Semiconductor vehicle-mounted ice water all-in-one machine device based on TEC

Abstract

A thermoelectric cooler (TEC)-based semiconductor vehicle-mounted ice water all-in-one machine device comprises a shell, and a heat conduction pipe connector is arranged on the shell wall of the shell; a water storage assembly, a refrigeration assembly, an ice making assembly, a discharging assembly, a heat dissipation assembly and an electrical control system are arranged in the shell; wherein the heat dissipation assembly is respectively connected with the refrigeration assembly and the ice making assembly; the heat dissipation assembly comprises a refrigeration heat dissipation device and an ice-making heat dissipation device; the refrigeration heat dissipation device and the ice-making heat dissipation device are connected in series through a heat conduction pipe, and a heat conduction pipe connector is arranged at the tail end of the heat conduction pipe. The vehicle-mounted ice making system has the advantages that by combining the low-temperature environment generated by the compressor of the vehicle-mounted air conditioning system, existing heat exchange resources in a vehicle can be effectively utilized, energy consumption of refrigeration equipment is reduced, ice making efficiency is improved, and extra power consumption does not need to be increased.

Description

TECHNICAL FIELD

[0001] The utility model relates to a kind of semiconductor vehicle-mounted ice water integrated machine device based on TEC. BACKGROUND

[0002] With the continuous development of vehicle-mounted electronic equipment and system, the demand for vehicle-mounted temperature control gradually increases, especially in high temperature environment, how to ensure that vehicle-mounted electronic equipment and module run at the best temperature becomes more and more important. Due to its small size, light weight, fast response and other advantages, semiconductor refrigeration technology is gradually applied to refrigeration equipment. However, one of the main problems of semiconductor refrigeration is its low heat exchange efficiency, which requires an efficient heat dissipation system to ensure its normal operation.

[0003] CN2024223987498 discloses an ice-making assembly and a semiconductor super-silent ice water integrated machine device based on TEC, which has the technical scheme that: the device realizes refrigeration and heating through semiconductor refrigeration sheet; wherein, the refrigeration assembly and the ice-making assembly are the core components of the super-silent ice water integrated machine, each including a set of TEC refrigeration module and a water-cooled heat dissipation system, wherein the refrigeration assembly and the ice-making assembly share a set of heat dissipation system. The refrigeration assembly is used to reduce the temperature in the ice tank, so that normal temperature water becomes 5℃ ice water, ensuring temperature control and cooling effect during ice-making water process; the ice-making assembly is used to reduce the temperature in the ice-making tank, so that ice water solidifies into ice blocks, ensuring temperature control and cooling effect during ice-making process. The water-cooled plates of the refrigeration assembly and the ice-making assembly in the heat dissipation system are connected in series through pipes, connected to water-cooled radiators through pipes, and cooled through the heat dissipation fins and cooling pipes in the water-cooled radiators, with fans installed on the water-cooled radiators to assist heat dissipation. However, in this scheme, the heat dissipation system still uses water-cooled heat dissipation, but the water-cooled heat dissipation speed is slow, which cannot meet the demand for efficient heat dissipation. UTILITY MODEL CONTENTS

[0004] The technical problem to be solved by the utility model is how to meet the requirement of efficient heat dissipation in actual demand, therefore, a semiconductor vehicle-mounted ice water integrated machine device based on TEC is provided.

[0005] The technical scheme of the utility model is specifically:

[0006] A semiconductor vehicle-mounted ice water integrated machine device based on TEC, comprising a shell, a heat-conducting pipe connection port is arranged on the shell wall of the shell;

[0007] A water storage assembly, a refrigeration assembly, an ice-making assembly, a discharge assembly, a heat dissipation assembly and an electrical control system are arranged in the shell; wherein, the heat dissipation assembly is connected with the refrigeration assembly and the ice-making assembly respectively;

[0008] The heat dissipation assembly comprises a refrigeration heat dissipation device and an ice-making heat dissipation device; the refrigeration heat dissipation device and the ice-making heat dissipation device are connected in series through a heat pipe; and the heat pipe is provided with a heat pipe connecting port at the end thereof.

