Special equipment for cleaning ultra-clean surface of gold bonding wire

Abstract

The utility model discloses special equipment for ultra-clean surface cleaning treatment of gold bonding wires, which comprises a cleaning box, wire guide rollers are arranged on two sides of the top of the cleaning box, and the wire guide rollers are at least used for guiding and discharging a plurality of gold bonding wires; a first cleaning roller and a second cleaning roller are arranged below the two sides of the interior of the cleaning box correspondingly and are symmetrically distributed. A lifting roller moving up and down is arranged below the middle of the cleaning box and at least used for intermittently pressing the gold bonding wire downwards. And a winder is arranged on one side of the cleaning box and at least used for winding the treated gold bonding wire. According to the gold bonding wire cleaning device, the wire guide roller and the cleaning roller are adopted, a plurality of gold bonding wires can be uniformly guided in parallel, the gold bonding wires can sequentially penetrate through the interior of the cleaning box, surface cleaning of the gold bonding wires is achieved, cleaning liquid on the surfaces of the gold bonding wires is collected and dried through the drying machine and the liquid collecting hopper, and the gold bonding wire cleaning efficiency is improved. And the gold bonding wire processing efficiency is improved.

Description

Technical Field

[0001] This utility model relates to the field of bonding wire processing technology, specifically to special equipment for ultra-clean surface cleaning treatment of bonding wire. Background Technology

[0002] Bonding wire is a gold alloy wire used as an interconnect in integrated circuits, also known as ball bonding wire or lead wire. Bonding wire contains ≥99.99% gold and <0.01% total trace elements. There are three types of bonding wire: γ-type, C-type, and FA-type, with the latter two used for high-speed bonding. Trace elements such as beryllium, copper, and silver refine the grain size, increase recrystallization temperature, and strengthen the gold. Bonding wire is manufactured using a high-frequency furnace vacuum melting process, followed by secondary remelting and directional crystallization. The ingot is then homogenized and cold-worked into finished products, or manufactured using a liquid extrusion process. Bonding wire is an important material in the microelectronics industry, used as the connecting wire between chips and lead frames.

[0003] Generally, cleaning the surface of bonding wires requires immersing them in a cleaning tank to contact the cleaning solution and achieve the desired cleanliness. However, this method is simplistic and ineffective, and the lack of specialized equipment for cleaning bonding wires fails to meet the required surface cleanliness standards. Therefore, there is an urgent need to design specialized equipment for ultra-clean surface cleaning of bonding wires to address these issues. Utility Model Content

[0004] The purpose of this invention is to provide a special equipment for ultra-clean surface cleaning of bonding wires, so as to solve the above-mentioned shortcomings in the prior art.

[0005] To achieve the above objectives, this utility model provides the following technical solution:

[0006] A special equipment for ultra-clean surface cleaning of bonding wires includes a cleaning tank, on both sides of the top of the cleaning tank, and the guide rollers are used to guide and feed at least a number of bonding wires.

[0007] Cleaning roller one and cleaning roller two are respectively arranged on the lower sides of the inside of the cleaning tank, and the cleaning roller one and cleaning roller two are symmetrically distributed.

[0008] A lifting roller that moves up and down is provided in the lower middle part of the cleaning tank. The lifting roller is used at least intermittently pressing down the key alloy wire.

[0009] A winding device is provided on one side of the cleaning box, which is used at least to wind up the processed bonding wire.

[0010] A liquid collection hopper is fixedly installed on one side of the outer wall of the cleaning tank, and the liquid collection hopper collects the cleaning liquid adhering to the surface of the bonding wire.

[0011] A dryer is installed on one side of the cleaning tank, above the liquid collection hopper;

[0012] Both sides of the cleaning tank are equipped with synchronous lifting devices, which are used to drive the lifting rollers to move up and down.

[0013] Preferably, a reflux port is provided on one side of the outer wall of the cleaning tank, and the bottom side of the liquid collection hopper is connected to the reflux port.

[0014] Preferably, several bearing seats are provided on both outer walls of the cleaning tank, and one end of the first cleaning roller and the second cleaning roller are provided on the bearing seats.

[0015] Preferably, the guide roller includes supports at both ends, and a support shaft is installed on the supports. The outer wall of the support shaft is provided with a plurality of guide grooves distributed at equal intervals, and the bonding wire is inserted into the inside of the guide grooves.

[0016] Preferably, the cleaning roller one, the lifting roller, and the cleaning roller two have the same structure.

[0017] The cleaning roller includes a central roller shaft, and a plurality of cleaning grooves are provided on the outside of the roller shaft. Brushes are provided on the inner wall of the cleaning grooves.

[0018] Preferably, a through hole is provided on one side of the outer wall of the liquid collecting hopper, and the bonding wire is inserted inside the through hole.

