Device for attaching electrostatic chuck base to ceramic electrode

Abstract

The utility model relates to the technical field of semiconductor preparation, and discloses a device for laminating an electrostatic chuck base and a ceramic electrode, which comprises a first laminating device and a second laminating device, and is characterized in that the first laminating device comprises a first bottom plate, and the first bottom plate is provided with a first positioning device and a second positioning device; the first positioning device and the second positioning device are arranged on the same surface of the first bottom plate; the second laminating device comprises a second bottom plate, the second bottom plate is provided with a third positioning device and a fourth positioning device, and the third positioning device and the fourth positioning device are arranged on the same surface of the second bottom plate. According to the device for attaching the electrostatic chuck base to the ceramic electrode, in the using process, the adhesive is transferred to the surface of the electrostatic chuck base, and the electrostatic chuck base can be effectively prevented from being scratched; meanwhile, the ceramic electrode is placed on the adhesive glue through the fourth positioning device, so that the electrostatic chuck base is attached to the ceramic electrode, and alignment of the electrostatic chuck base and the ceramic electrode is very accurate.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor preparation, especially relate to a device for electrostatic chuck base and ceramic electrode lamination. BACKGROUND

[0002] The semiconductor electrostatic chuck is an adsorption device based on electrostatic principle, is widely used in semiconductor production line and precision machining equipment, and utilizes electrostatic adsorption principle to carry out the flat and uniform clamping of ultrathin wafer or other micro objects. Its principle is that when the object with static electricity approaches another object without static electricity, due to electrostatic induction, the object without static electricity will generate the electric charge of the opposite polarity to the charged object, so as to attract each other, and show the "electrostatic adsorption" phenomenon. The electrostatic chuck is mainly composed of an electrostatic chuck base and a ceramic electrode. In the production process of the electrostatic chuck, the ceramic electrode needs to be laminated on the electrostatic chuck base. Since there is no suitable auxiliary tool, the electrostatic chuck base and the ceramic electrode are often not accurately aligned when laminated, and the electrostatic chuck base is scratched, thereby affecting the lamination efficiency and the quality of the electrostatic chuck.

[0003] Therefore, there is an urgent need for a device for electrostatic chuck base and ceramic electrode lamination to solve the above technical problems. UTILITY MODEL CONTENT

[0004] The utility model discloses a device for electrostatic chuck base and ceramic electrode lamination, which can solve the problem that the ceramic electrode needs to be laminated on the electrostatic chuck base in the production process of the electrostatic chuck, and there is no suitable auxiliary tool, the electrostatic chuck base and the ceramic electrode are often not accurately aligned when laminated, and the electrostatic chuck base is scratched, thereby affecting the lamination efficiency and the quality of the electrostatic chuck.

[0005] To achieve this purpose, the utility model adopts the following technical scheme:

[0006] A device for electrostatic chuck base and ceramic electrode lamination, comprising

[0007] The first lamination device is used for the lamination between the release film and the adhesive, comprising a first bottom plate, the first bottom plate is provided with a first positioning device and a second positioning device, and the first positioning device and the second positioning device are arranged on the same face of the first bottom plate, the first positioning device is used for positioning the release film, and the second positioning device is used for positioning the adhesive.

[0008] The second lamination device is used for lamination between the electrostatic chuck base and the ceramic electrode, and comprises a second bottom plate, wherein the second bottom plate is provided with a third positioning device and a fourth positioning device, and the third positioning device and the fourth positioning device are arranged on the same surface of the second bottom plate, the third positioning device is used for positioning a release film, and the fourth positioning device is used for positioning a ceramic electrode.

[0009] The first positioning device and the third positioning device are located in a corresponding position.

[0010] As an optional solution, the first positioning device is provided with at least three first pins arranged on the same surface of the first bottom plate, the at least three first pins are not arranged on the same straight line, and the release film is provided with first through holes corresponding to the first pins.

[0011] As an optional solution, the second positioning device is provided with at least three second pins arranged on the same surface of the first bottom plate, the at least three second pins are not arranged on the same straight line, and the adhesive is provided with second through holes corresponding to the second pins.

[0012] As an optional solution, the third positioning device is provided with at least three third pins arranged on the same surface of the second bottom plate, and the at least three third pins are not arranged on the same straight line.