[0009] The refrigeration assembly comprises a TEC refrigeration module and an ice tank; the TEC refrigeration module comprises a first semiconductor refrigeration sheet, the cold end of the first semiconductor refrigeration sheet is fixedly connected with a cold end fin, the cold end fin is located inside the ice tank and is in contact with water in the ice tank, the hot end of the first semiconductor refrigeration sheet is connected with a refrigeration heat dissipation device, a temperature sensor is arranged in the ice tank, and the ice tank is connected with an ice-water outlet pipe.

[0010] The ice-making assembly comprises a TEC ice-making module and an ice-making forming mechanism, the TEC ice-making module comprises a second semiconductor refrigeration sheet, the cold end of the second semiconductor refrigeration sheet is provided with an ice tray, the ice tray is connected with the ice-making forming mechanism below, and the hot end of the second semiconductor refrigeration sheet is provided with an ice-making heat dissipation device.

[0011] The ice-making heat dissipation device comprises an ice-making module liquid cooling plate, the ice-making module liquid cooling plate is in communication with an ice-making module heat pipe, the refrigeration heat dissipation device comprises a refrigeration module liquid cooling plate, the refrigeration module liquid cooling plate is in communication with a refrigeration module heat pipe, and the refrigeration module heat pipe in the refrigeration heat dissipation device and the ice-making module heat pipe in the ice-making heat dissipation device are connected to the heat pipe connecting port.

[0012] The refrigeration module liquid cooling plate of the refrigeration heat dissipation device and the ice-making module liquid cooling plate of the ice-making heat dissipation device are also in communication through a converging pipe.

[0013] The refrigeration heat dissipation device and the ice-making heat dissipation device are connected to the heat pipe connecting port, the heat pipe connecting port is connected to an external heat pipe, and the heat pipe is connected to a vehicle-mounted compressor and a condenser in sequence.

[0014] The semiconductor ice-water all-in-one machine has the advantages that: the semiconductor ice-water all-in-one machine utilizes the low-temperature environment generated by the compressor of the vehicle-mounted air conditioning system, effectively utilizes the existing heat exchange resources in the vehicle, reduces the energy consumption of the refrigeration equipment, improves the ice-making efficiency, and does not need to increase additional power consumption. The compressor heat dissipation technology is used to replace the traditional water-cooling heat dissipation system, the heat dissipation efficiency is improved, the equipment design is optimized, the limitation of the environmental temperature on the semiconductor refrigeration equipment is solved, the liquid cooling structure is connected to the vehicle-mounted compressor refrigeration system through the heat pipe, the temperature of the hot surface of the semiconductor refrigeration sheet can be maintained at 5 DEG C at the lowest, the temperature of the cold surface of the refrigeration sheet is greatly reduced compared with the air-cooling heat dissipation, and therefore the refrigeration effect of the ice-water all-in-one machine is improved. BRIEF DESCRIPTION OF DRAWINGS

[0015] Figure 1 The utility model discloses an appearance diagram;

[0016] Figure 2Structure diagram of refrigeration assembly;

[0017] Figure 3 Structure diagram of ice making assembly and heat dissipation structure;

[0018] Figure 4 Structure diagram of ice tray;

[0019] Figure 5 Principle diagram of heat dissipation assembly.

[0020] Reference signs are:

[0021] Water storage assembly 1; discharge assembly 2; refrigeration heat dissipation device 3; heat pipe connecting port 4; power supply interface 5; ice making heat dissipation device 6; ice tank 7; ice making forming mechanism 8; ice tray 9; refrigeration module heat pipe 10; water tank 11; ice making module heat pipe 12; converging pipe 13, throttling device 14; condenser fan 15; heat pipe 16; ice making assembly 17; refrigeration assembly 18; vehicle-mounted compressor 19; condenser 20; solid discharge mechanism 202; liquid discharge mechanism 201. DETAILED DESCRIPTION

[0022] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0023] As shown in Figure 1 , Figure 2 A semiconductor vehicle-mounted ice and water integrated machine device based on TEC, comprising a shell 1, a heat pipe connecting port 4 and a power supply interface 5 are arranged on the shell wall of the shell 1.

[0024] A water storage assembly, a refrigeration assembly 18, an ice making assembly 17, a discharge assembly 2, a heat dissipation assembly and an electrical control system are arranged in the shell 1; wherein the heat dissipation assembly is connected with the refrigeration assembly and the ice making assembly 17 respectively.

