TOF (Time of Flight) module cover plate for preventing overflowing glue from polluting light sensing area of chip

Abstract

The TOF module cover plate capable of preventing overflowing glue from polluting the light sensing area of the chip at least comprises a cover plate body, the cover plate body at least comprises a top wall and a side wall, the top wall and the side wall enclose to form a cavity with an open bottom, a plurality of partitions formed by protruding from the top wall on one side of the cavity are arranged in the cavity, and the partitions are used for dividing the cavity into a plurality of mounting areas. A plurality of retaining walls formed by protruding from the top wall on one side of the cavity are arranged between the partition and any mounting area, and a glue guide groove is formed between the retaining walls and the partition. The utility model has the advantages that the structure is simple, glue overflow and smudginess on the surface of the chip caused by the heat aggregation effect during extrusion and baking when the substrate is pasted are prevented, the bad pollution of the glue on the chip is thoroughly solved in the process, the rejection of defective products is reduced, the production cost is reduced, and the production yield is also improved at the same time.

Description

TECHNICAL FIELD

[0001] The utility model relates to chip packaging technical field, concretely relates to a TOF module cover plate of preventing overflowed glue from polluting chip photosensitive area. BACKGROUND

[0002] TOF module, as the key component in modern photoelectric technology, its structure design is exquisite and complex. Figure 5 As shown in the figure, it usually includes substrate 2, and the light receiving chip 3 is attached on the substrate, and these chips are responsible for capturing and processing light signals. In order to ensure the stable transmission of signals, the module is also equipped with bonding wire 4 for connecting the chip and external circuit, ensuring the accurate flow of data. Above the light receiving chip, there is a layer of optical filter 5. This layer of optical filter is responsible for filtering out unnecessary light, allowing only light of specific wavelength or characteristics to pass through, so as to ensure that the light receiving chip can accurately capture the required light signal. In order to protect the internal structure, the module is also equipped with a cover plate 1. The cover plate is not only solid and durable, but also has a light hole 1322 on it, allowing reflected light to enter the module smoothly. After the filtering of the reflected light by the optical filter, it is accurately transmitted to the light receiving chip, completing the reception and processing of the light signal.

[0003] Usually, TOF module will contain multiple chip structures, each structure is independent and complete. Such design makes the module can process multiple light signals at the same time, improves its work efficiency and flexibility. As shown in the figure, Figure 6 In the packaging process, in order to ensure that the light between each chip structure does not interfere with each other, it is necessary to set up a partition 131 to isolate the light of different areas. This design is crucial to ensure the normal function and performance of the module.

[0004] As shown in the figure, Figure 7 The traditional cover plate partition 131 design has obvious defects. When the cover plate is attached to the substrate, the glue 6 is easy to be extruded and overflowed by the partition. Especially in the process of glue baking, due to the fluidity and temperature of the glue, the glue is easy to flow down along the side wall of the cover plate, directly polluting the surface of the chip 3 and its photosensitive area. This pollution not only affects the normal work of the chip, but also may cause the complete failure of the product function, bringing great inconvenience and loss to production and use. SUMMARY

[0005] The technical problem to be solved by the utility model is to provide a TOF module cover plate with simple structure, which can prevent the glue from overflowing due to extrusion when attaching the substrate and heat accumulation effect during baking, causing the surface of the chip to be dirty, completely solve the glue pollution on the chip in the process, reduce the scrap of defective products, reduce the production cost, and improve the production yield at the same time.

[0006] In order to solve the above technical problems, the utility model provides a technical scheme, a TOF module cover plate preventing overflow glue from polluting chip photosensitive area, at least including top wall and side wall, the top wall and the side wall are surrounded and form the cavity of bottom open, a plurality of from the top wall is protruding and forms the partition in the cavity one side of the cavity is provided with, the partition is used for dividing the cavity into a plurality of installation area, the position between the partition and any installation area is provided with a plurality of from the top wall is protruding and forms the retaining wall in the cavity one side, the retaining wall and the partition form the glue guide groove between.

[0007] A preferred embodiment, any installation area is provided with the recess groove that is recessed and forms by the top wall close to the cavity one side, the recess groove is provided with the light transmission hole in.

[0008] A preferred embodiment, the retaining wall extends along the recess groove close to the side edge direction of the partition one side, and the length of the retaining wall is greater than the length of the recess groove close to the side edge of the partition one side.

[0009] A preferred embodiment, the protruding height of the retaining wall is greater than or equal to the protruding height of the partition.