[0019] Preferably, the dryer includes an outer shell, and a plurality of equally spaced guide plates are arranged inside the lower part of the outer shell. The guide plates have a tapered structure, and a downward blowing fan is arranged above the outer shell.

[0020] Preferably, the lifting device includes a reciprocating cylinder installed on the outer wall of the cleaning tank. A lifting rod is provided inside the top of the reciprocating cylinder. A connecting arm is fixed to the top of the lifting rod. A crossbeam is fixedly installed between the two connecting arms. A synchronizing rod that is in close contact with the inner wall of the cleaning tank is fixedly provided at one end of the connecting arm.

[0021] The beneficial effects of the special equipment for ultra-clean surface cleaning of bonding wires provided by this utility model in the above technical solution are as follows:

[0022] (1) The cleaning roller and lifting roller are used to allow the bonding wire to be wound inside the cleaning groove on the roller shaft. The rotation of the roller shaft allows the brush to further clean the surface of the bonding wire, thus improving the cleaning effect on the bonding wire.

[0023] (2) The guide roller and cleaning roller used can guide several bonded wires in a uniform parallel manner, so that they pass through the inside of the cleaning box in an orderly manner, thereby cleaning the surface of the bonded wires. The cleaning liquid on the surface of the bonded wires is collected and dried by the dryer and the liquid collection hopper, which improves the efficiency of bonded wire processing. Attached Figure Description

[0024] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this utility model. For those skilled in the art, other drawings can be obtained based on these drawings.

[0025] Figure 1 This is a structural schematic diagram of an embodiment of the special equipment for ultra-clean surface cleaning treatment of bonding alloy wires according to this utility model.

[0026] Figure 2 This is a front view structural schematic diagram of an embodiment of the special equipment for ultra-clean surface cleaning treatment of bonding alloy wires according to this utility model.

[0027] Figure 3 A schematic diagram of the lifting device provided in an embodiment of the special equipment for ultra-clean surface cleaning of bonding alloy wires according to this utility model.

[0028] Figure 4 A schematic diagram of the wire roller structure provided in an embodiment of the special equipment for ultra-clean surface cleaning treatment of bonding alloy wires according to this utility model.

[0029] Figure 5 This is a schematic diagram of the dryer structure provided in an embodiment of the special equipment for ultra-clean surface cleaning treatment of bonding alloy wires according to this utility model.

[0030] Figure 6 This is a schematic diagram of the cleaning roller structure provided in an embodiment of the special equipment for ultra-clean surface cleaning of bonding alloy wires according to this utility model.

[0031] 1. Cleaning box; 11. Return port; 12. Bearing seat; 2. Guide roller; 21. Support; 22. Support shaft; 23. Guide groove; 3. Cleaning roller one; 31. Roller shaft; 32. Cleaning tank; 33. Brush; 4. Lifting roller; 5. Cleaning roller two; 6. Winder; 7. Liquid collection hopper; 71. Through hole; 8. Dryer; 81. Outer shell; 82. Fan; 83. Guide plate; 9. Bonded alloy wire; 10. Lifting device; 101. Reciprocating cylinder; 102. Lifting rod; 103. Connecting arm; 104. Synchronizing rod; 105. Crossbeam. Detailed Implementation

[0032] To enable those skilled in the art to better understand the technical solution of this utility model, the present utility model will be further described in detail below with reference to the accompanying drawings.

[0033] like Figure 1-6 As shown in the figure, the special equipment for ultra-clean surface cleaning treatment of bonding alloy wires provided in this embodiment of the utility model includes a cleaning tank 1. Guide rollers 2 are provided on both sides of the top of the cleaning tank 1, and the guide rollers 2 are used to guide and feed at least multiple bonding alloy wires 9. Cleaning roller 1 3 and cleaning roller 2 5 are respectively provided on the lower sides of the inner side of the cleaning tank 1, and the cleaning roller 1 3 and cleaning roller 2 5 are symmetrically distributed. A lifting roller 4 that moves up and down is provided in the lower middle part of the cleaning tank 1, and the lifting roller 4 is used to intermittently press down on the bonding alloy wires 9. A winding device 6 is provided on one side of the cleaning tank 1, and the winding device 6 is used to wind up the treated bonding alloy wires 9. A liquid collection hopper 7 is fixedly installed on the outer wall of one side of the cleaning tank 1, and the liquid collection hopper 7 collects the cleaning liquid adhering to the surface of the bonding alloy wires 9. A dryer 8 is provided on one side of the cleaning tank 1 above the liquid collection hopper 7.

[0034] Both sides of the cleaning tank 1 are equipped with synchronous lifting devices 10, which are used to drive the lifting rollers 4 to move up and down.

[0035] In this embodiment, a cleaning tank 1 is included, and a special cleaning solution is poured into the cleaning tank 1 to clean the surface of the bonding wire 9.