[0025] The heat dissipation assembly comprises a refrigeration heat dissipation device 3 and an ice making heat dissipation device 6; the refrigeration heat dissipation device 3 and the ice making heat dissipation device 6 are connected in series through a heat pipe, and the heat pipe is provided with a heat pipe connecting port 4 at the end.

[0026] The following is a specific analysis:

[0027] The water storage assembly is arranged in the shell 1 and comprises a water storage tank in which normal temperature drinking water is stored. The water storage tank is connected with a water storage inlet pipe and a water storage outlet pipe, and preferably, the water storage inlet pipe and the water storage outlet pipe are arranged at the bottom of the water storage tank. A cold water pump is arranged in the water storage tank and connected with the water storage inlet pipe and the water storage outlet pipe. The cold water pump pumps the normal temperature drinking water in the water storage tank into the refrigeration assembly. The water storage assembly can refer to the disclosure of CN2024223987498.

[0028] The refrigeration assembly 18 is arranged in the shell 1 and communicates with the water storage assembly, and is used for preparing ice water. The refrigeration assembly comprises a TEC refrigeration module and an ice tank 7. The TEC refrigeration module comprises a first semiconductor refrigeration sheet, and a cold end fin is fixedly connected to the cold end of the first semiconductor refrigeration sheet. The cold end fin is located in the ice tank 7 and contacts water in the ice tank 7. The hot end of the first semiconductor refrigeration sheet is connected with a refrigeration heat dissipation device 3. The refrigeration heat dissipation device 3 comprises a refrigeration module liquid cooling plate located at the hot end of the first semiconductor refrigeration sheet. The refrigeration module liquid cooling plate mainly dissipates heat and cools the hot end of the first semiconductor refrigeration sheet. The refrigeration module liquid cooling plate communicates with a refrigeration module heat pipe 10.

[0029] It should be noted that the cold end fin of the first semiconductor refrigeration sheet and the refrigeration module liquid cooling plate and the hot end of the first semiconductor refrigeration sheet are coated with a heat-conducting material to achieve sufficient heat conduction. By electrifying the first semiconductor refrigeration sheet, the temperature of the cold end of the first semiconductor refrigeration sheet is lower than the temperature of the hot end of the first semiconductor refrigeration sheet, so as to absorb the heat of the cold end fin.

[0030] In the ice tank 7, the cold end fin of the TEC refrigeration module is located in the ice tank 7 to cool the water in the ice tank. A temperature sensor is arranged in the ice tank 7 to monitor the water temperature in real time. The water storage assembly is connected with the ice tank 7 through the water storage outlet pipe, so as to supply water to the ice tank 7. The ice tank 7 is connected with an ice water outlet pipe. A mixing tank is arranged on the discharging assembly 2 and connected with the ice water outlet pipe. A proportional electromagnetic valve is arranged on the ice water outlet pipe. The temperature sensor and the proportional electromagnetic valve are connected with a temperature controller.

[0031] The ice making assembly is arranged in the shell 1 and communicates with the refrigeration assembly. When ice blocks are needed, the ice water in the refrigeration assembly is transported into the ice making assembly to make ice blocks. The ice making assembly comprises a TEC ice making module and an ice making forming mechanism. Figure 3As shown, the TEC ice-making module includes a second semiconductor refrigeration sheet, the cold end of the second semiconductor refrigeration sheet is provided with an ice tray 9, the lower side of the ice tray 9 is connected with an ice-making forming mechanism 8; the hot end of the second semiconductor refrigeration sheet is provided with an ice-making heat dissipation device 6, the ice-making heat dissipation device 6 includes an ice-making module liquid cooling plate, which mainly dissipates heat from the hot end of the second semiconductor refrigeration sheet, and the ice-making module liquid cooling plate is in communication with an ice-making module heat pipe 12.