[0010] A preferred embodiment, the top end surface area of the partition is greater than or equal to the top end surface area of the retaining wall.

[0011] A preferred embodiment, the installation area includes first installation area and second installation area, the glue guide groove includes the first glue guide groove between the first installation area and the partition and the second glue guide groove between the second installation area and the partition, and the first glue guide groove and second glue guide groove are arranged in parallel.

[0012] The utility model discloses a TOF module cover plate preventing overflow glue from polluting chip photosensitive area, compared with prior art, has the following beneficial effects:

[0013] (1) The TOF module cover plate of the utility model prevents the overflow of glue from polluting the photosensitive area of the chip, and comprises at least a top wall and a side wall, and the top wall and the side wall form a cavity with an open bottom. On the one hand, the installer can easily place the components to be installed into the corresponding installation area and ensure the stable connection of the components through glue. On the other hand, when a component fails or needs to be replaced, the maintenance personnel can quickly locate the problem component and easily replace or repair it due to the clear cavity structure, thereby reducing the maintenance time and cost. A plurality of partitions are formed on one side of the cavity from the top wall, and the partitions are used to divide the cavity into a plurality of installation areas. The design of the partitions not only plays a role in dividing the installation areas, but also enhances the overall stability and reliability of the cover plate through reasonable layout and structural design. This makes the cover plate better protect the internal chips and other components during long-term use and prolong the service life of the product. A plurality of retaining walls are formed on one side of the cavity from the top wall between the partitions and any installation area, and the retaining walls and the partitions form a glue guide groove. The glue guide groove serves as a first anti-glue overflow structure and is used to accommodate glue. When the cover plate is attached to the substrate, even if the glue is extruded, the excess glue will be guided into the glue guide groove instead of overflowing onto the chip surface or the photosensitive area, thereby effectively preventing the glue from polluting the chip. The retaining walls serve as a second anti-glue overflow structure, and through the blocking of the retaining walls, the glue is prevented from overflowing from the partition gap when subjected to external forces (such as extrusion or thermal aggregation effect during baking). This double anti-glue overflow structure design is simple in structure and can effectively prevent the overflow of glue caused by extrusion and thermal aggregation effect during baking when the cover plate is attached to the substrate, thereby completely eliminating the dirt phenomenon caused by glue pollution on the surface of the chip. From the perspective of production technology, the number of defective products caused by glue pollution is reduced, thereby significantly reducing production costs and significantly improving production yield.

[0014] (2) The TOF module cover plate for preventing glue overflow pollution of the chip photosensitive area of the utility model, the retaining wall extends along the groove to the side edge direction close to the partition, and the length of the retaining wall is greater than the length of the side edge of the groove close to the partition. On the one hand, the increase of the length of the retaining wall means that the blocking range of the glue is wider, so that the glue overflow from the partition gap is prevented more effectively, and the reliability of the glue overflow prevention is further improved. On the other hand, the extension design of the retaining wall also enhances the connection strength between the retaining wall and the partition and the groove, so that the whole cover plate structure is more stable and is not easy to deform. The protrusion height of the retaining wall is greater than or equal to the protrusion height of the partition. On the one hand, the increase of the protrusion height of the retaining wall ensures that the glue guide groove formed between the retaining wall and the partition has sufficient depth, so that more glue can be accommodated to prevent glue overflow. On the other hand, when the protrusion height of the retaining wall is equal to or slightly greater than the partition, the alignment and fixation of the two can be more easily realized, and the production process is simplified. The top end surface area of the partition is greater than or equal to the top end surface area of the retaining wall. In the limited space of the cover plate, the space is fully utilized, the adhesive area between the cover plate and the substrate is increased, the overall strength of the structure is improved, and the cover plate is more stable when subjected to external force. BRIEF DESCRIPTION OF DRAWINGS

[0015] Figure 1 It is a cover plate body structure schematic view of an embodiment of the TOF module cover plate for preventing glue overflow pollution of the chip photosensitive area of the utility model.

[0016] Figure 2 It is a packaging process step S1 schematic view of an embodiment of the TOF module cover plate for preventing glue overflow pollution of the chip photosensitive area of the utility model.

[0017] Figure 3 It is a packaging process step S2 schematic view of an embodiment of the TOF module cover plate for preventing glue overflow pollution of the chip photosensitive area of the utility model.