[0013] As an optional solution, the fourth positioning device is provided with at least three fourth pins arranged on the same surface of the second bottom plate, and the at least three fourth pins are not arranged on the same straight line, the electrostatic chuck base is provided with third through holes, the ceramic electrode is provided with fourth through holes, and the second through holes and the third through holes correspond to the fourth pins.

[0014] The device for lamination between the electrostatic chuck base and the ceramic electrode has at least the following beneficial effects:

[0015] The device for lamination between the electrostatic chuck base and the ceramic electrode can effectively prevent the electrostatic chuck base from being scratched by transferring the adhesive to the surface of the electrostatic chuck base during use, and the ceramic electrode is placed on the adhesive through the fourth positioning device, so that the electrostatic chuck base and the ceramic electrode are laminated, and the alignment of the two is very accurate. BRIEF DESCRIPTION OF DRAWINGS

[0016] In order to more clearly illustrate the technical scheme in the embodiments of the utility model, the drawings needed to be used in the description of the embodiments of the utility model will be briefly introduced.

[0017] Fig. 1 The first lamination device structure schematic view provided by the embodiments of the utility model;

[0018] Fig. 2This is a schematic diagram of the structure of the second bonding device provided in an embodiment of the present utility model.

[0019] Figure label:

[0020] 1. First bonding device; 11. First base plate; 111. First pin; 112. Second pin; 2. Release film; 3. Adhesive; 4. Second bonding device; 41. Second base plate; 411. Third pin; 412. Fourth pin; 5. Electrostatic chuck base; 6. Ceramic electrode. Detailed Implementation

[0021] In order to better understand the technical means of this utility model and to implement it in accordance with the contents of the specification, the specific embodiments of this utility model will be further described in detail below with reference to the accompanying drawings and examples. The following examples are used to illustrate this utility model, but are not intended to limit the scope of this utility model.

[0022] In the existing technology, electrostatic chucks are mainly composed of an electrostatic chuck base and a ceramic electrode. During the production process of electrostatic chucks, the ceramic electrode needs to be attached to the electrostatic chuck base. Due to the lack of suitable auxiliary tools, the alignment between the electrostatic chuck base and the ceramic electrode is often inaccurate, and the electrostatic chuck base may be scratched, thus affecting the bonding efficiency and the quality of the electrostatic chuck.

[0023] Therefore, such as Figs. 1-2 As shown, an embodiment of this utility model provides a device for bonding an electrostatic chuck base to a ceramic electrode, in order to solve the above-mentioned technical problems.

[0024] Specifically, such as Figs. 1-2 As shown, an apparatus for bonding an electrostatic chuck base to a ceramic electrode includes a first bonding device 1 and a second bonding device 4. The first bonding device 1 is used for bonding a release film 2 to an adhesive 3. The first bonding device 1 includes a first base plate 11, which is provided with a first positioning device and a second positioning device, and the first positioning device and the second positioning device are disposed on the same surface of the first base plate 11. The first positioning device is used to position the release film 2, and the second positioning device is used to position the adhesive 3. The second bonding device 4 is used for bonding an electrostatic chuck base 5 to a ceramic electrode 6. The second bonding device 4 includes a second base plate 41, which is provided with a third positioning device and a fourth positioning device, and the third positioning device and the fourth positioning device are disposed on the same surface of the second base plate 41. The positions of the first positioning device and the third positioning device correspond to each other. The third positioning device is used to position the release film 2, and the fourth positioning device is used to position the electrostatic chuck base 5 and the ceramic electrode 6.

[0025] In the process of adhering the electrostatic chuck base 5 and the ceramic electrode 6, first, the release film 2 is fixed on the first bottom plate 11 through the first positioning device; then, the adhesive 3 is pasted on the release film 2 under the guidance of the second positioning device, and the electrostatic chuck base 5 is fixed on the second bottom plate 41 by using the fourth positioning device; secondly, the release film 2 and the adhesive 3 are taken out from the first bottom plate 11, and the release film 2 and the adhesive 3 are placed on the second adhering device 4 through the third positioning device, and the adhesive 3 is made to face the electrostatic chuck base 5, so that the adhesive 3 is bonded to the electrostatic chuck base 5, so that the adhesive 3 is transferred to the surface of the electrostatic chuck base 5, which can effectively prevent the surface of the electrostatic chuck base 5 from being scratched, and finally, the release film 2 on the adhesive 3 is taken out, and the ceramic electrode 6 is placed on the adhesive 3 through the fourth positioning device, so that the electrostatic chuck base 5 and the ceramic electrode 6 are adhered, and the alignment of the two is very accurate.