[0032] It should be noted that the ice tray 9 and the cold end of the second semiconductor refrigeration sheet, and the ice-making module liquid cooling plate and the hot end of the second semiconductor refrigeration sheet are evenly coated with a heat-conducting material, which can achieve sufficient heat conduction. By energizing the second semiconductor refrigeration sheet, the temperature of the cold end of the second semiconductor refrigeration sheet is lower than that of the hot end of the second semiconductor refrigeration sheet, so as to absorb the heat of the ice tray 9. The cold end ice tray adopts heat preservation and insulation measures, and the main purpose of the heat preservation layer is to reduce the heat loss of the cold end and further improve the ice-making speed. By changing the current direction of the second semiconductor refrigeration sheet, the temperature of the ice tray can be raised and lowered.

[0033] The structure of the ice-making forming mechanism is the same as that disclosed in CN2024223987498, which includes a water tank 11, an ice-making unit and a flow guide structure. The water tank 11 includes a water tank main body, a turnover motor is installed on one side of the water tank, and after the ice-making is completed, the water tank is turned over to pour the remaining water to the back wall, and the water flows into the lower ice tank along the inclined surface of the flow guide structure for recycling. The specific structure is not described here.

[0034] In this patent application, the refrigeration module heat pipe 10 in the refrigeration heat dissipation device 3 and the ice-making module heat pipe 12 in the ice-making heat dissipation device 6 are connected to the heat pipe connection port 4. In order to better achieve heat dissipation, the refrigeration module liquid cooling plate of the refrigeration heat dissipation device 3 and the ice-making module liquid cooling plate of the ice-making heat dissipation device 6 are also connected through a converging pipe 13, so as to realize heat exchange between the refrigeration heat dissipation device 3 and the ice-making heat dissipation device 6.

[0035] Finally, the refrigeration heat dissipation device 3 and the ice-making heat dissipation device 6 are connected to the vehicle-mounted compressor 19 through the heat pipe connection port 4, as shown in Figure 5 As shown, when working, the heat pipe connection port 4 is connected to the external heat pipe 16, the heat pipe 16 is connected to the vehicle-mounted compressor 19 and the condenser 20 in sequence, and the heat pipe 16 is connected to the vehicle-mounted compressor and the condenser system. The vehicle-mounted compressor of the vehicle air conditioner will take away the heat in the vehicle air and release it through the condenser when working. The heat of the condenser can be used as a heat source to help the hot surface of the refrigeration sheet dissipate heat efficiently, so that the refrigeration sheet can maintain good heat exchange efficiency when working.

[0036] Better, the heat pipe 16 is provided with a throttling device 14; the condenser 20 is provided with a condenser fan 15.

[0037] The discharge assembly 2 is arranged on the shell 1 and is used for discharging medium in the refrigeration assembly and the ice making assembly; the discharge assembly 2 comprises a solid discharge mechanism 202 and a liquid discharge mechanism 201; a water drip groove 3 is arranged below the liquid discharge mechanism for facilitating liquid discharge.

[0038] The solid discharge mechanism 202 is a storage ice tank and is used for discharging solid ice blocks, and the structure is the same as disclosed in CN2024223987498.

[0039] The liquid discharge mechanism 201 comprises a water mixing tank, and the water mixing tank is connected with an ice-water outlet pipe of the ice tank 7 and a water storage outlet pipe of the water storage assembly 1 through proportional electromagnetic valves. The temperature sensor in the ice tank and the proportional electromagnetic valves are connected with a temperature controller. According to the water temperature selected by a user, the temperature controller adjusts the opening degree of the proportional electromagnetic valves, and the proportional electromagnetic valves adjust the flow proportion of different water temperatures according to the instruction of the temperature controller. The mixed water of normal temperature water and cold water flows through the proportional electromagnetic valves to the water outlet of the water mixing tank and provides the required temperature for the user.

[0040] The electrical control system 9 is used for setting and adjusting the working parameters of the novel ice-water integrated machine, is responsible for monitoring and adjusting the running state of the novel ice-water integrated machine, and can be operated and set by a user through a control panel.

[0041] The working principle of the novel ice-water integrated machine is as follows:

[0042] The novel ice-water integrated machine comprises a shell assembly, a water storage assembly arranged in the shell and used for storing drinking water for water supply, a refrigeration assembly arranged in the shell assembly and in communication with the water storage assembly and used for preparing ice water, an ice making assembly arranged in the shell assembly and in communication with the refrigeration assembly and used for making ice blocks when ice blocks are needed, a discharge assembly arranged on the shell and used for discharging medium in the refrigeration assembly and the ice making assembly, and an electrical control system used for setting and adjusting the working parameters of the ice-water integrated machine and responsible for monitoring and adjusting the running state of the ice-water integrated machine.