[0018] Figure 4 It is a packaging process step S3 schematic view of an embodiment of the TOF module cover plate for preventing glue overflow pollution of the chip photosensitive area of the utility model.

[0019] Figure 5 It is a TOF module structure schematic view of the prior art.

[0020] Figure 6 It is a TOF module cover plate structure schematic view of the prior art.

[0021] Figure 7 It is a TOF module substrate glue overflow schematic view of the prior art.

[0022] BRIEF DESCRIPTION OF DRAWINGS

[0023] 1-Cover plate body; 11-Top wall; 12-Side wall; 13-Cavity; 131-Block; 132-Installation area; 1321-Groove; 1322-Light transmission hole; 1323-First installation area; 1324-Second installation area; 133-Block; 134-Adhesive guide groove; 1341-First adhesive guide groove; 1342-Second adhesive guide groove;

[0024] 2-Substrate;

[0025] 3-Optical receiver chip;

[0026] 4-bond line;

[0027] 5-Filter;

[0028] 6-Glue. Detailed Implementation

[0029] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the present utility model.

[0030] In the description of this utility model, it should be understood that the terms "upper", "lower", "front", "rear", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0031] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation", "connection" and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, an integral connection, or a detachable connection; they can refer to the internal connection of two components; they can refer to a direct connection or an indirect connection through an intermediate medium. For those skilled in the art, the specific meaning of the above terms in this utility model can be understood according to the specific circumstances.

[0032] This embodiment provides a TOF module cover plate to prevent adhesive overflow from contaminating the photosensitive area of ​​the chip, such as... Figure 1 As shown, it includes at least a cover plate body 1, which includes at least a top wall 11 and a side wall 12. The top wall and side wall together form a cavity 13 with an open bottom. On the one hand, installers can easily place the parts to be installed into the corresponding installation area and ensure a stable connection of the parts with glue. On the other hand, if a part malfunctions or needs to be replaced, due to the clear cavity structure, maintenance personnel can quickly locate the problematic part and easily replace or repair it, reducing maintenance time and costs.

[0033] The cavity is provided with a plurality of partitions 131 protruding from the top wall on one side of the cavity, which are used to divide the cavity into a plurality of installation areas 132. The design of the partitions not only serves to divide the installation areas, but also enhances the overall stability and reliability of the cover plate through reasonable layout and structural design. This enables the cover plate to better protect the internal chips and other components during long-term use, thereby prolonging the service life of the product.

[0034] A plurality of retaining walls 133 protruding from the top wall on one side of the cavity are arranged between the partitions 131 and any installation area 132, and a glue guide groove 134 is formed between the retaining walls and the partitions. The glue guide groove serves as a first anti-glue overflow structure and is used to contain glue. When the cover plate is attached to the substrate, even if the glue is squeezed, the excess glue will be guided into the glue guide groove instead of overflowing onto the chip surface or the light-sensitive area, thereby effectively preventing the problem of glue contamination of the chip. The retaining walls serve as a second anti-glue overflow structure, which prevents glue from overflowing from the partition gap when subjected to external forces such as squeezing or thermal aggregation during baking. This double anti-glue overflow structure design is simple in structure and can effectively prevent the problem of glue overflow caused by squeezing and thermal aggregation during baking when the cover plate is attached to the substrate, thereby completely eliminating the dirt phenomenon caused by glue contamination on the surface of the chip. From the perspective of production process, the number of defective products caused by glue contamination is reduced, thereby significantly reducing production costs and significantly improving production yield.

[0035] In this embodiment, the installation area 132 includes a first installation area 1323 and a second installation area 1324, the glue guide groove 134 includes a first glue guide groove 1341 between the first installation area 1323 and the partition 131, and a second glue guide groove 1342 between the second installation area 1324 and the partition 131, the first glue guide groove and the second glue guide groove are arranged in parallel, and the first glue guide groove and the second glue guide groove are symmetrically distributed on both sides of the partition. On the one hand, it avoids stress concentration inside the cavity of the cover plate, and on the other hand, it makes the structure inside the cavity of the cover plate more compact.

[0036] Further, any installation area 132 is provided with a groove 1321 recessed from the top wall near one side of the cavity, and a light transmission hole 1322 is arranged in the groove. By arranging a groove recessed from the top wall in the installation area and arranging a light transmission hole in the groove, the path and receiving angle of the light can be more accurately controlled, thereby improving the optical performance of the TOF module. The design of the groove enables the light transmission hole to be more closely attached above the chip, reducing the loss of light during transmission, and also making the structure of the entire module more compact.