[0026] In some embodiments, as shown in Fig. 1 In order to place the release film 2 on the first bottom plate 11 without wrinkles and reduce the manufacturing cost of the first adhering device 1, the first positioning device is provided with at least three first pins 111 on the same surface of the first bottom plate 11, the at least three first pins 111 are not on the same straight line, and the release film 2 is provided with first through holes corresponding to the first pins 111, and when the release film 2 is placed on the first bottom plate 11, the first through holes can be arranged on the first pins 111.

[0027] In some embodiments, as shown in Fig. 1 In order to accurately position the adhesive 3, the second positioning device is provided with at least three second pins 112 on the same surface of the first bottom plate 11, the at least three second pins 112 are not on the same straight line, and the adhesive 3 is provided with second through holes corresponding to the second pins 112, and when the adhesive 3 is adhered to the release film 2, the second through holes can be arranged on the second pins 112.

[0028] In some embodiments, as shown in Fig. 2 The third positioning device is provided with at least three third pins 411 on the same surface of the second bottom plate 41, the at least three third pins 411 are not on the same straight line, and each third pin 411 corresponds to the first pin 111, so that the release film 2 can be conveniently placed on the second adhering device 4.

[0029] In some embodiments, as shown in Fig. 2As shown, the fourth positioning device is provided with at least three fourth pins 412 on the same surface of the second bottom plate 41, the at least three fourth pins 412 are not on the same straight line, the electrostatic chuck base 5 is provided with third through holes, the ceramic electrode 6 is provided with fourth through holes, the third through holes and the fourth through holes correspond to the fourth pins, when the electrostatic chuck base 5 and the ceramic electrode 6 are respectively placed on the second bonding device 4, the third through holes and the fourth through holes can be arranged on the fourth pins 412, so that the electrostatic chuck base 5 and the ceramic electrode 6 are accurately positioned.

[0030] The preferred embodiments of the present application are described above, but the present application is not limited to the above, and it should be pointed out that, for ordinary skilled in the art, without departing from the technical principles of the present application, a number of improvements and modifications can be made, and these improvements and modifications should be considered as the protection scope of the present application.

Claims

1. A device for bonding an electrostatic chuck base to a ceramic electrode, characterized in that, Comprising The first fitting device (1) is used for the fitting between the release film (2) and the adhesive (3), comprising a first bottom plate (11), the first bottom plate (11) is provided with a first positioning device and a second positioning device, and the first positioning device and the second positioning device are arranged on the same surface of the first bottom plate (11), the first positioning device is used for positioning the release film (2), and the second positioning device is used for positioning the adhesive (3); The second fitting device (4) is used for the fitting between the electrostatic chuck base (5) and the ceramic electrode (6), comprising a second bottom plate (41), the second bottom plate (41) is provided with a third positioning device and a fourth positioning device, and the third positioning device and the fourth positioning device are arranged on the same surface of the second bottom plate (41), the third positioning device is used for positioning the release film (2), and the fourth positioning device is used for positioning the ceramic electrode (6); Wherein, the position of the first positioning device corresponds to the position of the third positioning device.

2. The apparatus for electrostatic chuck base and ceramic electrode bonding according to claim 1, wherein, The first positioning device is provided with at least three first pins (111) on the same surface of the first bottom plate (11), the at least three first pins (111) are not on the same straight line, and the release film (2) is provided with a first through hole corresponding to the first pin (111).

3. The apparatus for electrostatic chuck base and ceramic electrode bonding according to claim 1, wherein, The second positioning device is provided with at least three second pins (112) on the same surface of the first bottom plate (11), the at least three second pins (112) are not on the same straight line, and the adhesive (3) is provided with a second through hole corresponding to the second pin (112).

4. The apparatus for bonding a ceramic electrode to an electrostatic chuck base of any one of claims 1 to 3, wherein The third positioning device is provided with at least three third pins (411) on the same surface of the second bottom plate (41), and the at least three third pins (411) are not on the same straight line.

5. The apparatus for bonding a ceramic electrode to an electrostatic chuck base of any one of claims 1 to 3, wherein The fourth positioning device is provided with at least three fourth pins (412) on the same surface of the second bottom plate (41), the at least three fourth pins (412) are not on the same straight line, the electrostatic chuck base (5) is provided with a third through hole, the ceramic electrode (6) is provided with a fourth through hole, and the third through hole and the fourth through hole correspond to the fourth pin.

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