[0043] In the novel ice-water integrated machine, the in-vehicle compressor is used as a refrigeration fin heat dissipation technology, the working state of the in-vehicle air conditioner compressor is fully utilized for efficient heat exchange, the energy efficiency and heat dissipation effect of the semiconductor refrigeration system are optimized, efficient refrigeration water and ice making in the vehicle are realized, and the novel ice-water integrated machine has great market potential.

[0044] The above merely describes preferred embodiments of the present application, and it should be noted that, for those skilled in the art, without departing from the overall concept of the present application, a number of changes and improvements can be made, and these should also be considered as falling within the scope of the present application.

Claims

1. A TEC-based semiconductor vehicle-mounted ice and water all-in-one device, characterized by: It comprises a shell (1), a heat pipe connecting port (4) is arranged on the shell wall of the shell (1); A water storage assembly, a refrigeration assembly (18), an ice making assembly (17), a discharging assembly (2), a heat dissipation assembly and an electrical control system are arranged in the shell (1); wherein the heat dissipation assembly is connected with the refrigeration assembly and the ice making assembly (17) respectively. The heat dissipation assembly comprises a refrigeration heat dissipation device (3) and an ice making heat dissipation device (6); the refrigeration heat dissipation device (3) and the ice making heat dissipation device (6) are connected in series through a heat pipe; and the end of the heat pipe is provided with the heat pipe connecting port (4).

2. The TEC-based semiconductor vehicle-mounted ice and water all-in-one machine device according to claim 1, characterized by: The refrigeration assembly (18) comprises a TEC refrigeration module and an ice tank (7); wherein the TEC refrigeration module comprises a first semiconductor refrigeration sheet, the cold end of the first semiconductor refrigeration sheet is fixedly connected with a cold end fin, the cold end fin is located in the ice tank (7) and contacts with water in the ice tank (7); the hot end of the first semiconductor refrigeration sheet is connected with the refrigeration heat dissipation device (3); a temperature sensor is arranged in the ice tank (7); and the ice tank (7) is connected with an ice water outlet pipe.

3. The TEC-based semiconductor vehicle-mounted ice and water all-in-one machine device according to claim 1, characterized by: The ice making assembly comprises a TEC ice making module and an ice making forming mechanism, the TEC ice making module comprises a second semiconductor refrigeration sheet, the cold end of the second semiconductor refrigeration sheet is provided with an ice tray (9), the ice tray (9) is connected with the ice making forming mechanism (8) below; and the hot end of the second semiconductor refrigeration sheet is provided with the ice making heat dissipation device (6).

4. The TEC-based semiconductor vehicle-mounted ice and water all-in-one machine device according to claim 1, characterized by: The ice making heat dissipation device (6) comprises an ice making module liquid cooling plate, the ice making module liquid cooling plate is communicated with an ice making module heat pipe (12); the refrigeration heat dissipation device (3) comprises a refrigeration module liquid cooling plate, the refrigeration module liquid cooling plate is communicated with a refrigeration module heat pipe (10); and the refrigeration module heat pipe (10) in the refrigeration heat dissipation device (3) and the ice making module heat pipe (12) in the ice making heat dissipation device (6) are connected to the heat pipe connecting port (4) together.

5. A TEC-based semiconductor vehicle-mounted ice and water all-in-one machine device according to claim 4, characterized by: The refrigeration module liquid cooling plate of the refrigeration heat dissipation device (3) and the ice making module liquid cooling plate of the ice making heat dissipation device (6) are further communicated through a converging pipe (13).

6. The TEC-based semiconductor vehicle-mounted ice and water all-in-one machine device according to claim 4, characterized by: The refrigeration heat dissipation device (3) and the ice making heat dissipation device (6) are connected with the heat pipe connecting port (4), the heat pipe connecting port (4) is connected with an external heat pipe (16), and the heat pipe (16) is connected with a vehicle-mounted compressor (19) and a condenser (20) in sequence.

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