[0037] In this embodiment, the retaining wall 133 extends along the groove 1321 towards the side edge of the baffle 131, and the length of the retaining wall is greater than the length of the side edge of the groove near the baffle. On the one hand, the increase in the length of the retaining wall means that its blocking range of glue is wider, thereby more effectively preventing glue from overflowing from the baffle gap, further improving the reliability of the anti-glue overflow; on the other hand, the extension design of the retaining wall also enhances the connection strength between the retaining wall and the baffle and the groove, making the entire cover plate structure more stable and less prone to deformation.

[0038] Further, the protrusion height of the retaining wall 133 is greater than or equal to the protrusion height of the baffle 131. On the one hand, the increase in the protrusion height of the retaining wall ensures that the glue guide groove formed between the retaining wall and the baffle has sufficient depth, thereby being able to accommodate more glue and prevent glue overflow; on the other hand, when the protrusion height of the retaining wall is equal to or slightly greater than that of the baffle, the alignment and fixation of the two can be more easily achieved, simplifying the production process.

[0039] Preferably, the top end surface area of the baffle 131 is greater than or equal to the top end surface area of the retaining wall 133. In the limited space of the cover plate, the space is fully utilized, the adhesive area between the cover plate and the substrate is increased, and the overall strength of the structure is improved, making the cover plate more stable when subjected to external forces.

[0040] The TOF module cover plate packaging process of the embodiment for preventing glue overflow from polluting the photosensitive area of the chip:

[0041] Step S1, prepare dispensing, as shown in Figure 2 , the TOF module cover plate with the filter attached is inverted, ensuring that the inner surface of the cover plate is clean and free of dust to avoid affecting the subsequent dispensing and mounting effect.

[0042] Step S2, use a die bonder to dispense an appropriate amount of glue on the substrate, as shown in Figure 3 , the die bonder dispenses an appropriate amount of glue 6 on the substrate at positions corresponding to the side wall edge of the TOF module cover plate and the baffle 131, respectively.

[0043] Step S3, mount the cover plate to the substrate, as shown in Figure 4 , align the cover plate with the substrate to ensure accurate mounting position, and use appropriate pressure to mount the cover plate to the substrate, allowing the glue to be evenly distributed after being pressed. During the mounting process, the glue will be extruded and overflow to the surrounding. Some of the glue will flow into the glue guide groove beyond the baffle. The glue guide groove is designed to accommodate excess glue, preventing glue from overflowing onto the chip surface or photosensitive area, thereby effectively protecting the chip from contamination.

[0044] In conclusion, the above only the preferred embodiments of the present application, and not to limit the present application, any modification, equivalent replacement and improvement, etc. made within the spirit and principles of the present application, should be included in the scope of protection of the present application.

Claims

1. A TOF module cover plate for preventing overflow glue from polluting the photosensitive area of a chip, comprising at least a cover plate body (1), characterized in that: The cover plate body comprises at least a top wall (11) and a side wall (12), which enclose a bottom-opened cavity (13), a plurality of partitions (131) are arranged on one side of the cavity from the top wall, the partitions are used to divide the cavity into a plurality of installation areas (132), a plurality of retaining walls (133) are arranged between the partitions and any installation area, the retaining walls are arranged on one side of the cavity from the top wall, and a glue guide groove (134) is formed between the retaining walls and the partitions.

2. The TOF module cover plate according to claim 1, wherein: Any installation area (132) is provided with a groove (1321) recessed on one side of the cavity from the top wall, and a light hole (1322) is arranged in the groove.

3. The TOF module cover plate according to claim 2, wherein: The retaining wall (133) extends along the side edge of the groove (1321) close to the partition (131), and the length of the retaining wall is greater than the length of the side edge of the groove close to the partition.

4. The TOF module cover plate according to any one of claims 1-3, wherein: The protruding height of the retaining wall (133) is greater than or equal to the protruding height of the partition (131).

5. The TOF module cover plate of claim 4, wherein: The top end surface area of the partition (131) is greater than or equal to the top end surface area of the retaining wall (133).

6. The TOF module cover plate of claim 5, wherein: The installation area (132) comprises a first installation area (1323) and a second installation area (1324), the glue guide groove (134) comprises a first glue guide groove (1341) between the first installation area (1323) and the partition (131) and a second glue guide groove (1342) between the second installation area (1324) and the partition (131), and the first glue guide groove and the second glue guide groove are arranged in parallel.

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