclined chip removal groove 210 accelerates the entry of silicon powder, while the inclined second drainage hole 114 accelerates the discharge of coolant and silicon powder. The two work together to significantly reduce silicon powder adhesion on the surface of the grinding wheel during the use of the grinding machine, improving the grinding performance stability of the grinding wheel under long-term working conditions.

[0045] Specifically, in this embodiment, the angle between the extending direction of the second drainage hole 114 and the axial direction of the rotating shaft of the base 100 is 30°, and the angle between the extending direction of the chip removal groove 210 and the radial direction of the rotating shaft of the base 100 passing through the first outlet 221 is 30°; under this parameter design, experimental observation results show that:

[0046] 1. The chip removal and cooling capacity of the grinding wheel in this embodiment is improved by more than 100%, forming a three-dimensional all-round cooling system, reducing the number of dressing operations by more than 50%, extending the service life by more than 20%, and improving the durability of the grinding wheel.

[0047] 2. The grinding wheel of the grinding machine in this embodiment improves the grinding wheel dressing length record of the grinding machine by more than 60%, and there is room for further improvement.

[0048] 3. The grinding wheel of this embodiment solves the problem of fish scale pattern that cannot be eliminated by traditional grinding wheels.

[0049] 4. The surface roughness Ra of the silicon rod processed by the grinding wheel of the grinding machine of the embodiment is stable and less than or equal to 0.1 microns, and the defect that the surface roughness Ra increases with the increase of the grinding length in the traditional structure is eliminated.

[0050] In one or more other embodiments, the angle between the extension direction of the second drainage hole 114 and the axial direction of the rotation axis of the base body 100 is 10°-80°, preferably 20°-40°; the angle between the extension direction of the chip removal groove 210 and the radial direction of the rotation axis of the base body 100 passing through the first through hole 221 is 10°-80°, preferably 20°-60°.

[0051] Preferably, as shown in Figure 5 In one or more other embodiments, as shown in

[0052] The basic principle, main features and advantages of the present application are shown and described above. It should be understood by those skilled in the art that the present application is not limited by the above embodiments, and the above embodiments and descriptions in the specification are only preferred examples of the present application and do not limit the present application. Without departing from the spirit and scope of the present application, various changes and improvements can be made to the present application, and these changes and improvements all fall within the scope of the present application. The scope of protection of the present application is defined by the appended claims and their equivalents.

Claims

1. A grinding wheel for a chamfering machine, characterized by, The utility model relates to a flange plate (110) for connecting a grinding machine to drive the rotation of the base (100), and a working layer (200) arranged along the circumference of the base (100) for contacting the workpiece to be processed for grinding; the working layer (200) is provided with a plurality of chip removal grooves (210) on the side away from the base (100); the chip removal grooves (210) extend from the inner side (220) of the working layer (200) to the outer side (230) of the working layer (200); the chip removal grooves (210) pass through the inner side (220) and the outer side (230) to form first and second through openings (221) and (231) respectively; the extension direction of the chip removal grooves (210) is inclined relative to the radial direction of the rotation axis of the base (100) through the first through opening (221); the second through opening (231) is closer to the front end of the rotation of the base (100) relative to the first through opening (221). Further comprising: a transition layer (300) arranged between the base (100) and the working layer (200). The transition layer (300) is a non-diamond layer; the transition layer (300) comprises a binder, metal powder and filler. The working layer (200) is a diamond layer; the working layer (200) comprises abrasive, binder and filler.

2. The grinding wheel for a chamfering machine according to claim 1, wherein The flange plate (110) is provided with at least a plurality of mounting holes (111) uniformly distributed along the circumference of the flange plate (110); a first drainage hole (113) is arranged between the circumference where the mounting holes (111) are located and the central hole (112) of the flange plate (110). A plurality of second drainage holes (114) are arranged on the flange plate (110) outside the circumference where the mounting holes (111) are located; the second drainage holes (114) are uniformly distributed along the circumference of the flange plate (110).

3. The grinding wheel for a chamfering machine according to claim 2, wherein The first drainage hole (113) is arranged parallel to the axial direction of the rotation axis of the base (100); the second drainage hole (114) is arranged inclined relative to the axial direction of the rotation axis of the base (100); the side of the base (100) close to the working layer (200) is the first side (101), and the intersection of the second drainage hole (114) and the first side (101) is the first communication port (115); the side of the base (100) away from the working layer (200) is the second side (102), and the intersection of the second drainage hole (114) and the second side (102) is the second communication port (116); the distance between the second communication port (116) and the rotation axis of the base (100) is greater than the distance between the first communication port (115) and the rotation axis of the base (100).

4. The grinding wheel for a chamfering machine according to claim 1, wherein The included angle between the extension direction of the second drainage hole (114) and the axial direction of the rotation axis of the base (100) is 10°-80°.

5. The grinding wheel for a chamfering machine according to claim 1, wherein ​ 6. The grinding wheel for a chamfering machine according to claim 5, wherein ​ 7. The grinding wheel for a chamfering machine according to claim 6, wherein ​ 8. The grinding wheel for a chamfering machine according to claim 7, wherein ​ 9. The grinding wheel for a chamfering machine according to claim 7, wherein The flange plate (110) is provided with a plurality of lightening holes (117) which are uniformly distributed along the circumference of the flange plate (110).

10. The grinding wheel for a chamfering machine according to any one of claims 1 to 9, wherein The extension direction of the chip removal groove (210) forms an angle of 10°-80° with the radial direction of the rotation axis of the base body (100) through the first through hole (221).

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