[0036] Specifically, a reflux port 11 is provided on one side of the outer wall of the cleaning tank 1, and the bottom side of the liquid collecting hopper 7 is connected to the reflux port 11.

[0037] Specifically, several bearing seats 12 are provided on both outer walls of the cleaning tank 1. One end of the cleaning roller 3 and the cleaning roller 5 is set on the bearing seat 12. A drive motor, belt and pulley can be set on the outside of the bearing seat 12, which can drive the cleaning roller 3 and the cleaning roller 5 to rotate, further improving the cleaning effect.

[0038] In this embodiment, guide rollers 2 are provided on both sides of the top of the cleaning tank 1. The guide rollers 2 are used to guide and feed multiple bonding wires 9.

[0039] Specifically, the guide roller 2 includes supports 21 at both ends, and a support shaft 22 is installed on the support 21. Several guide grooves 23 are provided on the outer wall of the support shaft 22 at equal intervals, and the bonding wire 9 is inserted into the inside of the guide grooves 23.

[0040] In this embodiment, a first cleaning roller 3 and a second cleaning roller 5 are respectively arranged on the lower sides of the inside of the cleaning tank 1, and the first cleaning roller 3 and the second cleaning roller 5 are symmetrically distributed.

[0041] In this embodiment, a lifting roller 4 that moves up and down is provided in the lower middle part of the cleaning tank 1. The lifting roller 4 is used at least intermittently to press down the key alloy wire 9.

[0042] Specifically, the structures of cleaning roller 3, lifting roller 4, and cleaning roller 5 are the same.

[0043] Specifically, the cleaning roller 3 includes a roller shaft 31 located at the center, and several cleaning grooves 32 are provided on the outside of the roller shaft 31. Brushes 33 are provided on the inner wall of the cleaning grooves 32, allowing the bonding wire 9 to be inserted into the inside of the cleaning grooves 32. The brushes 33 are used to coat the outer surface of the bonding wire 9 to achieve deep cleaning of the surface of the bonding wire 9.

[0044] In this embodiment, a winding device 6 is provided on one side of the cleaning box 1. The winding device 6 is used at least to wind up the processed bonding wire 9.

[0045] In this embodiment, a liquid collection hopper 7 is fixedly installed on one outer wall of the cleaning tank 1 to collect the cleaning liquid adhering to the surface of the bonding wire 9.

[0046] Specifically, a through hole 71 is provided on one side of the outer wall of the liquid collecting hopper 7, and the bonding alloy wire 9 is inserted inside the through hole 71.

[0047] In this embodiment, a dryer 8 is provided on one side of the cleaning tank 1 above the liquid collection hopper 7 to achieve drying treatment of the surface of the bonding wire 9.

[0048] Specifically, the dryer 8 includes a shell 81, and several equally spaced guide plates 83 are arranged inside the lower part of the shell 81. The guide plates 83 have a constricted structure. A downward blowing fan 82 is arranged above the shell 81. The use of guide plates 83 increases the wind speed and improves the drying efficiency of the bonding alloy wire 9.

[0049] In this embodiment, both sides of the cleaning tank 1 are provided with synchronous lifting devices 10, and the lifting devices 10 are at least used to drive the lifting rollers 4 to move up and down.

[0050] Specifically, the lifting device 10 includes a reciprocating cylinder 101 installed on the outer wall of the cleaning tank 1. A lifting rod 102 is provided inside the top of the reciprocating cylinder 101. A connecting arm 103 is fixed to the top of the lifting rod 102. A crossbeam 105 is fixedly installed between the two connecting arms 103. A synchronizing rod 104 is fixedly provided at one end of the connecting arm 103 and closely attached to the inner wall of the cleaning tank 1. When the reciprocating cylinders 101 on both sides are started, the connecting arm 103 and the synchronizing rod 104 can be driven to reciprocate. The synchronizing rod 104 drives the lifting roller 4 at the bottom to rise and fall inside the cleaning tank 1, thereby driving the key alloy wire 9 to be dragged and cleaned.

[0051] Working steps: First, the bonding wire 9 is wound sequentially onto the guide roller 2, cleaning roller 1 3, lifting roller 4, cleaning roller 2 5, guide roller 2, liquid collection hopper 7, guide roller 2 and winding device 6.

[0052] Second, by rotating the winding device 6, the bonding wire 9 is wound up, and the bonding wire 9 is cleaned in the cleaning roller 1 3, lifting roller 4, and cleaning roller 2 5 inside the cleaning box 1. The cleaning is further enhanced by the cleaning tank 32 and brush 33 inside the cleaning roller 1 3, lifting roller 4, and cleaning roller 2 5.

[0053] 3. After cleaning the bonding wire 9, start the dryer 8 and blow a large volume of hot air directly onto the bonding wire 9, so that the cleaning liquid on the surface of the bonding wire 9 is blown into the inside of the liquid collection hopper 7 for collection, and at the same time flows back into the inside of the cleaning box 1. At this time, the surface of the bonding wire 9 becomes dry and clean.

[0054] Fourth, when using cleaning roller 1 3, lifting roller 4, and cleaning roller 2 5, the lifting roller 4 is controlled by the lifting device 10 to move up and down inside the cleaning box 1. This allows the winding device 6 to stop when the lifting roller 4 descends, thus dragging the bonding wire 9 into the cleaning box 1. When the lifting roller 4 rises, the winding device 6 is activated to wind up the bonding wire 9. This process is repeated to achieve continuous surface cleaning of the bonding wire 9.

[0055] The foregoing description only illustrates certain exemplary embodiments of the present invention. Undoubtedly, those skilled in the art can modify the described embodiments in various ways without departing from the spirit and scope of the present invention. Therefore, the above drawings and descriptions are illustrative in nature and should not be construed as limiting the scope of protection of the claims of the present invention.

Claims

1. A special equipment for ultra-clean surface cleaning treatment of bonded alloy wire, comprising a cleaning tank (1), characterized in that, The cleaning tank (1) is provided with guide rollers (2) on both sides of the top, and the guide rollers (2) are used to guide and feed at least a number of bonding wires (9); The cleaning tank (1) has a cleaning roller 1 (3) and a cleaning roller 2 (5) respectively located on the lower sides of its interior sides. The cleaning roller 1 (3) and the cleaning roller 2 (5) are symmetrically distributed. The cleaning tank (1) is provided with a lifting roller (4) that moves up and down in the lower middle part. The lifting roller (4) is used at least intermittently pressing down the key alloy wire (9). A winding device (6) is provided on one side of the cleaning box (1), and the winding device (6) is used at least to wind up the processed bonding wire (9). A liquid collection hopper (7) is fixedly installed on one side of the outer wall of the cleaning tank (1), and the liquid collection hopper (7) collects the cleaning liquid adhering to the surface of the bonding wire (9); A dryer (8) is provided on one side of the cleaning tank (1) above the liquid collection hopper (7); Both sides of the cleaning tank (1) are equipped with synchronous lifting devices (10), which are used to drive the lifting roller (4) to move up and down.

2. The special equipment for ultra-clean surface cleaning treatment of bonding alloy wires according to claim 1, characterized in that, A reflux port (11) is provided on one side of the outer wall of the cleaning tank (1), and the bottom side of the liquid collection hopper (7) is connected to the reflux port (11).

3. The special equipment for ultra-clean surface cleaning treatment of bonding alloy wires according to claim 1, characterized in that, Several bearing seats (12) are provided on both outer walls of the cleaning tank (1), and one end of the first cleaning roller (3) and the second cleaning roller (5) are provided on the bearing seats (12).

4. The special equipment for ultra-clean surface cleaning treatment of bonding alloy wires according to claim 1, characterized in that, The guide roller (2) includes supports (21) at both ends, and a support shaft (22) is installed on the support (21). A number of guide grooves (23) are provided on the outer wall of the support shaft (22), and the bonding wire (9) is inserted into the guide groove (23).

5. The special equipment for ultra-clean surface cleaning treatment of bonding alloy wires according to claim 1, characterized in that, The cleaning roller one (3), lifting roller (4), and cleaning roller two (5) have the same structure. The cleaning roller (3) includes a roller shaft (31) located at the center, and a plurality of cleaning grooves (32) are provided on the outside of the roller shaft (31), and brushes (33) are provided on the inner wall of the cleaning grooves (32).

6. The special equipment for ultra-clean surface cleaning treatment of bonding alloy wires according to claim 1, characterized in that, A through hole (71) is provided on one side of the outer wall of the liquid collecting hopper (7), and the bonding wire (9) is inserted inside the through hole (71).

7. The special equipment for ultra-clean surface cleaning treatment of bonding alloy wires according to claim 1, characterized in that, The dryer (8) includes a shell (81), and a number of equally spaced guide plates (83) are arranged inside the lower part of the shell (81). The guide plates (83) have a tapered structure, and a fan (82) for blowing air downwards is arranged above the shell (81).

8. The special equipment for ultra-clean surface cleaning treatment of bonding alloy wires according to claim 1, characterized in that, The lifting device (10) includes a reciprocating cylinder (101) installed on the outer wall of the cleaning tank (1). A lifting rod (102) is provided inside the top of the reciprocating cylinder (101). A connecting arm (103) is fixed to the top of the lifting rod (102). A crossbeam (105) is fixedly installed between the two connecting arms (103). A synchronizing rod (104) is fixedly provided at one end of the connecting arm (103) and closely attached to the inner wall of the cleaning tank (1).

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